Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.54 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.54 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.54 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.54 |
| ▸ | AGER | Q15109 | 1/20 | 0.52 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.50 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.49 |
| ▸ | HPGD | P15428 | 2/20 | 0.48 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.48 |
| ▸ | MAPT | P10636 | 2/20 | 0.47 |
| ▸ | LMNA | P02545 | 5/20 | 0.47 |
| ▸ | TSHR | P16473 | 2/20 | 0.47 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.47 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.47 |
| ▸ | RECQL | P46063 | 1/20 | 0.47 |
| ▸ | MEN1 | O00255 | 2/20 | 0.45 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.45 |
| ▸ | RAB9A | P51151 | 1/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.44 |
| ▸ | HTT | P42858 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Quinoline SCHEMBL28779802 | 0.90 | AGER (0.49) | CYP1A2CYP3A4CYP2C9CYP2C19AGER | |
| SCHEMBL6377520 | 0.86 | CYP1A2 (0.56) | CYP1A2CYP3A4CYP2C9CYP2C19AGER | |
| SCHEMBL28429464 | 0.80 | MEN1 (0.55) | CYP1A2CYP3A4CYP2C9CYP2C19AGER | |
| SCHEMBL258791 | 0.74 | MEN1 (0.76) | CYP1A2CYP3A4CYP2C9CYP2C19AGER | |
| Ethane SCHEMBL27196683 | 0.73 | CYP1A2 (0.56) | CYP1A2CYP3A4CYP2C9CYP2C19AGER | |
| SCHEMBL18821302 | 0.73 | CYP1A2 (0.74) | CYP1A2CYP3A4CYP2C9CYP2C19L3MBTL1 | |
| SCHEMBL18821160 | 0.71 | CYP1A2 (0.76) | CYP1A2CYP3A4CYP2C9CYP2C19L3MBTL1 | |
| SCHEMBL18797641 | 0.70 | CYP1A2 (1.00) | CYP1A2CYP3A4CYP2C9CYP2C19L3MBTL1 | |
| SCHEMBL28619302 | 0.70 | MEN1 (0.56) | CYP1A2CYP3A4CYP2C9CYP2C19AGER | |
| SCHEMBL166337 | 0.69 | LMNA (0.64) | CYP1A2CYP3A4CYP2C9CYP2C19L3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 303 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117612857-A | Forming method of composite magnetic material | 江西中石新材料有限公司 | 2024-02-27 | — | — | CN | claimed |
| CN-117612856-A | Anisotropic magnetic material forming method | 江西中石新材料有限公司 | 2024-02-27 | — | — | CN | claimed |
| EP-3713984-B1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2023-11-01 | — | — | EP | claimed |
| US-20220306908-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2022-09-29 | — | — | US | claimed |
| US-20220275252-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2022-09-01 | — | — | US | claimed |
| CN-112852371-A | Small-spacing epoxy plastic packaging material applied to outdoor display screen and preparation method thereof | 天津德高化成新材料股份有限公司 | 2021-05-28 | — | — | CN | claimed |
| WO-2021032727-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2021-02-25 | — | — | WO | claimed |
| WO-2021032822-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2021-02-25 | — | — | WO | claimed |
| CN-108587400-B | Bi-component insulating paint for magnetic ring | 江门市新会区新日旭电子材料有限公司 | 2020-12-08 | — | — | CN | claimed |
| EP-3713984-A1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2020-09-30 | — | — | EP | claimed |
| WO-2019101914-A1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2019-05-31 | — | — | WO | claimed |
| US-8063161-B2 | Low temperature curing acrylate and maleimide based formulations and methods for use thereof | DESIGNER MOLECULES, INC. (US) | 2011-11-22 | — | — | US | claimed |
| CN-1957012-B | Hardener for epoxy resin and epoxy resin composition | ASAHI KASEI E MATERIALS CORP (JP) | 2011-07-20 | — | — | CN | claimed |
| US-20100063184-A1 | LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2010-03-11 | — | — | US | claimed |
| WO-2008130894-A1 | LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2008-10-30 | — | — | WO | claimed |
| US-6358354-B1 | UV and thermally curable adhesive formulation | LEXMARK INTERNATIONAL, INC. | 2002-03-19 | — | — | US | claimed |
| US-5439977-A | Comprising a liquid epoxide compound, anhydride, secondary amine and imidazole-epoxide compound adduct having latent solubility upon heating; storage stability; workability; seals; electrical apparatus | AJINOMOTO CO., INC. (JP) | 1995-08-08 | — | — | US | claimed |
| US-4546155-A | ADDUCT OF EPOXY COMPOUND, TERTIARY AMINE COMPOUND, AND CARBOXYLIC ACID ANHYDRIDE | AJINOMOTO CO., INC. (JP) | 1985-10-08 | — | — | US | claimed |
| US-4542202-A | EPOXY COMPOUND WITH A HYDROXY, MERCAPTO, OR HYDRAZIDE MODIFIED TERTIARY AMINE | AJINOMOTO CO., INC. (JP) | 1985-09-17 | — | — | US | claimed |
| EP-4748870-A1 | EPOXY RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| EP-4748869-A1 | EPOXY RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED ARTICLE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| EP-4746003-A1 | COMPOUND, VARNISH, BOND MAGNET, AND MOTOR | Asahi Kasei Kabushiki Kaisha (JP) | 2026-05-20 | — | — | EP | disclosed |
| WO-2026100231-A1 | CURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2026-05-15 | — | — | WO | disclosed |
| EP-4692055-A1 | THIOL COMPOUND | AJINOMOTO CO., INC. (JP) | 2026-02-11 | — | — | EP | disclosed |
| US-20260008904-A1 | THIOL COMPOUND | AJINOMOTO CO., INC. (JP) | 2026-01-08 | — | — | US | disclosed |
| US-20250382263-A1 | THIOL COMPOUND | AJINOMOTO CO., INC. (JP) | 2025-12-18 | — | — | US | disclosed |
| US-20250382514-A1 | CURABLE ADHESIVE COMPOSITION COMPRISING MALEIMIDE AND THIOL | HENKEL AG & CO KGAA (DE) | 2025-12-18 | — | — | US | disclosed |
| US-20250289782-A1 | THIOL COMPOUND AND USES THEREOF | SHIKOKU CHEMICALS CORPORATION (JP) | 2025-09-18 | — | — | US | disclosed |
| EP-4608891-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2025-09-03 | — | — | EP | disclosed |
| EP-4609432-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT AND SEMICONDUCTOR DEVICE | Namics Corporation (JP) | 2025-09-03 | — | — | EP | disclosed |
| WO-2025126839-A1 | RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2025-06-19 | — | — | WO | disclosed |
