Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PCSK9 | Q8NBP7 | 1/20 | 0.39 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.38 |
| ▸ | NAAA | Q02083 | 1/20 | 0.38 |
| ▸ | AR | P10275 | 1/20 | 0.38 |
| ▸ | TSHR | P16473 | 2/20 | 0.37 |
| ▸ | CES2 | O00748 | 2/20 | 0.37 |
| ▸ | CES1 | P23141 | 2/20 | 0.37 |
| ▸ | HTT | P42858 | 2/20 | 0.37 |
| ▸ | EPHX1 | P07099 | 3/20 | 0.36 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.36 |
| ▸ | NR1H3 | Q13133 | 1/20 | 0.36 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6963563 | 0.94 | NAAA (0.41) | PCSK9PTGS2NAAACES2CES1 | |
| SCHEMBL6960170 | 0.92 | NAAA (0.43) | NAAACES2CES1HTTEPHX1 | |
| SCHEMBL271913 | 0.86 | ESR1 (0.37) | PCSK9PTGS2NAAATSHRCES2 | |
| SCHEMBL8862115 | 0.83 | DRD2 (0.36) | NAAACES2CES1HTTEPHX1 | |
| SCHEMBL3482551 | 0.83 | PCSK9 (0.39) | PCSK9PTGS2NAAAARTSHR | |
| SCHEMBL272398 | 0.83 | PCSK9 (0.39) | PCSK9PTGS2NAAAARTSHR | |
| SCHEMBL20592348 | 0.82 | — | — | |
| SCHEMBL271811 | 0.81 | NR1H2 (0.39) | PCSK9PTGS2NAAAARTSHR | |
| SCHEMBL3481932 | 0.79 | PCSK9 (0.37) | PCSK9PTGS2NAAAARTSHR | |
| SCHEMBL273717 | 0.79 | PCSK9 (0.37) | PCSK9PTGS2NAAAARTSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 275 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11912731-B2 | Use of silylated formiates as hydrosilane equivalents | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (FR) | 2024-02-27 | — | — | US | claimed |
| CN-114406181-B | Warm core box binder and preparation method thereof | 金耐源(河南)工业科技有限公司 | 2023-10-20 | — | — | CN | claimed |
| US-20210292345-A1 | Use of Silylated Formiates as Hydrosilane Equivalents | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (FR) | 2021-09-23 | — | — | US | claimed |
| EP-3507292-B1 | USE OF SILYLATED FORMIATES AS HYDROSILANE EQUIVALENTS | COMMISSARIAT ENERGIE ATOMIQUE (FR) | 2020-12-09 | — | — | EP | claimed |
| EP-3507292-A1 | USE OF SILYLATED FORMIATES AS HYDROSILANE EQUIVALENTS | Commissariat à l'Énergie Atomique et aux Énergies Alternatives (FR) | 2019-07-10 | — | — | EP | claimed |
| WO-2018041543-A1 | USE OF SILYLATED FORMIATES AS HYDROSILANE EQUIVALENTS | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (FR) | 2018-03-08 | — | — | WO | claimed |
| US-20150005485-A1 | SYNTHETIC HEPARIN PENTASACCHARIDES | ALCHEMIA LIMITED (AU) | 2015-01-01 | — | — | US | claimed |
| EP-1440077-B1 | SYNTHETIC HEPARIN PENTASACCHARIDES | ALCHEMIA LTD (AU) | 2013-05-01 | — | — | EP | claimed |
| US-8404833-B2 | Synthetic heparin disaccharides | ALCHEMIA LIMITED (AU) | 2013-03-26 | — | — | US | claimed |
| EP-2557086-A2 | Synthetic heparin pentasaccharides | Alchemia Limited (AU) | 2013-02-13 | — | — | EP | claimed |
| US-20120220759-A1 | SYNTHETIC HEPARIN DISACCHARIDES | ALCHEMIA LIMITED (AU) | 2012-08-30 | — | — | US | claimed |
| US-20120208993-A1 | SYNTHETIC HEPARIN TRISACCHARIDES | ALCHEMIA LIMITED (AU) | 2012-08-16 | — | — | US | claimed |
| US-20090187013-A1 | SYNTHETIC HEPARIN PENTASACCHARIDES | ALCHEMIA LIMITED (AU) | 2009-07-23 | — | — | US | claimed |
| US-7541445-B2 | Synthetic heparin pentasaccharides | ALCHEMIA LIMITED (AU) | 2009-06-02 | — | — | US | claimed |
| US-20050080042-A1 | synthetic monosaccharides, disaccharides, trisaccharides, tetrasaccharides and pentasaccharides for use in the preparation of synthetic heparinoids; Vascular thrombosis, cardiovascular disease | DR. REDDY'S LABORATORIES, SA (CH) | 2005-04-14 | — | — | US | claimed |
| EP-1440077-A1 | SYNTHETIC HEPARIN PENTASACCHARIDES | Alchemia Limited (AU) | 2004-07-28 | — | — | EP | claimed |
| WO-2003022860-A1 | SYNTHETIC HEPARIN PENTASACCHARIDES | ALCHEMIA PTY LTD (AU) | 2003-03-20 | — | — | WO | claimed |
| EP-0055239-B1 | NOVEL DERIVATIVES OF GUANINE | Astra Läkemedel Aktiebolag (SE) | 1986-07-16 | — | — | EP | claimed |
| EP-0055239-A1 | Novel derivatives of guanine | Astra Läkemedel Aktiebolag (SE) | 1982-06-30 | — | — | EP | claimed |
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-12601970-B2 | Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2026-04-14 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-20250370339-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-04 | — | — | US | disclosed |
| US-20250362601-A1 | Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component | HD MICROSYSTEMS LTD (JP) | 2025-11-27 | — | — | US | disclosed |
| US-20250341778-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-11-06 | — | — | US | disclosed |
| US-12405198-B2 | Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device | RESONAC CORPORATION (JP) | 2025-09-02 | — | — | US | disclosed |
| US-12386259-B2 | Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-08-12 | — | — | US | disclosed |
| US-12386256-B2 | Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2025-08-12 | — | — | US | disclosed |
| US-12386257-B2 | Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2025-08-12 | — | — | US | disclosed |
| CN-120153318-A | Photosensitive resin composition, method for producing cured relief pattern using same, and method for producing polyimide film | 旭化成株式会社 | 2025-06-13 | — | — | CN | disclosed |
| CN-113168101-B | Photosensitive resin composition, method for producing pattern cured film, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2025-02-18 | — | — | CN | disclosed |
