SCHEMBL445609

SCHEMBL445609

CCC(CC)OOC(C)=O

nearest known ligand 0.38

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.38
LMNA P02545 1/20 0.38
HSD17B10 Q99714 1/20 0.38
TSHR P16473 3/20 0.32
TDP1 Q9NUW8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL443489 0.86 PRKCA (0.38) ALDH1A1LMNAHSD17B10TSHRTDP1
SCHEMBL445105 0.83 CA2 (0.41) ALDH1A1TSHRTDP1
SCHEMBL445367 0.80 HDAC1 (0.37) ALDH1A1LMNAHSD17B10TSHRTDP1
SCHEMBL19385447 0.79 PRKCA (0.34) ALDH1A1LMNAHSD17B10TSHR
SCHEMBL28331115 0.77 ALDH1A1 (0.35) ALDH1A1TDP1
SCHEMBL446240 0.77
SCHEMBL445107 0.73 CTSK (0.40) ALDH1A1TSHRTDP1
SCHEMBL29255803 0.73 ALDH1A1 (0.48) ALDH1A1LMNATSHRTDP1
Alcohol SCHEMBL7530022 0.73 TSHR (0.34) ALDH1A1LMNAHSD17B10TSHR
SCHEMBL1584634 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10916437-B2 Methods of forming micropatterns and substrate processing apparatus SAMSUNG ELECTRONICS CO., LTD. (KR) 2021-02-09 US disclosed
US-20190198342-A1 Methods of Forming Micropatterns and Substrate Processing Apparatus SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-06-27 US disclosed
US-10134606-B2 Method of forming patterns and method of manufacturing integrated circuit device using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-11-20 US disclosed
US-9773672-B2 Method of forming micropatterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-09-26 US disclosed
US-20160233083-A1 METHOD OF FORMING MICROPATTERNS SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-08-11 US disclosed
US-20150340246-A1 METHOD OF FORMING PATTERNS AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-11-26 US disclosed
US-8986554-B2 Method of forming patterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-03-24 US disclosed
US-20130295772-A1 METHOD OF FORMING PATTERNS SAMSUNG ELECTRONICS CO., LTD. (KR) 2013-11-07 US disclosed
US-20120064463-A1 Method of Forming Micropatterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-03-15 US disclosed