Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GABRR1 | P24046 | 5/20 | 0.46 |
| ▸ | SLC1A2 | P43004 | 4/20 | 0.45 |
| ▸ | SLC1A1 | P43005 | 3/20 | 0.45 |
| ▸ | GABRR2 | P28476 | 1/20 | 0.39 |
| ▸ | PEPD | P12955 | 1/20 | 0.38 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.36 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.36 |
| ▸ | GRM8 | O00222 | 1/20 | 0.36 |
| ▸ | GRM6 | O15303 | 1/20 | 0.36 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
| ▸ | APEX1 | P27695 | 1/20 | 0.36 |
| ▸ | GRM5 | P41594 | 1/20 | 0.36 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.36 |
| ▸ | GRM1 | Q13255 | 1/20 | 0.36 |
| ▸ | GRM2 | Q14416 | 1/20 | 0.36 |
| ▸ | GRM3 | Q14832 | 1/20 | 0.36 |
| ▸ | GRM4 | Q14833 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5528485 | 0.86 | GABRR1 (0.43) | GABRR1SLC1A2SLC1A1GABRR2 | |
| SCHEMBL16349314 | 0.84 | GABRR1 (0.53) | GABRR1SLC1A2SLC1A1GABRR2PEPD | |
| SCHEMBL1819281 | 0.84 | GABRR1 (0.53) | GABRR1SLC1A2SLC1A1GABRR2CYP2C9 | |
| SCHEMBL28394520 | 0.84 | GABRR1 (0.53) | GABRR1SLC1A2SLC1A1GABRR2PEPD | |
| SCHEMBL7150608 | 0.84 | GABRR1 (0.59) | GABRR1SLC1A2SLC1A1GABRR2PEPD | |
| SCHEMBL6938207 | 0.84 | GABRR1 (0.59) | GABRR1SLC1A2SLC1A1GABRR2PEPD | |
| SCHEMBL2135258 | 0.84 | GABRR1 (0.59) | GABRR1SLC1A2SLC1A1GABRR2PEPD | |
| SCHEMBL339332 | 0.84 | GABRR1 (0.59) | GABRR1SLC1A2SLC1A1GABRR2PEPD | |
| SCHEMBL20346208 | 0.84 | GABRR1 (0.59) | GABRR1SLC1A2SLC1A1GABRR2PEPD | |
| SCHEMBL709492 | 0.84 | GABRR1 (0.59) | GABRR1SLC1A2SLC1A1GABRR2PEPD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 335 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240218170-A1 | POLYIMIDE RESIN COMPOSITION, POLYIMIDE-BASED ADHESIVE COMPOSITION, POLYIMIDE ADHESIVE FILM, AND FLEXIBLE METAL CLAD LAMINATE FILM | NEXFLEX CO., LTD. (KR) | 2024-07-04 | — | — | US | claimed |
| WO-2023056263-A1 | CADAVERINE-BASED POLYIMIDES | ZYMERGEN INC. (US) | 2023-04-06 | — | — | WO | claimed |
| EP-4028448-A1 | POLYMER LAYERS BY REACTIVE PRINTING | Heraeus Deutschland GmbH & Co. KG (DE) | 2022-07-20 | — | — | EP | claimed |
| CN-112390949-B | High-refractive-index polyimide light diffusant for epoxy resin | 艾森半导体材料(南通)有限公司 | 2022-06-28 | — | — | CN | claimed |
| CN-112898581-B | Zwitterionic electrode interface layer material, zwitterionic polymer and organic photovoltaic element | 位速科技股份有限公司 | 2022-04-26 | — | — | CN | claimed |
| CN-112898581-A | Zwitterionic electrode interface layer material, zwitterionic polymer and organic photovoltaic element | 位速科技股份有限公司 | 2021-06-04 | — | — | CN | claimed |
| WO-2021048219-A1 | POLYMER LAYERS BY REACTIVE PRINTING | HERAEUS DEUTSCHLAND GMBH & CO KG (DE) | 2021-03-18 | — | — | WO | claimed |
| EP-3789425-A1 | POLYMER LAYERS BY REACTIVE PRINTING | Heraeus Deutschland GmbH & Co KG (DE) | 2021-03-10 | — | — | EP | claimed |
| CN-112390949-A | High-refractive-index polyimide light diffusant for epoxy resin | 艾森半导体材料(南通)有限公司 | 2021-02-23 | — | — | CN | claimed |
| EP-3692091-A2 | OPTICALLY TRANSPARENT POLYIMIDES | Zymergen Inc. (US) | 2020-08-12 | — | — | EP | claimed |
| US-20200239635-A1 | OPTICALLY TRANSPARENT POLYIMIDES | AKRON POLYMER SYSTEMS, INC. | 2020-07-30 | — | — | US | claimed |
| CN-111187436-A | High-performance colorless transparent polyimide film and preparation method thereof | 株洲时代华鑫新材料技术有限公司 | 2020-05-22 | — | — | CN | claimed |
| CN-109575285-B | Method for preparing polyimide film by using PI matrix resin | 中国地质大学（北京） | 2020-05-05 | — | — | CN | claimed |
| EP-2787024-B1 | Thermosetting composition, hardened film and electronic component | JNC CORP (JP) | 2017-04-05 | — | — | EP | claimed |
| EP-2787024-A2 | Thermosetting composition, hardened film and electronic component | JNC Corporation (JP) | 2014-10-08 | — | — | EP | claimed |
| US-8796411-B2 | Polyimide precursor composition, polyimide film, and transparent flexible film | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-08-05 | — | — | US | claimed |
| US-20140213722-A1 | THERMOSETTING COMPOSITION, HARDENED FILM AND ELECTRONIC COMPONENT | JNC CORPORATION (JP) | 2014-07-31 | — | — | US | claimed |
| US-20110059305-A1 | POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM, AND TRANSPARENT FLEXIBLE FILM | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2011-03-10 | — | — | US | claimed |
| EP-2248843-A1 | POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM AND TRANSPARENT FLEXIBLE FILM | Hitachi Chemical DuPont Microsystems, Ltd. (JP) | 2010-11-10 | — | — | EP | claimed |
| JP-11080350-A | — | — | None | — | — | JP | disclosed |
| JP-3176484-A | — | — | None | — | — | JP | disclosed |
| US-20260071029-A1 | POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM AND POLYIMIDE/SUBSTRATE LAMINATE | UBE CORP (JP) | 2026-03-12 | — | — | US | disclosed |
| US-20260071028-A1 | BINDER FOR ENERGY STORAGE DEVICE, ELECTRODE FOR ENERGY STORAGE DEVICE, ENERGY STORAGE DEVICE, POLYMER COMPOSITE, AND PRODUCTION METHOD OF BINDER FOR ENERGY STORAGE DEVICE | UBE CORP (JP) | 2026-03-12 | — | — | US | disclosed |
| US-12479194-B2 | Laminate | TOYOBO CO., LTD. (JP) | 2025-11-25 | — | — | US | disclosed |
| US-12472732-B2 | Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device | TOYOBO CO., LTD. (JP) | 2025-11-18 | — | — | US | disclosed |
| US-12391813-B2 | Layered body including inorganic substrate and polyamic acid cured product | TOYOBO CO., LTD. (JP) | 2025-08-19 | — | — | US | disclosed |
| US-20250243324-A1 | POLYIMIDE PRECURSOR COMPOSITION AND METHOD FOR PRODUCING THE SAME | UBE CORPORATION (JP) | 2025-07-31 | — | — | US | disclosed |
| WO-2025079540-A1 | POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM, MULTILAYER OBJECT, AND ELECTRONIC DEVICE SUBSTRATE INCLUDING THESE | ＵＢＥ株式会社 | 2025-04-17 | — | — | WO | disclosed |
| WO-2025047667-A1 | SHEET MATERIAL AND METHOD FOR PRODUCING SHEET MATERIAL | 東洋紡株式会社 | 2025-03-06 | — | — | WO | disclosed |
| EP-4510244-A1 | BINDER FOR POWER STORAGE DEVICE, ELECTRODE FOR POWER STORAGE DEVICE, POWER STORAGE DEVICE, POLYMER COMPOSITE, AND METHOD FOR MANUFACTURING BINDER FOR POWER STORAGE DEVICE | UBE Corporation (JP) | 2025-02-19 | — | — | EP | disclosed |
| US-20250019508-A1 | LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT | TOYOBO CO., LTD. (JP) | 2025-01-16 | — | — | US | disclosed |
| US-12172409-B2 | Laminate of inorganic substrate/polymer film layer with attached protective film, laminate stack, laminate storage method, and laminate transport method | TOYOBO CO., LTD. (JP) | 2024-12-24 | — | — | US | disclosed |
| US-20240375381-A1 | TRANSPARENT HEAT-RESISTANT LAMINATED FILM | TOYOBO CO., LTD. (JP) | 2024-11-14 | — | — | US | disclosed |
| US-12115755-B2 | Laminate of polyimide film and inorganic substrate | TOYOBO CO., LTD. (JP) | 2024-10-15 | — | — | US | disclosed |
| US-20240336033-A1 | LAMINATE | TOYOBO CO., LTD. (JP) | 2024-10-10 | — | — | US | disclosed |
