SCHEMBL65270

SCHEMBL65270

Cc1ccc(S(=O)(=O)OS(c2ccccc2)(c2ccc(OC(C)(C)C)cc2)c2ccc(OC(C)(C)C)cc2)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTT P42858 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.45
FFAR1 O14842 1/20 0.40
BCHE P06276 2/20 0.39
ACHE P22303 2/20 0.39
VDR P11473 1/20 0.39
CYP3A4 P08684 2/20 0.38
CYP2C19 P33261 1/20 0.38
MEN1 O00255 3/20 0.37
KMT2A Q03164 3/20 0.37
CA12 O43570 2/20 0.37
CA9 Q16790 2/20 0.37
LMNA P02545 2/20 0.37
MAPT P10636 1/20 0.37
GAA P10253 1/20 0.37
CYP1A2 P05177 1/20 0.37
ATM Q13315 1/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
ALDH1A1 P00352 5/20 0.37
KEAP1 Q14145 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL64770 1.00 HTT (0.45) HTTSMN1; SMN2FFAR1BCHEACHE
SCHEMBL482368 0.95 TDP1 (0.46) HTTSMN1; SMN2CYP2C19MEN1KMT2A
SCHEMBL64968 0.94 BCHE (0.43) HTTSMN1; SMN2BCHEACHEVDR
SCHEMBL8496289 0.94 BCHE (0.43) HTTSMN1; SMN2BCHEACHEVDR
SCHEMBL3197600 0.94 TDP1 (0.40) HTTSMN1; SMN2CYP2C19MEN1KMT2A
SCHEMBL8920104 0.89 HTT (0.44) HTTSMN1; SMN2BCHEACHEVDR
SCHEMBL8078746 0.89 HTT (0.41) HTTSMN1; SMN2FFAR1BCHEACHE
SCHEMBL6757964 0.89 HTT (0.41) HTTSMN1; SMN2FFAR1BCHEACHE
SCHEMBL8494335 0.89 ALDH1A1 (0.46) BCHEACHECYP3A4CYP2C19MEN1
SCHEMBL5709656 0.89 ENPP2 (0.44) HTTSMN1; SMN2BCHEACHECYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 751 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6841334-B2 Onium salts and positive resist materials using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-01-11 US claimed
US-5624787-A NITROGENOUS COMPOUND AND SULFONIUM COMPOUND FOR POSITIVE PHOTORESISTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 1997-04-29 US claimed
US-20260146026-A1 COMPOUND, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT ADEKA CORPORATION (JP) 2026-05-28 US disclosed
US-20260093178-A1 POLYMER, METHOD OF PRODUCING THE SAME, RESIST COMPOSITION INCLUDING THE POLYMER, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-04-02 US disclosed
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
US-20260008932-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-01-08 US disclosed
EP-4675357-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2026-01-07 EP disclosed
EP-4664197-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-12-17 EP disclosed
US-12448485-B2 Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, pattern formation method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-10-21 US disclosed
US-20250298315-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-09-25 US disclosed
EP-4617775-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT-EMITTING ELEMENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-09-17 EP disclosed
EP-0665220-B1 Novel sulfonium salt and chemically amplified positive resist composition SHINETSU CHEMICAL CO (JP) 1999-04-07 EP disclosed
US-5876900-A POLYHYDROXYSTYRENE POLYMER SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-03-02 US disclosed
EP-0887705-A1 Resist compositions SHIN-ETSU CHEMICAL CO., LTD. (JP) 1998-12-30 EP disclosed
US-5691112-A P-TOLUENESULFONIC ACID TRIS(P-TERT-BUTOXYPHENYL) SULFONIUM AS PHOTOSENSITIVE ACID GENERATOR; FORMING SOLUBLE SURFACE LAYER SHIN-ETSU CHEMICAL CO., LTD. (JP) 1997-11-25 US disclosed
US-5679496-A CONTAINING SULFONIUM SALT HAVING TERT-BUTOXYCARBONYLMETHOXY GROUP(S) AS ACID LABILE GROUPS; SENSITIVITY, RESOLUTION, ETCH AND HEAT RESISTANCE SHIN-ETSU CHEMICAL CO., LTD. (JP) 1997-10-21 US disclosed
US-5633409-A POSITIVE RESISTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 1997-05-27 US disclosed
US-5624787-A NITROGENOUS COMPOUND AND SULFONIUM COMPOUND FOR POSITIVE PHOTORESISTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 1997-04-29 US disclosed
EP-0665220-A1 Novel sulfonium salt and chemically amplified positive resist composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 1995-08-02 EP disclosed
EP-0615163-A1 Onium salts and positive resist materials using the same Shin-Etsu Chemical Co., Ltd. (JP) 1994-09-14 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260008932-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS ASH2L, ALKBH2, ITGA1 HTT 4860/4885SMN1; SMN2 3419/4885FFAR1 715/4885
US-20260146026-A1 COMPOUND, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT CBR3, CBR1, NOTUM HTT 3518/4885SMN1; SMN2 2208/4885FFAR1 697/4885
US-20260093178-A1 POLYMER, METHOD OF PRODUCING THE SAME, RESIST COMPOSITION INCLUDING THE POLYMER, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION RPS21, CA11, RPL21 HTT 4300/4885SMN1; SMN2 564/4885FFAR1 2313/4885
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 HTT 3346/4885SMN1; SMN2 2618/4885FFAR1 640/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.