Known targets — ChEMBL curated mechanism
ABCC8ACEADORA1ADORA2AADORA2BADORA3ALDH5A1ALOX5ALOX5APATP4AATP4BBRAFCA1CA12CA2CA4CYSLTR1DHFRDPEP1EDNRAEDNRBESR2F10FDPSFGF1GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGARTGNRHRGSC1HMGCRIMPDH1IMPDH2KCNJ11LY96NOD2NR3C1NS3NS4ANS5bP2RY1P2RY12P2RY2P2RY4P2RY6PBP2XPDE3APDE3BPDE4APDE4BPDE4CPDE4DPDK1PDK2PDK3PDK4PPARGPPATPTGIRPTGS1PTGS2RAF1RYR1RYR3SCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASERPINC1SLC12A1SLC12A3SYKTHRATHRBTLR3TLR4TLR9TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYMSVKORC1XDHblablaIMP-1blaOXA-33blaOXA-58blaT-3blaT-4blaT-5blaT-6dacAdacBdacCfolAfolPfolP1ftsIfusAgaggyrAgyrBmecAmrcAmrcBmrdApbp1apbp1bpbp2pbp2apbp2bpbp3pbp4pbpApbpBpbpCpbpFpolponBrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpoArpoBrpoCrpoZrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GMNN | O75496 | 1/20 | 0.52 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.52 |
| ▸ | LMNA | P02545 | 1/20 | 0.52 |
| ▸ | TP53 | P04637 | 1/20 | 0.52 |
| ▸ | TSHR | P16473 | 1/20 | 0.52 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.52 |
| ▸ | THPO | P40225 | 1/20 | 0.52 |
| ▸ | HBB | P68871 | 1/20 | 0.52 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.52 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.52 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.43 |
| ▸ | MAPT | P10636 | 1/20 | 0.43 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.43 |
| ▸ | BBOX1 | O75936 | 3/20 | 0.43 |
| ▸ | ENPEP | Q07075 | 2/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Potassium Ion SCHEMBL10484570 | 0.94 | GMNN (0.46) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL564573 | 0.92 | GMNN (0.50) | GMNNALDH1A1LMNATP53TSHR | |
| Water SCHEMBL5356499 | 0.92 | GMNN (0.44) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL10484654 | 0.90 | GMNN (0.48) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL29623226 | 0.90 | GMNN (0.48) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL565085 | 0.85 | ALDH1A1 (0.44) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL17819132 | 0.85 | ALDH1A1 (0.44) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL28899359 | 0.83 | GMNN (0.52) | GMNNALDH1A1LMNATP53TSHR | |
| 2,2'-Dithiodiethanesulfonic Acid SCHEMBL835029 | 0.82 | KDM4E (0.48) | GMNNALDH1A1LMNATP53TSHR | |
| 2,2'-Dithiodiethanesulfonic Acid SCHEMBL18847 | 0.82 | KDM4E (0.48) | GMNNALDH1A1LMNATP53TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 992 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4746079-A1 | SECONDARY BATTERY AND PREPARATION METHOD THEREFOR, AND ELECTRIC DEVICE | Contemporary Amperex Technology Co., Limited (CN) | 2026-05-20 | — | — | EP | claimed |
| EP-4723250-A1 | CURRENT COLLECTOR, ELECTRODE SHEET, SECONDARY BATTERY, ELECTRIC DEVICE, COPPER FOIL, AND PREPARATION METHOD FOR COPPER FOIL | Contemporary Amperex Technology Co., Limited (CN) | 2026-04-08 | — | — | EP | claimed |
| EP-4703500-A1 | TRIVALENT CHROMIUM PLATING BATH | Dr.-Ing. Max Schlötter GmbH & Co. KG (DE) | 2026-03-04 | — | — | EP | claimed |
| US-12467155-B2 | Copper plating solution and negative electrode composite current collector prepared using same | CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED (CN) | 2025-11-11 | — | — | US | claimed |
| EP-4611156-A1 | COMPOSITE SEPARATOR, SECONDARY BATTERY, AND ELECTRICAL APPARATUS | Contemporary Amperex Technology (Hong Kong) Limited (HK) | 2025-09-03 | — | — | EP | claimed |
| CN-119776922-A | Tinning additive | 江西理工大学 | 2025-04-08 | — | — | CN | claimed |
| EP-4524292-A1 | METHOD FOR MANUFACTURING ELECTROLYTIC COPPER FOIL | Korea Zinc Co., Ltd. (KR) | 2025-03-19 | — | — | EP | claimed |
| EP-4524293-A1 | METHOD FOR CONTROLLING PROPERTIES OF ELECTROLYTIC COPPER FOIL, AND MANUFACTURING METHOD THEREFOR | Korea Zinc Co., Ltd. (KR) | 2025-03-19 | — | — | EP | claimed |
| US-20250019852-A1 | METHOD OF CONTROLLING PROPERTIES OF ELECTROLYTIC COPPER FOIL AND MANUFACTURING THE SAME | KZAM CORPORATION (KR) | 2025-01-16 | — | — | US | claimed |
| CN-114073170-B | Flexible printed wiring board and method for manufacturing the same | 住友电气工业株式会社 | 2025-01-03 | — | — | CN | claimed |
| US-20030070934-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-04-17 | — | — | US | claimed |
| US-20030066756-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-04-10 | — | — | US | claimed |
| EP-1300486-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | claimed |
| EP-1300487-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | claimed |
| EP-1300488-A2 | Plating path and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | claimed |
| US-20010013472-A1 | Forming copper film on insulation layer; immersion in solution of plating promoter; removing promoter from copper film leaving it on side walls and bottoms of via holes; electroplating to fill holes; improvement over planarization | SHINKO ELECTRIC INDUSTRIES CO., LTD. (JP) | 2001-08-16 | — | — | US | claimed |
| EP-1122989-A2 | Method of plating for filling via holes | SHINKO ELECTRIC INDUSTRIES CO. LTD. (JP) | 2001-08-08 | — | — | EP | claimed |
| EP-0058044-B1 | ELECTRODEPOSITION OF CHROMIUM | W. CANNING MATERIALS LIMITED (GB) | 1986-06-18 | — | — | EP | claimed |
| EP-0058044-A1 | Electrodeposition of chromium | W. CANNING MATERIALS LIMITED (GB) | 1982-08-18 | — | — | EP | claimed |
| US-4233112-A | PRINTED CIRCUITS | DART INDUSTRIES INC. (US) | 1980-11-11 | — | — | US | claimed |