| WO-2024203851-A1 | BINDER FOR POWER STORAGE DEVICE, ELECTRODE FOR POWER STORAGE DEVICE, POWER STORAGE DEVICE, POLYMER COMPOSITE, AND METHOD FOR MANUFACTURING BINDER FOR POWER STORAGE DEVICE | ＵＢＥ株式会社 | 2024-10-03 | — | — | WO | disclosed |
| US-20240278537-A1 | LAMINATE ROLL | TOYOBO CO., LTD. (JP) | 2024-08-22 | — | — | US | disclosed |
| US-20240246319-A1 | LAMINATE | TOYOBO CO., LTD. (JP) | 2024-07-25 | — | — | US | disclosed |
| WO-2024150578-A1 | HEAT-CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ELECTRONIC COMPONENT | JNC株式会社 | 2024-07-18 | — | — | WO | disclosed |
| US-20240227373-A1 | MULTILAYER BODY OF INORGANIC SUBSTRATE AND TRANSPARENT HEAT-RESISTANT POLYMER FILM | TOYOBO CO., LTD. (JP) | 2024-07-11 | — | — | US | disclosed |
| US-20240227363-A1 | LAMINATE OF INORGANIC SUBSTRATE AND HEAT-RESISTANT POLYMER FILM | TOYOBO CO., LTD. (JP) | 2024-07-11 | — | — | US | disclosed |
| US-20240218170-A1 | POLYIMIDE RESIN COMPOSITION, POLYIMIDE-BASED ADHESIVE COMPOSITION, POLYIMIDE ADHESIVE FILM, AND FLEXIBLE METAL CLAD LAMINATE FILM | NEXFLEX CO., LTD. (KR) | 2024-07-04 | — | — | US | disclosed |
| WO-2024135780-A1 | POLYIMIDE FILM, MULTILAYER BODY, FLEXIBLE ELECTRONIC DEVICE AND METHOD FOR PRODUCING FLEXIBLE ELECTRONIC DEVICE | 東洋紡株式会社 | 2024-06-27 | — | — | WO | disclosed |
| EP-4389419-A1 | TRANSPARENT HEAT-RESISTANT LAMINATED FILM | TOYOBO CO., LTD. (JP) | 2024-06-26 | — | — | EP | disclosed |
| WO-2024122376-A1 | EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND PHENOLIC RESIN | 日本化薬株式会社 | 2024-06-13 | — | — | WO | disclosed |
| WO-2024111656-A1 | COMPOUND, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF | 日本化薬株式会社 | 2024-05-30 | — | — | WO | disclosed |
| WO-2024111414-A1 | COMPOUND, CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME | 日本化薬株式会社 | 2024-05-30 | — | — | WO | disclosed |
| EP-4371767-A1 | MULTILAYER BODY OF INORGANIC SUBSTRATE AND TRANSPARENT HEAT-RESISTANT POLYMER FILM | TOYOBO CO., LTD. (JP) | 2024-05-22 | — | — | EP | disclosed |
| EP-4371766-A1 | LAMINATE OF INORGANIC SUBSTRATE AND HEAT-RESISTANT POLYMER FILM | TOYOBO CO., LTD. (JP) | 2024-05-22 | — | — | EP | disclosed |
| US-20240158578-A1 | POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE FILM | UBE CORPORATION (JP) | 2024-05-16 | — | — | US | disclosed |
| EP-4360873-A1 | LAMINATE | TOYOBO CO., LTD. (JP) | 2024-05-01 | — | — | EP | disclosed |
| US-11970578-B2 | Polyimide precursor, polyimide precursor composition, polyimide film, manufacturing method thereof, and use thereof | SK INNOVATION CO., LTD. (KR) | 2024-04-30 | — | — | US | disclosed |
| US-20240116274-A1 | LAMINATE OF INORGANIC SUBSTRATE/POLYMER FILM LAYER WITH ATTACHED PROTECTIVE FILM, LAMINATE STACK, LAMINATE STORAGE METHOD, AND LAMINATE TRANSPORT METHOD | TOYOBO CO., LTD. (JP) | 2024-04-11 | — | — | US | disclosed |
| WO-2024070793-A1 | CURABLE RESIN COMPOSITION, RESIN SHEET AND CURED PRODUCT | 日本化薬株式会社 | 2024-04-04 | — | — | WO | disclosed |
| US-20240075718-A1 | LAMINATE | TOYOBO CO., LTD. (JP) | 2024-03-07 | — | — | US | disclosed |
| US-20240059057-A1 | LAMINATED FILM, LAMINATED FILM MANUFACTURING METHOD, LAMINATE, AND LAMINATE MANUFACTURING METHOD | TOYOBO CO., LTD. (JP) | 2024-02-22 | — | — | US | disclosed |
| US-11898009-B2 | Polyimide, laminate, and electronic device including same | UBE CORPORATION (JP) | 2024-02-13 | — | — | US | disclosed |
| EP-4318676-A1 | POLYIMIDE COMPOUND, NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY BATTERIES THAT USES SAID POLYIMIDE COMPOUND, NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERIES, AND LITHIUM ION SECONDARY BATTERY | Wingo Technology Co., Ltd. (JP) | 2024-02-07 | — | — | EP | disclosed |
| WO-2024024901-A1 | POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM, AND POLYIMIDE FILM/SUBSTRATE LAYERED-PRODUCT | ＵＢＥ株式会社 | 2024-02-01 | — | — | WO | disclosed |
| US-20240034838-A1 | POLYAMIC ACID RESIN AND POLYIMIDE FILM USING THE SAME | DOOSAN CORPORATION (KR) | 2024-02-01 | — | — | US | disclosed |
| WO-2024009853-A1 | LAYERED PRODUCT AND METHOD FOR PRODUCING LAYERED PRODUCT | 東洋紡株式会社 | 2024-01-11 | — | — | WO | disclosed |
| EP-4302994-A1 | LAMINATED FILM, LAMINATED FILM MANUFACTURING METHOD, LAMINATE, AND LAMINATE MANUFACTURING METHOD | TOYOBO CO., LTD. (JP) | 2024-01-10 | — | — | EP | disclosed |
| EP-4302990-A1 | LAMINATE OF INORGANIC SUBSTRATE/POLYMER FILM LAYER WITH ATTACHED PROTECTIVE FILM, LAMINATE STACK, LAMINATE STORAGE METHOD, AND LAMINATE TRANSPORT METHOD | TOYOBO CO., LTD. (JP) | 2024-01-10 | — | — | EP | disclosed |
| WO-2023249053-A1 | METHOD FOR PRODUCING FILM | 東洋紡株式会社 | 2023-12-28 | — | — | WO | disclosed |
| US-11851412-B2 | Diamine compound, method of preparing the same, and composition containing the same | SK INNOVATION CO., LTD. (KR) | 2023-12-26 | — | — | US | disclosed |
| WO-2023243693-A1 | LAMINATE | 東洋紡株式会社 | 2023-12-21 | — | — | WO | disclosed |
| US-11833795-B2 | Multilayer body and method for producing flexible device | TOYOBO CO., LTD. (JP) | 2023-12-05 | — | — | US | disclosed |
| WO-2023199718-A1 | COPOLYIMIDE | 三菱瓦斯化学株式会社 | 2023-10-19 | — | — | WO | disclosed |
| WO-2023189424-A1 | COMPOUND, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREFROM, AND METHOD FOR PRODUCING COMPOUND | 日本化薬株式会社 | 2023-10-05 | — | — | WO | disclosed |
| US-20230312852-A1 | LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT | TOYOBO CO., LTD. (JP) | 2023-10-05 | — | — | US | disclosed |
| WO-2023190555-A1 | POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM, AND POLYIMIDE FILM/SUBSTRATE LAYERED-PRODUCT | ＵＢＥ株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023190687-A1 | POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMIDE FILM, AND POLYIMIDE METAL MULTILAYER BODY | ＵＢＥ株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023189719-A1 | LAMINATE AND METHOD FOR PRODUCING LAMINATE | 東洋紡株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023189411-A1 | MALEIMIDE COMPOUND, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, AMINE COMPOUND AND REACTION PRODUCT OF AMINE COMPOUND WITH MALEIC ANHYDRIDE | 日本化薬株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023190749-A1 | POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMIDE FILM, AND POLYIMIDE METAL MULTILAYER BODY | ＵＢＥ株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023171592-A1 | CURABLE RESIN COMPOSITION, RESIN SHEET, AND CURED PRODUCT OF SAME | 日本化薬株式会社 | 2023-09-14 | — | — | WO | disclosed |
| US-20230279184-A1 | COMPOSITION COMPRISING POLYIMIDE OR PRECURSOR THEREOF, CURED PRODUCT THEREOF, POLYIMIDE FILM COMPRISING CURED PRODUCT, LAMINATE PROVIDED WITH POLYIMIDE FILM, AND DEVICE PROVIDED WITH LAMINATE | LG CHEM, LTD. (KR) | 2023-09-07 | — | — | US | disclosed |
| US-20230271367-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE | TOYOBO CO., LTD. (JP) | 2023-08-31 | — | — | US | disclosed |
| WO-2023157839-A1 | LAMINATE | 東洋紡株式会社 | 2023-08-24 | — | — | WO | disclosed |
| EP-3575281-B1 | DIAMINE COMPOUND, AND POLYIMIDE COMPOUND AND MOLDED ARTICLE IN WHICH SAID DIAMINE COMPOUND IS USED | WINGO TECH CO LTD (JP) | 2023-08-23 | — | — | EP | disclosed |
| WO-2023149581-A1 | SURFACE TREATMENT SOLUTION, AND METHOD FOR MANUFACTURING SURFACE-TREATED RESIN AND RESIN FILM LAMINATE | 豊光社テクノロジーズ株式会社 | 2023-08-10 | — | — | WO | disclosed |
| WO-2023149521-A1 | RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAYERED MATERIAL, RESIN SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 味の素株式会社 | 2023-08-10 | — | — | WO | disclosed |
| EP-4223521-A1 | LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT | TOYOBO CO., LTD. (JP) | 2023-08-09 | — | — | EP | disclosed |
| US-20230242720-A1 | MODULUS MODIFIERS AND FILMS THEREOF | ZYMERGEN ACQUISITION SUB, INC. | 2023-08-03 | — | — | US | disclosed |
| JP-2023107382-A | METHOD FOR PRODUCING POLYAMIDE-IMIDE RESIN FILM, AND METHOD FOR PRODUCING POLYAMIDE-IMIDE RESIN LAMINATED FILM IN WHICH WHITENING IS SUPPRESSED | 三菱ケミカル株式会社 | 2023-08-03 | — | — | JP | disclosed |
| JP-2023105599-A | POLYAMIDE-IMIDE RESIN COMPOSITION, POLYAMIDE-IMIDE RESIN FILM, AND METHOD FOR CONTROLLING MORPHOLOGY OF POLYAMIDE-IMIDE RESIN COMPOSITION | 三菱ケミカル株式会社 | 2023-07-31 | — | — | JP | disclosed |
| WO-2023140276-A1 | POLYIMIDE BINDER PRECURSOR COMPOSITION, AND POWER STORAGE DEVICE USING SAME | ＵＢＥ株式会社 | 2023-07-27 | — | — | WO | disclosed |
| US-11702565-B2 | Polyimide varnish and method for producing same | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-07-18 | — | — | US | disclosed |
| CN-111757904-B | Polyimide precursor, polyimide film, varnish, and substrate | ＵＢＥ株式会社 | 2023-07-14 | — | — | CN | disclosed |
| US-20230211584-A1 | LAYERED PRODUCT INCLUDING HIGH TEMPERATURE-RESISTANT TRANSPARENT FILM | TOYOBO CO., LTD. (JP) | 2023-07-06 | — | — | US | disclosed |
| WO-2023128495-A1 | POLYIMIDE PRECURSOR COMPOSITION WITH IMPROVED FLEXIBILITY AND ELONGATION | 피아이첨단소재 주식회사 | 2023-07-06 | — | — | WO | disclosed |
| EP-4197779-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE | TOYOBO CO., LTD. (JP) | 2023-06-21 | — | — | EP | disclosed |
| US-20230173800-A1 | MULTILAYER BODY COMPRISING HIGHLY HEAT-RESISTANT TRANSPARENT FILM | TOYOBO CO., LTD. (JP) | 2023-06-08 | — | — | US | disclosed |
| EP-4186695-A1 | MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE DEVICE | TOYOBO CO., LTD. (JP) | 2023-05-31 | — | — | EP | disclosed |
| US-20230150252-A1 | MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE DEVICE | TOYOBO CO., LTD. (JP) | 2023-05-18 | — | — | US | disclosed |
| WO-2023080158-A1 | POLYIMIDE PRECURSOR COMPOSITION, AND PRODUCTION METHOD THEREFOR | ＵＢＥ株式会社 | 2023-05-11 | — | — | WO | disclosed |
| WO-2023080059-A1 | DISPERSION OF CARBON NANOTUBES, COATING LIQUID COMPOSITION FOR ELECTRODE USING SAME, ELECTRODE, AND LITHIUM ION SECONDARY BATTERY | 第一工業製薬株式会社 | 2023-05-11 | — | — | WO | disclosed |
| US-20230139268-A1 | FLEXIBLE TUBE FOR ENDOSCOPE, ENDOSCOPIC MEDICAL DEVICE, AND METHODS FOR PRODUCING THE SAME | FUJIFILM CORPORATION (JP) | 2023-05-04 | — | — | US | disclosed |
| WO-2023074259-A1 | AMINE COMPOUND, MALEIMIDE COMPOUND, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF | 日本化薬株式会社 | 2023-05-04 | — | — | WO | disclosed |
| WO-2023074536-A1 | PROTECTIVE FILM-EQUIPPED LAMINATE OF INORGANIC SUBSTRATE AND HEAT-RESISTANT POLYMER FILM | 東洋紡株式会社 | 2023-05-04 | — | — | WO | disclosed |
| WO-2023068089-A1 | PHENOLIC RESIN, EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF | 日本化薬株式会社 | 2023-04-27 | — | — | WO | disclosed |
| WO-2023063122-A1 | CURABLE RESIN COMPOSITION, PREPREG, AND CURED PRODUCT OF SAME | 日本化薬株式会社 | 2023-04-20 | — | — | WO | disclosed |
| WO-2023058408-A1 | LAMINATE EQUIPPED WITH PROTECTIVE-FILM-RELEASE-ASSISTING TAPE | 東洋紡株式会社 | 2023-04-13 | — | — | WO | disclosed |
| WO-2023056263-A1 | CADAVERINE-BASED POLYIMIDES | ZYMERGEN INC. (US) | 2023-04-06 | — | — | WO | disclosed |
| EP-4159440-A1 | LAYERED PRODUCT INCLUDING HIGH TEMPERATURE-RESISTANT TRANSPARENT FILM | TOYOBO CO., LTD. (JP) | 2023-04-05 | — | — | EP | disclosed |
| EP-4159431-A1 | MULTILAYER BODY COMPRISING HIGHLY HEAT-RESISTANT TRANSPARENT FILM | TOYOBO CO., LTD. (JP) | 2023-04-05 | — | — | EP | disclosed |
| WO-2023048121-A1 | POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE FILM | ＵＢＥ株式会社 | 2023-03-30 | — | — | WO | disclosed |
| WO-2023032521-A1 | LAMINATE | 東洋紡株式会社 | 2023-03-09 | — | — | WO | disclosed |
| WO-2023032648-A1 | POLY(AMIC ACID) VARNISH AND METHOD FOR PRODUCING POLY(AMIC ACID) VARNISH | 三井化学株式会社 | 2023-03-09 | — | — | WO | disclosed |
| WO-2023021899-A1 | TRANSPARENT HEAT-RESISTANT LAMINATED FILM | 東洋紡株式会社 | 2023-02-23 | — | — | WO | disclosed |
| WO-2023013453-A1 | ELECTRONIC DISPLAY APPARATUS | 東洋紡株式会社 | 2023-02-09 | — | — | WO | disclosed |
| CN-115667379-A | Resin film and method for producing resin film | 东洋纺株式会社 | 2023-01-31 | — | — | CN | disclosed |
| WO-2023002920-A1 | LAMINATE ROLL | 東洋紡株式会社 | 2023-01-26 | — | — | WO | disclosed |
| WO-2023002919-A1 | LAMINATE | 東洋紡株式会社 | 2023-01-26 | — | — | WO | disclosed |
| WO-2023286685-A1 | LAMINATE OF INORGANIC SUBSTRATE AND HEAT-RESISTANT POLYMER FILM | 東洋紡株式会社 | 2023-01-19 | — | — | WO | disclosed |
| WO-2023286686-A1 | MULTILAYER BODY OF INORGANIC SUBSTRATE AND TRANSPARENT HEAT-RESISTANT POLYMER FILM | 東洋紡株式会社 | 2023-01-19 | — | — | WO | disclosed |
| WO-2023286429-A1 | METHOD FOR MANUFACTURING CIRCUIT BOARD, CIRCUIT BOARD PRECURSOR WITH RELEASE FILM, AND CIRCUIT BOARD PRECURSOR WITH INORGANIC SUBSTRATE | 東洋紡株式会社 | 2023-01-19 | — | — | WO | disclosed |
| US-20230002547-A1 | COMPOUND, MIXTURE, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING COMPOUND | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2023-01-05 | — | — | US | disclosed |
| WO-2023276864-A1 | SILSESQUIOXANE COMPOUND AND METHOD FOR PRODUCING SAME | 東洋紡株式会社 | 2023-01-05 | — | — | WO | disclosed |
| WO-2023276880-A1 | POLYAMIC ACID, POLYIMIDE, AND USE THEREOF | 東洋紡株式会社 | 2023-01-05 | — | — | WO | disclosed |
| WO-2023276887-A1 | POLY(AMIC ACID), POLYIMIDE, AND USES THEREOF | 東洋紡株式会社 | 2023-01-05 | — | — | WO | disclosed |
| CN-115551714-A | Laminate comprising transparent highly heat-resistant film | 东洋纺株式会社 | 2022-12-30 | — | — | CN | disclosed |
| WO-2022270325-A1 | LAMINATE | 東洋紡株式会社 | 2022-12-29 | — | — | WO | disclosed |
| CN-115515790-A | Colorless multilayer polyimide film, laminate, and method for manufacturing flexible electronic device | 东洋纺株式会社 | 2022-12-23 | — | — | CN | disclosed |
| US-20220404706-A1 | CHEMICAL-RESISTANT POLYVALENT CARBOXYLIC ACID-CONTAINING PROTECTIVE FILM | NISSAN CHEMICAL CORPORATION (JP) | 2022-12-22 | — | — | US | disclosed |
| CN-115461213-A | Laminate for flexible display device, laminate for display device, and flexible display device | 大日本印刷株式会社 | 2022-12-09 | — | — | CN | disclosed |
