Known targets — ChEMBL curated mechanism
ABL1ACEACHEACVR1ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB1ADRB2ADRB3AGTR1ALKAVPR1AAVPR2BCHEBCRCA2CACNA1ACACNA1BCACNA1CCACNA1DCACNA1ECACNA1FCACNA1GCACNA1HCACNA1ICACNA1SCACNA2D1CACNA2D2CACNA2D3CACNA2D4CACNB1CACNB2CACNB3CACNB4CACNG1CACNG2CACNG3CACNG4CACNG5CACNG6CACNG7CACNG8CALCRLCASRCCR5CDK4CDK6CFBCHRM1CHRM2CHRM3CHRM4CHRM5CHRNA1CHRNA3CHRNA7CHRNB1CHRNB4CHRNDCHRNECHRNGCOXFA4COXFA4L2CRBNCSF1RCUL4ACYP19A1DDB1DPP4DRD1DRD2DRD3DRD4EDNRAEGFREML4ERBB2ERBB4ESR1ESR2FGFR1FGFR3FLT1FLT3FLT4GAAGABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGHSRGLAGNRHRGPD2GRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BGSTP1HCN4HCRTR1HCRTR2HDAC1HDAC10HDAC11HDAC2HDAC3HDAC4HDAC5HDAC6HDAC7HDAC8HDAC9HRH1HRH2HRH3HSD11B1HSP90AA1HSP90AB1HTR1AHTR1BHTR1DHTR1EHTR1FHTR2AHTR2BHTR2CHTR3AHTR3BHTR3CHTR3DHTR3EHTR4HTR5AHTR6HTR7IMPDH1IMPDH2ITGA2BITGB3ITKJAK1JAK2KCNA1KCNA10KCNA2KCNA3KCNA4KCNA5KCNA6KCNA7KCNB1KCNB2KCNC1KCNC2KCNC3KCNC4KCND1KCND2KCND3KCNF1KCNG1KCNG2KCNG3KCNG4KCNH1KCNH2KCNH3KCNH4KCNH5KCNH6KCNH7KCNH8KCNJ2KCNJ3KCNJ5KCNK3KCNK9KCNQ1KCNQ2KCNQ3KCNQ4KCNQ5KCNS1KCNS2KCNS3KCNV1KCNV2KDRKITKLKB1LCKMMAOAMAOBMAPK14METMMP1MMP13MMP7MMP8MT-ND1MT-ND2MT-ND3MT-ND4MT-ND4LMT-ND5MT-ND6NDUFA1NDUFA10NDUFA11NDUFA12NDUFA13NDUFA2NDUFA3NDUFA5NDUFA6NDUFA7NDUFA8NDUFA9NDUFAB1NDUFAF1NDUFAF2NDUFAF3NDUFAF4NDUFB1NDUFB10NDUFB11NDUFB2NDUFB3NDUFB4NDUFB5NDUFB6NDUFB7NDUFB8NDUFB9NDUFC1NDUFC2NDUFS1NDUFS2NDUFS3NDUFS4NDUFS5NDUFS6NDUFS7NDUFS8NDUFV1NDUFV2NDUFV3NR3C1NS5ANTRK1NTRK2NTRK3ODC1OPRD1OPRK1OPRM1P2RY12PAHPARP1PDE3APDE3BPDE4APDE4BPDE4CPDE4DPDE5APDE7APDE7BPDE8APDE8BPDGFRAPDGFRBPIK3CAPIK3CDPNPPOLA1POLA2POLD1POLD2POLD3POLD4POLEPOLE2POLE3PPARGPRIM1PRIM2PRKCAPRKCBPRKCDPRKCEPRKCGPRKCHPRKCIPRKCQPRKCZPRKD1PRKD3PTGS1PTGS2RBX1RENRETROCK1ROCK2RPE65RRM1RRM2RRM2BS1PR1S1PR2S1PR3S1PR4S1PR5SCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASCNN1ASCNN1BSCNN1GSIGMAR1SLC18A2SLC6A1SLC6A2SLC6A3SLC6A4SLC9A3SRCTACR1TOP1TOP2ATOP2BTTRTYMPdacAdacBdacCembAfolAftsIgyrAgyrBmrcAmrcBmrdAparCparEpolrplArplBrplCrplDrplErplFrplIrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmE2rpmFrpmGrpmG1rpmG2rpmG3rpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO
The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8366 | 0.97 | — | — | |
| Ammonia Solution, Strong SCHEMBL9336079 | 0.93 | — | — | |
| Bromide SCHEMBL1472022 | 0.93 | — | — | |
| Hydroxyamine SCHEMBL16774690 | 0.93 | FDPS (0.36) | — | |
| SCHEMBL27510435 | 0.93 | — | — | |
| SCHEMBL10400437 | 0.93 | — | — | |
| SCHEMBL23128914 | 0.90 | — | — | |
| Trimethylammonium SCHEMBL5011755 | 0.88 | FDPS (0.33) | — | |
| SCHEMBL11128550 | 0.88 | ALDH1A1 (0.35) | — | |
| Monoethanolamine SCHEMBL18041164 | 0.85 | ALDH1A1 (0.44) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-4066291-A | — | — | None | — | — | JP | disclosed |
