SCHEMBL36166

SCHEMBL36166

CS(OS(=O)(=O)C(F)(F)F)(c1ccccc1)c1ccccc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTR6 P50406 2/20 0.39
PSIP1 O75475 1/20 0.39
HSD11B1 P28845 2/20 0.39
APOBEC3G Q9HC16 1/20 0.38
PTGS2 P35354 2/20 0.37
CA2 P00918 3/20 0.37
ALDH1A1 P00352 2/20 0.37
CA1 P00915 2/20 0.37
CA5A P35218 2/20 0.37
CA9 Q16790 2/20 0.37
HSD17B10 Q99714 2/20 0.37
TDP1 Q9NUW8 1/20 0.37
CA12 O43570 1/20 0.37
CA3 P07451 1/20 0.37
CA4 P22748 1/20 0.37
CA6 P23280 1/20 0.37
CA7 P43166 1/20 0.37
PLA2G7 Q13093 1/20 0.37
CA13 Q8N1Q1 1/20 0.37
CA14 Q9ULX7 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL36458 0.84 HTR6 (0.39) HTR6PSIP1HSD11B1APOBEC3GCA2
SCHEMBL2024663 0.84 CA1 (0.38) HTR6PSIP1HSD11B1APOBEC3GPTGS2
SCHEMBL270030 0.83 CA1 (0.41) HSD11B1CA2CA1HSD17B10MEN1
SCHEMBL8847449 0.79 HTR6 (0.42) HTR6PSIP1HSD11B1APOBEC3GCA2
SCHEMBL37033 0.79 HTR6 (0.42) HTR6PSIP1HSD11B1APOBEC3GCA2
SCHEMBL444803 0.78 PTGS2 (0.44) HSD11B1PTGS2
SCHEMBL5410134 0.77 PSIP1 (0.45) HTR6PSIP1HSD11B1APOBEC3GCA2
SCHEMBL3136958 0.74 HTT (0.45) HSD11B1CA2ALDH1A1CA1CA5A
SCHEMBL36148 0.74 HTT (0.45) HSD11B1CA2ALDH1A1CA1CA5A
SCHEMBL387181 0.72 HSD11B1 (0.50) HSD11B1CA2ALDH1A1CA1NR1H3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 451 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4714988-A1 FLUORINE-CONTAINING POLYMER, COMPOSITION FOR FORMING FLUORINE-CONTAINING RESIN FILM, FLUORINE-CONTAINING RESIN FILM, COMPOSITION FOR FORMING RESIST PATTERN, METHOD FOR FORMING RESIST PATTERN, COMPOSITION FOR FORMING RESIST UPPER LAYER FILM, METHOD FOR DECOMPOSING FLUORINE-CONTAINING POLYMER, FLUORINE-CONTAINING POLYMERIZABLE MONOMER, COMPOUND, AND METHOD FOR PRODUCING FLUORINE-CONTAINING POLYMERIZABLE MONOMER Central Glass Company, Limited (JP) 2026-03-25 EP disclosed
EP-4714990-A1 COPOLYMER, POLYMER FOR WATER-REPELLENT AGENT, COMPOSITION FOR FORMING WATER-REPELLENT FILM, RESIN FILM, AND METHOD FOR FORMING RESIST PATTERN Central Glass Company, Limited (JP) 2026-03-25 EP disclosed
WO-2024248136-A1 COPOLYMER, POLYMER FOR WATER-REPELLENT AGENT, COMPOSITION FOR FORMING WATER-REPELLENT FILM, RESIN FILM, AND METHOD FOR FORMING RESIST PATTERN セントラル硝子株式会社 2024-12-05 WO disclosed
WO-2024248135-A1 FLUORINE-CONTAINING POLYMER, COMPOSITION FOR FORMING FLUORINE-CONTAINING RESIN FILM, FLUORINE-CONTAINING RESIN FILM, COMPOSITION FOR FORMING RESIST PATTERN, METHOD FOR FORMING RESIST PATTERN, COMPOSITION FOR FORMING RESIST UPPER LAYER FILM, METHOD FOR DECOMPOSING FLUORINE-CONTAINING POLYMER, FLUORINE-CONTAINING POLYMERIZABLE MONOMER, COMPOUND, AND METHOD FOR PRODUCING FLUORINE-CONTAINING POLYMERIZABLE MONOMER セントラル硝子株式会社 2024-12-05 WO disclosed
EP-2584409-B1 RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, POLYMERIC COMPOUND, AND COMPOUND TOKYO OHKA KOGYO CO LTD (JP) 2021-04-28 EP disclosed
EP-2060600-B1 Resist composition, method of forming resist pattern, novel compound, and acid generator TOKYO OHKA KOGYO CO LTD (JP) 2017-12-27 EP disclosed
EP-2093213-B1 Positive resist composition and method of forming a resist pattern using the same TOKYO OHKA KOGYO CO LTD (JP) 2017-10-04 EP disclosed
US-9618843-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2017-04-11 US disclosed
US-9618842-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2017-04-11 US disclosed
US-9494860-B2 Resist composition, method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2016-11-15 US disclosed
US-20070065748-A1 Resin for photoresist composition, photoresist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2007-03-22 US disclosed
US-7172848-B2 Chemical amplification type positive resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2007-02-06 US disclosed
EP-1736485-A1 POLYMER COMPOUND, PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER COMPOUND, AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2006-12-27 EP disclosed
US-20060194140-A1 Chemical amplification type positive resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2006-08-31 US disclosed
US-20060183876-A1 Resin for resist positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO, C., LTD. (JP) 2006-08-17 US disclosed
EP-1655315-A1 RESIN FOR RESIST, POSITIVE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2006-05-10 EP disclosed
EP-1602977-A1 Positive resist composition and compound used therein TOKYO OHKA KOGYO CO., LTD. (JP) 2005-12-07 EP disclosed
US-20050266340-A1 Positive resist composition and compound used therein TOKYO OHKA KOGYO CO., LTD. (JP) 2005-12-01 US disclosed
US-20050227172-A1 Process for producing photoresist composition, filtration device, application device, and photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2005-10-13 US disclosed
US-20050042540-A1 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. 2005-02-24 US disclosed