| CN-115461221-A | Polyimide film and method for producing same | 东洋纺株式会社 | 2022-12-09 | — | — | CN | disclosed |
| CN-115461214-A | Laminate for flexible display device, laminate for display device, and flexible display device | 大日本印刷株式会社 | 2022-12-09 | — | — | CN | disclosed |
| US-20220389165-A1 | Diamine Compound, Polyimide Precursor and Polyimide Film Using the Same, and Use Thereof | SK IE TECHNOLOGY CO., LTD. (KR) | 2022-12-08 | — | — | US | disclosed |
| CN-115428058-A | Display device member, optical layered body, and display device | 大日本印刷株式会社 | 2022-12-02 | — | — | CN | disclosed |
| WO-2022239494-A1 | METHOD OF PRODUCING RESIN FILM, AND UNCUT FILM | 東洋紡株式会社 | 2022-11-17 | — | — | WO | disclosed |
| CN-110945079-B | Polyimide varnish and method for producing same | 旭化成株式会社 | 2022-10-28 | — | — | CN | disclosed |
| CN-111149019-B | Optical film and image display device | 大日本印刷株式会社 | 2022-10-11 | — | — | CN | disclosed |
| WO-2022210274-A1 | TETRACARBOXYLIC DIANHYDRIDE, CARBONYL COMPOUND, ACID-ANHYDRIDE-GROUP-CONTAINING COMPOUND, METHODS FOR PRODUCING THESE, POLYIMIDE, AND POLYIMIDE PRECURSOR RESIN | ＥＮＥＯＳ株式会社 | 2022-10-06 | — | — | WO | disclosed |
| CN-110684195-B | Polyimide film, polyimide precursor, and polyimide | 宇部兴产株式会社 | 2022-09-27 | — | — | CN | disclosed |
| WO-2022185607-A1 | LAMINATE AND ENGINEERING PLASTIC FILM PROVIDED WITH PROTECTION FILM | 東洋紡株式会社 | 2022-09-09 | — | — | WO | disclosed |
| WO-2022185606-A1 | LAMINATED FILM, LAMINATED FILM MANUFACTURING METHOD, LAMINATE, AND LAMINATE MANUFACTURING METHOD | 東洋紡株式会社 | 2022-09-09 | — | — | WO | disclosed |
| WO-2022186002-A1 | LAMINATE OF INORGANIC SUBSTRATE/POLYMER FILM LAYER WITH ATTACHED PROTECTIVE FILM, LAMINATE STACK, LAMINATE STORAGE METHOD, AND LAMINATE TRANSPORT METHOD | 東洋紡株式会社 | 2022-09-09 | — | — | WO | disclosed |
| US-20220282052-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE | TOYOBO CO., LTD. (JP) | 2022-09-08 | — | — | US | disclosed |
| US-20220274314-A1 | APPARATUS FOR MANUFACTURING LAMINATE AND METHOD FOR MANUFACTURING LAMINATE | TOYOBO CO., LTD. (JP) | 2022-09-01 | — | — | US | disclosed |
| WO-2022176956-A1 | POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE FILM | 宇部興産株式会社 | 2022-08-25 | — | — | WO | disclosed |
| EP-4043215-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE | TOYOBO CO., LTD. (JP) | 2022-08-17 | — | — | EP | disclosed |
| EP-4039447-A1 | APPARATUS FOR MANUFACTURING LAMINATE AND METHOD FOR MANUFACTURING LAMINATE | TOYOBO CO., LTD. (JP) | 2022-08-10 | — | — | EP | disclosed |
| EP-4028448-A1 | POLYMER LAYERS BY REACTIVE PRINTING | Heraeus Deutschland GmbH & Co. KG (DE) | 2022-07-20 | — | — | EP | disclosed |
| CN-112390949-B | High-refractive-index polyimide light diffusant for epoxy resin | 艾森半导体材料(南通)有限公司 | 2022-06-28 | — | — | CN | disclosed |
| WO-2022118629-A1 | POLYMER PRODUCTION METHOD, POLYMER FILM MANUFACTURING METHOD EMPLOYING SAID METHOD, AND LAMINATE MANUFACTURING METHOD | 東洋紡株式会社 | 2022-06-09 | — | — | WO | disclosed |
| WO-2022113415-A1 | LAMINATE | 東洋紡株式会社 | 2022-06-02 | — | — | WO | disclosed |
| WO-2022114136-A1 | POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM, AND POLYIMIDE FILM/SUBSTRATE LAMINATE | 宇部興産株式会社 | 2022-06-02 | — | — | WO | disclosed |
| US-20220162445-A1 | POLYIMIDE COMPOUND AND MOLDED ARTICLE COMPRISING THE POLYIMIDE COMPOUND | WINGO TECHNOLOGY CO., LTD. (JP) | 2022-05-26 | — | — | US | disclosed |
| WO-2022102450-A1 | COLORLESS MULTILAYER POLYIMIDE FILM, LAMINATE BODY, AND FLEXIBLE ELECTRONIC DEVICE MANUFACTURING METHOD | 東洋紡株式会社 | 2022-05-19 | — | — | WO | disclosed |
| WO-2022102449-A1 | POLYIMIDE FILM AND PRODUCTION METHOD THEREFOR | 東洋紡株式会社 | 2022-05-19 | — | — | WO | disclosed |
| WO-2022102451-A1 | POLYIMIDE FILM AND PRODUCTION METHOD THEREFOR | 東洋紡株式会社 | 2022-05-19 | — | — | WO | disclosed |
| US-20220143964-A1 | HEAT-RESISTANT POLYMER FILM LAMINATE AND METHOD FOR PRODUCING HEAT-RESISTANT POLYMER FILM LAMINATE | TOYOBO CO., LTD. (JP) | 2022-05-12 | — | — | US | disclosed |
| CN-112898581-B | Zwitterionic electrode interface layer material, zwitterionic polymer and organic photovoltaic element | 位速科技股份有限公司 | 2022-04-26 | — | — | CN | disclosed |
| WO-2022070617-A1 | LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT | 東洋紡株式会社 | 2022-04-07 | — | — | WO | disclosed |
| WO-2022064890-A1 | TRANSPARENT FILM MANUFACTURING METHOD AND TRANSPARENT FILM | 富士フイルム株式会社 | 2022-03-31 | — | — | WO | disclosed |
| US-20220073681-A1 | Polyimide Precursor, Polyimide Precursor Composition, Polyimide Film, Manufacturing Method Thereof, and Use Thereof | SK IE TECHNOLOGY CO., LTD. (KR) | 2022-03-10 | — | — | US | disclosed |
| US-11267216-B2 | Polymer film laminated substrate and method for producing flexible electronic device | TOYOBO CO., LTD. (JP) | 2022-03-08 | — | — | US | disclosed |
| WO-2022034809-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE | 東洋紡株式会社 | 2022-02-17 | — | — | WO | disclosed |
| EP-3950273-A1 | HEAT-RESISTANT POLYMER FILM LAMINATE AND METHOD FOR PRODUCING HEAT-RESISTANT POLYMER FILM LAMINATE | TOYOBO CO., LTD. (JP) | 2022-02-09 | — | — | EP | disclosed |
| WO-2022018994-A1 | MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE DEVICE | 東洋紡株式会社 | 2022-01-27 | — | — | WO | disclosed |
| WO-2022004852-A1 | RESIN FILM AND PRODUCTION METHOD THEREOF | 東洋紡株式会社 | 2022-01-06 | — | — | WO | disclosed |
| WO-2022006145-A1 | MODULUS MODIFIERS AND FILMS THEREOF | ZYMERGEN INC. (US) | 2022-01-06 | — | — | WO | disclosed |
| WO-2021256298-A1 | COLORLESS MULTILAYER POLYIMIDE FILM, MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE ELECTRONIC DEVICE | 東洋紡株式会社 | 2021-12-23 | — | — | WO | disclosed |
| EP-3919548-A1 | POLYIMIDE COMPOUND AND MOLDED ARTICLE CONTAINING SAID POLYIMIDE COMPOUND | Wingo Technology Co., Ltd. (JP) | 2021-12-08 | — | — | EP | disclosed |
| EP-3919549-A1 | COMPOSITION AND METAL-INSULATING COATING MATERIAL | Mitsubishi Chemical Corporation (JP) | 2021-12-08 | — | — | EP | disclosed |
| WO-2021241572-A1 | POLYIMIDE FILM AND METHOD FOR PRODUCING SAME | 東洋紡株式会社 | 2021-12-02 | — | — | WO | disclosed |
| WO-2021241573-A1 | POLYIMIDE FILM AND METHOD FOR PRODUCING SAME | 東洋紡株式会社 | 2021-12-02 | — | — | WO | disclosed |
| WO-2021241574-A1 | LAMINATE INCLUDING TRANSPARENT FILM WITH HIGH HEAT RESISTANCE | 東洋紡株式会社 | 2021-12-02 | — | — | WO | disclosed |
| WO-2021241570-A1 | MULTILAYER BODY COMPRISING HIGHLY HEAT-RESISTANT TRANSPARENT FILM | 東洋紡株式会社 | 2021-12-02 | — | — | WO | disclosed |
| WO-2021241571-A1 | LAYERED PRODUCT INCLUDING HIGH TEMPERATURE-RESISTANT TRANSPARENT FILM | 東洋紡株式会社 | 2021-12-02 | — | — | WO | disclosed |
| WO-2021215182-A1 | METHOD FOR MANUFACTURING RESIN FILM, AND PRE-CUT FILM | 東洋紡株式会社 (JP) | 2021-10-28 | — | — | WO | disclosed |
| US-20210324144-A1 | COMPOSITION AND METAL INSULATING COVER MATERIAL | MITSUBISHI CHEMICAL CORPORATION (JP) | 2021-10-21 | — | — | US | disclosed |