| CN-113168102-B | Photosensitive resin composition, method for producing pattern cured product, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-11-19 | — | — | CN | disclosed |
| US-20240361697-A1 | METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2024-10-31 | — | — | US | disclosed |
| WO-2024225072-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND CURED FILM | 旭化成株式会社 | 2024-10-31 | — | — | WO | disclosed |
| US-20240352275-A1 | CURED RESIN FILM, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2024-10-24 | — | — | US | disclosed |
| WO-2024210063-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, CURED FILM, AND SEMICONDUCTOR DEVICE | 旭化成株式会社 | 2024-10-10 | — | — | WO | disclosed |
| US-20240329525-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-10-03 | — | — | US | disclosed |
| CN-112334833-B | Negative photosensitive resin composition, polyimide using same, and method for producing cured relief pattern | 旭化成株式会社 | 2024-09-24 | — | — | CN | disclosed |
| US-20240240061-A1 | RESIN COMPOSITION FOR DICING PROTECTION LAYER AND TREATMENT METHOD FOR SEMICONDUCTOR WAFER | RESONAC CORPORATION (JP) | 2024-07-18 | — | — | US | disclosed |
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| WO-2024122621-A1 | METHOD FOR PRODUCING SEMICONDUCTOR CHIPS | 株式会社レゾナック | 2024-06-13 | — | — | WO | disclosed |
| WO-2024111129-A1 | METHOD FOR PRODUCING POLYIMIDE PRECURSOR, POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING PATTERN CURED PRODUCT, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2024-05-30 | — | — | WO | disclosed |
| CN-118027090-A | Method for generating silanol by oxidizing silane | 吉林大学 | 2024-05-14 | — | — | CN | disclosed |
| WO-2024095927-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | 旭化成株式会社 | 2024-05-10 | — | — | WO | disclosed |
| EP-4365929-A1 | RESIN COMPOSITION FOR DICING PROTECTION LAYER AND TREATMENT METHOD FOR SEMICONDUCTOR WAFER | Resonac Corporation (JP) | 2024-05-08 | — | — | EP | disclosed |
| CN-114502617-B | Polyimide precursor, photosensitive resin composition, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-05-03 | — | — | CN | disclosed |
| WO-2024084636-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2024-04-25 | — | — | WO | disclosed |
| CN-117836927-A | Resin cured film, semiconductor device, and method for manufacturing semiconductor device | 株式会社力森诺科 | 2024-04-05 | — | — | CN | disclosed |
| CN-117783345-A | Method for detecting content of tert-butyl diphenyl chlorosilane | 山东博苑医药化学股份有限公司 | 2024-03-29 | — | — | CN | disclosed |
| US-20240101761-A1 | POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-03-28 | — | — | US | disclosed |
| CN-114207038-B | Resin composition, method for producing cured product, pattern cured product, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-03-22 | — | — | CN | disclosed |
| US-20240092973-A1 | POLYIMIDE PRECURSOR, RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE-PROTECTIVE FILM, AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2024-03-21 | — | — | US | disclosed |
| CN-117730398-A | Resin composition for dicing protective layer and method for processing semiconductor wafer | 株式会社力森诺科 | 2024-03-19 | — | — | CN | disclosed |
| US-11912731-B2 | Use of silylated formiates as hydrosilane equivalents | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (FR) | 2024-02-27 | — | — | US | disclosed |
| CN-117280447-A | Photosensitive resin composition selection method, pattern cured film production method, cured film, semiconductor device, and semiconductor device production method | 株式会社力森诺科 | 2023-12-22 | — | — | CN | disclosed |
| US-20230359122-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2023-11-09 | — | — | US | disclosed |
| CN-114406181-B | Warm core box binder and preparation method thereof | 金耐源(河南)工业科技有限公司 | 2023-10-20 | — | — | CN | disclosed |
| US-20230324789-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PERMANENT RESIST, METHOD FOR FORMING PERMANENT RESIST, AND METHOD FOR INSPECTING PERMANENT RESIST CURED FILM | RESONAC CORPORATION (JP) | 2023-10-12 | — | — | US | disclosed |
| CN-116710498-A | Polyimide precursor resin composition and method for producing same | 旭化成株式会社 | 2023-09-05 | — | — | CN | disclosed |
| CN-116609998-A | Polyimide precursor, negative photosensitive resin composition, and method for producing cured relief pattern using same | 旭化成株式会社 | 2023-08-18 | — | — | CN | disclosed |
| US-20230221639-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-07-13 | — | — | US | disclosed |
| CN-116194840-A | Photosensitive resin composition, permanent resist, method for forming permanent resist, and method for inspecting cured film for permanent resist | 株式会社力森诺科 | 2023-05-30 | — | — | CN | disclosed |
| US-11640112-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-05-02 | — | — | US | disclosed |
| US-20230110416-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-04-13 | — | — | US | disclosed |
| US-20230104391-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2023-04-06 | — | — | US | disclosed |
| CN-115755526-A | Photosensitive resin composition and method for producing cured relief pattern | 旭化成株式会社 | 2023-03-07 | — | — | CN | disclosed |
| WO-2023027115-A1 | CURED RESIN FILM, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 株式会社レゾナック | 2023-03-02 | — | — | WO | disclosed |
| WO-2023026403-A1 | CURED RESIN FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 株式会社レゾナック | 2023-03-02 | — | — | WO | disclosed |
| US-11592744-B2 | Positive-type photosensitive resin composition | HD MICROSYSTEMS, LTD. (JP) | 2023-02-28 | — | — | US | disclosed |
| WO-2023002846-A1 | RESIN COMPOSITION FOR DICING PROTECTION LAYER AND TREATMENT METHOD FOR SEMICONDUCTOR WAFER | 昭和電工マテリアルズ株式会社 | 2023-01-26 | — | — | WO | disclosed |
| WO-2023281584-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PERMANENT RESIST, METHOD FOR FORMING PERMANENT RESIST, AND METHOD FOR INSPECTING PERMANENT RESIST CURED FILM | 昭和電工マテリアルズ株式会社 | 2023-01-12 | — | — | WO | disclosed |
| CN-110088680-B | Double-layer photosensitive layer roll | 旭化成株式会社 | 2022-12-30 | — | — | CN | disclosed |
| WO-2022239232-A1 | METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-11-17 | — | — | WO | disclosed |
| US-11487201-B2 | Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2022-11-01 | — | — | US | disclosed |
| CN-115185157-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2022-10-14 | — | — | CN | disclosed |
| CN-115151868-A | Photosensitive resin composition, method for sorting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device | 昭和电工材料株式会社 | 2022-10-04 | — | — | CN | disclosed |
| US-20220291584-A1 | Resin Composition, Method for Manufacturing Cured Product, Cured Product, Patterned Cured Product, Interlayer Insulation Film, Cover Coating Layer, Surface Protection Film, and Electronic Component | HD MICROSYSTEMS, LTD. (JP) | 2022-09-15 | — | — | US | disclosed |
| CN-115039029-A | Negative photosensitive resin composition and method for producing cured relief pattern | 旭化成株式会社 | 2022-09-09 | — | — | CN | disclosed |
| US-20220276555-A1 | Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component | HD MICROSYSTEMS, LTD. (JP) | 2022-09-01 | — | — | US | disclosed |
| CN-107870516-B | Positive photosensitive resin composition, patterned film and method for manufacturing bump | 奇美实业股份有限公司 | 2022-08-02 | — | — | CN | disclosed |
| WO-2022154020-A1 | POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME | 旭化成株式会社 | 2022-07-21 | — | — | WO | disclosed |
| CN-110627610-B | Method for synthesizing alkyne by catalyzing asymmetric cross coupling | 南方科技大学 | 2022-07-05 | — | — | CN | disclosed |
| CN-114502617-A | Polyimide precursor, resin composition, photosensitive resin composition, method for producing patterned cured film, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2022-05-13 | — | — | CN | disclosed |
| CN-114245882-A | Photosensitive resin composition, method for producing patterned cured film, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2022-03-25 | — | — | CN | disclosed |
| US-20220011669-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2022-01-13 | — | — | US | disclosed |
| CN-113820920-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2021-12-21 | — | — | CN | disclosed |
| US-20210382391-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2021-12-09 | — | — | US | disclosed |
| CN-110028666-B | Polyimide precursor and resin composition containing same | 旭化成株式会社 | 2021-11-09 | — | — | CN | disclosed |
| WO-2021215374-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 (JP) | 2021-10-28 | — | — | WO | disclosed |
| US-20210311390-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2021-10-07 | — | — | US | disclosed |
| CN-111808420-B | Resin precursor, resin composition containing the same, polyimide resin film, and method for producing the same | 旭化成株式会社 | 2021-09-28 | — | — | CN | disclosed |
| US-20210292345-A1 | Use of Silylated Formiates as Hydrosilane Equivalents | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (FR) | 2021-09-23 | — | — | US | disclosed |
| US-20210294213-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2021-09-23 | — | — | US | disclosed |
| EP-3873484-A1 | NOVEL STING AGONISTS | Venenum Biodesign, LLC (US) | 2021-09-08 | — | — | EP | disclosed |
| CN-107850844-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2021-09-07 | — | — | CN | disclosed |
| WO-2021153608-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | 旭化成株式会社 | 2021-08-05 | — | — | WO | disclosed |
| CN-113196170-A | Photosensitive resin composition, method for producing patterned cured product, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2021-07-30 | — | — | CN | disclosed |
| CN-113196169-A | Photosensitive resin composition, method for producing patterned cured product, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2021-07-30 | — | — | CN | disclosed |
| CN-113168102-A | Photosensitive resin composition, method for producing patterned cured product, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2021-07-23 | — | — | CN | disclosed |
| CN-113168101-A | Photosensitive resin composition, method for producing patterned cured film, interlayer insulating film, cover coat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2021-07-23 | — | — | CN | disclosed |
| CN-113168092-A | Photosensitive resin composition, method for producing patterned cured product, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2021-07-23 | — | — | CN | disclosed |
| CN-108604059-B | Positive photosensitive resin composition | 艾曲迪微系统股份有限公司 | 2021-07-02 | — | — | CN | disclosed |
