SCHEMBL503330

SCHEMBL503330

O=S(=O)(OS(c1ccc(F)cc1)(c1ccc(F)cc1)c1ccc(F)cc1)C(F)(F)F

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 1/20 0.42
SOS1 Q07889 1/20 0.40
CA2 P00918 3/20 0.39
MMP2 P08253 2/20 0.39
CA1 P00915 2/20 0.39
MMP1 P03956 1/20 0.39
MMP9 P14780 1/20 0.39
MMP8 P22894 1/20 0.39
MMP13 P45452 1/20 0.39
PKM P14618 2/20 0.38
ALDH1A1 P00352 2/20 0.37
ABCC9 O60706 1/20 0.36
ABCC8 Q09428 1/20 0.36
KCNJ11 Q14654 1/20 0.36
KCNJ8 Q15842 1/20 0.36
F2 P00734 2/20 0.36
PRSS1 P07477 2/20 0.36
PRSS2 P07478 2/20 0.36
PRSS3 P35030 2/20 0.36
FFAR1 O14842 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL503373 0.94 PKM (0.46) HSD11B1PKMALDH1A1FFAR1FFAR4
SCHEMBL3130157 0.94 PKM (0.46) HSD11B1PKMALDH1A1FFAR1FFAR4
SCHEMBL9135546 0.91 ACHE (0.46) HSD11B1ALDH1A1FFAR4MEN1KMT2A
SCHEMBL4848809 0.88 PKM (0.46) HSD11B1SOS1CA2MMP2CA1
SCHEMBL37033 0.83 HTR6 (0.42) HSD11B1CA2MMP2CA1MMP1
SCHEMBL562440 0.82 ALDH1A1 (0.45) HSD11B1CA2MMP2CA1MMP1
SCHEMBL36225 0.82 GAA (0.45) CA2MMP2CA1MMP1MMP9
SCHEMBL3146242 0.82 LMNA (0.43) HSD11B1CA2CA1PKMFFAR4
SCHEMBL1803692 0.82 KIF11 (0.47) HSD11B1CA2CA1MMP1ALDH1A1
SCHEMBL1802639 0.80 CA1 (0.46) HSD11B1SOS1CA2MMP2CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 178 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026100410-A1 IODINE-CONTAINING POLYMERIZABLE COMPOUND AND IODINE-CONTAINING POLYMER 三菱瓦斯化学株式会社 2026-05-15 WO disclosed
US-20250321485-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-10-16 US disclosed
WO-2024014329-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2024-01-18 WO disclosed
WO-2024014330-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2024-01-18 WO disclosed
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-26 US disclosed
US-20230096312-A1 RESIST COMPOSITION AND METHOD FOR USING RESIST COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-03-30 US disclosed
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-02-07 US disclosed
WO-2023008355-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAID COMPOSITION 三菱瓦斯化学株式会社 2023-02-02 WO disclosed
WO-2023008354-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2023-02-02 WO disclosed
US-11480877-B2 Resist composition, method for forming resist pattern, and polyphenol compound used therein MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-10-25 US disclosed
US-20060188812-A1 Phenolic hydroxyl group-containing copolymer and radiation-sensitive resin composition JSR CORPORATION (JP) 2006-08-24 US disclosed
EP-1686424-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2006-08-02 EP disclosed
US-20060166138-A1 Radiation-sensitive resin composition JSR CORPORATION 2006-07-27 US disclosed
EP-1666970-A1 COMPOUND FOR RESIST AND RADIATION-SENSITIVE COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2006-06-07 EP disclosed
US-20060078821-A1 A caroboxyalkylanthracene based compound, a hydroxy or alkoxystyrene polymer, and a sulfonimide compound as photoacid generator; low sublimation properties and excellent compatibility with other components; exhibits optimum controllability of radiation transmittance; microfabrication JSR CORPORATION (JP) 2006-04-13 US disclosed
EP-1640804-A2 Positive-tone radiation-sensitive resin composition JSR Corporation (JP) 2006-03-29 EP disclosed
US-20050053861-A1 Onium salt compound and radiation-sensitive resin composition JSR CORPORATION (JP) 2005-03-10 US disclosed
US-20040191672-A1 Resist composition MITSUBISHI GAS CHEMICAL CO., LTD. (JP) 2004-09-30 US disclosed
EP-1443362-A2 Resist composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2004-08-04 EP disclosed
US-20030022095-A1 Negative type radiation sensitive resin composition JSR CORPORATION (JP) 2003-01-30 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11480877-B2 Resist composition, method for forming resist pattern, and polyphenol compound used therein SLC11A2, ABCC1, FBL HSD11B1 1689/4885SOS1 3877/4885CA2 3898/4885
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin SLC39A11, CROCC, TERB1 HSD11B1 2144/4885SOS1 535/4885CA2 3332/4885
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R HSD11B1 2424/4885SOS1 2631/4885CA2 1466/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.