SCHEMBL705960

SCHEMBL705960

CCCCCC(CC)O[SiH2]C[SiH2]OC(CC)CCCCC

nearest known ligand 0.35

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
OPRM1 P35372 1/20 0.34
FDPS P14324 4/20 0.34
SMPD1 P17405 3/20 0.34
LAP3 P28838 2/20 0.32
LMNA P02545 1/20 0.32
DNM1 Q05193 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL706237 0.93 ALDH1A1 (0.33) FDPSDNM1
SCHEMBL708147 0.89 DNM1 (0.37) OPRM1FDPSSMPD1LMNADNM1
SCHEMBL708069 0.87 DNM1 (0.41) OPRM1FDPSSMPD1LMNADNM1
SCHEMBL702508 0.87 OPRM1 (0.34) OPRM1FDPSSMPD1LMNADNM1
SCHEMBL705253 0.87 OPRM1 (0.34) OPRM1FDPSSMPD1LAP3LMNA
SCHEMBL706337 0.85 FDPS (0.33) OPRM1FDPSSMPD1LAP3LMNA
SCHEMBL703777 0.85 FDPS (0.33) OPRM1FDPSSMPD1LAP3LMNA
SCHEMBL705970 0.85 LMNA (0.35) OPRM1FDPSSMPD1LMNADNM1
SCHEMBL705248 0.84 PRKCA (0.30)
SCHEMBL713124 0.84 DNM1 (0.35) FDPSDNM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed