SCHEMBL565103

SCHEMBL565103

Nc1c(O)cccc1S(=O)(=O)c1cccc(O)c1N

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CDK2 P24941 2/20 0.50
GAA P10253 2/20 0.48
G6PD P11413 1/20 0.47
CASP7 P55210 1/20 0.47
CASP6 P55212 1/20 0.47
TDP1 Q9NUW8 3/20 0.44
MCL1 Q07820 2/20 0.44
L3MBTL1 Q9Y468 2/20 0.44
ALPL P05186 1/20 0.44
ALPI P09923 1/20 0.44
ALPG P10696 1/20 0.44
DNMT1 P26358 1/20 0.44
STAT3 P40763 1/20 0.44
AURKA O14965 1/20 0.42
AURKB Q96GD4 1/20 0.42
CA1 P00915 5/20 0.41
CA2 P00918 5/20 0.41
CA9 Q16790 3/20 0.41
CA6 P23280 3/20 0.41
CA12 O43570 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29545862 1.00 CDK2 (0.50) CDK2GAAG6PDCASP7CASP6
SCHEMBL635927 0.86 CDK2 (0.61) CDK2G6PDCASP7CASP6STAT3
SCHEMBL564663 0.86 HTR6 (0.58) CDK2GAAG6PDCASP7CASP6
SCHEMBL3030721 0.84 AURKA (0.53) CDK2GAAG6PDCASP7CASP6
SCHEMBL15009597 0.83 TTR (0.51) CDK2GAATDP1MCL1L3MBTL1
SCHEMBL9359459 0.83 CDK2 (0.47) CDK2GAAG6PDCASP7CASP6
SCHEMBL29204880 0.82 GAA (0.48) GAAL3MBTL1CA1CA2CA9
SCHEMBL4458549 0.79 CDK2 (0.44) CDK2GAAG6PDCASP7CASP6
SCHEMBL10429481 0.78 ALDH1A1 (0.45) CDK2G6PDCASP7CASP6MCL1
SCHEMBL11442294 0.78 CA2 (0.50) GAACA1CA2CA9CA6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20140316074-A1 POLYAMIC ACID POLYMER COMPOSITE AND PREPARATION METHOD THEREOF LG CHEM, LTD. (KR) 2014-10-23 US claimed
CN-116096781-A Polycarbonate and process for producing the same 株式会社LG化学 2023-05-09 CN disclosed
EP-3919549-A1 COMPOSITION AND METAL-INSULATING COATING MATERIAL Mitsubishi Chemical Corporation (JP) 2021-12-08 EP disclosed
US-20210324144-A1 COMPOSITION AND METAL INSULATING COVER MATERIAL MITSUBISHI CHEMICAL CORPORATION (JP) 2021-10-21 US disclosed
US-20210122724-A1 TETRACARBOXYLIC DIANHYDRIDE, CARBONYL COMPOUND, POLYIMIDE PRECURSOR RESIN, AND POLYIMIDE ENEOS CORPORATION (JP) 2021-04-29 US disclosed
US-10947353-B2 Resin composition MITSUBISHI CHEMICAL CORPORATION (JP) 2021-03-16 US disclosed
US-20200325100-A1 SUBSTITUTED OR UNSUBSTITUTED ALLYL GROUP-CONTAINING MALEIMIDE COMPOUND, PRODUCTION METHOD THEREFOR, AND COMPOSITION AND CURED PRODUCT USING SAID COMPOUND DIC CORPORATION (JP) 2020-10-15 US disclosed
US-10669377-B2 Polyimide solution, heat-resistant non-woven fabric, and method for manufacturing same TORAY INDUSTRIES, INC. (JP) 2020-06-02 US disclosed
US-20200109276-A1 COMPOSITION, CURED PRODUCT AND LAMINATE DIC CORPORATION (JP) 2020-04-09 US disclosed
EP-3560968-A1 COMPOSITION, CURED PRODUCT AND LAMINATE DIC Corporation (JP) 2019-10-30 EP disclosed
EP-1333077-A1 VARNISH CONTAINING POLYAMIDE RESIN AND USE THEREOF Nippon Kayaku Kabushiki Kaisha (JP) 2003-08-06 EP disclosed
US-20030091842-A1 Cover-lay film and printed circuit board having the same UBE INDUSTRIES, LTD. (JP) 2003-05-15 US disclosed
EP-1300444-A1 EPOXY RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM Nippon Kayaku Kabushiki Kaisha (JP) 2003-04-09 EP disclosed
US-6372859-B1 MAKING A PASTE BY MIXING A SOLUTION OF HEAT-RESISTANT RESIN A IN A SOLVENT, FINE PARTICLES OF RESIN B INSOLUBLE IN THE SOLVENT BUT SOLUBLE UPON HEATING; HEATING TO DISSOLVE; COOLING TO DEPOSIT OR DISPERSE THE PARTICLES; CURING HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-04-16 US disclosed
EP-1112311-A1 CURABLE PERFLUOROELASTOMER COMPOSITION DUPONT DOW ELASTOMERS L.L.C. (US) 2001-07-04 EP disclosed
EP-0984051-A1 HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-03-08 EP disclosed
WO-2000009603-A1 CURABLE PERFLUOROELASTOMER COMPOSITION DUPONT DOW ELASTOMERS L.L.C. (US) 2000-02-24 WO disclosed
EP-0612311-A1 SALTS OF POLYBENZAZOLE MONOMERS AND THEIR USE THE DOW CHEMICAL COMPANY (US) 1994-08-31 EP disclosed
US-5276128-A Polybenzoxazoles or polybenzthiazoles as dopes for fibers or films THE DOW CHEMICAL COMPANY (US) 1994-01-04 US disclosed
WO-1993008156-A1 SALTS OF POLYBENZAZOLE MONOMERS AND THEIR USE THE DOW CHEMICAL COMPANY (US) 1993-04-29 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20210122724-A1 TETRACARBOXYLIC DIANHYDRIDE, CARBONYL COMPOUND, POLYIMIDE PRECURSOR RESIN, AND POLYIMIDE EXOSC4, RIN1, EXOSC5 CDK2 1429/4885GAA 2537/4885G6PD 1862/4885
US-20200325100-A1 SUBSTITUTED OR UNSUBSTITUTED ALLYL GROUP-CONTAINING MALEIMIDE COMPOUND, PRODUCTION METHOD THEREFOR, AND COMPOSITION AND CURED PRODUCT USING SAID COMPOUND WASF2, FAR1, NOTUM CDK2 1269/4885GAA 4230/4885G6PD 2577/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.