| WO-2025121227-A1 | CURABLE COMPOSITION, CURED PRODUCT, ADHESIVE, AND SEALANT | 四国化成工業株式会社 | 2025-06-12 | — | — | WO | disclosed |
| CN-113444340-B | Resin composition | 味之素株式会社 | 2025-06-10 | — | — | CN | disclosed |
| WO-2025100081-A1 | COMPOSITION, EPOXY RESIN COMPOSITION, FILM, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE | 旭化成株式会社 | 2025-05-15 | — | — | WO | disclosed |
| CN-119998352-A | Epoxy resin curing agent, epoxy resin composition, sealing material, electrically conductive material, thermally conductive material, adhesive for camera module, adhesive for structure, matrix resin for fiber-reinforced plastic, impregnating and fixing material, interlayer insulating film, film-type solder resist, sealing sheet, electrically conductive film, anisotropic electrically conductive film, thermally conductive film, and method for producing dyed cured product | 旭化成株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-119998945-A | Resin composition, adhesive, sealant, cured product, and semiconductor device | 纳美仕有限公司 | 2025-05-13 | — | — | CN | disclosed |
| CN-112724596-B | Curable composition and cured product | 盛势达技研株式会社 | 2025-04-18 | — | — | CN | disclosed |
| EP-4524130-A1 | THIOL COMPOUND AND USES THEREOF | Shikoku Chemicals Corporation (JP) | 2025-03-19 | — | — | EP | disclosed |
| EP-4524174-A1 | CURING AGENT AND USE THEREOF | Shikoku Chemicals Corporation (JP) | 2025-03-19 | — | — | EP | disclosed |
| CN-112745793-B | Curable composition | 味之素株式会社 | 2025-03-14 | — | — | CN | disclosed |
| EP-4502012-A1 | RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2025-02-05 | — | — | EP | disclosed |
| EP-4502010-A1 | RESIN COMPOSITION, ADHESIVE, ENCAPSULATION MATERIAL, CURED OBJECT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2025-02-05 | — | — | EP | disclosed |
| EP-4502011-A1 | RESIN COMPOSITION, ADHESIVE AGENT, ENCAPSULANT, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2025-02-05 | — | — | EP | disclosed |
| WO-2025023051-A1 | EPOXY RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2025-01-30 | — | — | WO | disclosed |
| WO-2025023048-A1 | EPOXY RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED ARTICLE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2025-01-30 | — | — | WO | disclosed |
| CN-119365518-A | Resin composition, cured product, sealing material, adhesive, insulating material, coating material, prepreg, multilayer body, and fiber-reinforced composite material | 三菱瓦斯化学株式会社 | 2025-01-24 | — | — | CN | disclosed |
| WO-2025013940-A1 | COMPOUND, VARNISH, BOND MAGNET, AND MOTOR | 旭化成株式会社 | 2025-01-16 | — | — | WO | disclosed |
| EP-4052913-B1 | INKJET HEAD AND PRODUCTION METHOD FOR INKJET HEAD | KONICA MINOLTA INC (JP) | 2025-01-08 | — | — | EP | disclosed |
| CN-119183463-A | Curing agent and use thereof | 四国化成工业株式会社 | 2024-12-24 | — | — | CN | disclosed |
| CN-119173501-A | Thiol compound and use thereof | 四国化成工业株式会社 | 2024-12-20 | — | — | CN | disclosed |
| CN-118984849-A | Resin composition, adhesive, sealing material, cured product, semiconductor device, and electronic component | 纳美仕有限公司 | 2024-11-19 | — | — | CN | disclosed |
| CN-118984848-A | Resin composition, adhesive, sealing material, cured product, semiconductor device, and electronic component | 纳美仕有限公司 | 2024-11-19 | — | — | CN | disclosed |
| US-20240376291-A1 | EPOXY RESIN COMPOSITION, FILM, METHOD FOR PRODUCING FILM, AND CURED PRODUCTS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-11-14 | — | — | US | disclosed |
| CN-118871506-A | Resin composition, adhesive, sealing material, cured product, semiconductor device, and electronic component | 纳美仕有限公司 | 2024-10-29 | — | — | CN | disclosed |
| WO-2024204052-A1 | THIOL COMPOUND | 味の素株式会社 | 2024-10-03 | — | — | WO | disclosed |
| WO-2024204053-A1 | THIOL COMPOUND | 味の素株式会社 | 2024-10-03 | — | — | WO | disclosed |
| CN-118725792-A | Composition, adhesive, cured product, and electronic component | 味之素株式会社 | 2024-10-01 | — | — | CN | disclosed |
| CN-112745770-B | Curable composition | 味之素株式会社 | 2024-08-02 | — | — | CN | disclosed |
| EP-4405429-A1 | THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF | Henkel AG & Co. KGaA (DE) | 2024-07-31 | — | — | EP | disclosed |
| EP-4403596-A1 | RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, CURED PRODUCTS OF THESE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2024-07-24 | — | — | EP | disclosed |
| EP-4403595-A1 | RESIN COMPOSITION FOR JET DISPENSING, ADHESIVE FOR ELECTRONIC COMPONENT, CURED PRODUCTS THEREOF, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2024-07-24 | — | — | EP | disclosed |
| US-20240240067-A1 | THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF | HENKEL AG & CO KGAA (DE) | 2024-07-18 | — | — | US | disclosed |
| EP-4392998-A1 | ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION FOR BONDING SOLAR CELLS | Henkel AG & Co. KGaA (DE) | 2024-07-03 | — | — | EP | disclosed |
| CN-114213333-B | Thiol compound, method for synthesizing same, and use of thiol compound | 四国化成工业株式会社 | 2024-06-25 | — | — | CN | disclosed |
| US-20240199925-A1 | ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION FOR BONDING SOLAR CELLS | HENKEL AG & CO KGAA (DE) | 2024-06-20 | — | — | US | disclosed |
| CN-110054865-B | Resin composition | 味之素株式会社 | 2024-05-14 | — | — | CN | disclosed |
| CN-117980427-A | Thermally conductive adhesive composition, method for the production and use thereof | 汉高股份有限及两合公司 | 2024-05-03 | — | — | CN | disclosed |
| WO-2024089906-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT AND SEMICONDUCTOR DEVICE | NAMICS CORPORATION (JP) | 2024-05-02 | — | — | WO | disclosed |
| WO-2024089905-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | NAMICS CORPORATION (JP) | 2024-05-02 | — | — | WO | disclosed |
