SCHEMBL4060913

SCHEMBL4060913

Cc1cc(O)c(O)cc1C(c1ccccc1)c1cc(O)c(O)cc1C

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TYR P14679 1/20 0.42
LMNA P02545 3/20 0.39
HTT P42858 2/20 0.39
HKDC1 Q2TB90 1/20 0.38
ACP3 P15309 1/20 0.37
ALDH1A1 P00352 3/20 0.37
MAPT P10636 3/20 0.37
HSD17B10 Q99714 2/20 0.37
NPSR1 Q6W5P4 2/20 0.37
KDM4E B2RXH2 1/20 0.37
CYP1A2 P05177 1/20 0.37
CYP3A4 P08684 1/20 0.37
CYP2D6 P10635 1/20 0.37
G6PD P11413 1/20 0.37
CYP2C9 P11712 1/20 0.37
PKM P14618 1/20 0.37
HPGD P15428 1/20 0.37
ALOX15 P16050 1/20 0.37
ALOX12 P18054 1/20 0.37
MAPK1 P28482 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5612635 0.90 ALDH1A1 (0.45) TYRLMNAHTTHKDC1ACP3
SCHEMBL21096811 0.90 TYR (0.46) TYRLMNAHTTACP3ALDH1A1
SCHEMBL25998080 0.86 ALDH1A1 (0.35) TYRLMNAHTTHKDC1ALDH1A1
SCHEMBL9615467 0.85 LMNA (0.49) TYRLMNAHTTALDH1A1MAPT
SCHEMBL4055460 0.84 ESR1 (0.41) LMNAALDH1A1MAPTHSD17B10NPSR1
SCHEMBL5372483 0.83 ALOX15 (0.56) TYRLMNAHTTHKDC1ALDH1A1
SCHEMBL21087439 0.82 LMNA (0.36) TYRLMNAHKDC1ALDH1A1MAPT
SCHEMBL28539201 0.82 BACE1 (0.50) TYRLMNAHTTHKDC1ALDH1A1
SCHEMBL12922916 0.80 HSD17B1 (0.41) LMNAHTTACP3ALDH1A1MAPT
SCHEMBL278561 0.79 CYP2D6 (0.50) LMNAHTTALDH1A1MAPTHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-7089888-A None JP disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
EP-3498788-B1 SOLDER MASK INKJET INKS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AGFA GEVAERT NV (BE) 2023-05-03 EP disclosed
US-20220411654-A1 Radiation Curable Inkjet Ink for Manufacturing Printed Circuit Boards AGFA-GEVAERT NV (BE) 2022-12-29 US disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
US-20220091509-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-03-24 US disclosed
US-20220025199-A1 RADIATION CURABLE INKJET INK FOR MANUFACTURING PRINTED CIRCUIT BOARDS AGFA-GEVAERT NV (BE) 2022-01-27 US disclosed
US-20220010156-A1 RADIATION CURABLE INKJET INK FOR MANUFACTURING PRINTED CIRCUIT BOARDS AGFA-GEVAERT NV (BE) 2022-01-13 US disclosed
US-20210403738-A1 NOVEL PHOTOINITIATORS AGFA-GEVAERT NV (BE) 2021-12-30 US disclosed
US-20120184100-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-07-19 US disclosed
US-20120184101-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-07-19 US disclosed
US-20120184101-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-07-19 US disclosed
US-7534547-B2 Optically active compound and photosensitive resin composition OSAKA GAS COMPANY LIMITED (JP) 2009-05-19 US disclosed
JP-2007169493-A EPOXY RESIN COMPOSITION FOR SEALING AND SEMICONDUCTOR DEVICE MATSUSHITA ELECTRIC WORKS LTD 2007-07-05 JP disclosed
US-20040225048-A1 Vibration damping material composition TITECS JAPAN CORPORATION (JP) 2004-11-11 US disclosed
EP-1408075-A1 Vibration damping material composition Titecs Japan Corporation (JP) 2004-04-14 EP disclosed
EP-1375463-A1 OPTICALLY ACTIVE COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION Kansai Research Institute, Inc. (JP) 2004-01-02 EP disclosed
US-20030211421-A1 Optically active compound and photosensitive resin composition KRI, INC. (JP) 2003-11-13 US disclosed
JP-H0789888-A PRODUCTION OF BISCATECHOL ASAHI ORGANIC CHEM IND CO LTD 1995-04-04 JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20030211421-A1 Optically active compound and photosensitive resin composition ARCN1, RAD51, PAM TYR 1522/4885LMNA 202/4885HTT 1421/4885
US-20210403738-A1 NOVEL PHOTOINITIATORS AGK, AASDHPPT, BCKDK TYR 1377/4885LMNA 3774/4885HTT 1965/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.