Known targets — ChEMBL curated mechanism
ABCC8ACEADORA1ADORA2AADORA2BADORA3ALDH5A1ALOX5ALOX5APATP4AATP4BBRAFCA1CA12CA2CA4CYSLTR1DHFRDPEP1EDNRAEDNRBESR2F10FDPSFGF1GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGARTGNRHRGSC1HMGCRIMPDH1IMPDH2KCNJ11LY96NOD2NR3C1NS3NS4ANS5bP2RY1P2RY12P2RY2P2RY4P2RY6PBP2XPDE3APDE3BPDE4APDE4BPDE4CPDE4DPDK1PDK2PDK3PDK4PPARGPPATPTGIRPTGS1PTGS2RAF1RYR1RYR3SCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASERPINC1SLC12A1SLC12A3SYKTHRATHRBTLR3TLR4TLR9TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYMSVKORC1XDHblablaIMP-1blaOXA-33blaOXA-58blaT-3blaT-4blaT-5blaT-6dacAdacBdacCfolAfolPfolP1ftsIfusAgaggyrAgyrBmecAmrcAmrcBmrdApbp1apbp1bpbp2pbp2apbp2bpbp3pbp4pbpApbpBpbpCpbpFpolponBrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpoArpoBrpoCrpoZrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GMNN | O75496 | 1/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.48 |
| ▸ | LMNA | P02545 | 1/20 | 0.48 |
| ▸ | TP53 | P04637 | 1/20 | 0.48 |
| ▸ | TSHR | P16473 | 1/20 | 0.48 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.48 |
| ▸ | THPO | P40225 | 1/20 | 0.48 |
| ▸ | HBB | P68871 | 1/20 | 0.48 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.48 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.48 |
| ▸ | BBOX1 | O75936 | 2/20 | 0.40 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.40 |
| ▸ | MAPT | P10636 | 1/20 | 0.40 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.40 |
| ▸ | ENPEP | Q07075 | 2/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL421602 | 0.79 | GMNN (0.52) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL28899359 | 0.79 | GMNN (0.52) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL3890653 | 0.77 | GMNN (0.50) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL27175717 | 0.77 | GMNN (0.50) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL29623226 | 0.75 | GMNN (0.48) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL3580301 | 0.75 | ALDH1A1 (0.48) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL917845 | 0.74 | ALDH1A1 (0.67) | GMNNALDH1A1LMNATP53TSHR | |
| Eprodisate SCHEMBL293813 | 0.74 | ALDH1A1 (0.67) | GMNNALDH1A1LMNATP53TSHR | |
| Potassium Ion SCHEMBL10484570 | 0.74 | GMNN (0.46) | GMNNALDH1A1LMNATP53TSHR | |
| Water SCHEMBL5356499 | 0.72 | GMNN (0.44) | GMNNALDH1A1LMNATP53TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 369 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250357624-A1 | COMPOSITE SEPARATOR, SECONDARY BATTERY AND ELECTRICAL APPARATUS | CONTEMPORARY AMPEREX TECHNOLOGY HONG KONG LTD (CN) | 2025-11-20 | — | — | US | claimed |
| US-20250223717-A1 | COPPER PLATING ADDITIVE COMPOSITIONS, COPPER PLATING SOLUTIONS, AND USES THEREOF | JIANGYIN NANOPORE INNOVATIVE MATERIALS TECHNOLOGY LTD (CN) | 2025-07-10 | — | — | US | claimed |
| US-20250129501-A1 | COPPER FOIL WITH HIGH ELONGATION RATE AND METHOD OF MANUFACTURING SAME | DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY-ACADEMY COOPERATION (KR) | 2025-04-24 | — | — | US | claimed |
| EP-4499903-A1 | COPPER PLATING ADDITIVE COMPOSITIONS, COPPER PLATING SOLUTIONS, AND USES THEREOF | JIANGYIN NANOPORE INNOVATIVE MATERIALS TECHNOLOGY LTD (CN) | 2025-02-05 | — | — | EP | claimed |
| WO-2023179704-A1 | COPPER PLATING ADDITIVE COMPOSITIONS, COPPER PLATING SOLUTIONS, AND USES THEREOF | JIANGYIN NANOPORE INNOVATIVE MATERIALS TECHNOLOGY LTD (CN) | 2023-09-28 | — | — | WO | claimed |
| US-11174566-B2 | Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating | ATOTECH DEUTSCHLAND GMBH (DE) | 2021-11-16 | — | — | US | claimed |
| US-20200141018-A1 | AQUEOUS ACIDIC COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROLYTICALLY DEPOSITING OF A COPPER COATING | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-05-07 | — | — | US | claimed |
| CN-110741109-A | Aqueous acidic copper electroplating bath and method for electrolytically depositing copper coatings | 安美特德国有限公司 | 2020-01-31 | — | — | CN | claimed |
| US-20190333835-A1 | METHODS OF COPPER PLATING THROUGH WAFER VIA | SKYWORKS SOLUTIONS INC (US) | 2019-10-31 | — | — | US | claimed |
| EP-3415664-B1 | AQUEOUS ACIDIC COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROLYTICALLY DEPOSITING OF A COPPER COATING | ATOTECH DEUTSCHLAND GMBH (DE) | 2019-09-18 | — | — | EP | claimed |
| WO-2018228821-A1 | AQUEOUS ACIDIC COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROLYTICALLY DEPOSITING OF A COPPER COATING | ATOTECH DEUTSCHLAND GMBH (DE) | 2018-12-20 | — | — | WO | claimed |
| EP-3415664-A1 | AQUEOUS ACIDIC COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROLYTICALLY DEPOSITING OF A COPPER COATING | ATOTECH Deutschland GmbH (DE) | 2018-12-19 | — | — | EP | claimed |
| US-9476135-B2 | Electro chemical plating process | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2016-10-25 | — | — | US | claimed |
| US-20140262797-A1 | Electro Chemical Plating Process | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2014-09-18 | — | — | US | claimed |
| US-20130193575-A1 | OPTIMIZATION OF COPPER PLATING THROUGH WAFER VIA | SKYWORKS SOLUTIONS, INC. (US) | 2013-08-01 | — | — | US | claimed |
| US-20080149487-A1 | A preprocessing device including a prewetting solution and a plating device to form a plating layer on a semiconductor substrate; prewetting the inside of the via holes to form a wetting layer to improve the absorption of the interior for copper plating; stacking chips by connecting through plated holes | DONGBU HITEK CO., LTD. (KR) | 2008-06-26 | — | — | US | claimed |
| US-20070238287-A1 | Methods of forming semiconductor constructions, and methods of selectively removing metal-containing materials relative to oxide | MICRON TECHNOLOGY, INC. | 2007-10-11 | — | — | US | claimed |
| WO-2004053455-A2 | PLATING BATH COMPOSITION CONTROL | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2004-06-24 | — | — | WO | claimed |
| US-20040108213-A1 | Analyzing; determination by-product concentration; calibration; circulati | ADVANCED TECHNOLOGY MATERIALS, INC. | 2004-06-10 | — | — | US | claimed |
| EP-0058044-B1 | ELECTRODEPOSITION OF CHROMIUM | W. CANNING MATERIALS LIMITED (GB) | 1986-06-18 | — | — | EP | claimed |