SCHEMBL5132867

SCHEMBL5132867

C=Cc1ccccc1-c1ccc(CCC)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 2/20 0.41
MAOB P27338 2/20 0.38
LPL P06858 1/20 0.35
LIPG Q9Y5X9 1/20 0.35
NISCH Q9Y2I1 1/20 0.35
ALDH1A1 P00352 2/20 0.34
MAPT P10636 2/20 0.34
KDM4E B2RXH2 1/20 0.34
LMNA P02545 1/20 0.34
GAA P10253 1/20 0.34
HPGD P15428 1/20 0.34
HTT P42858 1/20 0.34
CACNA1B Q00975 1/20 0.34
APBA1 Q02410 1/20 0.34
MCL1 Q07820 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
NPSR1 Q6W5P4 1/20 0.34
CNR1 P21554 1/20 0.34
CNR2 P34972 1/20 0.34
HSD11B1 P28845 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3301861 0.87 THRA (0.47) THRBALDH1A1MAPTKDM4ELMNA
SCHEMBL4508207 0.86 TP53 (0.41) ALDH1A1MAPTKDM4ELMNAHTT
SCHEMBL6284038 0.83 XDH (0.45) THRBMAOBLPLLIPGALDH1A1
SCHEMBL5039208 0.82 HTR7 (0.45) CNR1CNR2ALOX5PDK2
SCHEMBL8029291 0.81 MAOB (0.47) MAOBLPLLIPGNISCHMAPT
SCHEMBL2467050 0.81 ALDH1A1 (0.48) THRBALDH1A1LMNAHPGD
SCHEMBL7922968 0.80 MAOB (0.36) THRBMAOBMCL1
SCHEMBL7922963 0.80 MAOB (0.36) THRBMAOBMCL1
SCHEMBL28488901 0.80 PSMB5 (0.43) THRBCNR1CNR2ALOX5PDK2
SCHEMBL27728679 0.79 ALDH1A1 (0.41) MAOBALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof NOTARK CORPORATION (US) 2026-02-10 US disclosed
US-20260035495-A1 FUNCTIONAL COPOLYMERS AND METHODS OF PREPARATION THEREOF Kraton Corporation (US) 2026-02-05 US disclosed
US-20250367910-A1 LAMINATES BASED ON COPOLYMERS OF DIISOALKENYLARENES NOTARK CORPORATION (US) 2025-12-04 US disclosed
US-12447719-B2 Metal-clad laminate, wiring board, resin-including metal foil, and resin composition PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-10-21 US disclosed
US-12312452-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-05-27 US disclosed
US-12233621-B2 Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-02-25 US disclosed
WO-2024219272-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME 日本化薬株式会社 2024-10-24 WO disclosed
US-12109779-B2 Copper-clad laminate, wiring board, and copper foil with resin PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-10-08 US disclosed
US-12024590-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-07-02 US disclosed
US-20210246251-A1 RESIN COMPOSITION, PREPREG, RESIN-ADDED FILM, RESIN-ADDED METAL FOIL, METAL-CLAD LAYERED PLATE, AND WIRING PLATE PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2021-08-12 US disclosed
WO-2021079817-A1 METAL CLAD LAMINATE, WIRING BOARD, RESIN-INCLUDING METAL FOIL, AND RESIN COMPOSITION パナソニックIPマネジメント株式会社 2021-04-29 WO disclosed
WO-2021079819-A1 COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN パナソニックIPマネジメント株式会社 2021-04-29 WO disclosed
WO-2021060178-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2021-04-01 WO disclosed
WO-2021024923-A1 RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD パナソニックIPマネジメント株式会社 2021-02-11 WO disclosed
WO-2020230870-A1 COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL パナソニックIPマネジメント株式会社 2020-11-19 WO disclosed
WO-2020196759-A1 PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2020-10-01 WO disclosed
WO-2020017399-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE AND WIRING BOARD パナソニックIPマネジメント株式会社 2020-01-23 WO disclosed
US-7402645-B2 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2008-07-22 US disclosed
US-20070155923-A1 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-07-05 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260035495-A1 FUNCTIONAL COPOLYMERS AND METHODS OF PREPARATION THEREOF VCL, FGB, CDH1 THRB 491/4885MAOB 252/4885LPL 4344/4885
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME PSMA1, PSMB10, RAD51 THRB 4026/4885MAOB 4533/4885LPL 1735/4885
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof DSG1, CDH1, CAD THRB 4061/4885MAOB 809/4885LPL 2070/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.