SCHEMBL431994

SCHEMBL431994

CCCCOCC(C)OCC(C)OCC(C)OCCCC

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.53
LPAR1 Q92633 5/20 0.39
LPAR3 Q9UBY5 5/20 0.39
LPAR2 Q9HBW0 2/20 0.39
USP2 O75604 1/20 0.38
TSHR P16473 2/20 0.38
SPHK1 Q9NYA1 1/20 0.38
HTT P42858 1/20 0.37
HSD17B10 Q99714 1/20 0.37
CYP3A4 P08684 2/20 0.36
TLR2 O60603 2/20 0.33
PRKD3 O94806 1/20 0.33
PRKCG P05129 1/20 0.33
PRKCB P05771 1/20 0.33
PRKCA P17252 1/20 0.33
PRKCH P24723 1/20 0.33
PRKCI P41743 1/20 0.33
PRKCE Q02156 1/20 0.33
PRKCQ Q04759 1/20 0.33
PRKCZ Q05513 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28728615 1.00 TDP1 (0.53) TDP1LPAR1LPAR3LPAR2USP2
SCHEMBL429585 1.00 TDP1 (0.53) TDP1LPAR1LPAR3LPAR2USP2
SCHEMBL230477 1.00 TDP1 (0.53) TDP1LPAR1LPAR3LPAR2USP2
SCHEMBL28729672 1.00 TDP1 (0.53) TDP1LPAR1LPAR3LPAR2USP2
SCHEMBL80455 0.96 TDP1 (0.52) TDP1LPAR1LPAR3LPAR2USP2
SCHEMBL22499935 0.94 TDP1 (0.48) TDP1LPAR1LPAR3LPAR2USP2
SCHEMBL23159796 0.94 TDP1 (0.62) TDP1LPAR1LPAR3LPAR2USP2
SCHEMBL4891519 0.94 TDP1 (0.57) TDP1LPAR1LPAR3LPAR2USP2
SCHEMBL8642635 0.94 TDP1 (0.52) TDP1LPAR1LPAR3LPAR2USP2
SCHEMBL25289202 0.94 TDP1 (0.52) TDP1LPAR1LPAR3LPAR2USP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 764 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12545862-B2 Method for producing decomposing/cleaning composition RESONAC CORPORATION (JP) 2026-02-10 US claimed
US-20250257242-A1 CMP POLISHING LIQUID AND POLISHING METHOD RESONAC CORPORATION (JP) 2025-08-14 US claimed
WO-2025066477-A1 ALKALI-DEVELOPABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT HAVING CURED PRODUCT 太阳油墨(苏州)有限公司 2025-04-03 WO claimed
CN-119717391-A Alkali-developable resin composition, dry film, cured product, and electronic component having the cured product 太阳油墨(苏州)有限公司 2025-03-28 CN claimed
US-20240042376-A1 WATER-LEAN CARBON DIOXIDE ABSORBENT AND METHOD FOR CAPTURING CARBON DIOXIDE BY USING SAME CE-TEK CO., LTD. (KR) 2024-02-08 US claimed
WO-2023068516-A1 LOW-WATER TYPE CARBON DIOXIDE ABSORBENT AND METHOD FOR CAPTURING CARBON DIOXIDE BY USING SAME 주식회사 씨이텍 2023-04-27 WO claimed
CN-114027309-B Iodine-containing disinfectant containing polyvinylpyrrolidone and polyalcohol ether and preparation method thereof 佛山市正典生物技术有限公司 2023-04-25 CN claimed
CN-114208818-B Iodine-containing disinfectant containing polyol ether and/or cyclic ether and preparation method thereof 佛山市正典生物技术有限公司 2022-10-04 CN claimed
CN-114208818-A Iodine-containing disinfectant containing polyol ether and/or cyclic ether and preparation method thereof 佛山市正典生物技术有限公司 2022-03-22 CN claimed
CN-114027309-A Iodine-containing disinfectant containing polyvinylpyrrolidone and polyol ether and preparation method thereof 佛山市正典生物技术有限公司 2022-02-11 CN claimed
US-10543454-B2 Carbon dioxide absorbent UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2020-01-28 US claimed
US-10099172-B2 Carbon dioxide absorbent comprising triamine UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2018-10-16 US claimed
US-20180257023-A1 CARBON DIOXIDE ABSORBENT UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2018-09-13 US claimed
US-20170246587-A1 CARBON DIOXIDE ABSORBENT COMPRISING TRIAMINE UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2017-08-31 US claimed
US-20170225118-A1 CARBON DIOXIDE ABSORBENT COMPRISING OXYGEN-CONTAINING DIAMINE UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2017-08-10 US claimed
CN-102453148-B Olefin polymerization catalyst component, olefin polymerization catalyst and olefin polymerization method CHINA PETROLEUM & CHEMICAL 2014-04-02 CN claimed
CN-102131910-B Cleaning agent composition for removing lead-free flux and system for removing lead-free flux ARAKAWA CHEM IND 2012-12-19 CN claimed
CN-102453148-A Olefin polymerization catalyst component, olefin polymerization catalyst, and olefin polymerization method CHINA PETROLEUM & CHEMICAL 2012-05-16 CN claimed
US-5512198-A WEAR RESISTANCE NIPPON OIL CO., LTD. (JP) 1996-04-30 US claimed
WO-2026087353-A1 USE OF NON-VOLATILE AND LOW WATER SENSITIVE COUNTERIONS IN LATICES CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2026-04-30 WO disclosed
US-12577508-B2 Composition, and method for cleaning adhesive polymer RESONAC CORPORATION (JP) 2026-03-17 US disclosed
EP-4700824-A1 LOW-TEMPERATURE-SINTERING BONDING MATERIAL AND BONDED STRUCTURE Daicel Corporation (JP) 2026-02-25 EP disclosed
US-12545862-B2 Method for producing decomposing/cleaning composition RESONAC CORPORATION (JP) 2026-02-10 US disclosed
US-20260018421-A1 SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD CENTRAL GLASS CO LTD (JP) 2026-01-15 US disclosed
US-20250343040-A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PRODUCTION METHOD CENTRAL GLASS CO LTD (JP) 2025-11-06 US disclosed
EP-3913025-B1 AQUEOUS REACTION LIQUID CANON PRODUCTION PRINTING HOLDING BV (NL) 2025-11-05 EP disclosed
EP-4012726-B1 ADHESIVE CONDUCTIVE PASTE DAICEL CORP (JP) 2025-10-22 EP disclosed
EP-4628555-A1 TWO-COMPONENT CLEAR COATING COMPOSITION Nippon Paint Automotive Coatings Co., Ltd. (JP) 2025-10-08 EP disclosed
US-20250304843-A1 ANTIFREEZE AGENTS AND COOLANTS FOR FUEL CELLS, STORAGE BATTERIES AND BATTERIES BASF SE (DE) 2025-10-02 US disclosed
US-20250270480-A1 PROCESSING SOLUTION, METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR TOKYO OHKA KOGYO CO., LTD. (JP) 2025-08-28 US disclosed
US-20250270474-A1 PROCESSING SOLUTION, METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR TOKYO OHKA KOGYO CO., LTD. (JP) 2025-08-28 US disclosed
US-20250270415-A1 PRINTING METHOD, PRINTER AND INK SET CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2025-08-28 US disclosed
EP-4606873-A1 PRINTING METHOD, PRINTER AND INK SET Canon Production Printing Holding B.V. (NL) 2025-08-27 EP disclosed
US-20250257242-A1 CMP POLISHING LIQUID AND POLISHING METHOD RESONAC CORPORATION (JP) 2025-08-14 US disclosed
EP-4597547-A1 CHEMICAL SOLUTION, METHOD FOR PRODUCING MODIFIED SUBSTRATE, AND METHOD FOR PRODUCING LAYERED BODY FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
US-20250215024-A1 CHEMICAL LIQUID, MANUFACTURING METHOD OF MODIFIED SUBSTRATE, AND MANUFACTURING METHOD OF LAMINATE FUJIFILM CORPORATION (JP) 2025-07-03 US disclosed
US-20250201546-A1 METHOD FOR PROCESSING SUBSTRATE, KIT FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-06-19 US disclosed
WO-2025127083-A1 CMP POLISHING LIQUID AND POLISHING METHOD 株式会社レゾナック 2025-06-19 WO disclosed
WO-2025126439-A1 CMP POLISHING LIQUID AND POLISHING METHOD 株式会社レゾナック 2025-06-19 WO disclosed
WO-2025127074-A1 CMP POLISHING LIQUID AND POLISHING METHOD 株式会社レゾナック 2025-06-19 WO disclosed
WO-2025126434-A1 CMP POLISHING LIQUID AND POLISHING METHOD 株式会社レゾナック 2025-06-19 WO disclosed
US-20250188315-A1 POLISHING AGENT AND POLISHING METHOD RESONAC CORPORATION (JP) 2025-06-12 US disclosed
WO-2025105151-A1 METHOD OF MANUFACTURING TREATED SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR FUJIFILM CORPORATION (JP) 2025-05-22 WO disclosed
US-12305110-B2 Antifreeze agents and coolants for fuel cells, storage batteries and batteries BASF SE (DE) 2025-05-20 US disclosed
CN-119948406-A Photosensitive colored resin composition, cured product, partition wall, organic electroluminescent element, color filter, and image display device 三菱化学株式会社 2025-05-06 CN disclosed
US-20250140548-A1 PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD, (JP) 2025-05-01 US disclosed
US-20250140549-A1 PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD, (JP) 2025-05-01 US disclosed
US-12286546-B2 Pre-treatment liquid for use in ink jet printing CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2025-04-29 US disclosed
EP-3877481-B1 USE OF AN ESSENTIALLY WATER-FREE COMPOSITION AS A COOLANT AND ANTIFREEZE FOR FUEL CELLS, ACCUMULATORS AND BATTERIES BASF SE (DE) 2025-04-23 EP disclosed
WO-2025078258-A1 FOOD SAFE AQUEOUS INKJET COMPOSITIONS CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2025-04-17 WO disclosed
WO-2025078257-A1 FOOD SAFE AQUEOUS INKJET COMPOSITIONS CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2025-04-17 WO disclosed
US-20250122393-A1 FOOD SAFE AQUEOUS INKJET COMPOSITIONS CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2025-04-17 US disclosed
US-20250122397-A1 FOOD SAFE AQUEOUS INKJET COMPOSITIONS CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2025-04-17 US disclosed
EP-4538341-A1 FOOD SAFE AQUEOUS INKJET COMPOSITIONS Canon Production Printing Holding B.V. (NL) 2025-04-16 EP disclosed
EP-4538339-A1 FOOD SAFE AQUEOUS INKJET COMPOSITIONS Canon Production Printing Holding B.V. (NL) 2025-04-16 EP disclosed
EP-4538347-A2 USE OF A SUBSTANTIALLY ANHYDROUS COMPOSITION AS COOLANT AND ANTIFREEZE AGENTS FOR FUEL CELLS, ACCUMULATORS AND BATTERIES BASF SE (DE) 2025-04-16 EP disclosed
EP-4538340-A1 FOOD SAFE AQUEOUS INKJET COMPOSITIONS Canon Production Printing Holding B.V. (NL) 2025-04-16 EP disclosed
EP-4535406-A1 SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD Central Glass Company, Limited (JP) 2025-04-09 EP disclosed
EP-4535405-A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PRODUCTION METHOD Central Glass Company, Limited (JP) 2025-04-09 EP disclosed
CN-119768898-A Chemical solution, method for producing modified substrate, and method for producing laminate 富士胶片株式会社 2025-04-04 CN disclosed
WO-2025066477-A1 ALKALI-DEVELOPABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT HAVING CURED PRODUCT 太阳油墨(苏州)有限公司 2025-04-03 WO disclosed
CN-113169060-B Chamfering part treating agent composition and method for manufacturing wafer 中央硝子株式会社 2025-04-01 CN disclosed
CN-119717391-A Alkali-developable resin composition, dry film, cured product, and electronic component having the cured product 太阳油墨(苏州)有限公司 2025-03-28 CN disclosed
US-12252587-B2 Curable resin composition, thin film, and color conversion panel and display device including thin film SAMSUNG SDI CO., LTD. (KR) 2025-03-18 US disclosed
US-20250084351-A1 PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-03-13 US disclosed
US-20250075092-A1 JETABLE NEUTRALIZING LIQUID TO PREVENT PRIMER SALT INTERACTION WITH VARNISH APPLICATION CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2025-03-06 US disclosed
US-20250075094-A1 TWO-PACK TYPE CLEAR COATING COMPOSITION NIPPON PAINT AUTOMOTIVE COATING CO. LTD. (JP) 2025-03-06 US disclosed
EP-4516529-A1 JETABLE NEUTRALIZING LIQUID TO PREVENT PRIMER SALT INTERACTION WITH VARNISH APPLICATION Canon Production Printing Holding B.V. (NL) 2025-03-05 EP disclosed
US-20250066621-A1 COMPOSITION FOR FILM FORMATION AND METHOD FOR MANUFACTURING SUBSTRATE CENTRAL GLASS COMPANY, LIMITED (JP) 2025-02-27 US disclosed
CN-111742391-B Chemical solution for forming water-repellent protective film, method for producing same, and method for producing surface-treated body 中央硝子株式会社 2025-02-18 CN disclosed
EP-4259734-B1 PRE-TREATMENT LIQUID FOR USE IN INK JET PRINTING CANON PRODUCTION PRINTING HOLDING BV (NL) 2025-02-12 EP disclosed
EP-3961676-B1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-01-22 EP disclosed
EP-4495204-A1 POLISHING AGENT AND POLISHING METHOD Resonac Corporation (JP) 2025-01-22 EP disclosed
CN-119317618-A Sulfonium salt and acid generator containing same 三亚普罗股份有限公司 2025-01-14 CN disclosed
US-20240425780-A1 CLEANING SOLUTION, METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR TOKYO OHKA KOGYO CO., LTD. (JP) 2024-12-26 US disclosed
US-12163087-B2 Surface treatment agent and method for manufacturing surface treatment body CENTRAL GLASS COMPANY, LIMITED (JP) 2024-12-10 US disclosed
WO-2024248021-A1 FILM-FORMING COMPOSITION, METHOD FOR PRODUCING SUBSTRATE, AND METHOD FOR PRODUCING FILM-FORMING COMPOSITION セントラル硝子株式会社 2024-12-05 WO disclosed
US-12152169-B2 Adhesive conductive paste DAICEL CORPORATION (JP) 2024-11-26 US disclosed
EP-4459666-A1 COMPOSITION FOR FILM FORMATION AND METHOD FOR PRODUCING SUBSTRATE Central Glass Company, Limited (JP) 2024-11-06 EP disclosed
US-12128350-B2 Water-lean carbon dioxide absorbent and method for capturing carbon dioxide by using same CE-TEK CO., LTD. (KR) 2024-10-29 US disclosed
WO-2024219382-A1 LOW-TEMPERATURE-SINTERING BONDING MATERIAL AND BONDED STRUCTURE 株式会社ダイセル 2024-10-24 WO disclosed
CN-118804958-A Aqueous multi-liquid polyurethane coating composition 关西涂料株式会社 2024-10-18 CN disclosed
CN-118804957-A Aqueous multi-liquid polyurethane coating composition 关西涂料株式会社 2024-10-18 CN disclosed
WO-2024214715-A1 ADDITIVE COMPOSITION FOR COMMON RAIL DIESEL ENGINE FUEL 油化産業株式会社 2024-10-17 WO disclosed
CN-113169248-B Method for manufacturing semiconductor element and method for manufacturing solar cell 东丽株式会社 2024-10-01 CN disclosed
US-20240317779-A1 METAL COMPLEXES HAVING 4-H,6-H OR 8-H DIHYDROAZULENYL LIGANDS AND USE THEREOF UMICORE AG & CO. KG (DE) 2024-09-26 US disclosed
US-20240317788-A1 PRECIOUS METAL COMPLEXES WITH DIHYDROAZULENYL LIGANDS AND USE THEREOF UMICORE AG & CO. KG (DE) 2024-09-26 US disclosed
US-12098319-B2 Liquid chemical for forming water-repellent protective film, method for preparing same, and method for manufacturing surface-treated body CENTRAL GLASS COMPANY, LIMITED (JP) 2024-09-24 US disclosed
EP-4011990-B1 PRE-TREATMENT LIQUID FOR USE IN INK JET PRINTING CANON PRODUCTION PRINTING HOLDING BV (NL) 2024-09-11 EP disclosed
WO-2024177001-A1 SULFONIUM SALT AND ACID GENERATOR CONTAINING SAID SULFONIUM SALT サンアプロ株式会社 2024-08-29 WO disclosed
US-20240287103-A1 WATER-REPELLENT PROTECTIVE FILM-FORMING AGENT, WATER-REPELLENT PROTECTIVE FILM-FORMING CHEMICAL SOLUTION, AND WAFER SURFACE TREATMENT METHOD CENTRAL GLASS CO LTD (JP) 2024-08-29 US disclosed
CN-110874026-B Stripping liquid composition for color filter and method for using same 易案爱富科技有限公司 2024-07-12 CN disclosed
WO-2024143097-A1 SUBSTRATE TREATING METHOD AND SUBSTRATE MANUFACTURING METHOD セントラル硝子株式会社 2024-07-04 WO disclosed
WO-2024128017-A1 SULFONIUM SALT, ACID GENERATING AGENT, AND PHOTORESIST サンアプロ株式会社 2024-06-20 WO disclosed
WO-2024122565-A1 PHOTOSENSITIVE COLORED RESIN COMPOSITION, CURED PRODUCT, PARTITION WALL, ORGANIC ELECTROLUMINESCENT ELEMENT, COLOR FILTER, AND IMAGE DISPLAY DEVICE 三菱ケミカル株式会社 2024-06-13 WO disclosed
WO-2024116463-A1 TWO-COMPONENT CLEAR COATING COMPOSITION 日本ペイント・オートモーティブコーティングス株式会社 2024-06-06 WO disclosed
EP-3296327-B1 METHOD FOR PRODUCING ELLIPTICAL, NEEDLE-SHAPED, OR ROD-SHAPED POLYMER PARTICLES NISSHINBO HOLDINGS INC (JP) 2024-05-15 EP disclosed
US-20240142874-A1 NON-CHEMICALLY AMPLIFIED RESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-05-02 US disclosed
US-20240116075-A1 SUBSTRATE, SELECTIVE FILM DEPOSITION METHOD, DEPOSITION FILM OF ORGANIC MATTER, AND ORGANIC MATTER CENTRAL GLASS COMPANY, LIMITED (JP) 2024-04-11 US disclosed
WO-2024070526-A1 CHEMICAL SOLUTION, METHOD FOR PRODUCING MODIFIED SUBSTRATE, AND METHOD FOR PRODUCING LAYERED BODY 富士フイルム株式会社 2024-04-04 WO disclosed
US-11945152-B2 Model material ink set, support material composition, ink set, three-dimensional shaped object, and method for manufacturing three-dimensional shaped object MAXELL, LTD. (JP) 2024-04-02 US disclosed
EP-3715094-B1 COMPOSITION FOR MODEL MATERIAL MAXELL LTD (JP) 2024-03-27 EP disclosed
CN-115551934-B Curable resin composition, cured film prepared therefrom, and electronic device comprising cured film 三星SDI株式会社 2024-03-12 CN disclosed
CN-117677901-A Positive photosensitive resin composition 日产化学株式会社 2024-03-08 CN disclosed
CN-108026225-B Resin composition for mold material, resin composition for support material, stereolithography product, and method for producing stereolithography product 麦克赛尔株式会社 2024-03-05 CN disclosed
CN-117625025-A Aqueous multi-liquid polyurethane coating composition 关西涂料株式会社 2024-03-01 CN disclosed
CN-112969770-B Novel antifreeze and coolant for fuel cells, storage cells and batteries 巴斯夫欧洲公司 2024-02-27 CN disclosed
CN-114269892-B Composition and method for cleaning adhesive polymer 株式会社力森诺科 2024-02-23 CN disclosed
US-20240055273-A1 Wet Etching Solution and Wet Etching Method CENTRAL GLASS COMPANY, LIMITED (JP) 2024-02-15 US disclosed
WO-2024029354-A1 SULFONIUM SALT AND ACID GENERATOR CONTAINING SAID SULFONIUM SALT サンアプロ株式会社 2024-02-08 WO disclosed
US-20240042376-A1 WATER-LEAN CARBON DIOXIDE ABSORBENT AND METHOD FOR CAPTURING CARBON DIOXIDE BY USING SAME CE-TEK CO., LTD. (KR) 2024-02-08 US disclosed
CN-115109413-B Curable resin composition, film, color conversion panel, and display device 三星SDI株式会社 2024-02-02 CN disclosed
EP-3877482-B1 USE OF HEAT TRANSFER FLUIDS FOR COOLING LITHIUM BATTERIES BASF SE (DE) 2024-01-10 EP disclosed
CN-114746536-B Method for producing decomposition cleaning composition 株式会社力森诺科 2024-01-09 CN disclosed
CN-117304414-A Resin composition for mold material and stereolithography 麦克赛尔株式会社 2023-12-29 CN disclosed
EP-4294817-A1 NOBLE METAL COMPLEXES WITH DIHYDROAZULENYL LIGANDS AND USE THEREOF Umicore AG & Co. KG (DE) 2023-12-27 EP disclosed
WO-2023243611-A1 CMP POLISHING LIQUID AND POLISHING METHOD 株式会社レゾナック 2023-12-21 WO disclosed
CN-112602174-B Composition, method for cleaning adhesive polymer, method for manufacturing device wafer, and method for regenerating supporting wafer 株式会社力森诺科 2023-12-08 CN disclosed
WO-2023234368-A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PRODUCTION METHOD セントラル硝子株式会社 2023-12-07 WO disclosed
WO-2023234370-A1 SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD セントラル硝子株式会社 2023-12-07 WO disclosed
EP-4287240-A1 SUBSTRATE, SELECTIVE FILM DEPOSITION METHOD, DEPOSITION FILM OF ORGANIC MATTER, AND ORGANIC MATTER Central Glass Company, Limited (JP) 2023-12-06 EP disclosed
US-20230374669-A1 Wet Etching Method CENTRAL GLASS COMPANY, LIMITED (JP) 2023-11-23 US disclosed
US-11817310-B2 Bevel portion treatment agent composition and method of manufacturing wafer CENTRAL GLASS COMPANY, LIMITED (JP) 2023-11-14 US disclosed
US-11807837-B2 Composition, method for cleaning adhesive polymer, method for producing device wafer, and method for regenerating support wafer RESONAC CORPORATION (JP) 2023-11-07 US disclosed
WO-2023203867-A1 AQUEOUS MULTI-COMPONENT POLYURETHANE COATING COMPOSITION 関西ペイント株式会社 2023-10-26 WO disclosed
WO-2023203680-A1 POLISHING AGENT AND POLISHING METHOD 株式会社レゾナック 2023-10-26 WO disclosed
WO-2023204123-A1 COMPOUND, ACID GENERATOR COMPRISING SAID COMPOUND, PHOTORESIST, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING SAID PHOTORESIST サンアプロ株式会社 2023-10-26 WO disclosed
US-11795335-B2 Resin composition for modeling material, light curing molding ink set, and method for manufacturing optically shaped article MAXELL, LTD. (JP) 2023-10-24 US disclosed
CN-116917295-A Metal complexes with 4-H, 6-H or 8-H-dihydroazulene ligands and uses thereof 优米科尔股份公司及两合公司 2023-10-20 CN disclosed
WO-2023199841-A1 COMPOUND, ACID GENERATOR CONTAINING SAID COMPOUND, PHOTORESIST, AND METHOD FOR PRODUCING ELECTRONIC DEVICE USING SAID PHOTORESIST サンアプロ株式会社 2023-10-19 WO disclosed
EP-4259734-A1 PRE-TREATMENT LIQUID FOR USE IN INK JET PRINTING Canon Production Printing Holding B.V. (NL) 2023-10-18 EP disclosed
US-11781026-B2 Aqueous ink composition CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2023-10-10 US disclosed
US-11781092-B2 Composition, and method for cleaning adhesive polymer RESONAC CORPORATION (JP) 2023-10-10 US disclosed
WO-2023189304-A1 AQUEOUS MULTI-COMPONENT POLYURETHANE COATING COMPOSITION 関西ペイント株式会社 2023-10-05 WO disclosed
US-20230312966-A1 PRE-TREATMENT LIQUID FOR USE IN INK JET PRINTING CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2023-10-05 US disclosed
CN-116802188-A Noble metal complex with azulene-based ligand and use thereof 优米科尔股份公司及两合公司 2023-09-22 CN disclosed
CN-111630633-B Chemical solution for forming water-repellent protective film and method for treating surface of wafer 中央硝子株式会社 2023-09-19 CN disclosed
CN-113423754-B Curable resin composition, cured product, acid-modified maleimide resin, and curing agent DIC株式会社 2023-09-19 CN disclosed
EP-3888927-B1 METHOD FOR APPLYING AN IMAGE ONTO A RECORDING MEDIUM CANON PRODUCTION PRINTING HOLDING BV (NL) 2023-09-13 EP disclosed
CN-111699546-B Water-repellent protective film forming agent and chemical solution for forming water-repellent protective film 中央硝子株式会社 2023-09-12 CN disclosed
