SCHEMBL707649

SCHEMBL707649

CCC(O[SiH3])c1cccc(C(C)(C)C)c1C(C)(C)C

nearest known ligand 0.33

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
CA2 P00918 1/20 0.33
CYP1A2 P05177 1/20 0.31
CYP3A4 P08684 1/20 0.31
CYP2C9 P11712 1/20 0.31
TSHR P16473 1/20 0.31
CYP2C19 P33261 1/20 0.31
GABRA1 P14867 1/20 0.30
GABRB2 P47870 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL703822 0.88 CA2 (0.32) CA2CYP2C9CYP2C19
SCHEMBL705123 0.85 TSHR (0.36) CA2CYP1A2CYP3A4CYP2C9TSHR
SCHEMBL703503 0.78 CA2 (0.36) CA2TSHRGABRA1GABRB2
SCHEMBL29226060 0.78 TSHR (0.41) CA2CYP1A2CYP3A4CYP2C9TSHR
SCHEMBL707595 0.72 TSHR (0.33) CA2CYP1A2CYP3A4CYP2C9TSHR
SCHEMBL714262 0.71 GABRA1 (0.43) CA2CYP1A2CYP3A4CYP2C9TSHR
SCHEMBL11574234 0.71 CA2 (0.43) CA2CYP1A2CYP3A4TSHRCYP2C19
SCHEMBL704366 0.70 ADRA2A (0.37) CYP1A2CYP3A4CYP2C9TSHRCYP2C19
SCHEMBL19809267 0.70 CA2 (0.46) CA2CYP1A2CYP3A4TSHRCYP2C19
SCHEMBL705169 0.68 ESR1 (0.47) CYP1A2CYP3A4CYP2C9TSHRCYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed