SCHEMBL238589

SCHEMBL238589

CC(O)Nn1nnc2ccccc21

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP4Z1 Q86W10 10/20 0.50
SLC9A1 P19634 3/20 0.47
POLB P06746 2/20 0.47
MAPK1 P28482 1/20 0.47
ATM Q13315 1/20 0.47
KEAP1 Q14145 1/20 0.47
APAF1 O14727 1/20 0.44
CYP1A2 P05177 2/20 0.43
CYP2C8 P10632 1/20 0.43
CYP2B6 P20813 1/20 0.43
CYP4F8 P98187 1/20 0.43
CYP4F12 Q9HCS2 1/20 0.43
DGAT1 O75907 1/20 0.43
ALDH1A1 P00352 1/20 0.43
CYP3A4 P08684 1/20 0.43
CYP2D6 P10635 1/20 0.43
MAPT P10636 1/20 0.43
CYP2C9 P11712 1/20 0.43
THPO P40225 1/20 0.43
TDP1 Q9NUW8 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5828536 0.81 APAF1 (0.54) CYP4Z1SLC9A1POLBAPAF1CYP1A2
SCHEMBL16335870 0.80 CYP4Z1 (0.48) CYP4Z1SLC9A1POLBKEAP1APAF1
SCHEMBL7243835 0.76 POLB (0.55) CYP4Z1SLC9A1POLBMAPK1ATM
SCHEMBL29518725 0.76 CYP4Z1 (0.57) CYP4Z1SLC9A1POLBMAPK1ATM
SCHEMBL5662069 0.76 CYP4Z1 (0.57) CYP4Z1SLC9A1POLBMAPK1ATM
SCHEMBL513592 0.75 SLC9A1 (0.70) CYP4Z1SLC9A1POLBMAPK1ATM
SCHEMBL1866263 0.73 SLC9A1 (0.52) CYP4Z1SLC9A1POLBMAPK1ATM
SCHEMBL9882895 0.72 CYP4Z1 (0.50) CYP4Z1SLC9A1POLBAPAF1CYP1A2
SCHEMBL18833167 0.72 CYP4Z1 (0.53) CYP4Z1SLC9A1POLBMAPK1ATM
SCHEMBL16639135 0.72 CYP4Z1 (0.55) CYP4Z1SLC9A1POLBMAPK1ATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-100543124-C Substrate is with clean-out system and purging method WAKO PURE CHEM IND LTD (JP) 2009-09-23 CN claimed
JP-56122884-A None JP disclosed
JP-6085455-A None JP disclosed
JP-55149393-A None JP disclosed
JP-63234013-A None JP disclosed
JP-1219183-A None JP disclosed
US-20230203347-A1 METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET, AND PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2023-06-29 US disclosed
EP-4130182-A1 METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET, AND PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2023-02-08 EP disclosed
CN-115397936-A Method for producing adhesive sheet and adhesive sheet 日东电工株式会社 2022-11-25 CN disclosed
EP-1679361-B1 CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD WAKO PURE CHEM IND LTD (JP) 2015-06-24 EP disclosed
EP-2192167-A1 ADHESIVE COMPOSITION FOR ELECTRONIC COMPONENTS AND ADHESIVE SHEET FOR ELECTRONIC COMPONENTS USING THE SAME Toray Industries, Inc. (JP) 2010-06-02 EP disclosed
CN-100543124-C Substrate is with clean-out system and purging method WAKO PURE CHEM IND LTD (JP) 2009-09-23 CN disclosed
US-20070235061-A1 Cleaning Agent for Substrate and Cleaning Method WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2007-10-11 US disclosed
CN-1875090-A Cleaning agent for substrate and cleaning method WAKO PURE CHEM IND LTD (JP) 2006-12-06 CN disclosed
EP-1679361-A1 CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD Wako Pure Chemical Industries, Ltd. (JP) 2006-07-12 EP disclosed
JP-H0685455-A SURFACE TREATMENT OF COPPER FOIL FOR PRINTED CIRCUIT USE NIKKO GUURUDO FOIL KK 1994-03-25 JP disclosed
JP-H01219183-A CORROSION INHIBITOR COMPOSITION FOR COPPER TATSUTA ELECTRIC WIRE & CABLE CO LTD 1989-09-01 JP disclosed
JP-S63234013-A RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE TATSUTA ELECTRIC WIRE & CABLE CO LTD 1988-09-29 JP disclosed
JP-S56122884-A RUST INHIBITOR TATSUTA ELECTRIC WIRE & CABLE CO LTD 1981-09-26 JP disclosed
JP-S55149393-A LUBRICATING AND RUST-PROOFING AGENT FOR COPPER OR COPPER ALLOY TATSUTA ELECTRIC WIRE & CABLE CO LTD 1980-11-20 JP disclosed