| WO-2024090259-A1 | RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2024-05-02 | — | — | WO | disclosed |
| CN-117957068-A | Method for discharging resin composition, method for manufacturing electronic component, and electronic component | 纳美仕有限公司 | 2024-04-30 | — | — | CN | disclosed |
| CN-117957270-A | Resin composition for injection dispensing, adhesive for electronic component, cured product thereof, and electronic component | 纳美仕有限公司 | 2024-04-30 | — | — | CN | disclosed |
| CN-117940488-A | Resin composition, adhesive for electronic component, cured product thereof, and electronic component | 纳美仕有限公司 | 2024-04-26 | — | — | CN | disclosed |
| EP-3998252-B1 | THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS | SHIKOKU CHEM (JP) | 2024-04-24 | — | — | EP | disclosed |
| US-20240124621-A1 | CURABLE COMPOSITION AND USE THEREOF | HENKEL AG & CO KGAA (DE) | 2024-04-18 | — | — | US | disclosed |
| CN-117859183-A | Conductive adhesive composition for bonding solar cells | 汉高股份有限及两合公司 | 2024-04-09 | — | — | CN | disclosed |
| EP-4341354-A1 | CURABLE COMPOSITION AND USE THEREOF | Henkel AG & Co. KGaA (DE) | 2024-03-27 | — | — | EP | disclosed |
| CN-114641396-B | Ink jet head and method for manufacturing the same | 柯尼卡美能达株式会社 | 2024-03-08 | — | — | CN | disclosed |
| US-11919308-B2 | Inkjet head and production method for inkjet head | Konica Minolta, Inc. (JP) | 2024-03-05 | — | — | US | disclosed |
| CN-117651730-A | Resin composition and adhesive | 纳美仕有限公司 | 2024-03-05 | — | — | CN | disclosed |
| CN-117612857-A | Forming method of composite magnetic material | 江西中石新材料有限公司 | 2024-02-27 | — | — | CN | disclosed |
| CN-117612856-A | Anisotropic magnetic material forming method | 江西中石新材料有限公司 | 2024-02-27 | — | — | CN | disclosed |
| CN-117580888-A | Epoxy resin composition, film, method for producing film, and cured product | 旭化成株式会社 | 2024-02-20 | — | — | CN | disclosed |
| EP-4301823-A1 | CURABLE ADHESIVE COMPOSITION COMPRISING MALEIMIDE AND THIOL | Henkel AG & Co. KGaA (DE) | 2024-01-10 | — | — | EP | disclosed |
| CN-117377731-A | Curable composition and use thereof | 汉高股份有限及两合公司 | 2024-01-09 | — | — | CN | disclosed |
| WO-2023228509-A1 | RESIN COMPOSITION, CURED SUBSTANCE, SEALING MATERIAL, ADHESIVE, INSULATING MATERIAL, COATING MATERIAL, PREPREG, MULTILAYER BODY, AND FIBER-REINFORCED COMPOSITE MATERIAL | 三菱瓦斯化学株式会社 | 2023-11-30 | — | — | WO | disclosed |
| WO-2023218702-A1 | CURING AGENT AND USE THEREOF | 四国化成工業株式会社 | 2023-11-16 | — | — | WO | disclosed |
| WO-2023218862-A1 | THIOL COMPOUND AND USES THEREOF | 四国化成工業株式会社 | 2023-11-16 | — | — | WO | disclosed |
| US-11807596-B2 | Thiol compounds, synthesis method therefor, and utilization of said thiol compounds | SHIKOKU CHEMICALS CORPORATION (JP) | 2023-11-07 | — | — | US | disclosed |
| EP-3713984-B1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2023-11-01 | — | — | EP | disclosed |
| CN-116940647-A | Curable adhesive composition comprising maleimide and thiol | 汉高股份有限及两合公司 | 2023-10-24 | — | — | CN | disclosed |
| WO-2023190571-A1 | CONDUCTIVE COMPOSITION | タツタ電線株式会社 | 2023-10-05 | — | — | WO | disclosed |
| US-11773207-B2 | Thiol compound, method for synthesizing same, and uses for said thiol compound | SHIKOKU CHEMICALS CORPORATION (JP) | 2023-10-03 | — | — | US | disclosed |
| WO-2023181847-A1 | RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-09-28 | — | — | WO | disclosed |
| WO-2023181845-A1 | RESIN COMPOSITION, ADHESIVE, ENCAPSULATION MATERIAL, CURED OBJECT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-09-28 | — | — | WO | disclosed |
| WO-2023181846-A1 | RESIN COMPOSITION, ADHESIVE AGENT, ENCAPSULANT, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-09-28 | — | — | WO | disclosed |
| WO-2023181831-A1 | RESIN COMPOSITION, ADHESIVE OR ENCAPSULATION MATERIAL, CURED OBJECT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-09-28 | — | — | WO | disclosed |
| CN-116715939-A | Curable resin composition, adhesive, and adhesive method | 味之素株式会社 | 2023-09-08 | — | — | CN | disclosed |
| CN-112823176-B | resin composition | 纳美仕有限公司 | 2023-08-22 | — | — | CN | disclosed |
| CN-112823177-B | Resin composition | 纳美仕有限公司 | 2023-08-15 | — | — | CN | disclosed |
| CN-111788247-B | Coated particles | 味之素株式会社 | 2023-07-18 | — | — | CN | disclosed |
| US-20230182414-A1 | Method for Preparing Fiber-Reinforced Parts Based on Cyanate Ester/Epoxy Blends | ARXADA AG (CH) | 2023-06-15 | — | — | US | disclosed |
| CN-112852371-B | Small-spacing epoxy plastic packaging material applied to outdoor display screen and preparation method thereof | 天津德高化成新材料股份有限公司 | 2023-05-12 | — | — | CN | disclosed |
| CN-116063978-A | Curable composition | 味之素株式会社 | 2023-05-05 | — | — | CN | disclosed |
| CN-110054760-B | One-component resin composition | 味之素株式会社 | 2023-05-05 | — | — | CN | disclosed |
| US-20230127633-A1 | INHIBITORS OF OXIDIZED LOW-DENSITY LIPOPROTEIN RECEPTOR 1 AND METHODS OF USE THEREOF | BIO VENTURES, LLC | 2023-04-27 | — | — | US | disclosed |
| US-20230127633-A1 | INHIBITORS OF OXIDIZED LOW-DENSITY LIPOPROTEIN RECEPTOR 1 AND METHODS OF USE THEREOF | BIO VENTURES, LLC | 2023-04-27 | — | — | US | disclosed |
| WO-2023062938-A1 | METHOD FOR EJECTING RESIN COMPOSITION, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-04-20 | — | — | WO | disclosed |
| WO-2023044701-A1 | THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF | HENKEL AG & CO. KGAA (DE) | 2023-03-30 | — | — | WO | disclosed |
| WO-2023042599-A1 | RESIN COMPOSITION FOR JET DISPENSING, ADHESIVE FOR ELECTRONIC COMPONENT, CURED PRODUCTS THEREOF, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-03-23 | — | — | WO | disclosed |
| WO-2023042600-A1 | RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, CURED PRODUCTS OF THESE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-03-23 | — | — | WO | disclosed |
