SCHEMBL2620558

SCHEMBL2620558

COc1ccc(C2(c3ccc(OC)cc3)CCC(C(C)(C)C3CCC(c4ccc(CO)cc4)(c4ccc(CO)cc4)CC3)CC2)cc1

nearest known ligand 0.38

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ SLC6A4 P31645 2/20 0.37
▸ SLC6A3 Q01959 2/20 0.37
▸ ALDH1A1 P00352 3/20 0.36
▸ SMN1; SMN2 Q16637 2/20 0.36
▸ PPARG P37231 1/20 0.36
▸ PPARA Q07869 1/20 0.36
▸ ATM Q13315 1/20 0.36
▸ L3MBTL1 Q9Y468 1/20 0.36
▸ CYP19A1 P11511 1/20 0.36
▸ NPC1 O15118 1/20 0.35
▸ RAB9A P51151 1/20 0.35
▸ ADORA3 P0DMS8 1/20 0.35
▸ MEN1 O00255 1/20 0.35
▸ CYP2C9 P11712 1/20 0.35
▸ CYP2C19 P33261 1/20 0.35
▸ KMT2A Q03164 1/20 0.35
▸ NPSR1 Q6W5P4 1/20 0.35
▸ SLC18A2 Q05940 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15981141 0.80 BACE1 (0.47) SLC6A4SLC6A3ALDH1A1SMN1; SMN2L3MBTL1
SCHEMBL12360680 0.78 DRD2 (0.43) ALDH1A1SMN1; SMN2PPARGPPARARAB9A
SCHEMBL15869205 0.75 SLC6A4 (0.44) SLC6A4SLC6A3ADORA3
SCHEMBL15869180 0.73 ADORA3 (0.46) SLC6A4SLC6A3ADORA3
SCHEMBL15869194 0.73 GPR174 (0.37) ALDH1A1SMN1; SMN2L3MBTL1RAB9AADORA3
SCHEMBL45831 0.73 ESR2 (0.53) SLC6A4SLC6A3
SCHEMBL8089502 0.72 MAPT (0.44) ALDH1A1SLC18A2
SCHEMBL2620574 0.72 HTR2C (0.43) ALDH1A1PPARGPPARARAB9A
SCHEMBL4181089 0.72 IDO1 (0.58) SLC6A4ALDH1A1SMN1; SMN2
SCHEMBL27329 0.72 IDO1 (0.58) SLC6A4ALDH1A1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180079864-A1 POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION FUJIFILM CORPORATION (JP) 2018-03-22 — — US disclosed
US-20180051136-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT TORAY INDUSTRIES, INC. (JP) 2018-02-22 — — US disclosed
US-9005876-B2 Positive photosensitive resin composition for spray coating and method for producing through electrode using the same SUMITOMO BAKELITE CO., LTD. (JP) 2015-04-14 — — US disclosed
US-8883391-B2 Positive type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2014-11-11 — — US disclosed
US-20140113448-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING AND METHOD FOR PRODUCING THROUGH ELECTRODE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2014-04-24 — — US disclosed
US-20130280654-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE CURED FILM SUMITOMO BAKELITE CO (JP) 2013-10-24 — — US disclosed
US-8530119-B2 Positive photosensitive resin composition, cured film, protective film, interlayer insulating film, and semiconductor device and display element using the same SUMITOMO BAKELITE CO., LTD. (JP) 2013-09-10 — — US disclosed
US-8492469-B2 Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured film SUMITOMO BAKELITE CO., LTD. (JP) 2013-07-23 — — US disclosed
US-20130108967-A1 METHOD FOR FORMING CURED FILM SUMITOMO BAKELITE CO., LTD. (JP) 2013-05-02 — — US disclosed
US-8367283-B2 Positive photosensitive resin composition, cured film, protecting film, insulating film and semiconductor and display devices using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2013-02-05 — — US disclosed
US-20120251949-A1 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2012-10-04 — — US disclosed
US-20120100484-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INTERLAYER INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY ELEMENT USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2012-04-26 — — US disclosed
US-20110200937-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING AND METHOD FOR PRODUCING THROUGH ELECTRODE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2011-08-18 — — US disclosed
US-20110159432-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTING FILM, INSULATING FILM AND SEMICONDUCTOR AND DISPLAY DEVICES USING THE SAME SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-06-30 — — US disclosed
US-20110136952-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE CURED FILM SUMITOMO BAKELITE CO., LTD. (JP) 2011-06-09 — — US disclosed
Send feedback