US-20230282473-A1 SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATES AND SURFACE TREATMENT AGENT COMPOSITION CENTRAL GLASS COMPANY, LIMITED (JP) 2023-09-07 US disclosed
US-20230282474-A1 SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATES AND SURFACE TREATMENT AGENT COMPOSITION CENTRAL GLASS COMPANY, LIMITED (JP) 2023-09-07 US disclosed
CN-116710597-A Wet etching solution and wet etching method 中央硝子株式会社 2023-09-05 CN disclosed
CN-116685715-A Substrate, selective film deposition method, deposited film of organic substance, and organic substance 中央硝子株式会社 2023-09-01 CN disclosed
US-11738585-B2 Method for applying an image onto the recording medium and corresponding printing apparatus CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2023-08-29 US disclosed
CN-111512418-B Surface treatment agent and method for producing surface-treated body 中央硝子株式会社 2023-08-29 CN disclosed
CN-113272471-B Substrate, selective film deposition method, deposited film of organic substance, and organic substance 中央硝子株式会社 2023-07-18 CN disclosed
WO-2023127942-A1 COMPOSITION FOR FILM FORMATION AND METHOD FOR PRODUCING SUBSTRATE セントラル硝子株式会社 2023-07-06 WO disclosed
WO-2023120322-A1 DECOMPOSITION CLEANING COMPOSITION AND METHOD FOR PRODUCING SAME 株式会社レゾナック 2023-06-29 WO disclosed
CN-116324036-A Wet etching method 中央硝子株式会社 2023-06-23 CN disclosed
US-11674046-B2 Aqueous reaction liquid CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2023-06-13 US disclosed
US-20230174806-A1 MODEL MATERIAL CLEAR COMPOSITION, MODEL MATERIAL COMPOSITION SET, AND COMPOSITION SET FOR OPTICAL SHAPING MAXELL, LTD. (JP) 2023-06-08 US disclosed
US-11670498-B2 Surface treatment agent and surface-treated body manufacturing method CENTRAL GLASS COMPANY, LIMITED (JP) 2023-06-06 US disclosed
EP-3677433-B1 INKJET IMAGE FORMATION METHOD KONICA MINOLTA INC (JP) 2023-05-24 EP disclosed
EP-3578338-B1 MODEL MATERIAL INK SET, SUPPORT MATERIAL COMPOSITION, INK SET, THREE-DIMENSIONAL SHAPED OBJECT, AND METHOD FOR MANUFACTURING THREE-DIMENSIONAL SHAPED OBJECT MAXELL LTD (JP) 2023-05-10 EP disclosed
EP-3702387-B1 PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE TOKYO OHKA KOGYO CO LTD (JP) 2023-05-10 EP disclosed
WO-2023068516-A1 LOW-WATER TYPE CARBON DIOXIDE ABSORBENT AND METHOD FOR CAPTURING CARBON DIOXIDE BY USING SAME 주식회사 씨이텍 2023-04-27 WO disclosed
CN-114027309-B Iodine-containing disinfectant containing polyvinylpyrrolidone and polyalcohol ether and preparation method thereof 佛山市正典生物技术有限公司 2023-04-25 CN disclosed
CN-115926162-A Unsaturated group-containing polycarboxylic acid resin, process for producing the same, photosensitive resin composition, and cured product thereof 日本化药株式会社 2023-04-07 CN disclosed
CN-115926058-A Polyamide-imide (meth) acrylate resin, active energy ray-curable resin composition, and cured product thereof 日本化药株式会社 2023-04-07 CN disclosed
CN-115933312-A Colored photosensitive composition, cured product, and image display device 日本化药株式会社 2023-04-07 CN disclosed
US-20230100703-A1 MODEL MATERIAL CLEAR COMPOSITION AND COMPOSITION SET FOR OPTICAL SHAPING MAXELL, LTD. (JP) 2023-03-30 US disclosed
US-20230094224-A1 POLISHING AGENT, STOCK SOLUTION FOR POLISHING AGENT, AND POLISHING METHOD RESONAC CORPORATION (JP) 2023-03-30 US disclosed
EP-4155376-A1 SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATE, AND SURFACE TREATMENT AGENT COMPOSITION Central Glass Company, Limited (JP) 2023-03-29 EP disclosed
EP-4155375-A1 SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATES, AND SURFACE TREATMENT AGENT COMPOSITION Central Glass Company, Limited (JP) 2023-03-29 EP disclosed
CN-110773401-B Method for repairing and coating coated body 关西涂料株式会社 2023-03-17 CN disclosed
US-11597786-B2 Composition for model material MAXELL, LTD. (JP) 2023-03-07 US disclosed
US-20230039366-A1 COMPOSITION, AND METHOD FOR CLEANING ADHESIVE POLYMER SHOWA DENKO K.K. (JP) 2023-02-09 US disclosed
CN-115699259-A Surface treatment method for semiconductor substrate and surface treatment agent composition 中央硝子株式会社 2023-02-03 CN disclosed
WO-2023007941-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SPECIFIC COPOLYMER 日産化学株式会社 2023-02-02 WO disclosed
WO-2023007972-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2023-02-02 WO disclosed
CN-115668459-A Surface treatment method for semiconductor substrate and surface treatment agent composition 中央硝子株式会社 2023-01-31 CN disclosed
CN-115551934-A Curable resin composition, cured film formed therefrom, and electronic device having cured film 三星SDI株式会社 2022-12-30 CN disclosed
WO-2022255216-A1 AQUEOUS COATING COMPOSITION AND METHOD FOR PRODUCING COATED ARTICLE 日本ペイント株式会社 2022-12-08 WO disclosed
EP-4098643-A1 PRECIOUS METAL COMPLEXES WITH DIHYDROGUAJAZULENYL LIGANDS AND THEIR USE UMICORE AG & Co. KG (DE) 2022-12-07 EP disclosed
CN-115427547-A Composition and method for cleaning adhesive polymer 昭和电工株式会社 2022-12-02 CN disclosed
US-20220380704-A1 METHOD FOR PRODUCING DECOMPOSING/CLEANING COMPOSITION RESONAC CORPORATION (JP) 2022-12-01 US disclosed
CN-115397775-A Method for producing organic solvent dispersion sol of surface-modified silica particles 日产化学株式会社 2022-11-25 CN disclosed
WO-2022244593-A1 DECOMPOSING/CLEANING COMPOSITION, METHOD FOR PRODUCING SAME, AND METHOD FOR CLEANING ADHESIVE POLYMER 昭和電工株式会社 2022-11-24 WO disclosed
EP-3696202-B1 RESIN COMPOSITION FOR MODEL MATERIALS, RESIN COMPOSITION FOR SUPPORT MATERIALS, OPTICALLY SHAPED ARTICLE AND METHOD FOR PRODUCING OPTICALLY SHAPED ARTICLESHAPED ARTICLE AND MEHTOD FOR PRODUCING OPTOCALLY SHAPED ARTICLE MAXELL LTD (JP) 2022-11-23 EP disclosed
CN-113264856-B Sulfonium salt, photoacid generator, and photosensitive composition 东京应化工业株式会社 2022-11-22 CN disclosed
CN-110157311-B Aqueous two-component polyurethane coating composition 关西涂料株式会社 2022-11-15 CN disclosed
US-11485067-B2 Resin composition for modeling material, resin composition for supporting material, photofabrication product, and process for producing photofabrication product MAXELL, LTD. (JP) 2022-11-01 US disclosed
US-20220325156-A1 Surface Treatment Agent and Method for Manufacturing Surface Treatment Body CENTRAL GLASS COMPANY, LIMITED (JP) 2022-10-13 US disclosed
WO-2022208663-A1 WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE, AND CURABLE COMPOSITION 昭和電工マテリアルズ株式会社 2022-10-06 WO disclosed
CN-114208818-B Iodine-containing disinfectant containing polyol ether and/or cyclic ether and preparation method thereof 佛山市正典生物技术有限公司 2022-10-04 CN disclosed
US-11459475-B2 Retardation of primer and ink absorption to postpone cockling by temperature switchable pre-treatment liquid CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2022-10-04 US disclosed