| WO-2023026872-A1 | EPOXY RESIN COMPOSITION | ナミックス株式会社 | 2023-03-02 | — | — | WO | disclosed |
| WO-2023024071-A1 | ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION FOR BONDING SOLAR CELLS | HENKEL AG & CO. KGAA (DE) | 2023-03-02 | — | — | WO | disclosed |
| WO-2023017752-A1 | RESIN COMPOSITION AND ADHESIVE | ナミックス株式会社 | 2023-02-16 | — | — | WO | disclosed |
| WO-2023276773-A1 | RESIN COMPOSITION AND ADHESIVE | ナミックス株式会社 | 2023-01-05 | — | — | WO | disclosed |
| CN-111315719-B | Thiol compound, method for synthesizing same, and use of thiol compound | 四国化成工业株式会社 | 2022-12-27 | — | — | CN | disclosed |
| US-20220402269-A1 | INKJET HEAD AND PRODUCTION METHOD FOR INKJET HEAD | Konica Minolta, Inc. (JP) | 2022-12-22 | — | — | US | disclosed |
| WO-2022241772-A1 | CURABLE COMPOSITION AND USE THEREOF | HENKEL AG & CO. KGAA (DE) | 2022-11-24 | — | — | WO | disclosed |
| CN-112840004-B | Resin composition | 纳美仕有限公司 | 2022-11-08 | — | — | CN | disclosed |
| US-11472957-B2 | Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module | NAMICS CORPORATION (JP) | 2022-10-18 | — | — | US | disclosed |
| CN-115124813-A | Resin composition | 味之素株式会社 | 2022-09-30 | — | — | CN | disclosed |
| US-20220306908-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2022-09-29 | — | — | US | disclosed |
| US-11441015-B2 | Coated particle | AJINOMOTO CO., INC. (JP) | 2022-09-13 | — | — | US | disclosed |
| CN-111978898-B | Method for producing pressure-sensitive adhesive reactive adhesive tape | 德莎欧洲股份公司 | 2022-09-09 | — | — | CN | disclosed |
| WO-2022183481-A1 | CURABLE ADHESIVE COMPOSITION COMPRISING MALEIMIDE AND THIOL | HENKEL AG & CO. KGAA (DE) | 2022-09-09 | — | — | WO | disclosed |
| EP-4052913-A1 | INKJET HEAD AND PRODUCTION METHOD FOR INKJET HEAD | KONICA MINOLTA, INC. (JP) | 2022-09-07 | — | — | EP | disclosed |
| US-20220275252-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2022-09-01 | — | — | US | disclosed |
| CN-114641396-A | Ink jet head and method of manufacturing ink jet head | 柯尼卡美能达株式会社 | 2022-06-17 | — | — | CN | disclosed |
| EP-3998252-A1 | THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS | Shikoku Chemicals Corporation (JP) | 2022-05-18 | — | — | EP | disclosed |
| CN-110431168-B | Curable composition and structure | 味之素株式会社 | 2022-04-29 | — | — | CN | disclosed |
| US-20220112330-A1 | THIOL COMPOUND, METHOD FOR SYNTHESIZING SAME, AND USES FOR SAID THIOL COMPOUND | SHIKOKU CHEMICALS CORPORATION (JP) | 2022-04-14 | — | — | US | disclosed |
| CN-114276298-A | Thiol compound, method for synthesizing same, and use of thiol compound | 四国化成工业株式会社 | 2022-04-05 | — | — | CN | disclosed |
| CN-114213333-A | Thiol compound, method for synthesizing same, and use of thiol compound | 四国化成工业株式会社 | 2022-03-22 | — | — | CN | disclosed |
| CN-109679275-B | Polyacetal resin composition | 旭化成株式会社 | 2022-03-01 | — | — | CN | disclosed |
| EP-3741803-B1 | METHOD FOR PRODUCING REACTIVE ADHESIVE TAPES | TESA SE (DE) | 2021-10-13 | — | — | EP | disclosed |
| EP-3714001-B1 | PROCESS FOR PRODUCING PRESSURE-SENSITIVE REACTIVE ADHESIVE TAPES | TESA SE (DE) | 2021-10-13 | — | — | EP | disclosed |
| CN-113444340-A | Resin composition | 味之素株式会社 | 2021-09-28 | — | — | CN | disclosed |
| US-20210292596-A1 | THERMOSETTING POWDER COATING MATERIAL, COATING FILM USING THE COATING MATERIAL, AND COATED BODY COMPRISING THE COATING FILM | SOMAR CORPORATION (JP) | 2021-09-23 | — | — | US | disclosed |
| CN-109715695-B | Resin composition, adhesive, sealing material, dam agent, semiconductor device, and image sensor module | 纳美仕有限公司 | 2021-09-14 | — | — | CN | disclosed |
| CN-106967208-B | Coated particles | 味之素株式会社 | 2021-09-10 | — | — | CN | disclosed |
| CN-113272274-A | Thiol compound, synthesis method thereof and application of thiol compound | 四国化成工业株式会社 | 2021-08-17 | — | — | CN | disclosed |
| CN-112852371-A | Small-spacing epoxy plastic packaging material applied to outdoor display screen and preparation method thereof | 天津德高化成新材料股份有限公司 | 2021-05-28 | — | — | CN | disclosed |
| CN-112840004-A | Resin composition | 纳美仕有限公司 | 2021-05-25 | — | — | CN | disclosed |
| CN-112823176-A | Resin composition | 纳美仕有限公司 | 2021-05-18 | — | — | CN | disclosed |
| CN-112823177-A | Resin composition | 纳美仕有限公司 | 2021-05-18 | — | — | CN | disclosed |
| CN-112745770-A | Curable composition | 味之素株式会社 | 2021-05-04 | — | — | CN | disclosed |
| CN-112745793-A | Curable composition | 味之素株式会社 | 2021-05-04 | — | — | CN | disclosed |
| CN-112724596-A | Curable composition and cured product | 盛势达技研株式会社 | 2021-04-30 | — | — | CN | disclosed |
| EP-2758481-B1 | ELECTRICALLY CONDUCTIVE ADHESIVES COMPRISING SILVER-COATED PARTICLES | HENKEL AG & CO KGAA (DE) | 2021-04-21 | — | — | EP | disclosed |
| CN-108753101-B | Epoxy powder coating and application thereof | 江门市新会区新日旭电子材料有限公司 | 2021-02-26 | — | — | CN | disclosed |
| WO-2021032727-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2021-02-25 | — | — | WO | disclosed |
| WO-2021032822-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2021-02-25 | — | — | WO | disclosed |
| CN-107011514-B | Photoand thermosetting resin composition | 味之素株式会社 | 2020-12-18 | — | — | CN | disclosed |
| CN-108587400-B | Bi-component insulating paint for magnetic ring | 江门市新会区新日旭电子材料有限公司 | 2020-12-08 | — | — | CN | disclosed |
| US-20200369606-A1 | THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS | SHIKOKU CHEMICALS CORPORATION (JP) | 2020-11-26 | — | — | US | disclosed |
| EP-3741803-A1 | METHOD FOR PRODUCING REACTIVE ADHESIVE TAPES | tesa SE (DE) | 2020-11-25 | — | — | EP | disclosed |
| CN-111978898-A | Method for producing pressure-sensitive adhesive reactive adhesive tape | 德莎欧洲股份公司 | 2020-11-24 | — | — | CN | disclosed |
| CN-111902511-A | Sealing adhesive | 味之素株式会社 | 2020-11-06 | — | — | CN | disclosed |
