SCHEMBL75422

SCHEMBL75422

C=C(C)C(=O)OC1CCC2CC1OC2=O

nearest known ligand 0.35

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
GPX4 P36969 1/20 0.35
KDM4E B2RXH2 1/20 0.34
NPC1 O15118 1/20 0.34
POLB P06746 1/20 0.34
MAPT P10636 1/20 0.34
PKM P14618 1/20 0.34
HTT P42858 1/20 0.34
RECQL P46063 1/20 0.34
RAB9A P51151 1/20 0.34
ATM Q13315 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
ALDH1A1 P00352 1/20 0.31
OPRM1 P35372 1/20 0.31
OPRD1 P41143 1/20 0.31
OPRK1 P41145 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19062654 1.00 GPX4 (0.35) GPX4KDM4ENPC1POLBMAPT
SCHEMBL25617837 1.00 GPX4 (0.35) GPX4KDM4ENPC1POLBMAPT
SCHEMBL1141699 0.88 GPX4 (0.35) GPX4KDM4ENPC1POLBMAPT
SCHEMBL685870 0.86 ALDH1A1 (0.35) ALDH1A1
SCHEMBL12840775 0.85 ALDH1A1 (0.33) GPX4ALDH1A1
SCHEMBL10027352 0.85 KDM4E (0.30) KDM4ENPC1POLBMAPTPKM
SCHEMBL12140426 0.85
SCHEMBL18793138 0.85
SCHEMBL10061832 0.84 CHRM2 (0.37)
SCHEMBL1697128 0.84 ALDH1A1 (0.33) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 909 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230174471-A1 ACETAL-BASED COMPOUND, ACETAL-BASED PREPOLYMER, ACETAL-BASED POLYMER, AND PHOTORESIST COMPOSITION COMPRISING THE SAME INHA INDUSTRY PARTNERSHIP INSTITUTE (KR) 2023-06-08 US disclosed
US-10377692-B2 Photoresist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2019-08-13 US disclosed
US-10222696-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-03-05 US disclosed
US-10012903-B2 Resist composition and pattern forming process SHIN-ESTU CHEMICAL CO., LTD. (JP) 2018-07-03 US disclosed
US-10012903-B2 Resist composition and pattern forming process SHIN-ESTU CHEMICAL CO., LTD. (JP) 2018-07-03 US disclosed
US-10007178-B2 Positive resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-06-26 US disclosed
US-10007178-B2 Positive resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-06-26 US disclosed
US-10005868-B2 Resist composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-06-26 US disclosed
US-20180134860-A1 STRETCHABLE FILM, METHOD FOR FORMING THE SAME, STRETCHABLE WIRING FILM, AND METHOD FOR MANUFACTURING THE SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-05-17 US disclosed
US-20180134860-A1 STRETCHABLE FILM, METHOD FOR FORMING THE SAME, STRETCHABLE WIRING FILM, AND METHOD FOR MANUFACTURING THE SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-05-17 US disclosed
US-7189493-B2 Polymer, positive resist composition, and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-03-13 US disclosed
EP-1752479-A1 ACRYLIC STAR POLYMER NIPPON SODA CO., LTD. (JP) 2007-02-14 EP disclosed
US-7144675-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2006-12-05 US disclosed
US-20060160247-A1 Unsaturated carboxylic acid hemicacetal ester, polymeric compound and photoresist resin composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2006-07-20 US disclosed
EP-1676869-A1 PHOTORESIST RESIN AND PHOTORESIST RESIN COMPOSITION Daicel Chemical Industries, Ltd. (JP) 2006-07-05 EP disclosed
US-7033726-B2 Photoresist polymeric compound and photoresist resin composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2006-04-25 US disclosed
US-20050238990-A1 Photoresist resin and photoresist resin composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-10-27 US disclosed
EP-1584634-A1 POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST Daicel Chemical Industries, Ltd. (JP) 2005-10-12 EP disclosed
US-20050014087-A1 Photoresist polymeric compound and photoresist resin composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-01-20 US disclosed
US-20040048192-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2004-03-11 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20060160247-A1 Unsaturated carboxylic acid hemicacetal ester, polymeric compound and photoresist resin composition HCAR1, HCAR2, RARA GPX4 1035/4885KDM4E 3157/4885NPC1 4727/4885
US-20230174471-A1 ACETAL-BASED COMPOUND, ACETAL-BASED PREPOLYMER, ACETAL-BASED POLYMER, AND PHOTORESIST COMPOSITION COMPRISING THE SAME PARP10, ADCY10, APRT GPX4 3266/4885KDM4E 2385/4885NPC1 4408/4885
US-10377692-B2 Photoresist composition C1R, C1S, F12 GPX4 3785/4885KDM4E 4299/4885NPC1 3833/4885
US-10222696-B2 Resist composition and patterning process SLC11A2, GRN, PGF GPX4 2314/4885KDM4E 1896/4885NPC1 4647/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.