SCHEMBL86047

SCHEMBL86047

C=C(C)c1ccc(C(O)(C(F)(F)F)C(F)(F)F)cc1

nearest known ligand 0.53

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
NR1H3 Q13133 13/20 0.53
NR1H2 P55055 12/20 0.53
MLYCD O95822 4/20 0.52
SMN1; SMN2 Q16637 2/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15582362 0.82 HSD11B1 (0.46)
SCHEMBL20616201 0.81 CES2 (0.35) NR1H3NR1H2MLYCDSMN1; SMN2
SCHEMBL3702855 0.81 NR1H3 (0.50) NR1H3NR1H2MLYCD
SCHEMBL1474670 0.80 CES2 (0.54)
SCHEMBL1476091 0.79 PDE2A (0.46) NR1H3NR1H2MLYCD
SCHEMBL86347 0.79 NR1H2 (0.39) NR1H3NR1H2MLYCDSMN1; SMN2
SCHEMBL26474236 0.79 TSHR (0.35) NR1H3NR1H2MLYCD
SCHEMBL13100303 0.79 SMN1; SMN2 (0.59) NR1H3NR1H2MLYCDSMN1; SMN2
SCHEMBL131990 0.79 NR1H2 (0.68) NR1H3NR1H2MLYCDSMN1; SMN2
SCHEMBL428959 0.78 MLYCD (0.77) NR1H3NR1H2MLYCDSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5250626-A Miscible blends of polyphosphazenes and acidic functional polymers EASTMAN KODAK COMPANY (US) 1993-10-05 US claimed
US-20230213862-A1 PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2023-07-06 US disclosed
US-9507262-B2 Resist top-coat composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-11-29 US disclosed
US-9274428-B2 Resist top coat composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-03-01 US disclosed
US-9201300-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-12-01 US disclosed
US-20150234274-A1 RESIST TOP-COAT COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-08-20 US disclosed
US-8951712-B2 Resist protective film-forming composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-02-10 US disclosed
US-20150030983-A1 RESIST TOP COAT COMPOSITION AND PATTERNING PROCESS SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-01-29 US disclosed
US-20140178818-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-06-26 US disclosed
US-20140080064-A1 RESIST PROTECTIVE FILM-FORMING COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-03-20 US disclosed
US-8129099-B2 Double patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-03-06 US disclosed
US-20090208886-A1 DOUBLE PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-08-20 US disclosed
US-6794109-B2 POLYMER CONTAINING A FLUORINATED STYRENE COPOLYMER MASSACHUSETTS INSTITUTE OF TECHNOLOGY 2004-09-21 US disclosed
US-20020160297-A1 Low abosorbing resists for 157 nm lithography AIR FORCE, UNITED STATES 2002-10-31 US disclosed
WO-2002069043-A2 LOW ABSORBING RESISTS FOR 157 NM LITHOGRAPHY MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) 2002-09-06 WO disclosed