SCHEMBL3890653

SCHEMBL3890653

O=S(=O)([O-])CCCSCCSCCCS(=O)(=O)[O-].[Na+].[Na+]

nearest known ligand 0.50

Known targets — ChEMBL curated mechanism

ABCC8ACEADORA1ADORA2AADORA2BADORA3ALDH5A1ALOX5ALOX5APATP4AATP4BBRAFCA1CA12CA2CA4CYSLTR1DHFRDPEP1EDNRAEDNRBESR2F10FDPSFGF1GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGARTGNRHRGSC1HMGCRIMPDH1IMPDH2KCNJ11LY96NOD2NR3C1NS3NS4ANS5bP2RY1P2RY12P2RY2P2RY4P2RY6PBP2XPDE3APDE3BPDE4APDE4BPDE4CPDE4DPDK1PDK2PDK3PDK4PPARGPPATPTGIRPTGS1PTGS2RAF1RYR1RYR3SCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASERPINC1SLC12A1SLC12A3SYKTHRATHRBTLR3TLR4TLR9TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYMSVKORC1XDHblablaIMP-1blaOXA-33blaOXA-58blaT-3blaT-4blaT-5blaT-6dacAdacBdacCfolAfolPfolP1ftsIfusAgaggyrAgyrBmecAmrcAmrcBmrdApbp1apbp1bpbp2pbp2apbp2bpbp3pbp4pbpApbpBpbpCpbpFpolponBrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpoArpoBrpoCrpoZrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
GMNN O75496 1/20 0.50
ALDH1A1 P00352 1/20 0.50
LMNA P02545 1/20 0.50
TP53 P04637 1/20 0.50
TSHR P16473 1/20 0.50
MAPK1 P28482 1/20 0.50
THPO P40225 1/20 0.50
HBB P68871 1/20 0.50
PMP22 Q01453 1/20 0.50
SMN1; SMN2 Q16637 1/20 0.50
KDM4E B2RXH2 1/20 0.42
MAPT P10636 1/20 0.42
ALOX15 P16050 1/20 0.42
BBOX1 O75936 3/20 0.41
ENPEP Q07075 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27175717 1.00 GMNN (0.50) GMNNALDH1A1LMNATP53TSHR
SCHEMBL28899359 0.97 GMNN (0.52) GMNNALDH1A1LMNATP53TSHR
SCHEMBL4662172 0.86 TDP1 (0.43) GMNNALDH1A1LMNATP53TSHR
SCHEMBL29283218 0.86 KDM4E (0.52) GMNNALDH1A1LMNATP53TSHR
SCHEMBL29283222 0.86 KDM4E (0.52) GMNNALDH1A1LMNATP53TSHR
SCHEMBL4772745 0.84 GMNN (0.41) GMNNALDH1A1LMNATP53TSHR
SCHEMBL4662525 0.83 BBOX1 (0.47) GMNNALDH1A1LMNATP53TSHR
SCHEMBL421602 0.81 GMNN (0.52) GMNNALDH1A1LMNATP53TSHR
SCHEMBL751070 0.80 KDM4E (0.48) GMNNALDH1A1LMNATP53TSHR
SCHEMBL29283227 0.78 GMNN (0.33) GMNNALDH1A1LMNATP53TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1651801-A2 AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION ATOTECH Deutschland GmbH (DE) 2006-05-03 EP claimed
WO-2005014891-A2 AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION ATOTECH DEUTSCHLAND GMBH (DE) 2005-02-17 WO claimed
CN-113924669-B Copper foil capable of preventing occurrence of wrinkles, electrode comprising the same, secondary battery comprising the same, and method for manufacturing the same SK纳力世有限公司 2025-04-29 CN disclosed
EP-2010698-B1 PROCESS FOR ELECTROLYTICALLY PLATING COPPER MACDERMID INC (US) 2013-07-03 EP disclosed
US-7575666-B2 electrodeposition of copper metal on a very small printed circuit and carry out in confined spaces; pre-treatment solution contains anti-suppressor disodium bis(3-sulfopropyl) disulfide; lower the surface tension with surfactant or wetting agent CITIBANK, N.A. 2009-08-18 US disclosed
EP-2010698-A2 PROCESS FOR ELECTROLYTICALLY PLATING COPPER MacDermid, Incorporated (US) 2009-01-07 EP disclosed
WO-2007126453-A2 PROCESS FOR ELECTROLYTICALLY PLATING COPPER MACDERMID, INCORPORATED (US) 2007-11-08 WO disclosed
US-20070235343-A1 Process for electrolytically plating copper CITIBANK, N.A. 2007-10-11 US disclosed
EP-1651801-A2 AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION ATOTECH Deutschland GmbH (DE) 2006-05-03 EP disclosed
WO-2005014891-A2 AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION ATOTECH DEUTSCHLAND GMBH (DE) 2005-02-17 WO disclosed