SCHEMBL703822

SCHEMBL703822

CCCC(O[SiH3])c1cccc(C(C)(C)C)c1C(C)(C)C

nearest known ligand 0.32

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
CA2 P00918 1/20 0.32
TP53 P04637 1/20 0.31
CYP2D6 P10635 1/20 0.31
CYP2C9 P11712 1/20 0.31
ALOX15 P16050 1/20 0.31
CYP2C19 P33261 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL707649 0.88 CA2 (0.33) CA2CYP2C9CYP2C19
SCHEMBL707595 0.86 TSHR (0.33) CA2TP53CYP2D6CYP2C9ALOX15
SCHEMBL703503 0.76 CA2 (0.36) CA2
SCHEMBL705123 0.72 TSHR (0.36) CA2CYP2D6CYP2C9CYP2C19
SCHEMBL29226060 0.72 TSHR (0.41) CA2TP53CYP2D6CYP2C9ALOX15
SCHEMBL706192 0.71 ADRA2A (0.34) TP53CYP2D6CYP2C9CYP2C19
SCHEMBL707196 0.70 GABRA1 (0.36) CA2
SCHEMBL703010 0.70 ESR1 (0.44) TP53CYP2D6CYP2C9ALOX15CYP2C19
SCHEMBL706263 0.70 GABRA1 (0.35) CA2
SCHEMBL702730 0.69 TAS1R3 (0.36) CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed