SCHEMBL893283

SCHEMBL893283

Cc1cc(-c2cc(C)c(CCl)c(C)c2)cc(C)c1CCl

nearest known ligand 0.41

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.41
CYP3A4 P08684 2/20 0.41
TSHR P16473 2/20 0.41
TDP1 Q9NUW8 2/20 0.41
TP53 P04637 1/20 0.41
CA1 P00915 1/20 0.41
CA2 P00918 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.32
CYP1A2 P05177 1/20 0.31
CYP2C9 P11712 1/20 0.31
CYP2C19 P33261 1/20 0.31
HTR1D P28221 1/20 0.30
PGK1 P00558 1/20 0.30
PGK2 P07205 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL531025 0.82 RAPGEF4 (0.46) TSHRHTR1D
SCHEMBL21472699 0.80 RAPGEF4 (0.40) ALDH1A1CYP3A4TSHRL3MBTL1
SCHEMBL20669667 0.78 PTGS2 (0.34) TP53L3MBTL1CYP1A2
SCHEMBL7983095 0.78 HTR1D (0.40) ALDH1A1TP53L3MBTL1HTR1D
SCHEMBL2810221 0.77 PGK1 (0.44) L3MBTL1HTR1DPGK1PGK2
SCHEMBL2989162 0.76 HTR1D (0.56) ALDH1A1CYP3A4TSHRTDP1TP53
SCHEMBL7983320 0.74 ADRA2A (0.43) HTR1D
SCHEMBL10753734 0.74 ALDH1A1 (0.46) ALDH1A1CYP3A4TSHR
SCHEMBL5872351 0.72 PGK1 (0.37) L3MBTL1PGK1PGK2
SCHEMBL892872 0.71 CA1 (0.48) ALDH1A1CYP3A4TSHRTDP1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130289187-A1 RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE SUMITOMO BAKELITE COMPANY LIMITED (JP) 2013-10-31 US disclosed
US-8502399-B2 Resin composition for encapsulating semiconductor and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-08-06 US disclosed
US-20120080809-A1 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2012-04-05 US disclosed
US-20080286688-A1 Photosensitive Resin Composition and Cured Product Thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2008-11-20 US disclosed
EP-1710626-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF Nippon Kayaku Kabushiki Kaisha (JP) 2006-10-11 EP disclosed