Trifluoroacetic Acid

Trifluoroacetic Acid

SCHEMBL107133

O=C([O-])C(F)(F)F.c1ccc([S+](c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.45

Full drug profile on Sugi Atlas →

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
CES1 P23141 7/20 0.45
CA2 P00918 1/20 0.38
CA4 P22748 1/20 0.38
PTPN1 P18031 1/20 0.34
FAAH O00519 3/20 0.34
HDAC6 Q9UBN7 2/20 0.34
TDP1 Q9NUW8 1/20 0.34
CES2 O00748 1/20 0.33
MEN1 O00255 1/20 0.33
MAPT P10636 1/20 0.33
HTT P42858 1/20 0.33
RAB9A P51151 1/20 0.33
KMT2A Q03164 1/20 0.33
CPA1 P15085 1/20 0.33
KCNN1 Q92952 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4964687 0.89 CES1 (0.39) CES1CA2CA4PTPN1HDAC6
Trifluoroacetic Acid SCHEMBL12230969 0.86 CES1 (0.48) CES1PTPN1FAAHHDAC6MEN1
Trifluoroacetic Acid SCHEMBL1131290 0.86 HPGD (0.46) CES1MEN1MAPTKMT2A
SCHEMBL6656488 0.86 MAPK1 (0.37) CES1CA2CA4PTPN1HDAC6
Trifluoroacetic Acid SCHEMBL756666 0.85 CES2 (0.45) CES1CA2CA4CES2MAPT
SCHEMBL4962904 0.84 HDAC1 (0.40) CES1CA2CA4PTPN1HDAC6
Bicarbonate SCHEMBL105292 0.84 CA2 (0.46) CES1CA2CA4HDAC6TDP1
Bicarbonate SCHEMBL105290 0.84 CA2 (0.46) CES1CA2CA4HDAC6TDP1
SCHEMBL545780 0.83 CES1 (0.34) CES1CA2CA4HDAC6MEN1
SCHEMBL29745841 0.83 CES1 (0.34) CES1CA2CA4HDAC6MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 728 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260118764-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND SILICON-CONTAINING RESIST UNDERLAYER FILM NISSAN CHEMICAL CORPORATION (JP) 2026-04-30 US disclosed
US-20260118767-A1 REVERSE PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-30 US disclosed
EP-4715465-A1 MULTILAYER BODY, METHOD FOR PRODUCING MULTILAYER BODY, AND PHOTOSENSITIVE SURFACE MODIFIER Nissan Chemical Corporation (JP) 2026-03-25 EP disclosed
US-12585188-B2 Composition for forming resist underlying film NISSAN CHEMICAL CORPORATION (JP) 2026-03-24 US disclosed
US-12570872-B2 Acrylic polymerized polysiloxane, composition comprising the same, and cured film produced using the same MERCK PATENT GMBH (DE) 2026-03-10 US disclosed
CN-121586750-A Composition for forming silicon-containing underlayer film for directional self-assembly 日产化学株式会社 2026-02-27 CN disclosed
US-20260044081-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-02-12 US disclosed
EP-4692943-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION Nissan Chemical Corporation (JP) 2026-02-11 EP disclosed
EP-4692941-A2 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2026-02-11 EP disclosed
EP-4679175-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM Nissan Chemical Corporation (JP) 2026-01-14 EP disclosed
US-5958648-A Radiation sensitive resin composition JSR CORPORATION (JP) 1999-09-28 US disclosed
US-5925484-A Black photosensitive resin composition, color filter made by using the same, and a process for the production thereof TOPPAN PRINTING CO., LTD. (JP) 1999-07-20 US disclosed
EP-0880075-A1 Radiation sensitive resin composition JSR Corporation (JP) 1998-11-25 EP disclosed
EP-0854169-A1 BLACK PHOTOSENSITIVE RESIN COMPOSITION, COLOR FILTER MADE BY USING THE SAME, AND PROCESS FOR THE PRODUCTION THEREOF Toppan Printing Co., Ltd. (JP) 1998-07-22 EP disclosed
US-5773194-A PHOTOSENSITIVITY; DURABILITY KONICA CORPORATION (JP) 1998-06-30 US disclosed
EP-0762208-A2 Light sensitive composition, presensitized lithographic printing plate and image forming method employing the printing plate KONICA CORPORATION (JP) 1997-03-12 EP disclosed
EP-0594452-B1 Radiation sensitive resin composition for microlens JAPAN SYNTHETIC RUBBER CO LTD (JP) 1997-01-15 EP disclosed
US-5432039-A Radiation sensitive quinone diazide and resin composition for microlens JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-07-11 US disclosed
EP-0594452-A2 Radiation sensitive resin composition for microlens JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1994-04-27 EP disclosed
EP-0523957-A1 Radiation-sensitive composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1993-01-20 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12570872-B2 Acrylic polymerized polysiloxane, composition comprising the same, and cured film produced using the same SMC1A, SMC2, SMC3 CES1 2840/4885CA2 4133/4885CA4 4196/4885
US-20260118764-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND SILICON-CONTAINING RESIST UNDERLAYER FILM SRSF1, MACF1, SRPK1 CES1 2191/4885CA2 3173/4885CA4 1459/4885
US-12585188-B2 Composition for forming resist underlying film SRR, SMC1A, ASH2L CES1 762/4885CA2 100/4885CA4 77/4885
US-20260118767-A1 REVERSE PATTERNING PROCESS EFNA1, EPHA4, ETV6 CES1 2618/4885CA2 2902/4885CA4 281/4885
US-20260044081-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS SMC1A, SPOUT1, LBR CES1 3024/4885CA2 2105/4885CA4 1681/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.