SCHEMBL182496

SCHEMBL182496

CCC(C)(C)O[Si](O)(OC(C)(C)CC)OC(C)(C)CC

nearest known ligand 0.43

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.43
TDP1 Q9NUW8 2/20 0.43
ALDH1A1 P00352 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4630501 0.92 ALDH1A1 (0.38) TSHRTDP1ALDH1A1
SCHEMBL4947212 0.92 ALDH1A1 (0.38) TSHRTDP1ALDH1A1
SCHEMBL4630474 0.92 ALDH1A1 (0.38) TSHRTDP1ALDH1A1
SCHEMBL16681999 0.85 ALDH1A1 (0.36) TSHRTDP1ALDH1A1
SCHEMBL1975221 0.82 TSHR (0.43) TSHRTDP1ALDH1A1
SCHEMBL4631286 0.81 ALDH1A1 (0.33) TSHRTDP1ALDH1A1
SCHEMBL4631722 0.81 ALDH1A1 (0.33) TSHRTDP1ALDH1A1
SCHEMBL2284224 0.81 ALDH1A1 (0.30) TSHRTDP1ALDH1A1
SCHEMBL825172 0.80 TSHR (0.41) TSHRTDP1ALDH1A1
SCHEMBL4947163 0.79 ALDH1A1 (0.32) TSHRTDP1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 712 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4744089-A1 SELECTIVE DEPOSITION OF ALUMINUM-CONTAINING DIELECTRIC MATERIAL ON DIELECTRIC OVER METAL UTILIZING ALKYNES Versum Materials US, LLC (US) 2026-05-20 EP claimed
US-20260123372-A1 MANUFACTURING SEMICONDUCTOR DEVICE USING SELECTIVE DIELECTRIC ON DIELECTRIC (DOD) DEPOSITION PROCESS SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-04-30 US claimed
US-20260103796-A1 MULTILAYER COATINGS FOR REDUCED SURFACE METALS ON OXIDE FILMS ENTEGRIS INC (US) 2026-04-16 US claimed
US-12604684-B2 Method and system for mitigating underlayer damage during formation of patterned structures ASM IP HOLDING B.V. (NL) 2026-04-14 US claimed
EP-4719364-A1 PREPARATION OF PHARMACEUTICAL COMPOSITIONS USING SUPERCYCLE VAPOR PHASE DEPOSITION OF INORGANIC OXIDES Applied Materials, Inc. (US) 2026-04-08 EP claimed
US-12571093-B2 Selective deposition of silicon oxide on metal surfaces ASM IP HOLDING B.V. (NL) 2026-03-10 US claimed
US-20260018458-A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME EMD PERFORMANCE MATERIALS CORP. (US) 2026-01-15 US claimed
US-20250376758-A1 SELECTIVE DEPOSITION OF METAL-CONTAINING MATERIAL ASM IP HOLDING BV (NL) 2025-12-11 US claimed
US-12491165-B2 Low temperature silicon oxide coating for pharmaceutical applications APPLIED MATERIALS, INC. (US) 2025-12-09 US claimed
US-12431354-B2 Silicon nitride and silicon oxide deposition methods using fluorine inhibitor ASM IP HOLDING B.V. (NL) 2025-09-30 US claimed
US-20070077717-A1 Method for forming transistor of semiconductor device HYNIX SEMICONDUCTOR INC. (KR) 2007-04-05 US claimed
US-7157385-B2 Method of depositing a silicon dioxide-comprising layer in the fabrication of integrated circuitry MICRON TECHNOLOGY, INC. (US) 2007-01-02 US claimed
US-7135418-B1 Optimal operation of conformal silica deposition reactors NOVELLUS SYSTEMS, INC. (US) 2006-11-14 US claimed
US-20060216548-A1 Nanolaminate thin films and method for forming the same using atomic layer deposition UDC IRELAND LIMITED (IE) 2006-09-28 US claimed
US-7109129-B1 Optimal operation of conformal silica deposition reactors NOVELLUS SYSTEMS, INC. (US) 2006-09-19 US claimed
US-20060189159-A1 Methods of depositing a silicon dioxide comprising layer in the fabrication of integrated circuitry, and methods of forming trench isolation in the fabrication of integrated circuitry DERDERIAN GARO J 2006-08-24 US claimed
US-20060183347-A1 Method of depositing a silicon dioxide-comprising layer in the fabrication of integrated circuitry DERDERIAN GARO J 2006-08-17 US claimed
US-20060046518-A1 Method of increasing deposition rate of silicon dioxide on a catalyst MICRON TECHNOLOGY, INC. (US) 2006-03-02 US claimed
US-20060008972-A1 Method of forming trench isolation in the fabrication of integrated circuitry DERDERIAN GARO J 2006-01-12 US claimed
US-20050054213-A1 Methods of depositing a silicon dioxide comprising layer in the fabrication of integrated circuitry, and methods of forming trench isolation in the fabrication of integrated circuitry OMNIMAX INTERNATIONAL, LLC 2005-03-10 US claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260018458-A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME PARG, PIEZO1, CACNG1 TSHR 4335/4885TDP1 2121/4885ALDH1A1 3558/4885
US-12571093-B2 Selective deposition of silicon oxide on metal surfaces EPCAM, L1CAM, ITGAM TSHR 3108/4885TDP1 4499/4885ALDH1A1 1009/4885
US-20260103796-A1 MULTILAYER COATINGS FOR REDUCED SURFACE METALS ON OXIDE FILMS CBL, CBLB, AGO2 TSHR 3360/4885TDP1 4132/4885ALDH1A1 1250/4885
US-12604684-B2 Method and system for mitigating underlayer damage during formation of patterned structures MRE11, SPOP, OGG1 TSHR 4541/4885TDP1 2463/4885ALDH1A1 4568/4885
US-20260123372-A1 MANUFACTURING SEMICONDUCTOR DEVICE USING SELECTIVE DIELECTRIC ON DIELECTRIC (DOD) DEPOSITION PROCESS PDK1, HPD, HAO2 TSHR 4501/4885TDP1 545/4885ALDH1A1 41/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.