US-20220306809-A1 CURABLE RESIN COMPOSITION, THIN FILM, AND COLOR CONVERSION PANEL AND DISPLAY DEVICE INCLUDING THIN FILM SAMSUNG SDI CO., LTD. (KR) 2022-09-29 US disclosed
CN-115109413-A Curable resin composition, film, color conversion panel, and display device 三星SDI株式会社 2022-09-27 CN disclosed
US-20220290078-A1 COMPOSITION, AND METHOD FOR CLEANING ADHESIVE POLYMER SHOWA DENKO K.K. (JP) 2022-09-15 US disclosed
CN-111410902-B Aqueous multi-component polyurethane coating compositions 关西涂料株式会社 2022-09-06 CN disclosed
US-20220275247-A1 ADHESIVE CONDUCTIVE PASTE DAICEL CORPORATION (JP) 2022-09-01 US disclosed
EP-3757176-B1 INK JET COATING COMPOSITION CANON PRODUCTION PRINTING HOLDING BV (NL) 2022-08-31 EP disclosed
US-11427022-B2 Ink jet coating composition CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2022-08-30 US disclosed
WO-2022175112-A1 NOBLE METAL COMPLEXES WITH DIHYDROAZULENYL LIGANDS AND USE THEREOF UMICORE AG & CO. KG (DE) 2022-08-25 WO disclosed
WO-2022175111-A1 METAL COMPLEXES HAVING 4-H, 6-H OR 8-H DIHYDROAZULENYL LIGANDS AND USE THEREOF UMICORE AG & CO. KG (DE) 2022-08-25 WO disclosed
EP-4047003-A1 METAL COMPLEXES WITH 4-H-, 6-H- OR 8-H-DIHYDROAZULENYL LIGANDS AND THEIR USE UMICORE AG & Co. KG (DE) 2022-08-24 EP disclosed
WO-2022168632-A1 PHOTOACID GENERATOR AND RESIN COMPOSITION FOR PHOTOLITHOGRAPHY サンアプロ株式会社 2022-08-11 WO disclosed
WO-2022163825-A1 SUBSTRATE, SELECTIVE FILM DEPOSITION METHOD, DEPOSITION FILM OF ORGANIC MATTER, AND ORGANIC MATTER セントラル硝子株式会社 2022-08-04 WO disclosed
WO-2022149565-A1 WET ETCHING SOLUTION AND WET ETCHING METHOD セントラル硝子株式会社 2022-07-14 WO disclosed
CN-114746536-A Method for producing decomposition cleaning composition 昭和电工株式会社 2022-07-12 CN disclosed
US-20220213335-A1 RESIN COMPOSITION FOR MODELING MATERIAL, LIGHT CURING MOLDING INK SET, AND METHOD FOR MANUFACTURING OPTICALLY SHAPED ARTICLE MAXELL LTD (JP) 2022-07-07 US disclosed
CN-111093949-B Composition for mold material 麦克赛尔株式会社 2022-06-24 CN disclosed
CN-107229184-B Colored photosensitive composition, colored cured product obtained therefrom, display element, and method for producing colored cured product 东京应化工业株式会社 2022-06-24 CN disclosed
WO-2022128573-A1 PRE-TREATMENT LIQUID FOR USE IN INK JET PRINTING CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2022-06-23 WO disclosed
US-20220186061-A1 PRE-TREATMENT LIQUID FOR USE IN INK JET PRINTING CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2022-06-16 US disclosed
US-20220187517-A1 WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE, AND WAVELENGTH CONVERSION RESIN COMPOSITION SHOWA DENKO MATERIALS CO., LTD. (JP) 2022-06-16 US disclosed
EP-4011989-A1 PRE-TREATMENT LIQUID FOR USE IN INK JET PRINTING Canon Production Printing Holding B.V. (NL) 2022-06-15 EP disclosed
EP-4011990-A1 PRE-TREATMENT LIQUID FOR USE IN INK JET PRINTING Canon Production Printing Holding B.V. (NL) 2022-06-15 EP disclosed
EP-4012726-A1 ADHESIVE CONDUCTIVE PASTE Daicel Corporation (JP) 2022-06-15 EP disclosed
EP-3351367-B1 RESIN COMPOSITION FOR MODELING MATERIAL, LIGHT CURING MOLDING INK SET, AND METHOD FOR MANUFACTURING OPTICALLY SHAPED ARTICLE MAXELL LTD (JP) 2022-06-15 EP disclosed
US-20220179138-A1 WAVELENGTH CONVERSION MEMBER AND UTILIZATION THEREOF, BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE SHOWA DENKO MATERIALS CO., LTD. (JP) 2022-06-09 US disclosed
WO-2022118624-A1 URETHANIZATION REACTION CATALYST, URETHANE COMPOUND, CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING URETHANE COMPOUND DIC株式会社 2022-06-09 WO disclosed
CN-108391449-B Method for manufacturing semiconductor element and method for manufacturing solar cell 东丽株式会社 2022-05-17 CN disclosed
US-20220135815-A1 AQUEOUS INK COMPOSITION CANON PRODUCTION PRINTING HOLDING B.V. (NL) 2022-05-05 US disclosed
EP-3992257-A1 AQUEOUS INK COMPOSITION Canon Production Printing Holding B.V. (NL) 2022-05-04 EP disclosed
CN-107229185-B Energy-sensitive composition, cured product, and method for producing cured product 东京应化工业株式会社 2022-04-15 CN disclosed
CN-110407998-B Composition for reducing aldehyde release, polyol product, polyurethane system, preparation method and application thereof 奥斯佳材料科技(上海)有限公司 2022-04-08 CN disclosed
EP-3979004-A1 SURFACE TREATMENT AGENT AND METHOD FOR MANUFACTURING SURFACE TREATMENT BODY Central Glass Company, Limited (JP) 2022-04-06 EP disclosed
CN-114269892-A Composition and method for cleaning adhesive polymer 昭和电工株式会社 2022-04-01 CN disclosed
CN-114270453-A Adhesive conductor paste 株式会社大赛璐 2022-04-01 CN disclosed
CN-114208818-A Iodine-containing disinfectant containing polyol ether and/or cyclic ether and preparation method thereof 佛山市正典生物技术有限公司 2022-03-22 CN disclosed
US-11282709-B2 Chemical agent for forming water repellent protective film and surface treatment method for wafers CENTRAL GLASS COMPANY, LIMITED (JP) 2022-03-22 US disclosed
WO-2022054615-A1 PHENOXY RESIN, RESIN COMPOSITION, CURED PRODUCT, LAMINATE FOR ELECTRIC/ELECTRONIC CIRCUITS, AND METHOD FOR PRODUCING PHENOXY RESIN 日鉄ケミカル&マテリアル株式会社 2022-03-17 WO disclosed
US-20220081575-A1 SUBSTRATE, SELECTIVE FILM DEPOSITION METHOD, DEPOSITION FILM OF ORGANIC MATTER, AND ORGANIC MATTER CENTRAL GLASS COMPANY, LIMITED (JP) 2022-03-17 US disclosed
EP-3961676-A1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2022-03-02 EP disclosed
EP-3582252-B1 POLISHING METHOD SHOWA DENKO MATERIALS CO LTD (JP) 2022-02-23 EP disclosed
US-11247502-B2 Inkjet image formation method Konica Minolta, Inc. (JP) 2022-02-15 US disclosed
CN-114027309-A Iodine-containing disinfectant containing polyvinylpyrrolidone and polyol ether and preparation method thereof 佛山市正典生物技术有限公司 2022-02-11 CN disclosed
CN-114008538-A Surface treatment agent and method for producing surface-treated body 中央硝子株式会社 2022-02-01 CN disclosed
WO-2022019199-A1 MULTI-LAYER COATED FILM AND MULTI-LAYER COATED FILM FORMING METHOD 関西ペイント株式会社 2022-01-27 WO disclosed
US-20220020582-A1 BEVEL PORTION TREATMENT AGENT COMPOSITION AND METHOD OF MANUFACTURING WAFER CENTRAL GLASS COMPANY, LIMITED (JP) 2022-01-20 US disclosed
US-20210403782-A1 NEW ANTIFREEZE AGENTS AND COOLANTS FOR FUEL CELLS, STORAGE BATTERIES AND BATTERIES BASF SE (DE) 2021-12-30 US disclosed
CN-107074759-B Sulfonium salt, photoacid generator, and photosensitive composition 东京应化工业株式会社 2021-12-14 CN disclosed
US-20210380862-A1 NEW HEAT TRANSFER LIQUID FOR COOLING LITHIUM STORAGE BATTERIES BASF SE (DE) 2021-12-09 US disclosed
CN-113652134-A Stain-resistant matte aqueous coating composition and method for forming stain-resistant matte coating film 关西涂料株式会社 2021-11-16 CN disclosed
CN-113557610-A Wavelength conversion member, backlight unit, image display device, and resin composition for wavelength conversion 昭和电工材料株式会社 2021-10-26 CN disclosed
