SCHEMBL958717

SCHEMBL958717

Brc1ccc2c3c(cccc13)C=C2

nearest known ligand 0.40

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.40
CYP1B1 Q16678 14/20 0.37
ALDH1A1 P00352 2/20 0.34
POLB P06746 2/20 0.34
RXFP1 Q9HBX9 1/20 0.34
PARP1 P09874 1/20 0.32
AHR P35869 1/20 0.31
KDM4E B2RXH2 1/20 0.31
MEN1 O00255 1/20 0.31
NPC1 O15118 1/20 0.31
LMNA P02545 1/20 0.31
MAPT P10636 1/20 0.31
PABPC1 P11940 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28938488 0.78 CYP1B1 (0.44) CYP1A2CYP1B1ALDH1A1POLBRXFP1
SCHEMBL8765377 0.76 HKDC1 (0.32)
SCHEMBL8765531 0.74
SCHEMBL8764547 0.74 HSP90AA1 (0.31) KDM4EMEN1MAPTKMT2A
SCHEMBL29405395 0.74 CYP1A2 (0.45) CYP1A2CYP1B1ALDH1A1POLBRXFP1
SCHEMBL3575204 0.74 CYP1A2 (0.45) CYP1A2CYP1B1ALDH1A1POLBRXFP1
SCHEMBL29406732 0.74 CYP1A2 (0.45) CYP1A2CYP1B1ALDH1A1POLBRXFP1
SCHEMBL2679177 0.74 CYP1A2 (0.45) CYP1A2CYP1B1ALDH1A1POLBRXFP1
SCHEMBL30366558 0.74 CYP1A2 (0.45) CYP1A2CYP1B1ALDH1A1POLBRXFP1
SCHEMBL19417358 0.74 CYP1A2 (0.45) CYP1A2CYP1B1ALDH1A1POLBRXFP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 274 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119875295-A Composition containing acenaphthene ring structure for benzoxazine resin and copper-clad plate 江苏东材新材料有限责任公司 2025-04-25 CN claimed
US-12624176-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-05-12 US disclosed
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
US-20260098143-A1 RESIN COMPOSITION, AND PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAID RESIN COMPOSITION PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-04-09 US disclosed
US-20260078253-A1 RESIN COMPOSITION, AND PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAME PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-03-19 US disclosed
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof NOTARK CORPORATION (US) 2026-02-10 US disclosed
US-12534584-B2 Resin composition, prepreg, resin-attached film, resin-attached metal foil, metal-cladded laminate sheet, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-01-27 US disclosed
US-20260002026-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-01-01 US disclosed
US-20260002021-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-01-01 US disclosed
US-20250382456-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-12-18 US disclosed
EP-1380556-A1 COMPOUND FOR ORGANIC EL ELEMENT AND ORGANIC EL ELEMENT TDK Corporation (JP) 2004-01-14 EP disclosed
CN-1464871-A Compound for organic el element and organic el element TDK CORP (JP) 2003-12-31 CN disclosed
US-20030229096-A1 Substituted imidazol-pyridazine derivatives EVOTEC INTERNATIONAL GMBH (DE) 2003-12-11 US disclosed
WO-2003097637-A1 (IMIDAZOL-1-YL-METHYL)-PYRIDAZINE AS NMDA RECEPTOR BLOCKER F. HOFFMANN-LA ROCHE AG (CH) 2003-11-27 WO disclosed
WO-2003053948-A1 ISOCHROMAN COMPOUNDS FOR TREATMENT OF CNS DISORDERS ELI LILLY AND COMPANY (US) 2003-07-03 WO disclosed
US-20030073040-A1 Pattern forming method and bilayer film JSR CORPORATION (JP) 2003-04-17 US disclosed
US-20020086934-A1 Anti-reflection coating forming composition JSR CORPORATION (JP) 2002-07-04 US disclosed
EP-1205805-A1 Anti-reflection coating forming composition JSR Corporation (JP) 2002-05-15 EP disclosed
EP-0505972-B1 Process for producing styrenic copolymer IDEMITSU KOSAN CO (JP) 1997-06-11 EP disclosed
EP-0505972-A2 Process for producing styrenic copolymer IDEMITSU KOSAN COMPANY LIMITED (JP) 1992-09-30 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (9 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260002026-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD WDR33, FCER2, C1R CYP1A2 2566/4885CYP1B1 1542/4885ALDH1A1 2620/4885
US-20260098143-A1 RESIN COMPOSITION, AND PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAID RESIN COMPOSITION VMA21, ARCN1, RAD51 CYP1A2 3662/4885CYP1B1 1637/4885ALDH1A1 2958/4885
US-12534584-B2 Resin composition, prepreg, resin-attached film, resin-attached metal foil, metal-cladded laminate sheet, and wiring board MECP2, WDR33, TERB1 CYP1A2 3569/4885CYP1B1 2017/4885ALDH1A1 2391/4885
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME PSMA1, PSMB10, RAD51 CYP1A2 2570/4885CYP1B1 1395/4885ALDH1A1 438/4885
US-20260078253-A1 RESIN COMPOSITION, AND PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAME ARCN1, TGFBR1, C1R CYP1A2 2511/4885CYP1B1 964/4885ALDH1A1 2046/4885
US-20260002021-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD POLR1G, WDR33, PSMB2 CYP1A2 1973/4885CYP1B1 1993/4885ALDH1A1 1287/4885
US-12624176-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PARG, CAD, COPE CYP1A2 3506/4885CYP1B1 1782/4885ALDH1A1 2478/4885
US-20030229096-A1 Substituted imidazol-pyridazine derivatives GRIN2B, GRIN2A, GRIN2C CYP1A2 1651/4885CYP1B1 622/4885ALDH1A1 1634/4885
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof DSG1, CDH1, CAD CYP1A2 1939/4885CYP1B1 1428/4885ALDH1A1 480/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.