Known targets — ChEMBL curated mechanism
ABCC8ACEADORA1ADORA2AADORA2BADORA3ALDH5A1ALOX5ALOX5APATP4AATP4BBRAFCA1CA12CA2CA4CYSLTR1DHFRDPEP1EDNRAEDNRBESR2F10FDPSFGF1GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGARTGNRHRGSC1HMGCRIMPDH1IMPDH2KCNJ11LY96NOD2NR3C1NS3NS4ANS5bP2RY1P2RY12P2RY2P2RY4P2RY6PBP2XPDE3APDE3BPDE4APDE4BPDE4CPDE4DPDK1PDK2PDK3PDK4PPARGPPATPTGIRPTGS1PTGS2RAF1RYR1RYR3SCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASERPINC1SLC12A1SLC12A3SYKTHRATHRBTLR3TLR4TLR9TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYMSVKORC1XDHblablaIMP-1blaOXA-33blaOXA-58blaT-3blaT-4blaT-5blaT-6dacAdacBdacCfolAfolPfolP1ftsIfusAgaggyrAgyrBmecAmrcAmrcBmrdApbp1apbp1bpbp2pbp2apbp2bpbp3pbp4pbpApbpBpbpCpbpFpolponBrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpoArpoBrpoCrpoZrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO
The experimentally established mechanism targets of Thiosulfuric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 1/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.46 |
| ▸ | TSHR | P16473 | 1/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.46 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Thiosulfuric Acid SCHEMBL146659 | 1.00 | MEN1 (0.46) | MEN1ALDH1A1TSHRKMT2AKDM4E | |
| Thiosulfuric Acid SCHEMBL31090016 | 1.00 | — | — | |
| Thiosulfuric Acid SCHEMBL28476703 | 0.95 | MEN1 (0.43) | MEN1ALDH1A1TSHRKMT2AKDM4E | |
| Thiosulfuric Acid SCHEMBL896433 | 0.95 | MEN1 (0.43) | MEN1ALDH1A1TSHRKMT2AKDM4E | |
| Thiosulfuric Acid SCHEMBL11787332 | 0.95 | ALDH1A1 (0.50) | MEN1ALDH1A1TSHRKMT2AKDM4E | |
| Thiosulfuric Acid SCHEMBL4088 | 0.95 | — | — | |
| Thiosulfuric Acid SCHEMBL27724216 | 0.95 | ALDH1A1 (0.50) | MEN1ALDH1A1TSHRKMT2AKDM4E | |
| Thiosulfuric Acid SCHEMBL11200821 | 0.95 | ALDH1A1 (0.50) | MEN1ALDH1A1TSHRKMT2AKDM4E | |
| Thiosulfuric Acid SCHEMBL337690 | 0.95 | MEN1 (0.39) | MEN1ALDH1A1TSHRKMT2A | |
| Thiosulfuric Acid SCHEMBL7156513 | 0.90 | MEN1 (0.36) | MEN1ALDH1A1TSHRKMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3186413-B1 | COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONTAINING LAYERS | ATOTECH DEUTSCHLAND GMBH (DE) | 2019-02-06 | — | — | EP | disclosed |
| EP-3023520-B1 | ENVIRONMENTALLY FRIENDLY GOLD ELECTROPLATING COMPOSITIONS AND CORRESPONDING METHOD | ROHM & HAAS ELECT MAT (US) | 2019-01-30 | — | — | EP | disclosed |
| EP-1306466-B1 | Electroless gold plating composition | ROHM & HAAS ELECT MAT (US) | 2018-11-21 | — | — | EP | disclosed |
| EP-2634293-B1 | COMPOSITES OF CARBON BLACK AND METAL | ROHM & HAAS ELECT MAT (US) | 2018-07-18 | — | — | EP | disclosed |
| EP-3186413-A1 | COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONTAINING LAYERS | ATOTECH Deutschland GmbH (DE) | 2017-07-05 | — | — | EP | disclosed |
| US-20170159195-A1 | COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONTAINING LAYERS | ATOTECH DEUTSCHLAND GMBH (DE) | 2017-06-08 | — | — | US | disclosed |
| EP-1728898-B1 | Electrolytes for the deposition of gold alloys | ROHM & HAAS ELECT MAT (US) | 2017-02-22 | — | — | EP | disclosed |
| US-20160145756-A1 | ENVIRONMENTALLY FRIENDLY GOLD ELECTROPLATING COMPOSITIONS AND METHODS | ROHM AND HAAS ELECRONIC MATERIALS LLC | 2016-05-26 | — | — | US | disclosed |
| US-20160145745-A1 | FORMALDEHYDE-FREE ELECTROLESS METAL PLATING COMPOSITIONS AND METHODS | ROHM AND HAAS ELECRONIC MATERIALS LLC | 2016-05-26 | — | — | US | disclosed |
| EP-3023515-A2 | FORMALDEHYDE-FREE ELECTROLESS METAL PLATING COMPOSITIONS AND METHODS | Rohm and Haas Electronic Materials LLC (US) | 2016-05-25 | — | — | EP | disclosed |
| US-20090104463-A1 | Gold alloy electrolytes | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2009-04-23 | — | — | US | disclosed |
| US-7465385-B2 | Gold alloy electrolytes | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-12-16 | — | — | US | disclosed |
| US-20060283714-A1 | Gold alloy electrolytes | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2006-12-21 | — | — | US | disclosed |
| EP-1728898-A2 | Electrolytes for the deposition of gold alloys | Rohm and Haas Electronic Materials LLC (US) | 2006-12-06 | — | — | EP | disclosed |
| US-6911230-B2 | Plating method | SHIPLEY COMPANY, L.L.C. (US) | 2005-06-28 | — | — | US | disclosed |
| US-6776828-B2 | ELECTROLESS GOLD PLATING COMPOSITION COMPRISING ONE OR MORE WATER SOLUBLE GOLD COMPOUNDS, ONE OR MORE GOLD COMPLEXING AGENTS, ONE OR MORE ORGANIC STABILIZER COMPOUNDS, AND ONE OR MORE UNIFORMITY ENHANCERS | SHIPLEY COMPANY, L.L.C. | 2004-08-17 | — | — | US | disclosed |
| US-20040018308-A1 | Plating method | SHIPLEY COMPANY, L.L.C. | 2004-01-29 | — | — | US | disclosed |
| US-20040009292-A1 | Including one or more water soluble gold compounds, gold complexing agents, organic stabilizer compounds, and carboxylic acid uniformity enhancers; for printed wiring board substrates, integrated circuits, lead frames, pads | SHIPLEY COMPANY, L.L.C. (US) | 2004-01-15 | — | — | US | disclosed |
| EP-1319734-A1 | Plating method | Shipley Co. L.L.C. (US) | 2003-06-18 | — | — | EP | disclosed |
| EP-1306466-A2 | Electroless gold plating composition | Shipley Co. L.L.C. (US) | 2003-05-02 | — | — | EP | disclosed |