CN-113557456-A Wavelength conversion member, application thereof, backlight unit and image display device 昭和电工材料株式会社 2021-10-26 CN disclosed
US-11155717-B2 Storage container storing liquid composition and method for storing liquid composition FUJIFILM CORPORATION (JP) 2021-10-26 US disclosed
US-20210317390-A1 COMPOSITION, METHOD FOR CLEANING ADHESIVE POLYMER, METHOD FOR PRODUCING DEVICE WAFER, AND METHOD FOR REGENERATING SUPPORT WAFER SHOWA DENKO K.K. (JP) 2021-10-14 US disclosed
US-11136474-B2 Polishing liquid and polishing method SHOWA DENKO MATERIALS CO., LTD. (JP) 2021-10-05 US disclosed
US-20210292643-A1 WAVELENGTH CONVERSION MEMBER, BACK LIGHT UNIT, IMAGE DISPLAY DEVICE, RESIN COMPOSITION FOR WAVELENGTH CONVERSION, AND RESIN CURED PRODUCT FOR WAVELENGTH CONVERSION SHOWA DENKO MATERIALS CO LTD (JP) 2021-09-23 US disclosed
CN-113423754-A Curable resin composition, cured product, acid-modified maleimide resin, and curing agent DIC株式会社 2021-09-21 CN disclosed
CN-110198827-B Ink set for mold material, support material composition, ink set, three-dimensional object, and method for producing three-dimensional object 麦克赛尔控股株式会社 2021-09-21 CN disclosed
EP-3877482-A1 NEW HEAT TRANSFER LIQUID FOR COOLING LITHIUM STORAGE BATTERIES BASF SE (DE) 2021-09-15 EP disclosed
EP-3877481-A1 NEW ANTIFREEZE AGENTS AND COOLANTS FOR FUEL CELLS, STORAGE BATTERIES AND BATTERIES BASF SE (DE) 2021-09-15 EP disclosed
US-11111401-B2 Light curing molding ink set, and method for manufacturing light cured article MAXELL HOLDINGS, LTD. (JP) 2021-09-07 US disclosed
CN-108727955-B Multi-component water-based primer coating composition and coating method 关西涂料株式会社 2021-08-31 CN disclosed
CN-109312045-B Alcohol-modified polyamideimide resin and method for producing same DIC株式会社 2021-08-24 CN disclosed
CN-113264856-A Sulfonium salt, photoacid generator, and photosensitive composition 东京应化工业株式会社 2021-08-17 CN disclosed
CN-113272471-A Substrate, selective film deposition method, organic deposition film, and organic material 中央硝子株式会社 2021-08-17 CN disclosed
EP-3351366-B1 LIGHT CURING MOLDING INK SET, AND METHOD FOR MANUFACTURING LIGHT CURED ARTICLE MAXELL HOLDINGS LTD (JP) 2021-08-11 EP disclosed
CN-113169060-A Chamfer treatment agent composition and method for producing wafer 中央硝子株式会社 2021-07-23 CN disclosed
CN-113169248-A Method for manufacturing semiconductor element and method for manufacturing solar cell 东丽株式会社 2021-07-23 CN disclosed
EP-3023449-B1 POLYAMIDE-IMIDE RESIN, AND CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME DAINIPPON INK & CHEMICALS (JP) 2021-07-14 EP disclosed
US-11061278-B2 Wavelength conversion member, back light unit, image display device, resin composition for wavelength conversion, and resin cured product for wavelength conversion SHOWA DENKO MATERIALS CO., LTD. (JP) 2021-07-13 US disclosed
CN-113015776-A Novel heat transfer liquid for cooling lithium storage batteries 巴斯夫欧洲公司 2021-06-22 CN disclosed
CN-112969770-A Novel antifreeze and coolant for fuel cells, storage cells and batteries 巴斯夫欧洲公司 2021-06-15 CN disclosed
US-11034860-B2 Polishing agent, stock solution for polishing agent, and polishing method SHOWA DENKO MATERIALS CO., LTD. (JP) 2021-06-15 US disclosed
EP-3216783-B1 SULFONATE COMPOUND, PHOTOACID GENERATOR, AND PHOTOLITHOGRAPHIC RESIN COMPOSITION SAN APRO LTD (JP) 2021-06-09 EP disclosed
WO-2021106460-A1 METHOD FOR PRODUCING DECOMPOSING/CLEANING COMPOSITION 昭和電工株式会社 2021-06-03 WO disclosed
CN-112888676-A Photoacid generators and resin compositions for lithography 三亚普罗股份有限公司 2021-06-01 CN disclosed
CN-106795107-B Sulfonate compound, photoacid generator, and resin composition for lithography 三亚普罗股份有限公司 2021-05-28 CN disclosed
US-20210139769-A1 WAVELENGTH CONVERSION MEMBER, BACK LIGHT UNIT, IMAGE DISPLAY DEVICE, CURABLE COMPOSITION AND CURED PRODUCT HITACHI CHEMICAL COMPANY, LTD. (JP) 2021-05-13 US disclosed
US-20210139768-A1 WAVELENGTH CONVERSION MEMBER, BACK LIGHT UNIT, IMAGE DISPLAY DEVICE, AND CURABLE COMPOSITION HITACHI CHEMICAL COMPANY, LTD. (JP) 2021-05-13 US disclosed
WO-2021084603-A1 RESIN COMPOSITION FOR WAVELENGTH CONVERSION, CURED RESIN MATERIAL FOR WAVELENGTH CONVERSION, WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE 昭和電工マテリアルズ株式会社 2021-05-06 WO disclosed
CN-108025486-B Resin composition for mold material, ink set for stereolithography, and method for producing stereolithography product 麦克赛尔控股株式会社 2021-05-04 CN disclosed
CN-108025492-B Ink set for photo-molding and method for producing photo-molded article 麦克赛尔控股株式会社 2021-05-04 CN disclosed
CN-112602174-A Composition, method for cleaning adhesive polymer, method for manufacturing device wafer, and method for recycling support wafer 昭和电工株式会社 2021-04-02 CN disclosed
US-20210090881-A1 SURFACE TREATMENT AGENT AND SURFACE-TREATED BODY MANUFACTURING METHOD CENTRAL GLASS COMPANY, LIMITED (JP) 2021-03-25 US disclosed
US-10946494-B2 Polishing agent, stock solution for polishing agent, and polishing method SHOWA DENKO MATERIALS CO., LTD. (JP) 2021-03-16 US disclosed
US-10947414-B2 Compositions for use in chemical mechanical polishing TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2021-03-16 US disclosed
WO-2021039274-A1 COMPOSITION, AND METHOD FOR CLEANING ADHESIVE POLYMER 昭和電工株式会社 2021-03-04 WO disclosed
US-20210040383-A1 WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE AND CURABLE COMPOSITION HITACHI CHEMICAL COMPANY, LTD. (JP) 2021-02-11 US disclosed
EP-3767345-A1 WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE AND CURABLE COMPOSITION Hitachi Chemical Company, Ltd. (JP) 2021-01-20 EP disclosed
CN-112230319-A Wavelength conversion member, backlight unit, image display device, wavelength conversion resin composition, and wavelength conversion resin cured product 日立化成株式会社 2021-01-15 CN disclosed
EP-3761076-A1 WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE AND CURABLE COMPOSITION Hitachi Chemical Company, Ltd. (JP) 2021-01-06 EP disclosed
EP-3761077-A1 WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE, CURABLE COMPOSITION AND CURED PRODUCT Hitachi Chemical Company, Ltd. (JP) 2021-01-06 EP disclosed
CN-112180488-A Wavelength conversion member, backlight unit, image display device, wavelength conversion resin composition, and wavelength conversion resin cured product 日立化成株式会社 2021-01-05 CN disclosed
CN-111971591-A Wavelength conversion member, backlight unit, image display device, and curable composition 日立化成株式会社 2020-11-20 CN disclosed
CN-111919142-A Wavelength conversion member, backlight unit, image display device, curable composition, and cured product 日立化成株式会社 2020-11-10 CN disclosed