| EP-3200911-B1 | METHOD FOR LIQUID AUTHENTICATION BY DETECTION OF FLAVONOID DERIVATIVES | SICPA HOLDING SA (CH) | 2021-04-28 | — | — | EP | disclosed |
| US-20210116809-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF MANUFACTURING PATTERN CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER-COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2021-04-22 | — | — | US | disclosed |
| WO-2021070232-A1 | POLYIMIDE PRECURSOR, RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE-PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2021-04-15 | — | — | WO | disclosed |
| CN-107329367-B | Photosensitive resin composition, method for producing cured relief pattern, semiconductor device, and display device | 旭化成株式会社 | 2021-03-23 | — | — | CN | disclosed |
| CN-112334833-A | Negative photosensitive resin composition, polyimide using same, and method for producing cured relief pattern | 旭化成株式会社 | 2021-02-05 | — | — | CN | disclosed |
| US-20200409263-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-12-31 | — | — | US | disclosed |
| EP-3413132-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | HD MICROSYSTEMS LTD (JP) | 2020-12-16 | — | — | EP | disclosed |
| EP-3507292-B1 | USE OF SILYLATED FORMIATES AS HYDROSILANE EQUIVALENTS | COMMISSARIAT ENERGIE ATOMIQUE (FR) | 2020-12-09 | — | — | EP | disclosed |
| US-10831101-B2 | Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-11-10 | — | — | US | disclosed |
| CN-111808420-A | Resin precursor, resin composition containing the same, polyimide resin film, and method for producing the same | 旭化成株式会社 | 2020-10-23 | — | — | CN | disclosed |
| CN-106146851-B | Photocurable composition and cured product containing same | 信越化学工业株式会社 | 2020-10-23 | — | — | CN | disclosed |
| US-10800988-B2 | Method for liquid authentication by detection of flavonoid derivatives | SICPA HOLDING SA (CH) | 2020-10-13 | — | — | US | disclosed |
| CN-106661326-B | Resin precursor, resin composition containing the same, polyimide resin film, and method for producing the same | 旭化成株式会社 | 2020-04-21 | — | — | CN | disclosed |
| WO-2020071204-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | 日立化成デュポンマイクロシステムズ株式会社 | 2020-04-09 | — | — | WO | disclosed |
| WO-2020071437-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN-CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATION FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT | 日立化成デュポンマイクロシステムズ株式会社 | 2020-04-09 | — | — | WO | disclosed |
| WO-2020070924-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED PATTERN, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM AND ELECTRONIC COMPONENT | 日立化成デュポンマイクロシステムズ株式会社 | 2020-04-09 | — | — | WO | disclosed |
| WO-2020071201-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | 日立化成デュポンマイクロシステムズ株式会社 | 2020-04-09 | — | — | WO | disclosed |
| WO-2020071422-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT | 日立化成デュポンマイクロシステムズ株式会社 | 2020-04-09 | — | — | WO | disclosed |
| WO-2020031240-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATION FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | 日立化成デュポンマイクロシステムズ株式会社 | 2020-02-13 | — | — | WO | disclosed |
| CN-110627610-A | Method for synthesizing alkyne by catalyzing asymmetric cross coupling | 南方科技大学 | 2019-12-31 | — | — | CN | disclosed |
| EP-3093303-B1 | PHOTOCURABLE COMPOSITION AND CURED PRODUCT | SHINETSU CHEMICAL CO (JP) | 2019-08-28 | — | — | EP | disclosed |
| EP-3507292-A1 | USE OF SILYLATED FORMIATES AS HYDROSILANE EQUIVALENTS | Commissariat à l'Énergie Atomique et aux Énergies Alternatives (FR) | 2019-07-10 | — | — | EP | disclosed |
| EP-2618216-B1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT | HITACHI CHEMICAL CO LTD (JP) | 2019-05-29 | — | — | EP | disclosed |
| US-20190113845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-04-18 | — | — | US | disclosed |
| US-20190049842-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | HD MICROSYSTEMS, LTD. (JP) | 2019-02-14 | — | — | US | disclosed |
| EP-3429999-A1 | METHOD FOR PREPARING ALKYLAMINES | Commissariat à l'Énergie Atomique et aux Énergies Alternatives (FR) | 2019-01-23 | — | — | EP | disclosed |
| US-10175577-B2 | Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2019-01-08 | — | — | US | disclosed |
| EP-3413132-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | Hitachi Chemical DuPont Microsystems, Ltd. (JP) | 2018-12-12 | — | — | EP | disclosed |
| US-10131646-B2 | Aromatic sulfonium salt compound, photoacid generator, resist composition, cationic polymerization initiator, and cationically polymerizable composition | ADEKA CORPORATION (JP) | 2018-11-20 | — | — | US | disclosed |
| EP-3374364-A1 | USE OF BORON FORMATES FOR REDUCING UNSATURATED ORGANIC FUNCTIONS | Commissariat à l'Énergie Atomique et aux Énergies Alternatives (FR) | 2018-09-19 | — | — | EP | disclosed |
| US-10023603-B2 | Preparation of monosaccharides, disaccharides, trisaccharides, and pentasaccharides of heparinoids | FORMOSA LABORATORIES, INC. (TW) | 2018-07-17 | — | — | US | disclosed |
| CN-107870516-A | Positive photosensitive resin composition, patterned film and method for manufacturing bump | 奇美实业股份有限公司 | 2018-04-03 | — | — | CN | disclosed |
| US-20180079738-A1 | AROMATIC SULFONIUM SALT COMPOUND, PHOTOACID GENERATOR, RESIST COMPOSITION, CATIONIC POLYMERIZATION INITIATOR, AND CATIONICALLY POLYMERIZABLE COMPOSITION | ADEKA CORPORATION (JP) | 2018-03-22 | — | — | US | disclosed |