| US-20210308987-A1 | LAMINATE, AND METHOD FOR PRODUCING LAMINATE | TOYOBO CO., LTD. (JP) | 2021-10-07 | — | — | US | disclosed |
| US-11136286-B2 | Diamine compound, and polyimide compound and molded product using the same | WINGO TECHNOLOGY CO., LTD. (JP) | 2021-10-05 | — | — | US | disclosed |
| US-11124474-B2 | Diamine compound, and polyimide compound and molded product using the same | WINGO TECHNOLOGY CO., LTD. (JP) | 2021-09-21 | — | — | US | disclosed |
| US-11078378-B2 | Polyimide film, polyimide varnish, and product and layered product using the polyimide film | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2021-08-03 | — | — | US | disclosed |
| US-11065853-B2 | Polyimide film layered body | TOYOBO CO., LTD. (JP) | 2021-07-20 | — | — | US | disclosed |
| EP-3450164-B1 | POLYIMIDE FILM LAYERED BODY | TOYO BOSEKI (JP) | 2021-07-14 | — | — | EP | disclosed |
| CN-112898581-A | Zwitterionic electrode interface layer material, zwitterionic polymer and organic photovoltaic element | 位速科技股份有限公司 | 2021-06-04 | — | — | CN | disclosed |
| US-11021572-B2 | Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2021-06-01 | — | — | US | disclosed |
| US-20210139390-A1 | PRODUCTION METHOD OF ORGANIC COMPOUND | UNITIKA LTD. (JP) | 2021-05-13 | — | — | US | disclosed |
| EP-3819283-A1 | METHOD FOR PRODUCING ORGANIC COMPOUND | Unitika Ltd. (JP) | 2021-05-12 | — | — | EP | disclosed |
| US-20210130649-A1 | POLYIMIDE VARNISH AND METHOD FOR PRODUCING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2021-05-06 | — | — | US | disclosed |
| WO-2021085397-A1 | CHEMICAL-RESISTANT POLYCARBOXYLIC ACID-CONTAINING PROTECTIVE FILM | 日産化学株式会社 | 2021-05-06 | — | — | WO | disclosed |
| US-20210122143-A1 | LAMINATE OF POLYIMIDE FILM AND INORGANIC SUBSTRATE | TOYOBO CO., LTD. (JP) | 2021-04-29 | — | — | US | disclosed |
| US-10992009-B2 | Nonaqueous electrolyte battery separator and nonaqueous electrolyte battery | TORAY INDUSTRIES, INC. | 2021-04-27 | — | — | US | disclosed |
| WO-2021070719-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE | 東洋紡株式会社 | 2021-04-15 | — | — | WO | disclosed |
| WO-2021065101-A1 | APPARATUS FOR MANUFACTURING LAMINATE AND METHOD FOR MANUFACTURING LAMINATE | 東洋紡株式会社 | 2021-04-08 | — | — | WO | disclosed |
| CN-107108886-B | Polyimide precursor, polyimide, and polyimide film | 宇部兴产株式会社 | 2021-03-30 | — | — | CN | disclosed |
| WO-2021053800-A1 | SOLVENT-SOLUBLE POLYIMIDE COMPOUND, LITHIUM-ION SECONDARY BATTERY NEGATIVE ELECTRODE PRODUCING RESIN COMPOSITION INCLUDING SAID SOLVENT-SOLUBLE POLYIMIDE COMPOUND, LITHIUM-ION SECONDARY BATTERY NEGATIVE ELECTRODE CONFIGURED USING SAID LITHIUM-ION SECONDARY BATTERY NEGATIVE ELECTRODE PRODUCING RESIN COMPOSITION, AND LITHIUM-ION SECONDARY BATTERY PROVIDED WITH SAID LITHIUM-ION SECONDARY BATTERY NEGATIVE ELECTRODE | ウィンゴーテクノロジー株式会社 | 2021-03-25 | — | — | WO | disclosed |
| WO-2021054476-A1 | METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE | 宇部興産株式会社 | 2021-03-25 | — | — | WO | disclosed |
| WO-2021054475-A1 | POLYIMIDE PRECURSOR COMPOSITION AND METHOD FOR PRODUCING FLEXIBLE ELECTRONIC DEVICE | 宇部興産株式会社 | 2021-03-25 | — | — | WO | disclosed |
| WO-2021048219-A1 | POLYMER LAYERS BY REACTIVE PRINTING | HERAEUS DEUTSCHLAND GMBH & CO KG (DE) | 2021-03-18 | — | — | WO | disclosed |
| US-10947353-B2 | Resin composition | MITSUBISHI CHEMICAL CORPORATION (JP) | 2021-03-16 | — | — | US | disclosed |
| EP-3789425-A1 | POLYMER LAYERS BY REACTIVE PRINTING | Heraeus Deutschland GmbH & Co KG (DE) | 2021-03-10 | — | — | EP | disclosed |
| CN-112390949-A | High-refractive-index polyimide light diffusant for epoxy resin | 艾森半导体材料(南通)有限公司 | 2021-02-23 | — | — | CN | disclosed |
| CN-112321828-A | Bio-based fluorine-containing polyimide resin, preparation method thereof and polyimide film | 合肥利夫生物科技有限公司 | 2021-02-05 | — | — | CN | disclosed |
| CN-108291088-B | Polyamic acid, polyimide, polyamic acid solution, polyimide laminate, flexible device substrate, and method for producing same | 株式会社钟化 | 2021-01-05 | — | — | CN | disclosed |
| US-10857762-B2 | Polymer film coated with a layer of silane coupling agent | TOYOBO CO., LTD. (JP) | 2020-12-08 | — | — | US | disclosed |
| WO-2020241523-A1 | POLYIMIDE PRECURSOR AND POLYIMIDE RESIN COMPOSITION | 旭化成株式会社 | 2020-12-03 | — | — | WO | disclosed |
| WO-2020213640-A1 | AROMATIC-AMINE RESIN, MALEIMIDE RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT OBTAINED THEREFROM | 日本化薬株式会社 | 2020-10-22 | — | — | WO | disclosed |
| WO-2020213639-A1 | MALEIMIDE RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT OBTAINED THEREFROM | 日本化薬株式会社 | 2020-10-22 | — | — | WO | disclosed |
| WO-2020196721-A1 | POLY(AMIC ACID) COMPOSITION, POLYIMIDE COMPOSITION AND POLYIMIDE MOLDED BODY | 株式会社大阪ソーダ | 2020-10-01 | — | — | WO | disclosed |
| WO-2020189556-A1 | POLYIMIDE FILM | 三菱ケミカル株式会社 | 2020-09-24 | — | — | WO | disclosed |
| WO-2020189557-A1 | POLYIMIDE FILM | 三菱ケミカル株式会社 | 2020-09-24 | — | — | WO | disclosed |
| US-10781288-B2 | Polyimide precursor and polyimide | UBE INDUSTRIES, LTD. (JP) | 2020-09-22 | — | — | US | disclosed |
| US-20200262782-A1 | Diamine Compound, and Polyimide Compound and Molded Product Using the Same | WINGO TECHNOLOGY CO., LTD. (JP) | 2020-08-20 | — | — | US | disclosed |
| US-20200262783-A1 | Diamine Compound, and Polyimide Compound and Molded Product Using the Same | WINGO TECHNOLOGY CO., LTD. (JP) | 2020-08-20 | — | — | US | disclosed |
| EP-3692091-A2 | OPTICALLY TRANSPARENT POLYIMIDES | Zymergen Inc. (US) | 2020-08-12 | — | — | EP | disclosed |
| WO-2020157953-A1 | POLYIMIDE COMPOUND AND MOLDED ARTICLE CONTAINING SAID POLYIMIDE COMPOUND | ウィンゴーテクノロジー株式会社 | 2020-08-06 | — | — | WO | disclosed |
| US-20200239635-A1 | OPTICALLY TRANSPARENT POLYIMIDES | AKRON POLYMER SYSTEMS, INC. | 2020-07-30 | — | — | US | disclosed |
| WO-2020141614-A2 | POLYIMIDE, POLYAMIC ACID, RESIN SOLUTION, COATING AGENT, AND POLYIMIDE FILM | ＪＸＴＧエネルギー株式会社 | 2020-07-09 | — | — | WO | disclosed |
| WO-2020137879-A1 | POWDER LIQUID DISPERSION, LAYERED PRODUCT, AND PRINTED BASE BOARD | ＡＧＣ株式会社 | 2020-07-02 | — | — | WO | disclosed |
| WO-2020138034-A1 | RESIN COMPOSITION USED FOR FORMING RESIST PATTERN, AND SEMICONDUCTOR PRODUCT MANUFACTURING METHOD | 株式会社カネカ | 2020-07-02 | — | — | WO | disclosed |
| US-10683259-B2 | Diamine compound, and polyimide compound and molded product using the same | WINGO TECHNOLOGY CO., LTD. (JP) | 2020-06-16 | — | — | US | disclosed |
| US-20200180259-A1 | POLYMER FILM LAMINATED SUBSTRATE AND METHOD FOR PRODUCING FLEXIBLE ELECTRONIC DEVICE | TOYOBO CO., LTD. (JP) | 2020-06-11 | — | — | US | disclosed |
| CN-107001662-B | Polyimide film, polyimide precursor, and polyimide | 宇部兴产株式会社 | 2020-05-05 | — | — | CN | disclosed |
| CN-109575285-B | Method for preparing polyimide film by using PI matrix resin | 中国地质大学（北京） | 2020-05-05 | — | — | CN | disclosed |