CN-111902744-A Wavelength conversion member, backlight unit, image display device, and curable composition 日立化成株式会社 2020-11-06 CN disclosed
US-20200350176-A1 CHEMICAL AGENT FOR FORMING WATER REPELLENT PROTECTIVE FILM AND SURFACE TREATMENT METHOD FOR WAFERS CENTRAL GLASS COMPANY, LIMITED (JP) 2020-11-05 US disclosed
US-20200339850-A1 CHEMICAL SOLUTION FOR FORMING WATER-REPELLENT PROTECTIVE FILM, METHOD FOR PREPARING SAME, AND METHOD FOR MANUFACTURING SURFACE-TREATED BODY CENTRAL GLASS COMPANY, LIMITED (JP) 2020-10-29 US disclosed
US-20200339611-A1 WATER-REPELLENT PROTECTIVE FILM-FORMING AGENT, WATER-REPELLENT PROTECTIVE FILM-FORMING CHEMICAL SOLUTION, AND WAFER SURFACE TREATMENT METHOD CENTRAL GLASS COMPANY, LIMITED (JP) 2020-10-29 US disclosed
US-10796921-B2 CMP fluid and method for polishing palladium HITACHI CHEMICAL COMPANY, LTD. (JP) 2020-10-06 US disclosed
CN-111742391-A Chemical solution for forming water-repellent protective film, method for producing same, and method for producing surface-treated body 中央硝子株式会社 2020-10-02 CN disclosed
EP-3715094-A1 COMPOSITION FOR MODEL MATERIAL Maxell Holdings, Ltd. (JP) 2020-09-30 EP disclosed
CN-111699546-A Water-repellent protective film forming agent, chemical solution for forming water-repellent protective film, and method for surface treatment of wafer 中央硝子株式会社 2020-09-22 CN disclosed
US-20200282636-A1 COMPOSITION FOR MODEL MATERIAL MAXELL, LTD. (JP) 2020-09-10 US disclosed
EP-3330306-B1 RESIN COMPOSITION FOR SUPPORTING MATERIAL, PHOTOFABRICATION PRODUCT, AND PROCESS FOR PRODUCING PHOTOFABRICATION PRODUCT MAXELL HOLDINGS LTD (JP) 2020-09-09 EP disclosed
CN-111624852-A Photosensitive resin composition and method for etching glass substrate 东京应化工业株式会社 2020-09-04 CN disclosed
CN-111630633-A Chemical solution for forming water-repellent protective film and method for surface treatment of wafer 中央硝子株式会社 2020-09-04 CN disclosed
EP-3702387-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2020-09-02 EP disclosed
WO-2020166212-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, ACID-MODIFIED MALEIMIDE RESIN, AND CURING AGENT DIC株式会社 2020-08-20 WO disclosed
EP-3696202-A1 RESIN COMPOSITION FOR MODEL MATERIALS, RESIN COMPOSITION FOR SUPPORT MATERIALS, OPTICALLY SHAPED ARTICLE AND METHOD FOR PRODUCING OPTICALLY SHAPED ARTICLESHAPED ARTICLE AND MEHTOD FOR PRODUCING OPTOCALLY SHAPED ARTICLE Maxell Holdings, Ltd. (JP) 2020-08-19 EP disclosed
US-20200255598-A1 WAVELENGTH CONVERSION MEMBER, BACK LIGHT UNIT, IMAGE DISPLAY DEVICE, RESIN COMPOSITION FOR WAVELENGTH CONVERSION, AND RESIN CURED PRODUCT FOR WAVELENGTH CONVERSION HITACHI CHEMICAL COMPANY, LTD. (JP) 2020-08-13 US disclosed
US-10729623-B2 Method for producing elliptical, needle-shaped, or rod-shaped polymer particles NISSHINBO HOLDINGS, INC. (JP) 2020-08-04 US disclosed
US-20200241361-A1 WAVELENGTH CONVERSION MEMBER, BACK LIGHT UNIT, IMAGE DISPLAY DEVICE, RESIN COMPOSITION FOR WAVELENGTH CONVERSION, AND RESIN CURED PRODUCT FOR WAVELENGTH CONVERSION SHOWA DENKO MATERIALS CO., LTD. (JP) 2020-07-30 US disclosed
CN-111410902-A Aqueous multi-component polyurethane coating compositions 关西涂料株式会社 2020-07-14 CN disclosed
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WO-2020137132-A1 RESIN COMPOSITION, INK FOR INK JET PRINTING, AND ARTICLE HAVING RESIN FILM 日立化成株式会社 2020-07-02 WO disclosed
CN-111349201-A Resin composition for support material and method for producing stereolithography product 麦克赛尔控股株式会社 2020-06-30 CN disclosed
US-20200180337-A1 INKJET IMAGE FORMATION METHOD Konica Minolta, Inc. (JP) 2020-06-11 US disclosed
CN-111183376-A Wavelength conversion member, backlight unit, image display device, wavelength conversion resin composition, and wavelength conversion resin cured product 日立化成株式会社 2020-05-19 CN disclosed
CN-111149022-A Wavelength conversion member, backlight unit, image display device, wavelength conversion resin composition, and wavelength conversion resin cured product 日立化成株式会社 2020-05-12 CN disclosed
CN-107406752-B Polishing agent, stock solution for polishing agent, and polishing method 日立化成株式会社 2020-05-08 CN disclosed
CN-111093949-A Composition for mold material 麦克赛尔控股株式会社 2020-05-01 CN disclosed
CN-110874026-A Stripping liquid composition for color filter and method for using same 易案爱富科技有限公司 2020-03-10 CN disclosed
CN-107614542-B Method for producing elliptical, needle-like or rod-like polymer particles 日清纺控股株式会社 2020-03-03 CN disclosed
CN-110773401-A Method for repairing and coating coated body 关西涂料株式会社 2020-02-11 CN disclosed
CN-110776830-A Polishing composition for chemical mechanical polishing process 台湾积体电路制造股份有限公司 2020-02-11 CN disclosed
US-20200040221-A1 COMPOSITIONS FOR USE IN CHEMICAL MECHANICAL POLISHING TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2020-02-06 US disclosed
US-10543454-B2 Carbon dioxide absorbent UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2020-01-28 US disclosed
EP-3199520-B1 SULFONIUM SALT, PHOTOACID GENERATOR, AND PHOTOSENSITIVE COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-12-25 EP disclosed
EP-3578338-A1 MODEL MATERIAL INK SET, SUPPORT MATERIAL COMPOSITION, INK SET, THREE-DIMENSIONAL SHAPED OBJECT, AND METHOD FOR MANUFACTURING THREE-DIMENSIONAL SHAPED OBJECT Maxell Holdings, Ltd. (JP) 2019-12-11 EP disclosed
US-20190352537-A1 POLISHING LIQUID AND POLISHING METHOD RESONAC CORPORATION (JP) 2019-11-21 US disclosed
WO-2019216174-A1 PHOTOACID GENERATOR AND PHOTOLITHOGRAPHIC RESIN COMPOSITION サンアプロ株式会社 (JP) 2019-11-14 WO disclosed
US-20190341246-A1 Chemical Liquid for Forming Water Repellent Protective Film CENTRAL GLASS COMPANY, LIMITED (JP) 2019-11-07 US disclosed
US-10450266-B2 Sulfonate compound, photoacid generator, and resin composition for photolithography SAN-APRO LIMITED (JP) 2019-10-22 US disclosed
WO-2019176144-A1 COMPOSITION FOR MODEL MATERIAL マクセルホールディングス株式会社 2019-09-19 WO disclosed
CN-110198827-A Ink set for mold material, support material composition, ink set, three-dimensional object, and method for producing three-dimensional object 麦克赛尔控股株式会社 2019-09-03 CN disclosed
CN-110157311-A Aqueous double-formulation polyurethane coating composition 关西涂料株式会社 2019-08-23 CN disclosed
US-10312402-B2 P-type diffusion layer forming composition HITACHI CHEMICAL COMPANY, LTD. (JP) 2019-06-04 US disclosed
CN-109791234-A Wavelength conversion material, backlight unit, image display device, and curable composition 日立化成株式会社 2019-05-21 CN disclosed
US-10283373-B2 CMP polishing liquid and polishing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2019-05-07 US disclosed
US-20190112489-A1 STORAGE CONTAINER STORING LIQUID COMPOSITION AND METHOD FOR STORING LIQUID COMPOSITION FUJIFILM CORPORATION (JP) 2019-04-18 US disclosed
US-20190085193-A1 INKJET RECORDING METHOD Konica Minolta, Inc. (JP) 2019-03-21 US disclosed
