Known targets — ChEMBL curated mechanism
ABL1ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB2AGTR1BCL2BCL2A1BCL2L1BCL2L10BCL2L2BCRBRAFCHRM1CHRNA10CHRNA9DRD1DRD2DRD3DRD4DRD5EGFRF2FLT1FLT4GCKGHSRGNRHRGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHTR1AHTR1BHTR1DHTR2AHTR2CHTR3AIDH2KDRKITMAOBMCL1MTTPPP4HBPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PIKFYVEROCK1ROCK2SLC18A2SLC6A2SLC6A3SLC6A4TACR1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8gyrAgyrBparCparEpol
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HTT | P42858 | 3/20 | 0.48 |
| ▸ | RAB9A | P51151 | 2/20 | 0.48 |
| ▸ | LMNA | P02545 | 2/20 | 0.48 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.43 |
| ▸ | ACE | P12821 | 1/20 | 0.43 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.42 |
| ▸ | GAA | P10253 | 2/20 | 0.42 |
| ▸ | NPC1 | O15118 | 1/20 | 0.42 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.41 |
| ▸ | MAPT | P10636 | 2/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.41 |
| ▸ | PKM | P14618 | 1/20 | 0.41 |
| ▸ | MEN1 | O00255 | 1/20 | 0.41 |
| ▸ | TP53 | P04637 | 1/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.41 |
| ▸ | PPARG | P37231 | 1/20 | 0.41 |
| ▸ | PPARA | Q07869 | 1/20 | 0.41 |
| ▸ | MMP1 | P03956 | 1/20 | 0.41 |
| ▸ | MMP2 | P08253 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9728462 | 0.94 | RAB9A (0.52) | HTTRAB9ALMNAL3MBTL1ACE | |
| SCHEMBL31038960 | 0.92 | HTT (0.44) | HTTRAB9ALMNAL3MBTL1ACE | |
| Trifluoromethanesulfonic Acid SCHEMBL20421987 | 0.91 | HTT (0.44) | HTTRAB9ALMNAL3MBTL1ACE | |
| SCHEMBL9220921 | 0.83 | LMNA (0.49) | HTTRAB9ALMNAL3MBTL1ACE | |
| SCHEMBL28697234 | 0.81 | ALDH1A1 (0.54) | HTTLMNAL3MBTL1KDM4EMAPT | |
| SCHEMBL9222914 | 0.79 | LMNA (0.50) | HTTRAB9ALMNAL3MBTL1NPC1 | |
| SCHEMBL28697235 | 0.79 | MEN1 (0.45) | HTTRAB9ALMNAL3MBTL1GAA | |
| SCHEMBL28973261 | 0.79 | ELANE (0.56) | HTTRAB9ALMNAGAANPC1 | |
| Trifluoromethanesulfonic Acid SCHEMBL29634745 | 0.78 | PPARG (0.48) | HTTRAB9ALMNAL3MBTL1GAA | |
| SCHEMBL20421986 | 0.77 | MMP1 (0.43) | RAB9AACEGAANPC1TAAR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114730132-B | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin | 富士胶片株式会社 | 2025-05-09 | — | — | CN | disclosed |
| CN-114761466-B | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin | 富士胶片株式会社 | 2024-12-10 | — | — | CN | disclosed |
| CN-114008527-B | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and polyimide or polyimide precursor | 富士胶片株式会社 | 2024-11-01 | — | — | CN | disclosed |
| CN-116113884-A | Method for producing cured product, method for producing laminate, and method for producing electronic device | 富士胶片株式会社 | 2023-05-12 | — | — | CN | disclosed |
| CN-115768832-A | Resin composition, method for producing same, and method for producing composition for pattern formation | 富士胶片株式会社 | 2023-03-07 | — | — | CN | disclosed |
| CN-115038755-A | Curable resin composition, resin film, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2022-09-09 | — | — | CN | disclosed |
| CN-114730145-A | Pattern forming method, photocurable resin composition, method for producing laminate, and method for producing electronic device | 富士胶片株式会社 | 2022-07-08 | — | — | CN | disclosed |
| CN-108700836-B | Method for manufacturing laminate and method for manufacturing semiconductor device | 富士胶片株式会社 | 2022-06-28 | — | — | CN | disclosed |
| CN-114514470-A | Pattern forming method, photosensitive resin composition, method for manufacturing laminate, and method for manufacturing semiconductor device | 富士胶片株式会社 | 2022-05-17 | — | — | CN | disclosed |
| US-10780679-B2 | Laminate, method for manufacturing laminate, semiconductor device, and method for manufacturing the semiconductor device | FUJIFILM CORPORATION (JP) | 2020-09-22 | — | — | US | disclosed |
| EP-3339352-B1 | RESIN, COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2020-09-16 | — | — | EP | disclosed |
| US-10450417-B2 | Resin, composition, cured film, method for manufacturing cured film and semiconductor device | FUJIFILM CORPORATION (JP) | 2019-10-22 | — | — | US | disclosed |
| EP-3339023-B1 | LAMINATE, METHOD FOR MANUFACTURING THE LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2019-07-03 | — | — | EP | disclosed |
| US-20180222164-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2018-08-09 | — | — | US | disclosed |
| US-20180215874-A1 | RESIN, COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2018-08-02 | — | — | US | disclosed |