| US-20200133048-A1 | POLYIMIDE FILM | UBE INDUSTRIES, LTD. (JP) | 2020-04-30 | — | — | US | disclosed |
| EP-3611224-A1 | COMPOSITION, COMPOSITE FILM AND MEMBRANE ELECTRODE ASSEMBLY | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-02-19 | — | — | EP | disclosed |
| US-20200031997-A1 | TRANSPARENT POLYIMIDE FILMS AND METHOD OF PREPARATION | RayiTEK Hi-tech Film Company, Ltd. (CN) | 2020-01-30 | — | — | US | disclosed |
| CN-110684195-A | Polyimide film, polyimide precursor, and polyimide | 宇部兴产株式会社 | 2020-01-14 | — | — | CN | disclosed |
| CN-110628025-A | Polyimide precursor, polyimide, and material for use in preparation thereof | 宇部兴产株式会社 | 2019-12-31 | — | — | CN | disclosed |
| EP-3575281-A1 | DIAMINE COMPOUND, AND POLYIMIDE COMPOUND AND MOLDED ARTICLE IN WHICH SAID DIAMINE COMPOUND IS USED | Wingo Technology Co., Ltd. (JP) | 2019-12-04 | — | — | EP | disclosed |
| EP-3534431-A1 | SEPARATOR FOR NONAQUEOUS-ELECTROLYTE CELL, AND NONAQUEOUS-ELECTROLYTE CELL | Toray Industries, Inc. (JP) | 2019-09-04 | — | — | EP | disclosed |
| US-20190161580-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT OF SAME, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2019-05-30 | — | — | US | disclosed |
| US-20190134963-A1 | POLYIMIDE FILM LAYERED BODY | TOYOBO CO., LTD. (JP) | 2019-05-09 | — | — | US | disclosed |
| US-20190094733-A1 | POLYESTER RESIN FOR TONERS, METHOD FOR PRODUCING SAME, TONER AND METHOD FOR PRODUCING TONER | MITSUBISHI CHEMICAL CORPORATION (JP) | 2019-03-28 | — | — | US | disclosed |
| EP-3438992-A1 | RESIN COMPOSITION | Mitsubishi Chemical Corporation (JP) | 2019-02-06 | — | — | EP | disclosed |
| US-20190031844-A1 | RESIN COMPOSITION | MITSUBISHI CHEMICAL CORPORATION (JP) | 2019-01-31 | — | — | US | disclosed |
| US-10189949-B2 | Transparent polyimide copolymer, polyimide resin composition and molded article, and production method of said copolymer | SOMAR CORPORATION (JP) | 2019-01-29 | — | — | US | disclosed |
| US-10174166-B2 | Polyimide precursor, polyimide, varnish, polyimide film, and substrate | UBE INDUSTRIES, LTD. (JP) | 2019-01-08 | — | — | US | disclosed |
| US-20180355172-A1 | POLYAMIDE ACID, POLYIMIDE, POLYAMIDE ACID SOLUTION, POLYIMIDE LAMINATE, FLEXIBLE DEVICE SUBSTRATE, AND PRODUCTION METHODS THEREOF | KANEKA CORPORATION (JP) | 2018-12-13 | — | — | US | disclosed |
| US-10053541-B2 | — | — | 2018-08-21 | — | — | US | disclosed |
| US-20180208766-A1 | POLYAMIC ACID SOLUTION COMPOSITION AND POLYIMIDE FILM | UBE INDUSTRIES, LTD. (JP) | 2018-07-26 | — | — | US | disclosed |
| US-20180171077-A1 | POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE COMPOSITION | UBE INDUSTRIES, LTD. (JP) | 2018-06-21 | — | — | US | disclosed |
| US-20180086939-A1 | POLYIMIDE FILM, POLYIMIDE VARNISH, AND PRODUCT AND LAYERED PRODUCT USING THE POLYIMIDE FILM | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2018-03-29 | — | — | US | disclosed |
| EP-3279237-A1 | POLYIMIDE FILM, POLYIMIDE VARNISH, PRODUCT USING POLYIMIDE FILM, AND LAMINATE | Asahi Kasei Kabushiki Kaisha (JP) | 2018-02-07 | — | — | EP | disclosed |
| US-20170342215-A1 | POLYIMIDE FILM, POLYIMIDE PRECURSOR, AND POLYIMIDE | UBE INDUSTRIES, LTD. (JP) | 2017-11-30 | — | — | US | disclosed |
| US-20170313821-A1 | POLYIMIDE PRECURSOR, POLYIMIDE, AND POLYIMIDE FILM | UBE INDUSTRIES, LTD. (JP) | 2017-11-02 | — | — | US | disclosed |
| US-9783640-B2 | Polyimide precursor, polyimide, polyimide film, varnish, and substrate | UBE INDUSTRIES, LTD. (JP) | 2017-10-10 | — | — | US | disclosed |
| US-9758623-B2 | Polyimide precursor and polyimide | UBE INDUSTRIES, LTD. (JP) | 2017-09-12 | — | — | US | disclosed |
| US-20170225433-A1 | POLYMER FILM COATED WITH A LAYER OF SILANE COUPLING AGENT | TOYOBO CO., LTD. (JP) | 2017-08-10 | — | — | US | disclosed |
| EP-3187331-A1 | POLYMER FILM COATED WITH LAYER OF SILANE COUPLING AGENT | Toyobo Co., Ltd. (JP) | 2017-07-05 | — | — | EP | disclosed |
| US-20170165879-A1 | RESIN PRECURSOR, RESIN COMPOSITION CONTAINING SAME, POLYIMIDE RESIN MEMBRANE, RESIN FILM, AND METHOD FOR PRODUCING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-06-15 | — | — | US | disclosed |
| EP-2787024-B1 | Thermosetting composition, hardened film and electronic component | JNC CORP (JP) | 2017-04-05 | — | — | EP | disclosed |
| EP-2657307-B1 | Inkjet Ink | JNC CORP (JP) | 2016-10-19 | — | — | EP | disclosed |
| US-20160297995-A1 | POLYIMIDE PRECURSOR, POLYIMIDE, POLYIMIDE FILM, VARNISH, AND SUBSTRATE | UBE INDUSTRIES, LTD. (JP) | 2016-10-13 | — | — | US | disclosed |
| US-20160168328-A1 | TRANSPARENT POLYIMIDE COPOLYMER, POLYIMIDE RESIN COMPOSITION AND MOLDED ARTICLE, AND PRODUCTION METHOD OF SAID COPOLYMER | SOMAR CORPORATION (JP) | 2016-06-16 | — | — | US | disclosed |
| US-20160137787-A1 | POLYMIDE PRECURSOR AND POLYMIDE | UBE INDUSTRIES, LTD. (JP) | 2016-05-19 | — | — | US | disclosed |
| US-20160059527-A1 | LOW DIELECTRIC POLYIMIDE FILM AND MANUFACTURE THEREOF | TAIMIDE TECHNOLOGY INCORPORATION (TW) | 2016-03-03 | — | — | US | disclosed |
| US-20160032056-A1 | POLYIMIDE PRECURSOR AND POLYIMIDE | UBE CORPORATION (JP) | 2016-02-04 | — | — | US | disclosed |
| US-20150361222-A1 | POLYIMIDE PRECURSOR, POLYIMIDE, VARNISH, POLYIMIDE FILM, AND SUBSTRATE | UBE CORPORATION (JP) | 2015-12-17 | — | — | US | disclosed |
| EP-2316811-B1 | PROCESS FOR PRODUCING HYDROGENATED AROMATIC POLYCARBOXYLIC ACID | MITSUBISHI GAS CHEMICAL CO (JP) | 2015-12-16 | — | — | EP | disclosed |
| US-20150307662-A1 | POLYIMIDE PRECURSOR, POLYIMIDE, POLYIMIDE FILM, VARNISH, AND SUBSTRATE | UBE CORPORATION (JP) | 2015-10-29 | — | — | US | disclosed |
| US-20150284513-A1 | POLYIMIDE PRECURSOR, POLYIMIDE, VARNISH, POLYIMIDE FILM, AND SUBSTRATE | UBE INDUSTRIES, LTD. (JP) | 2015-10-08 | — | — | US | disclosed |
| CN-104903764-A | Photopolymerizable liquid crystal composition, optical compensation film, optical compensataion laminate film, electrode substrate, substrate for liquid crystal display devices, and liquid crystal display device | ASAHI GLASS CO LTD | 2015-09-09 | — | — | CN | disclosed |
| EP-2568019-B1 | Inkjet ink | JNC CORP (JP) | 2015-09-02 | — | — | EP | disclosed |
| CN-104781293-A | Photo-polymerizable liquid crystal composition, optical compensation film, optical compensation laminate film, electrode substrate, liquid crystal device substrate, and liquid crystal device | ASAHI GLASS CO LTD | 2015-07-15 | — | — | CN | disclosed |
| US-20150158980-A1 | POLYIMIDE PRECURSOR AND POLYIMIDE | UBE CORPORATION (JP) | 2015-06-11 | — | — | US | disclosed |
| US-8980409-B2 | Laminate, method for producing same, and method for producing device structure using same | TOYOBO CO., LTD. (JP) | 2015-03-17 | — | — | US | disclosed |
| US-20150056367-A1 | COMPOSITION FOR FORMING LIQUID CRYSTAL ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY ELEMENT | SOKI CORPORATION (JP) | 2015-02-26 | — | — | US | disclosed |
