Known targets — ChEMBL curated mechanism
ABCC8ACEADORA1ADORA2AADORA2BADORA3ALDH5A1ALOX5ALOX5APATP4AATP4BBRAFCA1CA12CA2CA4CYSLTR1DHFRDPEP1EDNRAEDNRBESR2F10FDPSFGF1GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGARTGNRHRGSC1HMGCRIMPDH1IMPDH2KCNJ11LY96NOD2NR3C1NS3NS4ANS5bP2RY1P2RY12P2RY2P2RY4P2RY6PBP2XPDE3APDE3BPDE4APDE4BPDE4CPDE4DPDK1PDK2PDK3PDK4PPARGPPATPTGIRPTGS1PTGS2RAF1RYR1RYR3SCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASERPINC1SLC12A1SLC12A3SYKTHRATHRBTLR3TLR4TLR9TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYMSVKORC1XDHblablaIMP-1blaOXA-33blaOXA-58blaT-3blaT-4blaT-5blaT-6dacAdacBdacCfolAfolPfolP1ftsIfusAgaggyrAgyrBmecAmrcAmrcBmrdApbp1apbp1bpbp2pbp2apbp2bpbp3pbp4pbpApbpBpbpCpbpFpolponBrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpoArpoBrpoCrpoZrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GMNN | O75496 | 1/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.50 |
| ▸ | LMNA | P02545 | 1/20 | 0.50 |
| ▸ | TP53 | P04637 | 1/20 | 0.50 |
| ▸ | TSHR | P16473 | 1/20 | 0.50 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.50 |
| ▸ | THPO | P40225 | 1/20 | 0.50 |
| ▸ | HBB | P68871 | 1/20 | 0.50 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.50 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.50 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.42 |
| ▸ | MAPT | P10636 | 1/20 | 0.42 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.42 |
| ▸ | BBOX1 | O75936 | 3/20 | 0.41 |
| ▸ | ENPEP | Q07075 | 2/20 | 0.39 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10484654 | 0.97 | GMNN (0.48) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL421602 | 0.92 | GMNN (0.52) | GMNNALDH1A1LMNATP53TSHR | |
| Potassium Ion SCHEMBL10484570 | 0.86 | GMNN (0.46) | GMNNALDH1A1LMNATP53TSHR | |
| Water SCHEMBL5356499 | 0.84 | GMNN (0.44) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL917845 | 0.83 | ALDH1A1 (0.67) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL29623226 | 0.82 | GMNN (0.48) | GMNNALDH1A1LMNATP53TSHR | |
| 2,2'-Dithiodiethanesulfonic Acid SCHEMBL835029 | 0.80 | KDM4E (0.48) | GMNNALDH1A1LMNATP53TSHR | |
| 2,2'-Dithiodiethanesulfonic Acid SCHEMBL18847 | 0.80 | KDM4E (0.48) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL921255 | 0.80 | TSHR (0.63) | GMNNALDH1A1LMNATP53TSHR | |
| SCHEMBL3386062 | 0.80 | TSHR (0.63) | GMNNALDH1A1LMNATP53TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 92 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1300487-B1 | Copper plating bath | ROHM & HAAS ELECT MAT (US) | 2017-10-04 | — | — | EP | claimed |
| US-9598787-B2 | Method of filling through-holes | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2017-03-21 | — | — | US | claimed |
| EP-1651801-A2 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH Deutschland GmbH (DE) | 2006-05-03 | — | — | EP | claimed |
| US-6911068-B2 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. (US) | 2005-06-28 | — | — | US | claimed |
| WO-2005014891-A2 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH DEUTSCHLAND GMBH (DE) | 2005-02-17 | — | — | WO | claimed |
| US-20040206631-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2004-10-21 | — | — | US | claimed |
| US-20040104124-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2004-06-03 | — | — | US | claimed |
| US-6736954-B2 | A METAL PLATING BATH COMPRISING METAL SALTS AND AN ADDITIVE CONSUMPTION INHIBITOR(A HETEROATOM ORGANIC COMPOUNDS WHICH MAY CONTAIN SULFUR, OXYGEN OR NITROGEN HETEROATOMS) IMPROVE THE BRIGHTNESS OF PLATED METAL AS WELL AS THE DUCTILITY | SHIPLEY COMPANY, L.L.C. | 2004-05-18 | — | — | US | claimed |
| US-20040074778-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. (US) | 2004-04-22 | — | — | US | claimed |
| US-20030102226-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-06-05 | — | — | US | claimed |
| US-20030085132-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-05-08 | — | — | US | claimed |
| EP-1308540-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-05-07 | — | — | EP | claimed |
| EP-1308541-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Company LLC (US) | 2003-05-07 | — | — | EP | claimed |
| US-20030070934-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-04-17 | — | — | US | claimed |
| US-20030066756-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-04-10 | — | — | US | claimed |
| EP-1300486-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | claimed |
| EP-1300487-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | claimed |
| EP-1300488-A2 | Plating path and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | claimed |
| US-12325927-B2 | Complex waveform for electrolytic plating | MACDERMID ENTHONE INC. (US) | 2025-06-10 | — | — | US | disclosed |
| EP-1300486-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | disclosed |