Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | OPRM1 | P35372 | 1/20 | 0.34 |
| ▸ | FDPS | P14324 | 4/20 | 0.34 |
| ▸ | SMPD1 | P17405 | 3/20 | 0.34 |
| ▸ | LAP3 | P28838 | 2/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | DNM1 | Q05193 | 2/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL703777 | 0.94 | FDPS (0.33) | OPRM1FDPSSMPD1LAP3LMNA | |
| SCHEMBL706337 | 0.94 | FDPS (0.33) | OPRM1FDPSSMPD1LAP3LMNA | |
| SCHEMBL706820 | 0.93 | ALDH1A1 (0.33) | FDPSDNM1 | |
| SCHEMBL704464 | 0.89 | OPRM1 (0.36) | OPRM1FDPSSMPD1LMNADNM1 | |
| SCHEMBL702775 | 0.89 | DNM1 (0.37) | OPRM1FDPSSMPD1LMNADNM1 | |
| SCHEMBL5574631 | 0.88 | DNM1 (0.38) | FDPSSMPD1LMNADNM1 | |
| SCHEMBL5575136 | 0.88 | DNM1 (0.38) | FDPSSMPD1LMNADNM1 | |
| SCHEMBL5570824 | 0.87 | PRKCA (0.33) | FDPSDNM1 | |
| SCHEMBL5575087 | 0.87 | PRKCA (0.33) | FDPSDNM1 | |
| SCHEMBL706863 | 0.87 | DNM1 (0.41) | OPRM1FDPSSMPD1LMNADNM1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |