SCHEMBL547609

SCHEMBL547609

CC1C2CC3CC(C2)CC1(OC(=O)CBr)C3

nearest known ligand 0.33

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 2/20 0.33
HSD17B10 Q99714 1/20 0.33
NAAA Q02083 1/20 0.32
ALDH1A1 P00352 2/20 0.31
CYP17A1 P05093 1/20 0.31
EPHX2 P34913 3/20 0.30
CA12 O43570 1/20 0.30
CA2 P00918 1/20 0.30
CA7 P43166 1/20 0.30
CA9 Q16790 1/20 0.30
CA14 Q9ULX7 1/20 0.30
NPSR1 Q6W5P4 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27673001 0.85 OPRM1 (0.36) CYP19A1HSD17B10NAAAALDH1A1EPHX2
SCHEMBL5511555 0.84 ALDH1A1 (0.37) CYP19A1HSD17B10NAAAALDH1A1EPHX2
SCHEMBL548175 0.81 EPHX2 (0.32) ALDH1A1EPHX2
SCHEMBL2812415 0.80 NAAA (0.35) HSD17B10NAAAALDH1A1EPHX2NPSR1
SCHEMBL27659428 0.80 NAAA (0.35) CYP19A1HSD17B10NAAAALDH1A1EPHX2
SCHEMBL2184378 0.78 HSD17B10 (0.35) HSD17B10NAAAALDH1A1EPHX2NPSR1
SCHEMBL5917734 0.78 EPHX2 (0.32) CYP19A1HSD17B10NAAAALDH1A1EPHX2
SCHEMBL5917758 0.77 THRB (0.37) HSD17B10NAAAALDH1A1NPSR1
SCHEMBL7749055 0.77 SCN1A (0.46) CYP19A1ALDH1A1CYP17A1NPSR1
SCHEMBL5359724 0.75 NAAA (0.33) HSD17B10NAAANPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-26 US disclosed
US-20230348351-A1 COMPOUND, POLYMER, COMPOSITION, COMPOSITION FOR FILM FORMATION, PATTERN FORMATION METHOD, INSULATING FILM FORMATION METHOD, AND METHOD FOR PRODUCING COMPOUND MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-11-02 US disclosed
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-02-07 US disclosed
US-11256170-B2 Compound, resist composition, and method for forming resist pattern using it MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-02-22 US disclosed
US-11243467-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-02-08 US disclosed
US-11204552-B2 Radiation-sensitive composition, pattern-forming method and radiation-sensitive acid generating agent JSR CORPORATION (JP) 2021-12-21 US disclosed
US-20210309595-A1 COMPOSITION FOR FORMING OPTICAL COMPONENT, OPTICAL COMPONENT, COMPOUND, AND RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-10-07 US disclosed
US-11130724-B2 Compound, resin, composition, resist pattern formation method, and circuit pattern formation method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-09-28 US disclosed
EP-3831882-A1 OPTICAL COMPONENT-FORMING COMPOSITION, OPTICAL COMPONENT, COMPOUND, AND RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-06-09 EP disclosed
EP-3279727-B1 COMPOUND, RESIST COMPOSITION, AND METHOD FOR FORMING RESIST PATTERN USING IT MITSUBISHI GAS CHEMICAL CO (JP) 2021-06-09 EP disclosed
US-20100047709-A1 RADIATION-SENSITIVE COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2010-02-25 US disclosed
CN-101650531-A Calixarene compound, photoresist base material and composition thereof IDEMITSU KOSAN CO JP 2010-02-17 CN disclosed
CN-100565338-C What comprise the Photoactive compounds potpourri is used for the lithographic photoetching compositions of deep ultraviolet AZ ELECTRONIC MATERIALS JAPAN (JP) 2009-12-02 CN disclosed
EP-2080750-A1 RADIATION-SENSITIVE COMPOSITION Mitsubishi Gas Chemical Company, Inc. (JP) 2009-07-22 EP disclosed
CN-1938259-A Calixarene compound, photoresist base material and composition thereof IDEMITSU KOSAN CO (JP) 2007-03-28 CN disclosed
US-7193106-B2 Halogenoacetoxyadamantane derivatives and process for production thereof IDEMITSU KOSAN CO., LTD. (JP) 2007-03-20 US disclosed
CN-1809789-A Photoresist composition for deep ultraviolet lithography AZ ELECTRONIC MATERIALS USA (US) 2006-07-26 CN disclosed
US-20050258395-A1 Halogenoacetoxyadamantane derivatives and process for production thereof IDEMITSU KOSAN CO., LTD. (JP) 2005-11-24 US disclosed
CN-1659477-A Photoresist composition for deep ultraviolet lithography comprising a mixture of photoactive compounds AZ ELECTRONIC MATERIALS USA (JP) 2005-08-24 CN disclosed
EP-1516867-A1 HALOGENOACETOXYADAMANTANE DERIVATIVES AND PROCESS FOR PRODUCTION THEREOF IDEMITSU KOSAN CO., LTD. (JP) 2005-03-23 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (9 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin SLC39A11, CROCC, TERB1 CYP19A1 3684/4885HSD17B10 3831/4885NAAA 1625/4885
US-11256170-B2 Compound, resist composition, and method for forming resist pattern using it RDX, SLC11A2, FBL CYP19A1 1295/4885HSD17B10 1942/4885NAAA 1768/4885
US-20230348351-A1 COMPOUND, POLYMER, COMPOSITION, COMPOSITION FOR FILM FORMATION, PATTERN FORMATION METHOD, INSULATING FILM FORMATION METHOD, AND METHOD FOR PRODUCING COMPOUND PHOSPHO1, RER1, RIF1 CYP19A1 445/4885HSD17B10 2236/4885NAAA 559/4885
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R CYP19A1 2704/4885HSD17B10 1651/4885NAAA 2016/4885
US-20100047709-A1 RADIATION-SENSITIVE COMPOSITION C1S, C9, RAD51 CYP19A1 1447/4885HSD17B10 3495/4885NAAA 3153/4885
US-11204552-B2 Radiation-sensitive composition, pattern-forming method and radiation-sensitive acid generating agent NOS1, ADCY1, IFNAR1 CYP19A1 1430/4885HSD17B10 4080/4885NAAA 1393/4885
US-11243467-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R CYP19A1 2704/4885HSD17B10 1651/4885NAAA 2016/4885
US-11130724-B2 Compound, resin, composition, resist pattern formation method, and circuit pattern formation method RER1, NBAS, INTS9 CYP19A1 1576/4885HSD17B10 552/4885NAAA 2691/4885
US-20210309595-A1 COMPOSITION FOR FORMING OPTICAL COMPONENT, OPTICAL COMPONENT, COMPOUND, AND RESIN DCXR, MLX, TXN CYP19A1 1678/4885HSD17B10 2952/4885NAAA 3866/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.