| WO-2018041543-A1 | USE OF SILYLATED FORMIATES AS HYDROSILANE EQUIVALENTS | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (FR) | 2018-03-08 | — | — | WO | disclosed |
| EP-3272744-A1 | AROMATIC SULFONIUM SALT COMPOUND, PHOTOACID GENERATOR, RESIST COMPOSITION, CATIONIC POLYMERIZATION INITIATOR, AND CATIONICALLY POLYMERIZABLE COMPOSITION | Adeka Corporation (JP) | 2018-01-24 | — | — | EP | disclosed |
| EP-2133743-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2018-01-24 | — | — | EP | disclosed |
| EP-2328027-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, AND USES OF SAID RESIST PATTERN | HITACHI CHEMICAL CO LTD (JP) | 2018-01-17 | — | — | EP | disclosed |
| EP-3248005-A1 | NOVEL GLYCAN CONJUGATES AND METHODS OF USE THEREOF | Academia Sinica (TW) | 2017-11-29 | — | — | EP | disclosed |
| EP-3248013-A1 | CANCER MARKERS AND METHODS OF USE THEREOF | Academia Sinica (TW) | 2017-11-29 | — | — | EP | disclosed |
| US-20170298283-A1 | METHOD FOR LIQUID AUTHENTICATION BY DETECTION OF FLAVONOID DERIVATIVES | SICPA HOLDING SA (CH) | 2017-10-19 | — | — | US | disclosed |
| US-9786576-B2 | Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device | HITACHI CHEMICAL COMPANY, LTD (JP) | 2017-10-10 | — | — | US | disclosed |
| EP-3183262-A1 | NOVEL GLYCAN CONJUGATES AND USE THEREOF | Academia Sinica (TW) | 2017-06-28 | — | — | EP | disclosed |
| WO-2017100796-A1 | MODULATION OF GLOBOSERIES GLYCOSPHINGOLIPID SYNTHESIS AND CANCER BIOMARKERS | SINACA, Academia (TW) | 2017-06-15 | — | — | WO | disclosed |
| US-20170165879-A1 | RESIN PRECURSOR, RESIN COMPOSITION CONTAINING SAME, POLYIMIDE RESIN MEMBRANE, RESIN FILM, AND METHOD FOR PRODUCING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-06-15 | — | — | US | disclosed |
| US-20170102613-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2017-04-13 | — | — | US | disclosed |
| US-9575410-B2 | Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2017-02-21 | — | — | US | disclosed |
| EP-3129376-A1 | SUBSTITUTED 4,5,6,7-TETRAHYDRO-PYRAZOLO[1,5-A]PYRAZINE DERIVATIVES AND 5,6,7,8-TETRAHYDRO-4H-PYRAZOLO[1,5-A][1,4]DIAZEPINE DERIVATIVES AS ROS1 INHIBITORS | Janssen Pharmaceutica, N.V. (BE) | 2017-02-15 | — | — | EP | disclosed |
| US-20170015695-A1 | PREPARATION OF MONOSACCHARIDES, DISACCHARIDES, TRISACCHARIDES, AND PENTASACCHARIDES OF HEPARINOIDS | FORMOSA LABORATORIES, INC. (TW) | 2017-01-19 | — | — | US | disclosed |
| US-20160333171-A1 | PHOTOCURABLE COMPOSITION AND CURED PRODUCT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-11-17 | — | — | US | disclosed |
| EP-3093303-A1 | PHOTOCURABLE COMPOSITION AND CURED PRODUCT | Shin-Etsu Chemical Co., Ltd. (JP) | 2016-11-16 | — | — | EP | disclosed |
| WO-2016118961-A1 | CANCER MARKERS AND METHODS OF USE THEREOF | ACADEMIA SINICA (TW) | 2016-07-28 | — | — | WO | disclosed |
| WO-2016118191-A1 | NOVEL GLYCAN CONJUGATES AND METHODS OF USE THEREOF | ACADEMIA SINICA (TW) | 2016-07-28 | — | — | WO | disclosed |
| US-9395626-B2 | Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2016-07-19 | — | — | US | disclosed |
| US-20160194457-A1 | Curable Resin Composition | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2016-07-07 | — | — | US | disclosed |
| WO-2016086071-A1 | SPECTRALLY ENCODED CONSUMABLE SPECTROMETER APPARATUS AND METHODS | NUEOU, INC. (US) | 2016-06-02 | — | — | WO | disclosed |
| EP-3020765-A1 | CURABLE RESIN COMPOSITION | The Yokohama Rubber Company, Limited (JP) | 2016-05-18 | — | — | EP | disclosed |
| US-9274422-B2 | Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2016-03-01 | — | — | US | disclosed |
| WO-2016029071-A1 | NOVEL GLYCAN CONJUGATES AND USE THEREOF | ACADEMIA SINICA (TW) | 2016-02-25 | — | — | WO | disclosed |
| US-9243018-B2 | Synthetic heparin pentasaccharides | DR. REDDY'S LABORATORIES, SA (CH) | 2016-01-26 | — | — | US | disclosed |
| WO-2015144799-A1 | SUBSTITUTED 4,5,6,7-TETRAHYDRO-PYRAZOLO[1,5-a]PYRAZINE DERIVATIVES AND 5,6,7,8-TETRAHYDRO-4H-PYRAZOLO[1,5-a][1,4]DIAZEPINE DERIVATIVES AS ROS1 INHIBITORS | JANSSEN PHARMACEUTICA NV (BE) | 2015-10-01 | — | — | WO | disclosed |
| US-9134608-B2 | Positive photosensitive resin composition, method for producing patterned cured film and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2015-09-15 | — | — | US | disclosed |
| EP-2186799-B1 | AROMATIC SULFONIUM SALT COMPOUND | ADEKA CORP (JP) | 2015-07-08 | — | — | EP | disclosed |
| US-9073854-B2 | Aromatic sulfonium salt compound | ADEKA CORPORATION (JP) | 2015-07-07 | — | — | US | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| EP-2502915-B1 | AROMATIC SULFONIUM SALT COMPOUND | ADEKA CORP (JP) | 2015-03-18 | — | — | EP | disclosed |
| US-20150024173-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT | RESONAC CORPORATION (JP) | 2015-01-22 | — | — | US | disclosed |
| US-20150005485-A1 | SYNTHETIC HEPARIN PENTASACCHARIDES | ALCHEMIA LIMITED (AU) | 2015-01-01 | — | — | US | disclosed |
| US-20140349222-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2014-11-27 | — | — | US | disclosed |
| EP-2372457-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2014-11-26 | — | — | EP | disclosed |
| US-20140322635-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-10-30 | — | — | US | disclosed |
