SCHEMBL1207697

SCHEMBL1207697

CN1CCOCC1.c1ccc([B-](c2ccccc2)(c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.45
POLB P06746 3/20 0.42
MEN1 O00255 1/20 0.42
GAA P10253 1/20 0.42
KMT2A Q03164 1/20 0.42
TSHR P16473 2/20 0.41
SIGMAR1 Q99720 1/20 0.41
KDM4E B2RXH2 1/20 0.41
ALDH1A1 P00352 1/20 0.41
HPGD P15428 1/20 0.41
HSD17B10 Q99714 1/20 0.41
FAAH O00519 1/20 0.40
MGLL Q99685 1/20 0.40
NCOA3 Q9Y6Q9 1/20 0.40
AR P10275 1/20 0.40
SMN1; SMN2 Q16637 2/20 0.39
HTT P42858 1/20 0.39
ACHE P22303 1/20 0.39
PRKCB P05771 1/20 0.38
PRKCA P17252 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Tetraphenylphosphonium SCHEMBL22129841 0.90 LMNA (0.38) LMNAPOLBMEN1GAAKMT2A
Toluene SCHEMBL17164584 0.79 LMNA (0.48) LMNAPOLBMEN1GAAKMT2A
Aniline SCHEMBL28208327 0.78 ADRA2C (0.48) LMNAPOLBMEN1GAAKMT2A
Tetrahydrofuran SCHEMBL7197722 0.76 ALDH1A1 (0.40) LMNAPOLBMEN1GAAKMT2A
SCHEMBL20815494 0.76 LMNA (0.45) LMNAPOLBMEN1GAAKMT2A
Benzylamine SCHEMBL8890127 0.73 NCF1 (0.56) LMNAPOLBTSHRSIGMAR1KDM4E
Chlorotriphenylmethane SCHEMBL28791694 0.73 SMN1; SMN2 (0.46) LMNAPOLBMEN1GAAKMT2A
Hydrogen Peroxide SCHEMBL11793831 0.72
SCHEMBL1221354 0.72
SCHEMBL20614479 0.72 CA12 (0.45) TSHRKDM4EALDH1A1HPGDMGLL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 296 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122094914-A Zeolite, resin composition, liquid sealing agent, underfill material, method for producing sealing material, and electronic device 2026-05-26 CN disclosed
US-20260098188-A1 RELEASE AGENT COMPOSITION FOR LIGHT IRRADIATION RELEASE, AND ADHESIVE COMPOSITION FOR LIGHT IRRADIATION RELEASE NISSAN CHEMICAL CORPORATION (JP) 2026-04-09 US disclosed
US-12570858-B2 Curable composition, cured product, cured film, display panel, and method for producing cured film TOKYO OHKA KOGYO CO., LTD. (JP) 2026-03-10 US disclosed
US-12473471-B2 Laminate, production method therefor, and automotive exterior material MITSUBISHI CHEMICAL CORPORATION (JP) 2025-11-18 US disclosed
US-20250333565-A1 CHEMICAL-RESISTANT PROTECTIVE FILM NISSAN CHEMICAL CORPORATION (JP) 2025-10-30 US disclosed
EP-4636051-A1 RELEASER COMPOSITION FOR PHOTOIRRADIATION RELEASE, AND ADHESIVE COMPOSITION FOR PHOTOIRRADIATION RELEASE Nissan Chemical Corporation (JP) 2025-10-22 EP disclosed
US-20250279392-A1 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2025-09-04 US disclosed
WO-2025121298-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF 日本化薬株式会社 2025-06-12 WO disclosed
CN-116438141-B Zeolite, method for producing zeolite, composition, liquid sealant, resin composite material, sealing material, method for producing sealing material, and apparatus 三菱化学株式会社 2025-06-10 CN disclosed
WO-2025110218-A1 ZEOLITE, RESIN COMPOSITION, LIQUID SEALING AGENT, UNDERFILL MATERIAL, METHOD FOR PRODUCING SEALING MATERIAL, AND ELECTRONIC DEVICE 三菱ケミカル株式会社 2025-05-30 WO disclosed
EP-0707042-A1 Epoxy resin molding material for sealing electronic parts and sealed semiconductor device using the same HITACHI CHEMICAL CO., LTD. (JP) 1996-04-17 EP disclosed
US-5459223-A First stage polymerization, second stage curing, acid catalyst curing agent for an epoxy resin molding material for sealing electronic parts HITACHI CHEMICAL COMPANY (JP) 1995-10-17 US disclosed
EP-0610920-A2 Method of preparing naphthol-modified phenolic resin and epoxy resin molding material for sealing electronic parts Hitachi Chemical Co., Ltd. (JP) 1994-08-17 EP disclosed
US-5319005-A With phenol-aralkyl resin, inorganic filler, and cured product of vinyl and hydrogen-containing polysiloxanes HITACHI CHEMICAL CO., LTD. (JP) 1994-06-07 US disclosed
EP-0553371-A1 Epoxy resin molding material for sealing of electronic component HITACHI CHEMICAL CO., LTD. (JP) 1993-08-04 EP disclosed
EP-0529936-A1 Epoxy resin compositions MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-03-03 EP disclosed
EP-0503744-A2 Curable resin compositions and semiconductor devices coated and sealed with the same HITACHI, LTD. (JP) 1992-09-16 EP disclosed
US-4903119-A Semi-conductor device NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) 1990-02-20 US disclosed
EP-0237255-A2 Curable resin compositions and semiconductor devices coated and sealed with the same HITACHI, LTD. (JP) 1987-09-16 EP disclosed
US-4056579-A Novel thermosetting resin composition and cured product therefrom HITACHI, LTD. (JA) 1977-11-01 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12570858-B2 Curable composition, cured product, cured film, display panel, and method for producing cured film C5, CFL1, C9 LMNA 678/4885POLB 2921/4885MEN1 79/4885
US-20260098188-A1 RELEASE AGENT COMPOSITION FOR LIGHT IRRADIATION RELEASE, AND ADHESIVE COMPOSITION FOR LIGHT IRRADIATION RELEASE ERCC1, SMC2, SMC3 LMNA 100/4885POLB 3585/4885MEN1 4133/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.