SCHEMBL6748003

SCHEMBL6748003

CC(OC#N)c1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
TRPA1 O75762 1/20 0.41
TSHR P16473 1/20 0.41
ADRA2A P08913 2/20 0.40
ADRA2C P18825 2/20 0.40
KDM4E B2RXH2 2/20 0.40
THRB P10828 1/20 0.40
LMNA P02545 1/20 0.40
HIF1A Q16665 1/20 0.40
HCAR2 Q8TDS4 1/20 0.39
ALDH1A1 P00352 2/20 0.39
MIF P14174 2/20 0.38
ADRA2B P18089 1/20 0.37
TAAR1 Q96RJ0 2/20 0.37
MAPT P10636 1/20 0.36
HSD17B10 Q99714 1/20 0.36
PBRM1 Q86U86 1/20 0.36
ALOX5 P09917 1/20 0.36
CYP2D6 P10635 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4400588 1.00 TRPA1 (0.41) TRPA1TSHRADRA2AADRA2CKDM4E
SCHEMBL12157425 1.00 TRPA1 (0.41) TRPA1TSHRADRA2AADRA2CKDM4E
SCHEMBL20437579 0.84 ADRB1 (0.33) TRPA1TSHRADRA2AADRA2CKDM4E
SCHEMBL8762226 0.81 GABRA1 (0.36) TRPA1TSHRKDM4ETHRBLMNA
SCHEMBL7644979 0.79 ADRA2A (0.41) ADRA2AADRA2CKDM4ETHRBLMNA
SCHEMBL734869 0.78 ALOX5 (0.38) KDM4EALDH1A1ALOX5
SCHEMBL15689666 0.78 IDO1 (0.39) LMNAALDH1A1
SCHEMBL8763614 0.78 TRPA1 (0.39) TRPA1TSHRADRA2AADRA2CKDM4E
SCHEMBL96935 0.77 HCAR2 (0.43) ADRA2AADRA2CKDM4ETHRBLMNA
SCHEMBL16970750 0.77 HCAR2 (0.43) ADRA2AADRA2CKDM4ETHRBLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 192 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3438146-B1 CYANIC ACID ESTER COMPOUND AND METHOD FOR PRODUCING SAME, RESIN COMPOSITION, CURED ARTICLE, PREPREG, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE AGENT, METAL FOIL-CLAD LAMINATE PLATE, RESIN SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL CO (JP) 2026-04-08 EP disclosed
US-12486371-B2 Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2025-12-02 US disclosed
EP-3805293-B1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL CO (JP) 2025-09-17 EP disclosed
US-12312323-B2 Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-05-27 US disclosed
CN-115003716-B Resin composition, resin sheet, prepreg, and printed wiring board 三菱瓦斯化学株式会社 2025-04-11 CN disclosed
US-20250109222-A1 CYCLIC ORGANOSILOXANE CONTAINING IMIDE BOND AND POLYMERIZABLE UNSATURATED BOND, AND CURABLE RESIN COMPOSITION COMPRISING SAID CYCLIC ORGANOSILOXANE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-04-03 US disclosed
CN-117355545-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-10-18 CN disclosed
EP-4438655-A1 CYCLIC ORGANOSILOXANE CONTAINING IMIDE BOND AND POLYMERIZABLE UNSATURATED BOND, AND CURABLE RESIN COMPOSITION COMPRISING SAID CYCLIC ORGANOSILOXANE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-10-02 EP disclosed
US-12091542-B2 Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-09-17 US disclosed
WO-2024162321-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2024-08-08 WO disclosed
EP-3061745-A1 CYANIC ACID ESTER COMPOUND, CURABLE RESIN COMPOSITION CONTAINING SAID COMPOUND, AND CURED PRODUCT THEREOF Mitsubishi Gas Chemical Company, Inc. (JP) 2016-08-31 EP disclosed
US-20160237246-A1 RESIN COMPOSITION, PREPREG, LAMINATED SHEET, AND METAL-FOIL-CLAD LAMINATED BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-08-18 US disclosed
US-20160125972-A1 RESIN COMPOSITION, PREPREG, RESIN SHEET AND METAL FOIL-CLAD LAMINATE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-05-05 US disclosed
US-20160115271-A1 CYANATE ESTER COMPOUND, CURABLE RESIN COMPOSITION CONTAINING SAID COMPOUND, AND CURED PRODUCT OF SAID COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-04-28 US disclosed
EP-3012276-A1 CYANATE ESTER COMPOUND, CURABLE RESIN COMPOSITION CONTAINING SAID COMPOUND, AND CURED PRODUCT OF SAID COMPOSITION Mitsubishi Gas Chemical Company, Inc. (JP) 2016-04-27 EP disclosed
EP-3012294-A1 RESIN COMPOSITION, PREPREG, RESIN SHEET AND METAL FOIL-CLAD LAMINATE Mitsubishi Gas Chemical Company, Inc. (JP) 2016-04-27 EP disclosed
US-20150299110-A1 METHOD FOR PRODUCING CYANOGEN-HALIDE, CYANATE ESTER COMPOUND AND METHOD FOR PRODUCING THE SAME, AND RESIN COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-10-22 US disclosed
EP-2913302-A1 CYANOGEN-HALIDE PRODUCTION METHOD, CYANATE ESTER COMPOUND AND PRODUCTION METHOD THEREFOR, AND RESIN COMPOSITION Mitsubishi Gas Chemical Company, Inc. (JP) 2015-09-02 EP disclosed
WO-2014028338-A1 LIQUID COMPRESSION MOLDING ENCAPSULANTS HENKEL CORPORATION (US) 2014-02-20 WO disclosed
WO-2004037878-A2 CO-CURABLE COMPOSITIONS HENKEL CORPORATION (US) 2004-05-06 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20150299110-A1 METHOD FOR PRODUCING CYANOGEN-HALIDE, CYANATE ESTER COMPOUND AND METHOD FOR PRODUCING THE SAME, AND RESIN COMPOSITION MB, CBR3, CRYAA TRPA1 4164/4885TSHR 2347/4885ADRA2A 3461/4885
US-20250109222-A1 CYCLIC ORGANOSILOXANE CONTAINING IMIDE BOND AND POLYMERIZABLE UNSATURATED BOND, AND CURABLE RESIN COMPOSITION COMPRISING SAID CYCLIC ORGANOSILOXANE ZYX, MUS81, H1-0 TRPA1 1189/4885TSHR 3854/4885ADRA2A 3837/4885
US-12312323-B2 Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device ASH2L, RER1, SEM1 TRPA1 2640/4885TSHR 3751/4885ADRA2A 2446/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.