| EP-2827188-A1 | COMPOSITION FOR FORMING LIQUID CRYSTAL ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY ELEMENT | Soki Corporation (JP) | 2015-01-21 | — | — | EP | disclosed |
| US-20140378645-A1 | LIQUID CRYSTAL ALIGNING AGENT | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2014-12-25 | — | — | US | disclosed |
| EP-2803672-A1 | LIQUID CRYSTAL ALIGNING AGENT | Wako Pure Chemical Industries, Ltd. (JP) | 2014-11-19 | — | — | EP | disclosed |
| US-8859170-B2 | Photosensitive modified polyimide resin composition and use thereof | PI R&D CO., LTD. (JP) | 2014-10-14 | — | — | US | disclosed |
| EP-2787024-A2 | Thermosetting composition, hardened film and electronic component | JNC Corporation (JP) | 2014-10-08 | — | — | EP | disclosed |
| US-8846973-B2 | Process for producing hydrogenated aromatic polycarboxylic acid | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2014-09-30 | — | — | US | disclosed |
| US-8796411-B2 | Polyimide precursor composition, polyimide film, and transparent flexible film | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-08-05 | — | — | US | disclosed |
| US-20140213722-A1 | THERMOSETTING COMPOSITION, HARDENED FILM AND ELECTRONIC COMPONENT | JNC CORPORATION (JP) | 2014-07-31 | — | — | US | disclosed |
| US-8779085-B2 | Modified polyimide and method for producing modified polyimide | PI R&D CO., LTD. (JP) | 2014-07-15 | — | — | US | disclosed |
| US-20140155526-A1 | POLYIMIDE COMPOSITION VARNISH, FILM USING THE SAME, AND METHOD OF MANUFACTURING THE POLYIMIDE COMPOSITION VARNISH | SAMSUNG DISPLAY CO., LTD. (KR) | 2014-06-05 | — | — | US | disclosed |
| US-20140066571-A1 | POLYIMIDE PRECURSOR AND POLYIMIDE | UBE INDUSTRIES, LTD. (JP) | 2014-03-06 | — | — | US | disclosed |
| US-20140041800-A1 | LAMINATE, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING DEVICE STRUCTURE USING SAME | TOYOBO CO., LTD. (JP) | 2014-02-13 | — | — | US | disclosed |
| EP-2657307-A2 | Inkjet Ink | JNC Corporation (JP) | 2013-10-30 | — | — | EP | disclosed |
| US-8501874-B2 | Thermosetting resin composition, multilayer body using same, and circuit board | KANEKA CORPORATION (JP) | 2013-08-06 | — | — | US | disclosed |
| US-20130178597-A1 | POLYIMIDE PRECURSOR, POLYIMIDE, AND MATERIALS TO BE USED IN PRODUCING SAME | UBE INDUSTRIES, LTD. (JP) | 2013-07-11 | — | — | US | disclosed |
| EP-2597111-A1 | POLYIMIDE PRECURSOR, POLYIMIDE, AND MATERIALS TO BE USED IN PRODUCING SAME | Ube Industries, Ltd. (JP) | 2013-05-29 | — | — | EP | disclosed |
| EP-2568019-A1 | Inkjet ink | JNC Corporation (JP) | 2013-03-13 | — | — | EP | disclosed |
| EP-2530103-A1 | POLYIMIDE RESIN COMPOSITION, ADHESIVE AGENT AND LAMINATE EACH COMPRISING SAME, AND DEVICE | Mitsui Chemicals, Inc. (JP) | 2012-12-05 | — | — | EP | disclosed |
| US-20120295085-A1 | POLYMIDE RESIN COMPOSITION, ADHESIVE AGENT AND LAMINATE EACH COMPRISING SAME, AND DEVICE | MITSUI CHEMICALS, INC. (JP) | 2012-11-22 | — | — | US | disclosed |
| US-8304149-B2 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2012-11-06 | — | — | US | disclosed |
| US-20120126393-A1 | RESIN COMPOSITION, MULTILAYER BODY CONTAINING THE SAME, SEMICONDUCTOR DEVICE, AND FILM | MITSUI CHEMICALS, INC. (JP) | 2012-05-24 | — | — | US | disclosed |
| US-20120097435-A1 | PHOTOSENSITIVE MODIFIED POLYIMIDE RESIN COMPOSITION AND USE THEREOF | PI R&D CO., LTD. (JP) | 2012-04-26 | — | — | US | disclosed |
| US-20120097439-A1 | MODIFIED POLYIMIDE AND METHOD FOR PRODUCING MODIFIED POLYIMIDE | PI R&D CO., LTD. (JP) | 2012-04-26 | — | — | US | disclosed |
| US-8153260-B2 | Composite material | ADEKA CORPORATION (JP) | 2012-04-10 | — | — | US | disclosed |
| EP-2431400-A2 | MODIFIED POLYIMIDE AND METHOD FOR PRODUCING MODIFIED POLYIMIDE | PI R & D Co. Ltd (JP) | 2012-03-21 | — | — | EP | disclosed |
| EP-2426557-A1 | PHOTOSENSITIVE MODIFIED POLYIMIDE RESIN COMPOSITION AND USE THEREOF | PI R & D Co. Ltd (JP) | 2012-03-07 | — | — | EP | disclosed |
| US-8067523-B2 | Thermosetting resin composition, laminated body using it, and circuit board | KANEKA CORPORATION (JP) | 2011-11-29 | — | — | US | disclosed |
| US-20110196171-A1 | PROCESS FOR PRODUCING HYDROGENATED AROMATIC POLYCARBOXYLIC ACID | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2011-08-11 | — | — | US | disclosed |
| US-20110076458-A1 | PHOTOSENSITIVE POLYMER COMPOSITION, METHOD OF FORMING RELIEF PATTERNS, AND ELECTRONIC EQUIPMENT | NUNOMURA MASATAKA | 2011-03-31 | — | — | US | disclosed |
| US-20110059305-A1 | POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM, AND TRANSPARENT FLEXIBLE FILM | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2011-03-10 | — | — | US | disclosed |
| US-7851121-B2 | Photosensitive polyimide composition and polyimide precursor composition | CENTRAL GLASS CO., LTD. (JP) | 2010-12-14 | — | — | US | disclosed |
| US-7851128-B2 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2010-12-14 | — | — | US | disclosed |
| EP-2248843-A1 | POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM AND TRANSPARENT FLEXIBLE FILM | Hitachi Chemical DuPont Microsystems, Ltd. (JP) | 2010-11-10 | — | — | EP | disclosed |
| US-20100112323-A1 | COMPOSITE MATERIAL | ADEKA CORPORATION (JP) | 2010-05-06 | — | — | US | disclosed |
| US-7615260-B2 | Active-matrix liquid crystal display | HITACHI, LTD. (JP) | 2009-11-10 | — | — | US | disclosed |
| US-20090176172-A1 | PHOTOSENSITIVE POLYIMIDE COMPOSITION AND POLYIMIDE PRECURSOR COMPOSITION | CENTRAL GLASS CO., LTD. (JP) | 2009-07-09 | — | — | US | disclosed |
| US-7521511-B2 | Thermosetting resin composition, multilayer body using same, and circuit board | KANEKA CORPORATION (JP) | 2009-04-21 | — | — | US | disclosed |
| EP-1376231-B1 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEM DUPONT MICROSYS (JP) | 2009-04-01 | — | — | EP | disclosed |
| US-20090035541-A1 | Metal laminate, method for manufacturing same and use thereof | MITSUI CHEMICALS, INC. (JP) | 2009-02-05 | — | — | US | disclosed |
| US-20080306220-A1 | Thermosetting Resin Composition, Multilayer Body Using Same, and Circuit Board | KANEKA CORPORATION (JP) | 2008-12-11 | — | — | US | disclosed |
| US-20080268266-A1 | Polyimide Metal Laminate and Suspension for Hard Disk Using Same | MITSUI CHEMICALS, INC. (JP) | 2008-10-30 | — | — | US | disclosed |
| US-20070074896-A1 | Thermosetting resin composition, laminated body using it, and circuit board | KANEKA CORPORATION (JP) | 2007-04-05 | — | — | US | disclosed |
| US-20070072122-A1 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | NUNOMURA MASATAKA | 2007-03-29 | — | — | US | disclosed |
| US-7150947-B2 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2006-12-19 | — | — | US | disclosed |
| US-20060205891-A1 | Thermosetting resin composition, multilayer body using same, and circuit board | KANEKA CORPORATION (JP) | 2006-09-14 | — | — | US | disclosed |
| US-6933411-B2 | Aromatic diamine and polyimide thereof | MITSUI CHEMICALS, INC. (JP) | 2005-08-23 | — | — | US | disclosed |
| US-20050019692-A1 | Resist material and method for pattern formation | KUBOTA HIROSHI (JP) | 2005-01-27 | — | — | US | disclosed |
| US-20050012884-A1 | Active-matrix liquid crystal display | IPS ALPHA SUPPORT CO., LTD. (JP) | 2005-01-20 | — | — | US | disclosed |
| US-20050010019-A1 | Diaminodicarboxylic acids and intermediates thereof | MITSUI CHEMICALS, INC. (JP) | 2005-01-13 | — | — | US | disclosed |
| EP-1460058-A1 | DIAMINODICARBOXYLIC ACIDS AND INTERMEDIATES THEREOF | Mitsui Chemicals, Inc. (JP) | 2004-09-22 | — | — | EP | disclosed |
| JP-2004155713-A | NEW BICYCLOHEXYLTETRACARBOXYLIC ACID DIALKYL ESTER | MITSUI CHEMICALS INC | 2004-06-03 | — | — | JP | disclosed |
| US-6737503-B2 | LOW TEMPERATURE ADHESIVE BONDING | MITSUI CHEMICALS, INC. (JP) | 2004-05-18 | — | — | US | disclosed |
| US-20040082754-A1 | Novel aromatic diamine and polyimide thereof | MITSUI CHEMICALS, INC. (JP) | 2004-04-29 | — | — | US | disclosed |
| US-20040029045-A1 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. | 2004-02-12 | — | — | US | disclosed |
| EP-1376231-A1 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2004-01-02 | — | — | EP | disclosed |
| US-20030092870-A1 | Novel aromatic diamine and polyimide thereof | MITSUI CHEMICALS, INC. (JP) | 2003-05-15 | — | — | US | disclosed |
| EP-1288191-A2 | Novel aromatic diamine and polyimide thereof | Mitsui Chemicals, Inc. (JP) | 2003-03-05 | — | — | EP | disclosed |
| US-20010055727-A1 | Resist material and method for pattern formation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-12-27 | — | — | US | disclosed |
| US-20010046569-A1 | Active-matrix liquid crystal display | IPS ALPHA SUPPORT CO., LTD. (JP) | 2001-11-29 | — | — | US | disclosed |
| US-6316170-B2 | COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT | KABUSHIKI KAISHA TOSHIBA (JP) | 2001-11-13 | — | — | US | disclosed |
| US-20010006767-A1 | Developing solution and method of forming polyimide pattern by using the developing solution | YOSHIAKI KAWAMONZEN | 2001-07-05 | — | — | US | disclosed |
| US-6238752-B1 | MODIFIED DIAMINE | CHISSO CORPORATION (JP) | 2001-05-29 | — | — | US | disclosed |
| US-6183934-B1 | FOE USE IN FORMATION OF PATTERN OF INSULATION FILM, PASSIVATION FILM, .ALPHA.-RAY SHIELDING FILM, OPTICAL WAVEGUIDE | KABUSHIKI KAISHA TOSHIBA (JP) | 2001-02-06 | — | — | US | disclosed |
| US-6159654-A | Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating | KABUSHIKI KAISHA TOSHIBA (JP) | 2000-12-12 | — | — | US | disclosed |
| EP-1020442-A1 | NOVEL DIAMINO COMPOUNDS, POLYAMIC ACID, POLYIMIDE, LIQUID-CRYSTAL ALIGNMENT FILM MADE FROM FILM OF THE POLYIMIDE, AND LIQUID-CRYSTAL DISPLAY ELEMENT CONTAINING THE ALIGNMENT FILM | Chisso Corporation (JP) | 2000-07-19 | — | — | EP | disclosed |
| US-6001517-A | A THERMOSETTING POLYMER WHICH CAN BE CURED THROUGH CYCLODEHYDRATION UPON HEATING AND A CURE ACCELERATOR WHICH CAN BE DEACTIVATED OF ITS CURE ACCELERATION PROPERTY BY IRRIDIATION OF LIGHT | KABUSHIKI KAISHA TOSHIBA (JP) | 1999-12-14 | — | — | US | disclosed |
| US-5928733-A | Active-matrix liquid crystal display | HITACHI, LTD. (JP) | 1999-07-27 | — | — | US | disclosed |
| JP-H1180350-A | POLYIMIDE FOR OPTICAL PART AND OPTICAL PART BY USING THE SAME | HITACHI CHEM CO LTD | 1999-03-26 | — | — | JP | disclosed |
| US-5756650-A | COMPOSITION COMPRISING POLYAMIC ACID, CURE ACCELERATOR SELECTED FROM GROUP CONSISTING OF NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AMINO ACID COMPOUND, AROMATIC COMPOUND HAVING TWO OR MORE HYDROXYL GROUPS | KABUSHIKI KAISHA TOSHIBA (JP) | 1998-05-26 | — | — | US | disclosed |
| US-5578697-A | DIELECTRIC POLYMERS FOR ELECTRONICS | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-11-26 | — | — | US | disclosed |
| US-5571579-A | FORMING A POLYIMIDE FILM AND RUBBING THE SURFACE OF THE FILM | HITACHI CHEMICAL COMPANY, LTD (JP) | 1996-11-05 | — | — | US | disclosed |
| JP-H03176484-A | BICYCLOHEXYLTETRACARBOXYLIC ACID COMPOUND AND ITS ANHYDRIDE | JAPAN CARLIT CO LTD:THE | 1991-07-31 | — | — | JP | disclosed |
| JP-H03176484-A | BICYCLOHEXYLTETRACARBOXYLIC ACID COMPOUND AND ITS ANHYDRIDE | JAPAN CARLIT CO LTD:THE | 1991-07-31 | — | — | JP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (15 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20200262783-A1 | Diamine Compound, and Polyimide Compound and Molded Product Using the Same | PADI1, PRMT1, ODC1 | GABRR1 1047/4885SLC1A2 2143/4885SLC1A1 1946/4885 |
| US-20220389165-A1 | Diamine Compound, Polyimide Precursor and Polyimide Film Using the Same, and Use Thereof | PUF60, PARG, DDT | GABRR1 1943/4885SLC1A2 2445/4885SLC1A1 3440/4885 |
| US-20260071029-A1 | POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM AND POLYIMIDE/SUBSTRATE LAMINATE | SMC1A, F11, F12 | GABRR1 588/4885SLC1A2 1392/4885SLC1A1 1627/4885 |
| US-20110196171-A1 | PROCESS FOR PRODUCING HYDROGENATED AROMATIC POLYCARBOXYLIC ACID | DDC, PCCA, HPD | GABRR1 1563/4885SLC1A2 1199/4885SLC1A1 2078/4885 |
| US-20030092870-A1 | Novel aromatic diamine and polyimide thereof | DDT, AOC1, H1-4 | GABRR1 1658/4885SLC1A2 1143/4885SLC1A1 785/4885 |
| US-10683259-B2 | Diamine compound, and polyimide compound and molded product using the same | PADI1, PRMT1, ODC1 | GABRR1 1047/4885SLC1A2 2143/4885SLC1A1 1946/4885 |
| US-10781288-B2 | Polyimide precursor and polyimide | PKN2, PKN1, PCLAF | GABRR1 2000/4885SLC1A2 2611/4885SLC1A1 2572/4885 |
| US-20140378645-A1 | LIQUID CRYSTAL ALIGNING AGENT | CYP17A1, AUP1, NR5A1 | GABRR1 1046/4885SLC1A2 3142/4885SLC1A1 2934/4885 |
| US-20050010019-A1 | Diaminodicarboxylic acids and intermediates thereof | DDC, ODC1, ASS1 | GABRR1 2138/4885SLC1A2 518/4885SLC1A1 308/4885 |
| US-11851412-B2 | Diamine compound, method of preparing the same, and composition containing the same | SRM, DDT, AOC1 | GABRR1 2412/4885SLC1A2 1475/4885SLC1A1 1998/4885 |
| US-20200262782-A1 | Diamine Compound, and Polyimide Compound and Molded Product Using the Same | PADI1, PRMT1, ODC1 | GABRR1 1047/4885SLC1A2 2143/4885SLC1A1 1946/4885 |
| US-11136286-B2 | Diamine compound, and polyimide compound and molded product using the same | PADI1, PRMT1, ODC1 | GABRR1 1047/4885SLC1A2 2143/4885SLC1A1 1946/4885 |
| US-20230242720-A1 | MODULUS MODIFIERS AND FILMS THEREOF | SHBG, PTMS, SERPINA6 | GABRR1 1104/4885SLC1A2 1780/4885SLC1A1 1854/4885 |
| US-20260071028-A1 | BINDER FOR ENERGY STORAGE DEVICE, ELECTRODE FOR ENERGY STORAGE DEVICE, ENERGY STORAGE DEVICE, POLYMER COMPOSITE, AND PRODUCTION METHOD OF BINDER FOR ENERGY STORAGE DEVICE | TBCA, TBCD, TBCB | GABRR1 3380/4885SLC1A2 1496/4885SLC1A1 1653/4885 |
| US-11124474-B2 | Diamine compound, and polyimide compound and molded product using the same | PADI1, PRMT1, ODC1 | GABRR1 1047/4885SLC1A2 2143/4885SLC1A1 1946/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.