| US-20200339782-A1 | COATED PARTICLE | AJINOMOTO CO., INC. (JP) | 2020-10-29 | — | — | US | disclosed |
| CN-111788247-A | Coated particles | 味之素株式会社 | 2020-10-16 | — | — | CN | disclosed |
| EP-3713984-A1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2020-09-30 | — | — | EP | disclosed |
| EP-3714001-A1 | PROCESS FOR PRODUCING PRESSURE-SENSITIVE REACTIVE ADHESIVE TAPES | TESA SE (DE) | 2020-09-30 | — | — | EP | disclosed |
| EP-3702348-A1 | THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS | Shikoku Chemicals Corporation (JP) | 2020-09-02 | — | — | EP | disclosed |
| WO-2020145111-A1 | THIOL COMPOUND, METHOD FOR SYNTHESIZING SAME, AND USES FOR SAID THIOL COMPOUND | 四国化成工業株式会社 | 2020-07-16 | — | — | WO | disclosed |
| CN-111378411-A | Epoxy resin composition for semiconductor device underfill | ＫＣＣ公司 | 2020-07-07 | — | — | CN | disclosed |
| EP-3118236-B1 | RESIN COMPOSITION AND CURED PRODUCT THEREOF | OMRON TATEISI ELECTRONICS CO (JP) | 2020-07-01 | — | — | EP | disclosed |
| CN-107406741-B | Semiconductor device and image sensor module | 纳美仕有限公司 | 2020-06-12 | — | — | CN | disclosed |
| US-20200123112-A1 | INHIBITORS OF OXIDIZED LOW-DENSITY LIPOPROTEIN RECEPTOR 1 AND METHODS OF USE THEREOF | BIO VENTURES, LLC | 2020-04-23 | — | — | US | disclosed |
| US-20200123375-A1 | RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, DAM AGENT, SEMICONDUCTOR DEVICE AND IMAGE SENSOR MODULE | NAMICS CORPORATION (JP) | 2020-04-23 | — | — | US | disclosed |
| US-10550131-B2 | Mercaptoethylglycol uril compound and utilization thereof | SHIKOKU CHEMICALS CORPORATION (JP) | 2020-02-04 | — | — | US | disclosed |
| CN-107431025-B | Heat-curable sealant composition and use thereof | 汉高股份有限及两合公司 | 2020-01-17 | — | — | CN | disclosed |
| CN-107428781-B | Mercapto ethyl glycoluril compound and application thereof | 四国化成工业株式会社 | 2020-01-10 | — | — | CN | disclosed |
| CN-107428939-B | Resin combination, bonding agent and sealant | 纳美仕有限公司 | 2019-11-22 | — | — | CN | disclosed |
| US-10472461-B2 | Semiconductor device and image sensor module | NAMICS CORPORATION (JP) | 2019-11-12 | — | — | US | disclosed |
| CN-110431168-A | Solidification compound and structure | AJINOMOTO KK | 2019-11-08 | — | — | CN | disclosed |
| US-10450407-B2 | Coated particles | AJINOMOTO CO., INC. (JP) | 2019-10-22 | — | — | US | disclosed |
| US-10427394-B2 | Method for curing resin composition | OMRON CORPORATION (JP) | 2019-10-01 | — | — | US | disclosed |
| WO-2019181789-A1 | SEALING ADHESIVE | 味の素株式会社 | 2019-09-26 | — | — | WO | disclosed |
| CN-110054865-A | Resin combination | 味之素株式会社 | 2019-07-26 | — | — | CN | disclosed |
| CN-110054760-A | One-component resin composition | 味之素株式会社 | 2019-07-26 | — | — | CN | disclosed |
| EP-3269722-B1 | MERCAPTOETHYLGLYCOL URIL COMPOUND AND UTILIZATION THEREOF | SHIKOKU CHEM (JP) | 2019-06-19 | — | — | EP | disclosed |
| WO-2019101916-A1 | CURABLE COMPOSITION BASED ON FATTY-ACID MODIFIED EPOXY RESINS AND CURING AGENTS | TESA SE (DE) | 2019-05-31 | — | — | WO | disclosed |
| WO-2019101914-A1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2019-05-31 | — | — | WO | disclosed |
| WO-2019101913-A1 | PROCESS FOR PRODUCING PRESSURE-SENSITIVE REACTIVE ADHESIVE TAPES | TESA SE (DE) | 2019-05-31 | — | — | WO | disclosed |
| CN-109749359-A | one-component epoxy resin composition | 正一龙华特殊材料(深圳)有限公司 | 2019-05-14 | — | — | CN | disclosed |
| CN-109715695-A | Resin composition, adhesive, sealing material, dam agent, semiconductor device, and image sensor module | 纳美仕有限公司 | 2019-05-03 | — | — | CN | disclosed |
| EP-2527151-B1 | METHOD FOR MANUFACTURING INKJET HEAD | KONICA MINOLTA IJ TECH INC (JP) | 2019-03-13 | — | — | EP | disclosed |
| US-10221282-B2 | Resin composition, adhesive agent, and sealing agent | NAMICS CORPORATION (JP) | 2019-03-05 | — | — | US | disclosed |
| US-10138348-B2 | Resin composition and cured product thereof | OMRON CORPORATION (JP) | 2018-11-27 | — | — | US | disclosed |
| CN-108884371-A | Thermosetting adhesive film | ＫＣＣ公司 | 2018-11-23 | — | — | CN | disclosed |
| CN-108753101-A | A kind of epoxide powder coating and its application | 张建洲 | 2018-11-06 | — | — | CN | disclosed |
| CN-108587400-A | A kind of magnet ring two-component insulating coating | 张建洲 | 2018-09-28 | — | — | CN | disclosed |
| CN-104797623-B | Resin curing agent and one-component epoxy resin composition | 味之素株式会社 | 2018-09-25 | — | — | CN | disclosed |
| CN-106062028-B | Resin combination and its solidfied material | 欧姆龙株式会社 | 2018-09-14 | — | — | CN | disclosed |
| EP-3075736-B1 | MERCAPTOALKYL GLYCOLURILS AND USE OF SAME | SHIKOKU CHEM (JP) | 2018-08-22 | — | — | EP | disclosed |
| US-10030023-B2 | Mercaptoalkylglycolurils and use of same | SHIKOKU CHEMICALS CORPORATION (JP) | 2018-07-24 | — | — | US | disclosed |
| CN-105324363-B | Compound containing mercapto and one-component epoxy resin composition | 味之素株式会社 | 2018-07-17 | — | — | CN | disclosed |
| CN-105764907-B | Mercaptoalkyl glycoluril class and application thereof | 四国化成工业株式会社 | 2018-05-18 | — | — | CN | disclosed |
| CN-106062027-B | The curing of resin combination | 欧姆龙株式会社 | 2018-04-13 | — | — | CN | disclosed |
| US-20180051038-A1 | MERCAPTOETHYLGLYCOL URIL COMPOUND AND UTILIZATION THEREOF | SHIKOKU CHEMICALS CORPORATION (JP) | 2018-02-22 | — | — | US | disclosed |
| US-20180051127-A1 | SEMICONDUCTOR DEVICE AND IMAGE SENSOR MODULE | NAMICS CORPORATION (JP) | 2018-02-22 | — | — | US | disclosed |
| US-20180044478-A1 | RESIN COMPOSITION, ADHESIVE AGENT, AND SEALING AGENT | NAMICS CORPORATION (JP) | 2018-02-15 | — | — | US | disclosed |
| EP-3269722-A1 | MERCAPTOETHYLGLYCOL URIL COMPOUND AND UTILIZATION THEREOF | Shikoku Chemicals Corporation (JP) | 2018-01-17 | — | — | EP | disclosed |
| CN-107428939-A | Resin composition, adhesive and sealant | 纳美仕有限公司 | 2017-12-01 | — | — | CN | disclosed |