| CN-117545585-A | Solder paste and method for manufacturing electronic device | 千住金属工业株式会社 | 2024-02-09 | — | — | CN | disclosed |
| EP-1645646-B1 | TEMPERATURE FUSE ELEMENT, TEMPERATURE FUSE AND BATTERY USING THE SAME | PANASONIC CORP (JP) | 2011-10-05 | — | — | EP | disclosed |
| US-20110068889-A1 | THERMAL FUSE ELEMENT, THERMAL FUSE AND BATTERY USING THE THERMAL FUSE | SENDA KENJI | 2011-03-24 | — | — | US | disclosed |
| CN-100376704-C | Temperature fuse element, temperature fuse and battery using the same | MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) | 2008-03-26 | — | — | CN | disclosed |
| US-20070024407-A1 | Temperature fuse element, temperature fuse and battery using the same | PANASONIC CORPORATION (JP) | 2007-02-01 | — | — | US | disclosed |
| CN-1795280-A | Temperature fuse element, temperature fuse and battery using the same | MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) | 2006-06-28 | — | — | CN | disclosed |
| EP-1184880-B1 | Conductive adhesive and packaging structure using the same | MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) | 2006-04-19 | — | — | EP | disclosed |
| EP-1645646-A1 | TEMPERATURE FUSE ELEMENT, TEMPERATURE FUSE AND BATTERY USING THE SAME | Matsushita Electric Industrial Co., Ltd. (JP) | 2006-04-12 | — | — | EP | disclosed |
| CN-1247723-C | Conductive adhesive and assembled structural body by use of said adhesive | MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) | 2006-03-29 | — | — | CN | disclosed |
| US-6666994-B2 | Waterproof electrode; dispersion of conductivity particles in binder; contorlling corrosion | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2003-12-23 | — | — | US | disclosed |
| US-20030116756-A1 | Conductive adhesive and packaging structure using the same | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2003-06-26 | — | — | US | disclosed |
| US-6524721-B2 | Binder resin, curing agent, and second metal particles that have a standard electrode potential lower than first metal particles | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2003-02-25 | — | — | US | disclosed |
| US-20020043652-A1 | Conductive adhesive and packaging structure using the same | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. | 2002-04-18 | — | — | US | disclosed |
| CN-1340584-A | Conductive adhesive and assembled structural body by use of said adhesive | MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) | 2002-03-20 | — | — | CN | disclosed |
| EP-1184880-A2 | Conductive adhesive and packaging structure using the same | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2002-03-06 | — | — | EP | disclosed |
| US-5215602-A | Water-soluble flux | AT&T BELL LABORATORIES (US) | 1993-06-01 | — | — | US | disclosed |
| JP-H0466291-A | CREAM SOLDER FOR PRINTING | UCHIHASHI ESTEC CO LTD | 1992-03-02 | — | — | JP | disclosed |