SCHEMBL209447

SCHEMBL209447

Cc1cc(Cc2cc(C)c(O)c(CO)c2)cc(CO)c1O

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SHBG P04278 1/20 1.00
HMGB1 P09429 1/20 0.50
CXCL12 P48061 1/20 0.50
KDM4E B2RXH2 3/20 0.45
CASP6 P55212 1/20 0.45
ESR1 P03372 2/20 0.43
ESR2 Q92731 2/20 0.43
LMNA P02545 1/20 0.38
HTT P42858 1/20 0.38
PTGS1 P23219 2/20 0.37
PTGS2 P35354 2/20 0.37
CA1 P00915 1/20 0.37
CA2 P00918 1/20 0.37
ALDH1A1 P00352 1/20 0.34
HPGD P15428 1/20 0.34
HSD17B10 Q99714 1/20 0.34
MAOA P21397 1/20 0.34
ALK Q9UM73 1/20 0.34
PKM P14618 1/20 0.33
PTPN2 P17706 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30315885 1.00 SHBG (1.00) SHBGHMGB1CXCL12KDM4ECASP6
Water SCHEMBL31169663 0.96 SHBG (0.92) SHBGHMGB1CXCL12KDM4ECASP6
SCHEMBL21096810 0.89 SHBG (0.79) SHBGHMGB1CXCL12KDM4ECASP6
SCHEMBL283462 0.89 SHBG (0.80) SHBGHMGB1CXCL12KDM4ECASP6
SCHEMBL23864789 0.88 SHBG (0.77) SHBGHMGB1CXCL12KDM4ECASP6
SCHEMBL7522709 0.87 SHBG (0.76) SHBGHMGB1CXCL12KDM4ECASP6
SCHEMBL10130969 0.86 SHBG (0.74) SHBGHMGB1CXCL12CA2
SCHEMBL25446766 0.85 SHBG (0.74) SHBGHMGB1CXCL12KDM4ECASP6
SCHEMBL18218331 0.85 SHBG (0.72) SHBGHMGB1CXCL12KDM4ECASP6
SCHEMBL29941878 0.84 SHBG (0.73) SHBGHMGB1CXCL12ESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 433 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119039113-B Method for preparing 4,4' -methylenebis (2-hydroxymethyl-6-methylphenol) 天津久日半导体材料有限公司 2025-02-07 CN claimed
CN-119039113-A Method for preparing 4,4' -methylenebis (2-hydroxymethyl-6-methylphenol) 天津久日半导体材料有限公司 2024-11-29 CN claimed
CN-113831224-B Synthesis method of 4,4' -methylenebis (2-hydroxymethyl-6-methylphenol) 辽宁靖帆新材料有限公司 2024-02-20 CN claimed
WO-2026105628-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 日産化学株式会社 2026-05-21 WO disclosed
WO-2026105630-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 日産化学株式会社 2026-05-21 WO disclosed
CN-122011922-A Bottom anti-reflection coating composition and preparation and application thereof 嘉庚创新实验室 2026-05-12 CN disclosed
US-20260118765-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2026-04-30 US disclosed
US-12601972-B2 Resist underlayer film-forming composition with suppressed degeneration of crosslinking agent NISSAN CHEMICAL CORPORATION (JP) 2026-04-14 US disclosed
EP-4692943-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION Nissan Chemical Corporation (JP) 2026-02-11 EP disclosed
US-20260022203-A1 SELF-CROSSLINKABLE POLYMER AND RESIST UNDERLAYER FILM FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2026-01-22 US disclosed
EP-4679176-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION Nissan Chemical Corporation (JP) 2026-01-14 EP disclosed
US-20080108723-A1 Photosensitive Resin Composition TORAY INDUSTRIES, INC. (JP) 2008-05-08 US disclosed
US-20080108723-A1 Photosensitive Resin Composition TORAY INDUSTRIES, INC. (JP) 2008-05-08 US disclosed
US-20080075999-A1 Polyelectrolyte Material, Polyelectrolyte Component, Membrane Electrode Composite Body, and Polyelectrolyte Type Fuel Cell TORAY INDUSTRIES, INC. (JP) 2008-03-27 US disclosed
US-20040225048-A1 Vibration damping material composition TITECS JAPAN CORPORATION (JP) 2004-11-11 US disclosed
EP-1408075-A1 Vibration damping material composition Titecs Japan Corporation (JP) 2004-04-14 EP disclosed
EP-1375463-A1 OPTICALLY ACTIVE COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION Kansai Research Institute, Inc. (JP) 2004-01-02 EP disclosed
US-20030211421-A1 Optically active compound and photosensitive resin composition KRI, INC. (JP) 2003-11-13 US disclosed
US-5866724-A Positive resist composition and photosensitizers SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1999-02-02 US disclosed
EP-0769485-A1 Positive resist composition and photosensitizers SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1997-04-23 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260118765-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION ASH2L, ASIC1, RPA1 SHBG 4686/4885HMGB1 2409/4885CXCL12 1014/4885
US-20260022203-A1 SELF-CROSSLINKABLE POLYMER AND RESIST UNDERLAYER FILM FORMING COMPOSITION SMC2, SMC4, SMC3 SHBG 1450/4885HMGB1 325/4885CXCL12 2538/4885
US-20030211421-A1 Optically active compound and photosensitive resin composition ARCN1, RAD51, PAM SHBG 3960/4885HMGB1 196/4885CXCL12 2060/4885
US-12601972-B2 Resist underlayer film-forming composition with suppressed degeneration of crosslinking agent BHMT, AADAT, PNMT SHBG 3649/4885HMGB1 1484/4885CXCL12 4240/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.