| US-8871422-B2 | Negative-type photosensitive resin composition, pattern forming method and electronic parts | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2014-10-28 | — | — | US | disclosed |
| EP-2793082-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT | Hitachi Chemical Company, Ltd. (JP) | 2014-10-22 | — | — | EP | disclosed |
| US-8836089-B2 | Positive photosensitive resin composition, method of creating resist pattern, and electronic component | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-09-16 | — | — | US | disclosed |
| EP-1744213-B1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | HITACHI CHEM DUPONT MICROSYS (JP) | 2014-09-03 | — | — | EP | disclosed |
| EP-2341108-B1 | Surface treatment method for solid material | SHINETSU CHEMICAL CO (JP) | 2014-07-02 | — | — | EP | disclosed |
| US-8758977-B2 | Negative-type photosensitive resin composition, pattern forming method and electronic parts | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-06-24 | — | — | US | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20140120462-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN-CURED FILM USING PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-05-01 | — | — | US | disclosed |
| EP-2469337-B1 | Positive photosensitive resin composition, method for forming pattern, and electronic component | HITACHI CHEM DUPONT MICROSYS (JP) | 2014-01-22 | — | — | EP | disclosed |
| US-8574468-B1 | Benzo-fused heterocyclic chromophores for nonlinear optical devices | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2013-11-05 | — | — | US | disclosed |
| CN-101641767-B | Silicon dielectric treating agent for use after etching, process for producing semiconductor device, and semiconductor device | FUJITSU LTD | 2013-10-30 | — | — | CN | disclosed |
| US-8541631-B2 | Surface treatment method for solid material | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-09-24 | — | — | US | disclosed |
| EP-2221666-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2013-09-18 | — | — | EP | disclosed |
| US-8530003-B2 | Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device | FUJIFILM CORPORATION (JP) | 2013-09-10 | — | — | US | disclosed |
| EP-2618216-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical Co., Ltd. (JP) | 2013-07-24 | — | — | EP | disclosed |
| US-20130168859-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT | RESONAC CORPORATION (JP) | 2013-07-04 | — | — | US | disclosed |
| US-8461699-B2 | Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-06-11 | — | — | US | disclosed |
| EP-1440077-B1 | SYNTHETIC HEPARIN PENTASACCHARIDES | ALCHEMIA LTD (AU) | 2013-05-01 | — | — | EP | disclosed |
| US-8426985-B2 | Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-04-23 | — | — | US | disclosed |
| US-8420291-B2 | Positive photosensitive resin composition, method for forming pattern, electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2013-04-16 | — | — | US | disclosed |
| US-8404833-B2 | Synthetic heparin disaccharides | ALCHEMIA LIMITED (AU) | 2013-03-26 | — | — | US | disclosed |
| EP-2569312-A1 | SUBSTITUTED HETEROCYCLYL BENZYL PYRAZOLES, AND USE THEREOF | Bayer Pharma Aktiengesellschaft (DE) | 2013-03-20 | — | — | EP | disclosed |
| EP-2557086-A2 | Synthetic heparin pentasaccharides | Alchemia Limited (AU) | 2013-02-13 | — | — | EP | disclosed |
| US-20120288798-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM AND ELECTRONIC COMPONENT | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2012-11-15 | — | — | US | disclosed |
| US-8298747-B2 | Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2012-10-30 | — | — | US | disclosed |
| EP-2502915-A1 | AROMATIC SULFONIUM SALT COMPOUND | Adeka Corporation (JP) | 2012-09-26 | — | — | EP | disclosed |
| US-20120220759-A1 | SYNTHETIC HEPARIN DISACCHARIDES | ALCHEMIA LIMITED (AU) | 2012-08-30 | — | — | US | disclosed |
| US-20120208993-A1 | SYNTHETIC HEPARIN TRISACCHARIDES | ALCHEMIA LIMITED (AU) | 2012-08-16 | — | — | US | disclosed |
| US-8227624-B2 | Aromatic sulfonium salt compound | ADEKA CORPORATION (JP) | 2012-07-24 | — | — | US | disclosed |
| EP-2469337-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic component | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2012-06-27 | — | — | EP | disclosed |
| US-20120136155-A1 | AROMATIC SULFONIUM SALT COMPOUND | ADEKA CORPORATION (JP) | 2012-05-31 | — | — | US | disclosed |
| US-20120115333-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2012-05-10 | — | — | US | disclosed |
| US-8133550-B2 | Good breaking elongation characteristics, achievable high sensitivity and high film remaining rate, little in pattern size fluctuation at the heating time after lithographic process, capable of stable pattern formation; manufacturing a semiconductor device | FUJIFILM CORPORATION (JP) | 2012-03-13 | — | — | US | disclosed |
| US-8114970-B2 | Synthetic heparin monosaccharides | ALCHEMIA LIMITED (AU) | 2012-02-14 | — | — | US | disclosed |
| WO-2011141326-A1 | SUBSTITUTED HETEROCYCLYL BENZYL PYRAZOLES, AND USE THEREOF | BAYER PHARMA AKTIENGESELLSCHAFT (DE) | 2011-11-17 | — | — | WO | disclosed |
| US-20110254178-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | RESONAC CORPORATION (JP) | 2011-10-20 | — | — | US | disclosed |
| US-20110250396-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | RESONAC CORPORATION (JP) | 2011-10-13 | — | — | US | disclosed |