| CN-107428781-A | Mercaptoethyl glycoluril compounds and its application | 四国化成工业株式会社 | 2017-12-01 | — | — | CN | disclosed |
| CN-107431025-A | Heat-setting encapsulant composition and application thereof | 汉高股份有限及两合公司 | 2017-12-01 | — | — | CN | disclosed |
| CN-107406741-A | Semiconductor device and image sensor module | 纳美仕有限公司 | 2017-11-28 | — | — | CN | disclosed |
| US-9770886-B2 | Electrically conductive adhesives comprising silver-coated particles | HENKEL AG & CO. KGAA (DE) | 2017-09-26 | — | — | US | disclosed |
| US-20170247586-A1 | THERMALLY CURABLE SEALANT COMPOSITION AND THE USE THEREOF | ABLESTIK (SHANGHAI) LTD. (CN) | 2017-08-31 | — | — | US | disclosed |
| CN-105458161-B | A kind of powdered mold release agents composition | 浙江龙游展宇有机玻璃有限公司 | 2017-08-15 | — | — | CN | disclosed |
| CN-107011514-A | Light and heat hardening resin composition | 味之素株式会社 | 2017-08-04 | — | — | CN | disclosed |
| CN-106967208-A | Coated particle | 味之素株式会社 | 2017-07-21 | — | — | CN | disclosed |
| US-20170137563-A1 | COATED PARTICLES | AJINOMOTO CO., INC. (JP) | 2017-05-18 | — | — | US | disclosed |
| WO-2017075418-A1 | INHIBITORS OF OXIDIZED LOW-DENSITY LIPOPROTEIN RECEPTOR 1 AND METHODS OF USE THEREOF | BOARD OF TRUSTEES OF THE UNIVERSITY OF ARKANSAS (US) | 2017-05-04 | — | — | WO | disclosed |
| US-20170066899-A1 | RESIN COMPOSITION AND CURED PRODUCT THEREOF | OMRON CORPORATION (JP) | 2017-03-09 | — | — | US | disclosed |
| US-20170066230-A1 | METHOD FOR CURING RESIN COMPOSITION | OMRON CORPORATION (JP) | 2017-03-09 | — | — | US | disclosed |
| EP-3118236-A1 | RESIN COMPOSITION AND CURED PRODUCT THEREOF | Omron Corporation (JP) | 2017-01-18 | — | — | EP | disclosed |
| EP-3118237-A1 | METHOD FOR CURING RESIN COMPOSITION | Omron Corporation (JP) | 2017-01-18 | — | — | EP | disclosed |
| EP-2640765-B1 | ONE COMPONENT EPOXY RESIN COMPOSITION | Henkel IP & Holding GmbH (DE) | 2017-01-04 | — | — | EP | disclosed |
| CN-106062027-A | Method for curing resin composition | 欧姆龙株式会社 | 2016-10-26 | — | — | CN | disclosed |
| CN-106062028-A | Resin composition and cured product thereof | 欧姆龙株式会社 | 2016-10-26 | — | — | CN | disclosed |
| US-20160304684-A1 | Method for Preparing Fiber-Reinforced Parts Based on Cyanate Ester/Epoxy Blends | ARXADA AG (CH) | 2016-10-20 | — | — | US | disclosed |
| EP-3077449-A1 | METHOD FOR PREPARING FIBER-REINFORCED PARTS BASED ON CYANATE ESTER/EPOXY BLENDS | Lonza Ltd (CH) | 2016-10-12 | — | — | EP | disclosed |
| US-20160289237-A1 | MERCAPTOALKYLGLYCOLURILS AND USE OF SAME | SHIKOKU CHEMICALS CORPORATION (JP) | 2016-10-06 | — | — | US | disclosed |
| EP-3075736-A1 | MERCAPTOALKYL GLYCOLURILS AND USE OF SAME | Shikoku Chemicals Corporation (JP) | 2016-10-05 | — | — | EP | disclosed |
| CN-105764907-A | Mercaptoalkyl glycolurils and use of same | 四国化成工业株式会社 | 2016-07-13 | — | — | CN | disclosed |
| CN-105458161-A | Powdery release agent composition | ZHEJIANG LONGYOU ZHANYU ACRYLIC CO LTD | 2016-04-06 | — | — | CN | disclosed |
| CN-105324363-A | Thiol-group-containing compound and single-liquid epoxy resin composition | AJINOMOTO KK | 2016-02-10 | — | — | CN | disclosed |
| CN-104797623-A | Resin curing agent and one-pack type epoxy resin composition | AJINOMOTO KK | 2015-07-22 | — | — | CN | disclosed |
| WO-2015082613-A1 | METHOD FOR PREPARING FIBER-REINFORCED PARTS BASED ON CYANATE ESTER/EPOXY BLENDS | LONZA LTD (CH) | 2015-06-11 | — | — | WO | disclosed |
| EP-2758481-A1 | ELECTRICALLY CONDUCTIVE ADHESIVES COMPRISING SILVER-COATED PARTICLES | Henkel AG&Co. KGAA (DE) | 2014-07-30 | — | — | EP | disclosed |
| US-20140178671-A1 | ELECTRICALLY CONDUCTIVE ADHESIVES COMPRISING SILVER-COATED PARTICLES | HENKEL AG & CO. KGAA (DE) | 2014-06-26 | — | — | US | disclosed |
| CN-102333808-B | Microencapsulated hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack epoxy resin composition, and processed article | ASAHI KASEI E MATERIALS CORP | 2013-11-27 | — | — | CN | disclosed |
| EP-1785458-B1 | COATING LIQUID FOR FORMING TRANSPARENT COATING FILM AND BASE WITH TRANSPARENT COATING FILM | JGC CATALYSTS & CHEMICALS LTD (JP) | 2013-11-13 | — | — | EP | disclosed |
| CN-103282401-A | Resin composition | NAMICS CORP | 2013-09-04 | — | — | CN | disclosed |
| CN-103228696-A | One component epoxy resin composition | HENKEL CORP | 2013-07-31 | — | — | CN | disclosed |
| US-20130165600-A1 | ONE COMPONENT EPOXY RESIN COMPOSITION | HENKEL CORPORATION (US) | 2013-06-27 | — | — | US | disclosed |
| CN-103097436-A | Resin composition | NAMICS CORP | 2013-05-08 | — | — | CN | disclosed |
| WO-2013041568-A1 | ELECTRICALLY CONDUCTIVE ADHESIVES COMPRISING SILVER-COATED PARTICLES | HENKEL AG & CO. KGAA (DE) | 2013-03-28 | — | — | WO | disclosed |
| CN-102414241-A | Microencapsulated composition containing imidazole compound, curable composition using same, and masterbatch-type curing agent | ASAHI KASEI E MATERIALS CORP | 2012-04-11 | — | — | CN | disclosed |
| CN-102333808-A | Microencapsulated hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack epoxy resin composition, and processed article | ASAHI KASEI E MATERIALS CORP | 2012-01-25 | — | — | CN | disclosed |
| CN-101563776-B | Lead frame fixing material, lead frame and semiconductor device | SHIIMA ELECTRONICS INC. (JP) | 2011-12-07 | — | — | CN | disclosed |
| US-8063161-B2 | Low temperature curing acrylate and maleimide based formulations and methods for use thereof | DESIGNER MOLECULES, INC. (US) | 2011-11-22 | — | — | US | disclosed |
| CN-101010400-B | Coating liquid for forming transparent coating film and base with transparent coating film | CATALYSTS & CHEM IND CO | 2011-07-20 | — | — | CN | disclosed |
| CN-1957012-B | Hardener for epoxy resin and epoxy resin composition | ASAHI KASEI E MATERIALS CORP (JP) | 2011-07-20 | — | — | CN | disclosed |
| US-7927514-B2 | Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2011-04-19 | — | — | US | disclosed |
| US-7922860-B2 | Manufacturing inkjet head by adhering with epoxy resins and alkyl imidazole | KONICA MINOLTA HOLDINGS, INC. (JP) | 2011-04-12 | — | — | US | disclosed |
| US-7854860-B2 | High-speed curable two-part liquid epoxy resin adhesivescomprising a microcapsulated hardener for comprising an amineadduct of a epoxy resin and a covering or shell of an epoxyresin having infrared-sensitve binding groups; storage stability; sovent resistance; high adhesiveness; dispersibility | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2010-12-21 | — | — | US | disclosed |
| CN-101128502-B | Latent hardener for epoxy resin and epoxy resin composition | ASAHI CHEMICAL CORP (JP) | 2010-12-01 | — | — | CN | disclosed |
| US-7820772-B2 | comprises an amine adduct and a low-molecular amine compound 2-methylimidazole; bisphenol A type epoxy resin reacted with 2-methylimidazole as the amine adduct; excellent hardening property at low temperature, and storage stability at low and high temperature; adhesives; sealant | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2010-10-26 | — | — | US | disclosed |
| US-20100063184-A1 | LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2010-03-11 | — | — | US | disclosed |
| US-20100018647-A1 | Manufacturing method of inkjet head, and adhesive agent composition | KONICA MINOLTA HOLDINGS, INC. (JP) | 2010-01-28 | — | — | US | disclosed |
| CN-100584872-C | Latent curing agent and composition | ASAHI CHEMICAL CORP (JP) | 2010-01-27 | — | — | CN | disclosed |
| US-20090261298-A1 | High-speed curable two-part liquid epoxy resin adhesivescomprising a microcapsulated hardener for comprising an amineadduct of a epoxy resin and a covering or shell of an epoxyresin having infrared-sensitve binding groups; storage stability; sovent resistance; high adhesiveness; dispersibility | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2009-10-22 | — | — | US | disclosed |
| CN-101563776-A | Lead frame fixing material, lead frame and semiconductor device | HIIMA ELECTRONICS INC (JP) | 2009-10-21 | — | — | CN | disclosed |
| US-20090186962-A1 | Microcapsule-Based Hardener for Epoxy Resin, Masterbatch-Based Hardener Composition for Epoxy Resin, One-Part Epoxy Resin Composition, and Processed Good | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2009-07-23 | — | — | US | disclosed |
| US-20080268253-A1 | Coating Liquid for Forming Transparent Coating Film and Base with Transparent Coating Film | CATALYSTS & CHEMICALS INDUSTRIES CO., LTD. (JP) | 2008-10-30 | — | — | US | disclosed |
| WO-2008130894-A1 | LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2008-10-30 | — | — | WO | disclosed |
| US-20080251757-A1 | Latent Hardener For Epoxy Resin and Epoxy Resin Composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2008-10-16 | — | — | US | disclosed |
| EP-1980580-A1 | MICROCAPSULE TYPE HARDENER FOR EPOXY RESIN, MASTERBATCH TYPE HARDENER COMPOSITION FOR EPOXY RESIN, ONE-PACK TYPE EPOXY RESIN COMPOSITION, AND PROCESSED ARTICLE | Asahi Kasei Chemicals Corporation (JP) | 2008-10-15 | — | — | EP | disclosed |
| EP-1930359-A1 | HIGH-STABILITY MICROENCAPSULATED HARDENER FOR EPOXY RESIN AND EPOXY RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2008-06-11 | — | — | EP | disclosed |
| CN-101128502-A | Latent hardener for epoxy resin and epoxy resin composition | ASAHI CHEMICAL CORP (JP) | 2008-02-20 | — | — | CN | disclosed |
| CN-100357336-C | Capsule type hardener and composition | ASAHI CHEMICAL CORP (JP) | 2007-12-26 | — | — | CN | disclosed |
| EP-1852452-A1 | LATENT HARDENER FOR EPOXY RESIN AND EPOXY RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2007-11-07 | — | — | EP | disclosed |
| US-20070244268-A1 | Hardener for Epoxy Resin and Epoxy Resin Composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2007-10-18 | — | — | US | disclosed |
| CN-101010400-A | Coating liquid for forming transparent coating film and base with transparent coating film | CATALYSTS & CHEM IND CO (JP) | 2007-08-01 | — | — | CN | disclosed |
| EP-1785458-A1 | COATING LIQUID FOR FORMING TRANSPARENT COATING FILM AND BASE WITH TRANSPARENT COATING FILM | CATALYSTS & CHEMICALS INDUSTRIES CO., LTD. (JP) | 2007-05-16 | — | — | EP | disclosed |
| CN-1957012-A | Hardener for epoxy resin and epoxy resin composition | ASAHI CHEMICAL CORP (JP) | 2007-05-02 | — | — | CN | disclosed |
| US-20070055039-A1 | Latent curing agent and composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2007-03-08 | — | — | US | disclosed |
| EP-1731545-A1 | HARDENER FOR EPOXY RESIN AND EPOXY RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2006-12-13 | — | — | EP | disclosed |
| CN-1867602-A | Latent curing agents and compositions | ASAHI CHEMICAL CORP (JP) | 2006-11-22 | — | — | CN | disclosed |
| US-20060207720-A1 | Manufacturing method of inkjet head, and adhesive agent composition | KONICA MINOLTA HOLDINGS, INC. (JP) | 2006-09-21 | — | — | US | disclosed |
| EP-1671997-A1 | LATENT CURING AGENT AND COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2006-06-21 | — | — | EP | disclosed |
| US-20060128835-A1 | Capsule type hardener and composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2006-06-15 | — | — | US | disclosed |
| CN-1729225-A | Capsule type hardener and composition thereof | ASAHI CHEMICAL CORP (JP) | 2006-02-01 | — | — | CN | disclosed |
| EP-1593701-A1 | Curable resin composition | Ajinomoto Co., Inc. (JP) | 2005-11-09 | — | — | EP | disclosed |
| EP-0950677-B1 | Curable resin composition | AJINOMOTO KK (JP) | 2005-10-19 | — | — | EP | disclosed |
| EP-1557438-A1 | CAPSULE TYPE HARDENER AND COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2005-07-27 | — | — | EP | disclosed |
