SCHEMBL5033199

SCHEMBL5033199

C1=Cc2c(-c3ccccc3)ccc3cccc1c23

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.36
HSD17B10 Q99714 4/20 0.36
HPGD P15428 4/20 0.36
TSHR P16473 3/20 0.36
CYP1A2 P05177 2/20 0.36
CYP1A1 P04798 1/20 0.36
CYP3A4 P08684 1/20 0.36
CYP1B1 Q16678 1/20 0.36
MAPK1 P28482 3/20 0.35
ATM Q13315 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
THRB P10828 1/20 0.34
CDK4 P11802 1/20 0.34
CCND1 P24385 1/20 0.34
TNF P01375 1/20 0.33
TP53 P04637 1/20 0.32
CASP1 P29466 1/20 0.32
CASP7 P55210 1/20 0.32
HIF1A Q16665 1/20 0.32
ADORA3 P0DMS8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22338448 0.88 PDE6D (0.31) PDE6D
SCHEMBL30370114 0.86 KDM4E (0.33) ALDH1A1CYP1A2CYP3A4L3MBTL1MAPT
SCHEMBL28983086 0.86 KDM4E (0.33) ALDH1A1CYP1A2CYP3A4L3MBTL1MAPT
SCHEMBL6245157 0.80 ALDH1A1 (0.41) ALDH1A1HSD17B10HPGDMAPK1THRB
SCHEMBL25424485 0.77 IDO1 (0.42) ALDH1A1HSD17B10HPGDTSHRCYP1A2
SCHEMBL25239102 0.76 LMNA (0.41) ALDH1A1HSD17B10HPGDCYP1A2CYP1A1
SCHEMBL22338497 0.75
SCHEMBL27738343 0.73 TSHR (0.37) ALDH1A1HSD17B10HPGDTSHRCYP1A2
Benzene SCHEMBL27938048 0.72 ALDH1A1 (0.50) ALDH1A1HSD17B10HPGDTSHRCYP1A2
SCHEMBL24049581 0.72 ALDH1A1 (0.38) ALDH1A1HSD17B10HPGDTSHRCYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 134 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12624176-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-05-12 US disclosed
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
US-20260098143-A1 RESIN COMPOSITION, AND PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAID RESIN COMPOSITION PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-04-09 US disclosed
US-20260078253-A1 RESIN COMPOSITION, AND PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAME PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-03-19 US disclosed
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof NOTARK CORPORATION (US) 2026-02-10 US disclosed
US-20260035495-A1 FUNCTIONAL COPOLYMERS AND METHODS OF PREPARATION THEREOF Kraton Corporation (US) 2026-02-05 US disclosed
US-12534584-B2 Resin composition, prepreg, resin-attached film, resin-attached metal foil, metal-cladded laminate sheet, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-01-27 US disclosed
US-20260002026-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-01-01 US disclosed
US-20260002021-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-01-01 US disclosed
US-20250382455-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-12-18 US disclosed
US-7402645-B2 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2008-07-22 US disclosed
US-20070248911-A1 Pattern forming method and bilayer film IWASAWA HARUO 2007-10-25 US disclosed
US-7244549-B2 Pattern forming method and bilayer film JSR CORPORATION (JP) 2007-07-17 US disclosed
US-20070155923-A1 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-07-05 US disclosed
US-6852791-B2 Anti-reflection coating forming composition JSR CORPORATION (JP) 2005-02-08 US disclosed
EP-1205805-B1 Anti-reflection coating forming composition JSR CORP (JP) 2004-09-15 EP disclosed
US-20030073040-A1 Pattern forming method and bilayer film JSR CORPORATION (JP) 2003-04-17 US disclosed
US-20020086934-A1 Anti-reflection coating forming composition JSR CORPORATION (JP) 2002-07-04 US disclosed
EP-1205805-A1 Anti-reflection coating forming composition JSR Corporation (JP) 2002-05-15 EP disclosed
US-4816519-A VULCANIZABLE RUBBER BLEND, MOLDING MATERIALS NIPPON ZEON CO., LTD. (JP) 1989-03-28 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (9 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260035495-A1 FUNCTIONAL COPOLYMERS AND METHODS OF PREPARATION THEREOF VCL, FGB, CDH1 ALDH1A1 303/4885HSD17B10 173/4885HPGD 548/4885
US-20260002026-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD WDR33, FCER2, C1R ALDH1A1 2620/4885HSD17B10 4153/4885HPGD 974/4885
US-20260098143-A1 RESIN COMPOSITION, AND PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAID RESIN COMPOSITION VMA21, ARCN1, RAD51 ALDH1A1 2958/4885HSD17B10 4395/4885HPGD 3106/4885
US-12534584-B2 Resin composition, prepreg, resin-attached film, resin-attached metal foil, metal-cladded laminate sheet, and wiring board MECP2, WDR33, TERB1 ALDH1A1 2391/4885HSD17B10 3401/4885HPGD 2137/4885
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME PSMA1, PSMB10, RAD51 ALDH1A1 438/4885HSD17B10 961/4885HPGD 1608/4885
US-20260078253-A1 RESIN COMPOSITION, AND PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAME ARCN1, TGFBR1, C1R ALDH1A1 2046/4885HSD17B10 3033/4885HPGD 957/4885
US-20260002021-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD POLR1G, WDR33, PSMB2 ALDH1A1 1287/4885HSD17B10 3379/4885HPGD 1295/4885
US-12624176-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PARG, CAD, COPE ALDH1A1 2478/4885HSD17B10 3891/4885HPGD 1410/4885
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof DSG1, CDH1, CAD ALDH1A1 480/4885HSD17B10 2305/4885HPGD 2672/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.