| EP-2372457-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2011-10-05 | — | — | EP | disclosed |
| US-20110204528-A1 | POSTIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, AND ELECTRONIC COMPONENT | RESONAC CORPORATION (JP) | 2011-08-25 | — | — | US | disclosed |
| US-20110171436-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2011-07-14 | — | — | US | disclosed |
| EP-2341108-A1 | Surface treatment method for solid material | Shin-Etsu Chemical Co., Ltd. (JP) | 2011-07-06 | — | — | EP | disclosed |
| US-20110160464-A1 | SURFACE TREATMENT METHOD FOR SOLID MATERIAL | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-06-30 | — | — | US | disclosed |
| US-20110152540-A1 | AROMATIC SULFONIUM SALT COMPOUND | ADEKA CORPORATION (JP) | 2011-06-23 | — | — | US | disclosed |
| EP-2328027-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical Company, Ltd. (JP) | 2011-06-01 | — | — | EP | disclosed |
| US-20100258336-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, ELECTRONIC COMPONENT | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2010-10-14 | — | — | US | disclosed |
| EP-2221666-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2010-08-25 | — | — | EP | disclosed |
| US-20100159217-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERNS, AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD (JP) | 2010-06-24 | — | — | US | disclosed |
| EP-2186799-A1 | AROMATIC SULFONIUM SALT COMPOUND | Adeka Corporation (JP) | 2010-05-19 | — | — | EP | disclosed |
| US-20100092879-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2010-04-15 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| US-7638254-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2009-12-29 | — | — | US | disclosed |
| EP-2133743-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | Hitachi Chemical DuPont Microsystems, Ltd. (JP) | 2009-12-16 | — | — | EP | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| US-7601702-B2 | Dutpase Inhibitors | MEDIVIR AB (SE) | 2009-10-13 | — | — | US | disclosed |
| US-20090187013-A1 | SYNTHETIC HEPARIN PENTASACCHARIDES | ALCHEMIA LIMITED (AU) | 2009-07-23 | — | — | US | disclosed |
| US-20090181224-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2009-07-16 | — | — | US | disclosed |
| US-7541445-B2 | Synthetic heparin pentasaccharides | ALCHEMIA LIMITED (AU) | 2009-06-02 | — | — | US | disclosed |
| US-20090011364-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART | HATTORI TAKASHI | 2009-01-08 | — | — | US | disclosed |
| US-20080300216-A1 | Dutpase Inhibitors | MEDIVIR AB (SE) | 2008-12-04 | — | — | US | disclosed |
| US-7435525-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2008-10-14 | — | — | US | disclosed |
| US-20080076849-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| EP-1682076-A4 | INHIBITORS OF CORONAVIRUS PROTEASE AND METHODS OF USE THEREOF | FULCRUM PHARMACEUTICALS INC (US) | 2008-02-06 | — | — | EP | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| EP-1744213-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical DuPont Microsystems Ltd. (JP) | 2007-01-17 | — | — | EP | disclosed |
| EP-1682076-A2 | INHIBITORS OF CORONAVIRUS PROTEASE AND METHODS OF USE THEREOF | Fulcrum Pharmaceuticals, Inc. (US) | 2006-07-26 | — | — | EP | disclosed |
| EP-1599455-A1 | 4-(3- (2-PHENYL-OXAZOL-4-YLMETHOXY)-CYCLOHEXYLOXY)-BUTANE ACID DERIVATIVES AND RELATED COMPOUNDS AS PPAR MODULATORS FOR TREATING DIABETES OF TYPE 2 AND ATHEROSCLEROSIS | Sanofi-Aventis Deutschland GmbH (DE) | 2005-11-30 | — | — | EP | disclosed |
| WO-2005041904-A2 | INHIBITORS OF CORONAVIRUS PROTEASE AND METHODS OF USE THEREOF | FULCRUM PHARMACEUTICALS, INC. (US) | 2005-05-12 | — | — | WO | disclosed |
| EP-1523493-A1 | NOVEL TUBULYSIN ANALOGUES | Morphochem Aktiengesellschaft Für Kombinatorische Chemie (DE) | 2005-04-20 | — | — | EP | disclosed |
| US-20050080042-A1 | synthetic monosaccharides, disaccharides, trisaccharides, tetrasaccharides and pentasaccharides for use in the preparation of synthetic heparinoids; Vascular thrombosis, cardiovascular disease | DR. REDDY'S LABORATORIES, SA (CH) | 2005-04-14 | — | — | US | disclosed |
| WO-2004076428-A1 | 4-(3- (2-PHENYL-OXAZOL-4-YLMETHOXY)-CYCLOHEXYLOXY)-BUTANE ACID DERIVATIVES AND RELATED COMPOUNDS AS PPAR MODULATORS FOR TREATING DIABETES OF TYPE 2 AND ATHEROSCLEROSIS | AVENTIS PHARMA DEUTSCHLAND GMBH (DE) | 2004-09-10 | — | — | WO | disclosed |
| EP-1440077-A1 | SYNTHETIC HEPARIN PENTASACCHARIDES | Alchemia Limited (AU) | 2004-07-28 | — | — | EP | disclosed |
| WO-2004005327-A1 | NOVEL TUBULYSIN ANALOGUES | MORPHOCHEM AG KOMB CHEMIE (DE) | 2004-01-15 | — | — | WO | disclosed |
| EP-1329160-A2 | 4-ACYLAMINOPYRAZOLE DERIVATIVES | Sankyo Company, Limited (JP) | 2003-07-23 | — | — | EP | disclosed |
| WO-2003022860-A1 | SYNTHETIC HEPARIN PENTASACCHARIDES | ALCHEMIA PTY LTD (AU) | 2003-03-20 | — | — | WO | disclosed |
| EP-1235823-A1 | H-ANNELLATED BENZO F]CHROMENES | Optische Werke G. Rodenstock (DE) | 2002-09-04 | — | — | EP | disclosed |
| WO-2002051795-A1 | CARBOXAMIDES, MEDICAMENTS CONTAINING SAID COMPOUNDS, USE AND PRODUCTION THEREOF | BOEHRINGER INGELHEIM PHARMA GMBH & CO. KG (DE) | 2002-07-04 | — | — | WO | disclosed |
| WO-2002022594-A1 | H-ANNELLATED BENZO[F]CHROMENES | OPTISCHE WERKE G. RODENSTOCK (DE) | 2002-03-21 | — | — | WO | disclosed |