| US-6830646-B2 | Radiation curable resin layer | LEXMARK INTERNATIONAL, INC. | 2004-12-14 | — | — | US | disclosed |
| EP-0942028-B1 | Epoxy resin composition | AJINOMOTO KK (JP) | 2004-11-24 | — | — | EP | disclosed |
| WO-2004092237-A2 | RADIATION CURABLE RESIN LAYER | LEXMARK INTERNATIONAL, INC. (US) | 2004-10-28 | — | — | WO | disclosed |
| US-6783918-B2 | A MULTIFUNCTIONAL EPOXY COMPONENT, A DIFUNCTIONAL EPOXY COMPONENT, A SILANE COUPLING AGENT, AN ARYL SULFONIUM PHOTOINITIATOR, AND A NON-PHOTOREACTIVE SOLVENT | LEXMARK INTERNATIONAL, INC. | 2004-08-31 | — | — | US | disclosed |
| US-20030207209-A1 | 6Planarizing an ink jet heater chip. The resin formulation includes a multifunctional epoxy component, a difunctional epoxy component, a silane coupling agent, an aryl sulfonium salt photoinitiator, and a non-photoreactive solvent. The | FUNAI ELECTRIC CO., LTD (JP) | 2003-11-06 | — | — | US | disclosed |
| US-20030170567-A1 | Radiation curable resin layer | FUNAI ELECTRIC CO., LTD (JP) | 2003-09-11 | — | — | US | disclosed |
| US-6482899-B2 | LATENCY CURING AGENTS; STORAGE STABILITY | AJINOMOTO CO., INC. (JP) | 2002-11-19 | — | — | US | disclosed |
| US-6358354-B1 | UV and thermally curable adhesive formulation | LEXMARK INTERNATIONAL, INC. | 2002-03-19 | — | — | US | disclosed |
| US-20020010287-A1 | Latency curing agents; storage stability | AJINOMOTO CO., INC. (JP) | 2002-01-24 | — | — | US | disclosed |
| US-6232426-B1 | BLEND CONTAINING A THIOL, COMPOUND, LATENT CURING AGENT AND BORATE EATER | AJINOMOTO CO., INC. (JP) | 2001-05-15 | — | — | US | disclosed |
| EP-0662488-B1 | Epoxy-resin composition | AJINOMOTO KK (JP) | 1999-11-17 | — | — | EP | disclosed |
| EP-0950677-A2 | Curable resin composition | Ajinomoto Co., Inc. (JP) | 1999-10-20 | — | — | EP | disclosed |
| EP-0942028-A1 | Epoxy resin composition | Ajinomoto Co., Inc. (JP) | 1999-09-15 | — | — | EP | disclosed |
| EP-0594133-B1 | Polythiol epoxy resin composition with extended working life | AJINOMOTO KK (JP) | 1998-05-06 | — | — | EP | disclosed |
| EP-0569044-B1 | Latent curing agents for epoxy resins | AJINOMOTO KK (JP) | 1998-01-07 | — | — | EP | disclosed |
| US-5543486-A | LOW-TEMPERATURE, RAPID CURING OF EPOXY AND AMINE/EPOXY ADDUCT BECOMING SOLUBLE IN EPOXY UPON HEATING; MECHANICAL, ELECTRICAL AND CHEMICAL PROPERTIES | AJINOMOTO CO., INC. (JP) | 1996-08-06 | — | — | US | disclosed |
| US-5439977-A | Comprising a liquid epoxide compound, anhydride, secondary amine and imidazole-epoxide compound adduct having latent solubility upon heating; storage stability; workability; seals; electrical apparatus | AJINOMOTO CO., INC. (JP) | 1995-08-08 | — | — | US | disclosed |
| EP-0662488-A1 | Epoxy-resin composition | Ajinomoto Co., Inc. (JP) | 1995-07-12 | — | — | EP | disclosed |
| US-5430112-A | Epoxy resin and polythiol composition | AJINOMOTO CO., INC. (JP) | 1995-07-04 | — | — | US | disclosed |
| EP-0594133-A2 | Polythiol epoxy resin composition with extended working life | Ajinomoto Co., Inc. (JP) | 1994-04-27 | — | — | EP | disclosed |
| EP-0569044-A1 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1993-11-10 | — | — | EP | disclosed |
| US-4546155-A | ADDUCT OF EPOXY COMPOUND, TERTIARY AMINE COMPOUND, AND CARBOXYLIC ACID ANHYDRIDE | AJINOMOTO CO., INC. (JP) | 1985-10-08 | — | — | US | disclosed |
| US-4542202-A | EPOXY COMPOUND WITH A HYDROXY, MERCAPTO, OR HYDRAZIDE MODIFIED TERTIARY AMINE | AJINOMOTO CO., INC. (JP) | 1985-09-17 | — | — | US | disclosed |
| EP-0138465-A2 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1985-04-24 | — | — | EP | disclosed |
| EP-0104837-A2 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1984-04-04 | — | — | EP | disclosed |
| EP-0104837-A2 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1984-04-04 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (13 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20250289782-A1 | THIOL COMPOUND AND USES THEREOF | TMT1A, TXN, CTH | CYP1A2 2677/4885CYP3A4 3548/4885CYP2C9 1757/4885 |
| US-20250382263-A1 | THIOL COMPOUND | TMT1A, TST, TXN | CYP1A2 821/4885CYP3A4 1449/4885CYP2C9 1098/4885 |
| US-20160289237-A1 | MERCAPTOALKYLGLYCOLURILS AND USE OF SAME | CYSLTR1, MGMT, CYSLTR2 | CYP1A2 1554/4885CYP3A4 906/4885CYP2C9 822/4885 |
| US-20200123112-A1 | INHIBITORS OF OXIDIZED LOW-DENSITY LIPOPROTEIN RECEPTOR 1 AND METHODS OF USE THEREOF | LDLR, LOX, LOXL1 | CYP1A2 905/4885CYP3A4 1452/4885CYP2C9 1627/4885 |
| US-20230127633-A1 | INHIBITORS OF OXIDIZED LOW-DENSITY LIPOPROTEIN RECEPTOR 1 AND METHODS OF USE THEREOF | LDLR, LOX, LOXL1 | CYP1A2 905/4885CYP3A4 1452/4885CYP2C9 1627/4885 |
| US-20200369606-A1 | THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS | TMT1A, CTH, SLC7A11 | CYP1A2 2366/4885CYP3A4 1859/4885CYP2C9 1709/4885 |
| US-10550131-B2 | Mercaptoethylglycol uril compound and utilization thereof | MGMT, ESD, UGP2 | CYP1A2 2234/4885CYP3A4 2120/4885CYP2C9 1580/4885 |
| US-11773207-B2 | Thiol compound, method for synthesizing same, and uses for said thiol compound | TST, TMT1A, CTH | CYP1A2 2816/4885CYP3A4 3062/4885CYP2C9 2171/4885 |
| US-11807596-B2 | Thiol compounds, synthesis method therefor, and utilization of said thiol compounds | TMT1A, CTH, SLC7A11 | CYP1A2 2366/4885CYP3A4 1859/4885CYP2C9 1709/4885 |
| US-20220112330-A1 | THIOL COMPOUND, METHOD FOR SYNTHESIZING SAME, AND USES FOR SAID THIOL COMPOUND | TST, TMT1A, CTH | CYP1A2 2816/4885CYP3A4 3062/4885CYP2C9 2171/4885 |
| US-20180051038-A1 | MERCAPTOETHYLGLYCOL URIL COMPOUND AND UTILIZATION THEREOF | MGMT, ESD, UGP2 | CYP1A2 2234/4885CYP3A4 2120/4885CYP2C9 1580/4885 |
| US-20260008904-A1 | THIOL COMPOUND | CBR1, PSMA1, KAT2A | CYP1A2 947/4885CYP3A4 2810/4885CYP2C9 2966/4885 |
| US-10030023-B2 | Mercaptoalkylglycolurils and use of same | CYSLTR1, MGMT, CYSLTR2 | CYP1A2 1554/4885CYP3A4 906/4885CYP2C9 822/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.