SCHEMBL704111

SCHEMBL704111

CCc1cccc([SiH2]OC(C)(C)C)c1CC

nearest known ligand 0.39

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 4/20 0.39
GABRB2 P47870 4/20 0.39
TAAR1 Q96RJ0 2/20 0.34
HTR1A P08908 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL706208 0.84 GABRA1 (0.39) GABRA1GABRB2
SCHEMBL704058 0.80 LTB4R (0.30)
SCHEMBL707831 0.78 PTGS2 (0.35)
SCHEMBL707296 0.76 GABRA1 (0.35) GABRA1GABRB2TAAR1HTR1A
SCHEMBL705144 0.75 GABRA1 (0.38) GABRA1GABRB2TAAR1HTR1A
SCHEMBL706449 0.72 GABRA1 (0.46) GABRA1GABRB2TAAR1HTR1A
SCHEMBL703208 0.72 GABRA1 (0.41) GABRA1GABRB2TAAR1HTR1A
SCHEMBL21383327 0.72 GABRA1 (0.41) GABRA1GABRB2TAAR1HTR1A
SCHEMBL9745359 0.72 GABRA1 (0.46) GABRA1GABRB2TAAR1HTR1A
SCHEMBL704995 0.72 GABRA1 (0.41) GABRA1GABRB2TAAR1HTR1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed