SCHEMBL2864709

SCHEMBL2864709

Cl[Si](Cl)(Cl)CCc1ccc(-c2c3ccccc3c(-c3ccccc3)c3ccccc23)cc1

nearest known ligand 0.38

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
FFAR1 O14842 1/20 0.38
HIF1A Q16665 3/20 0.37
TAAR1 Q96RJ0 1/20 0.35
ACHE P22303 1/20 0.35
ESR1 P03372 2/20 0.35
ESR2 Q92731 2/20 0.35
TDP1 Q9NUW8 2/20 0.35
KCNH2 Q12809 1/20 0.35
KDM4E B2RXH2 1/20 0.35
MAPT P10636 1/20 0.35
MAPK1 P28482 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
HSD11B1 P28845 2/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
MMP12 P39900 1/20 0.34
CNR2 P34972 1/20 0.34
TP53 P04637 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2867796 0.96 TP53 (0.35) FFAR1HIF1AACHETDP1KDM4E
SCHEMBL2865883 0.93 FFAR1 (0.36) FFAR1HIF1ATAAR1TDP1KCNH2
SCHEMBL5493502 0.87 FFAR1 (0.48) FFAR1HIF1ATAAR1KCNH2MMP12
SCHEMBL2861031 0.86 MAOB (0.39) FFAR1HIF1ATAAR1TDP1KCNH2
SCHEMBL2865943 0.85 ALOX5 (0.44) ESR1ESR2L3MBTL1
SCHEMBL2867556 0.81 MAOB (0.41) FFAR1HIF1ATDP1CNR2
SCHEMBL208903 0.78 TDP1 (0.52) TAAR1TDP1KCNH2
SCHEMBL30250264 0.78 HSD11B1 (0.41) HSD11B1TP53
SCHEMBL6532094 0.76 TDP1 (0.50) TAAR1TDP1KCNH2
SCHEMBL5483434 0.76 FFAR1 (0.46) FFAR1HIF1ATAAR1KCNH2HSD11B1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7749921-B2 Semiconductor element, method for manufacturing the semiconductor element, electronic device and method for manufacturing the electronic device PANASONIC CORPORATION (JP) 2010-07-06 US disclosed
US-20090194763-A1 SEMICONDUCTOR ELEMENT, METHOD FOR MANUFACTURING THE SEMICONDUCTOR ELEMENT, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE PANASONIC CORPORATION (JP) 2009-08-06 US disclosed