| EP-1149086-A1 | NOVEL PROCESS FOR THE REMOVAL OF A SILYLOXY PROTECTING GROUP FROM 4-SILYLOXY-TETRAHYDRO-PYRAN-2-ONES | Lek Pharmaceutical and Chemical Co. D.D. (SI) | 2001-10-31 | — | — | EP | disclosed |
| JP-2001172250-A | GLUCOPYRANOSE DERIVATIVE | ONO PHARMACEUT CO LTD | 2001-06-26 | — | — | JP | disclosed |
| WO-2000046217-A1 | NOVEL PROCESS FOR THE REMOVAL OF A SILYLOXY PROTECTING GROUP FROM 4-SILYLOXY-TETRAHYDRO-PYRAN-2-ONES | LEK PHARMACEUTICALS AND CHEMICAL COMPANY D.D. (SI) | 2000-08-10 | — | — | WO | disclosed |
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| US-5252599-A | Antiasthma, antiallergens, antiinflammatory agents | MERCK FROSST CANADA, INC. (CA) | 1993-10-12 | — | — | US | disclosed |
| EP-0540572-A1 | CHIRAL ALKEN-ARYL-2,3-EPOXYALKYL-ETHERS AND THEIR USE IN LIQUID CRYSTAL MIXTURES. | HOECHST AG (DE) | 1993-05-12 | — | — | EP | disclosed |
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| WO-1992001685-A1 | CHIRAL ALKEN-ARYL-2,3-EPOXYALKYL-ETHERS AND THEIR USE IN LIQUID CRYSTAL MIXTURES | HOECHST AKTIENGESELLSCHAFT (DE) | 1992-02-06 | — | — | WO | disclosed |
| WO-1990003974-A1 | (1S,2S,3R,5R)-2-[3S)-2-HALOGEN-3-HYDROXY-1-ALKEN(INYL)]-3-TRIALKYL-SILYLOXY-7,7-(2,2-DIMETHYL-TRIMETHYLENDIOXY)-BICYCLO[3.3.0]OCTANE COMPOUNDS AND PROCESS FOR PRODUCING THE SAME | SCHERING AKTIENGESELLSCHAFT BERLIN UND BERGKAMEN (DE) | 1990-04-19 | — | — | WO | disclosed |
| EP-0139234-B1 | RESIN COMPOSITION | KABUSHIKI KAISHA TOSHIBA (JP) | 1989-11-29 | — | — | EP | disclosed |
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| US-4552937-A | Polymerization catalyst system | PHILLIPS PETROLEUM COMPANY (US) | 1985-11-12 | — | — | US | disclosed |
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| US-4472519-A | Polymerization catalyst system | PHILLIPS PETROLEUM COMPANY (US) | 1984-09-18 | — | — | US | disclosed |
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Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (21 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | PCSK9 4713/4885PTGS2 158/4885NAAA 2321/4885 |
| US-10800988-B2 | Method for liquid authentication by detection of flavonoid derivatives | COMT, CYP3A4, CYP2F1 | PCSK9 1593/4885PTGS2 1434/4885NAAA 818/4885 |
| US-12601970-B2 | Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component | ARCN1, P4HA1, COL1A1 | PCSK9 4680/4885PTGS2 1412/4885NAAA 4123/4885 |
| US-20210292345-A1 | Use of Silylated Formiates as Hydrosilane Equivalents | PFAS, EPM2A, CYP2F1 | PCSK9 1082/4885PTGS2 3386/4885NAAA 3020/4885 |
| US-10023603-B2 | Preparation of monosaccharides, disaccharides, trisaccharides, and pentasaccharides of heparinoids | HPSE, DDOST, FUT5 | PCSK9 173/4885PTGS2 2870/4885NAAA 1070/4885 |
| US-11912731-B2 | Use of silylated formiates as hydrosilane equivalents | PFAS, EPM2A, CYP2F1 | PCSK9 1082/4885PTGS2 3386/4885NAAA 3020/4885 |
| US-20090187013-A1 | SYNTHETIC HEPARIN PENTASACCHARIDES | HPSE, DDOST, STT3A | PCSK9 529/4885PTGS2 1740/4885NAAA 1119/4885 |
| US-20110160464-A1 | SURFACE TREATMENT METHOD FOR SOLID MATERIAL | H1-2, H1-0, HRH3 | PCSK9 4700/4885PTGS2 3170/4885NAAA 3563/4885 |
| US-20170015695-A1 | PREPARATION OF MONOSACCHARIDES, DISACCHARIDES, TRISACCHARIDES, AND PENTASACCHARIDES OF HEPARINOIDS | HPSE, DDOST, FUT5 | PCSK9 173/4885PTGS2 2870/4885NAAA 1070/4885 |
| US-20110152540-A1 | AROMATIC SULFONIUM SALT COMPOUND | SLC43A1, SLC7A5, SPIN2B | PCSK9 4433/4885PTGS2 3919/4885NAAA 2947/4885 |
| US-10131646-B2 | Aromatic sulfonium salt compound, photoacid generator, resist composition, cationic polymerization initiator, and cationically polymerizable composition | ASIC1, NOX5, SLC6A19 | PCSK9 4611/4885PTGS2 4044/4885NAAA 1598/4885 |
| US-20080300216-A1 | Dutpase Inhibitors | DUT, DHODH, POLR2H | PCSK9 4087/4885PTGS2 3862/4885NAAA 1261/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | PCSK9 4854/4885PTGS2 738/4885NAAA 1680/4885 |
| US-20120220759-A1 | SYNTHETIC HEPARIN DISACCHARIDES | HPSE, DDOST, STT3A | PCSK9 405/4885PTGS2 2080/4885NAAA 1067/4885 |
| US-20120136155-A1 | AROMATIC SULFONIUM SALT COMPOUND | F12, ASIC1, SPIN1 | PCSK9 3465/4885PTGS2 3046/4885NAAA 1215/4885 |
| US-20150005485-A1 | SYNTHETIC HEPARIN PENTASACCHARIDES | HPSE, DDOST, STT3A | PCSK9 644/4885PTGS2 2151/4885NAAA 1003/4885 |
| US-20050080042-A1 | synthetic monosaccharides, disaccharides, trisaccharides, tetrasaccharides and pentasaccharides for use in the preparation of synthetic heparinoids; Vascular thrombosis, cardiovascular disease | HPSE, DDOST, STS | PCSK9 89/4885PTGS2 1584/4885NAAA 1576/4885 |
| US-20120115333-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | CD79B, BRIX1, SMARCB1 | PCSK9 2481/4885PTGS2 3213/4885NAAA 1881/4885 |
| US-20170298283-A1 | METHOD FOR LIQUID AUTHENTICATION BY DETECTION OF FLAVONOID DERIVATIVES | COMT, CYP3A4, CYP2F1 | PCSK9 1593/4885PTGS2 1434/4885NAAA 818/4885 |
| US-20120208993-A1 | SYNTHETIC HEPARIN TRISACCHARIDES | HPSE, SERPINC1, DDOST | PCSK9 364/4885PTGS2 1984/4885NAAA 1179/4885 |
| US-20180079738-A1 | AROMATIC SULFONIUM SALT COMPOUND, PHOTOACID GENERATOR, RESIST COMPOSITION, CATIONIC POLYMERIZATION INITIATOR, AND CATIONICALLY POLYMERIZABLE COMPOSITION | ASIC1, NOX5, SLC6A19 | PCSK9 4611/4885PTGS2 4044/4885NAAA 1598/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.