CN-105542571-B Printing ink composition 奥西-技术有限公司 2019-03-12 CN disclosed
US-20190074173-A1 Water-Repellent Protective Film Forming Agent, Liquid Chemical for Forming Water-Repellent Protective Film, and Wafer Cleaning Method CENTRAL GLASS COMPANY, LIMITED (JP) 2019-03-07 US disclosed
US-10202493-B2 Polyamide-imide resin, and curable resin composition and cured product of same DIC CORPORATION (JP) 2019-02-12 US disclosed
EP-3431302-A1 INKJET RECORDING METHOD Konica Minolta, Inc. (JP) 2019-01-23 EP disclosed
US-20190009453-A1 RESIN COMPOSITION FOR MODELING MATERIAL, RESIN COMPOSITION FOR SUPPORTING MATERIAL, PHOTOFABRICATION PRODUCT, AND PROCESS FOR PRODUCING PHOTOFABRICATION PRODUCT MAXELL, LTD. (JP) 2019-01-10 US disclosed
US-10119049-B2 Polishing agent, storage solution for polishing agent and polishing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2018-11-06 US disclosed
CN-108727955-A The water-borne primer coating composition and coating process of multicomponent type 关西涂料株式会社 2018-11-02 CN disclosed
US-10099172-B2 Carbon dioxide absorbent comprising triamine UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2018-10-16 US disclosed
US-10090148-B2 Water-repellent protective film, and chemical solution for forming protective film CENTRAL GLASS COMPANY, LIMITED (JP) 2018-10-02 US disclosed
CN-105612606-B Wafer Cleaning Method 中央硝子株式会社 2018-09-21 CN disclosed
US-20180265720-A1 LIGHT CURING MOLDING INK SET, AND METHOD FOR MANUFACTURING LIGHT CURED ARTICLE HITACHI MAXELL, LTD. (JP) 2018-09-20 US disclosed
US-10077365-B2 Liquid chemical for forming water repellent protecting film, and process for cleaning wafers using the same CENTRAL GLASS COMPANY, LIMITED (JP) 2018-09-18 US disclosed
US-20180257023-A1 CARBON DIOXIDE ABSORBENT UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2018-09-13 US disclosed
US-20180258297-A1 RESIN COMPOSITION FOR MODELING MATERIAL, LIGHT CURING MOLDING INK SET, AND METHOD FOR MANUFACTURING OPTICALLY SHAPED ARTICLE MAXELL, LTD. (JP) 2018-09-13 US disclosed
US-10059662-B2 Sulfonium salt, photoacid generator, and photosensitive composition TOKYO OHKA KOGYO CO., LTD. (JP) 2018-08-28 US disclosed
CN-108431647-A Curable composition, wavelength conversion material, backlight unit, and image display device 日立化成株式会社 2018-08-21 CN disclosed
CN-108391449-A The manufacturing method of semiconductor element and the manufacturing method of solar cell 东丽株式会社 2018-08-10 CN disclosed
US-10037882-B2 Method for cleaning wafer CENTRAL GLASS COMPANY, LIMITED (JP) 2018-07-31 US disclosed
EP-3351367-A1 MODEL MATERIAL RESIN COMPOSITION, INK SET FOR OPTICAL SHAPING, AND METHOD FOR MANUFACTURING OPTICALLY SHAPED ARTICLE Maxell Holdings, Ltd. (JP) 2018-07-25 EP disclosed
EP-3351366-A1 OPTICAL SHAPING INK SET, AND METHOD FOR MANUFACTURING OPTICALLY SHAPED ARTICLE Maxell Holdings, Ltd. (JP) 2018-07-25 EP disclosed
US-20180179417-A1 POLISHING AGENT, STORAGE SOLUTION FOR POLISHING AGENT AND POLISHING METHOD RESONAC CORPORATION (JP) 2018-06-28 US disclosed
CN-105047545-B The manufacturing method of solar cell 日立化成株式会社 2018-06-15 CN disclosed
EP-3330306-A1 RESIN COMPOSITION FOR MODEL MATERIALS, RESIN COMPOSITION FOR SUPPORT MATERIALS, OPTICALLY SHAPED ARTICLE AND METHOD FOR PRODUCING OPTICALLY SHAPED ARTICLE Maxell Holdings, Ltd. (JP) 2018-06-06 EP disclosed
CN-104137227-B N-type diffusion layer forms with composition, has the manufacturing method of semiconductor substrate of n-type diffusion layer and the manufacturing method of solar cell device 日立化成株式会社 2018-05-18 CN disclosed
CN-103718309-B Semiconductor substrate, method for manufacturing same, solar cell element, and solar cell 日立化成株式会社 2018-05-18 CN disclosed
CN-108026225-A Resin composition for mold material, resin composition for support material, stereolithography article, and method for producing stereolithography article 麦克赛尔控股株式会社 2018-05-11 CN disclosed
CN-108025486-A Model timber-used resin combination, light chisel ink group and the manufacture method of light chisel product 麦克赛尔控股株式会社 2018-05-11 CN disclosed
CN-108025492-A Light chisel ink group and the manufacture method of light chisel product 麦克赛尔控股株式会社 2018-05-11 CN disclosed
US-20180104160-A1 METHOD FOR PRODUCING ELLIPTICAL, NEEDLE-SHAPED, OR ROD-SHAPED POLYMER PARTICLES NISSHINBO HOLDINGS, INC. (JP) 2018-04-19 US disclosed
US-9944827-B2 CMP polishing solution and polishing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2018-04-17 US disclosed
EP-3296327-A1 METHOD FOR PRODUCING ELLIPTICAL, NEEDLE-SHAPED, OR ROD-SHAPED POLYMER PARTICLES Nisshinbo Holdings Inc. (JP) 2018-03-21 EP disclosed
CN-104176393-B Pressurized delivered container, the keeping method for having used it and liquid relief method 中央硝子株式会社 2018-03-16 CN disclosed
US-20180043497-A1 Polishing Agent, Stock Solution for Polishing Agent, and Polishing Method HITACHI CHEMICAL COMPANY, LTD. (JP) 2018-02-15 US disclosed
EP-3282470-A1 COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD OF FORMING N-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL Hitachi Chemical Company, Ltd. (JP) 2018-02-14 EP disclosed
CN-104040701-B Semiconductor substrate with passivation film and method for manufacturing same, and solar cell element and method for manufacturing same 日立化成株式会社 2018-01-26 CN disclosed
CN-107614542-A Method for producing elliptical, needle-like or rod-like polymer particles 日清纺控股株式会社 2018-01-19 CN disclosed
CN-104488069-B Composition for forming passivation layer, semiconductor substrate with passivation layer, method for manufacturing semiconductor substrate with passivation layer, solar cell element, method for manufacturing solar cell element, and solar cell 日立化成株式会社 2018-01-19 CN disclosed
EP-2876671-B1 COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL HITACHI CHEMICAL CO LTD (JP) 2017-11-22 EP disclosed
CN-104428901-B Solar cell device and its manufacture method 日立化成株式会社 2017-11-03 CN disclosed
US-20170305848-A1 SULFONIUM SALT, PHOTOACID GENERATOR, AND PHOTOSENSITIVE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-10-26 US disclosed
CN-107229184-A Coloring photosensitive combination, staining and curing thing therefrom, the manufacture method of display element and staining and curing thing 东京应化工业株式会社 2017-10-03 CN disclosed
CN-107229185-A The manufacture method of energy sensitivities composition, solidfied material and solidfied material 东京应化工业株式会社 2017-10-03 CN disclosed
EP-2662883-B1 Composition for forming p-type diffusion layer, method for forming p-type diffusion layer, and method for producing photovoltaic cell HITACHI CHEMICAL CO LTD (JP) 2017-09-27 EP disclosed
EP-3216783-A1 SULFONATE COMPOUND, PHOTOACID GENERATOR, AND PHOTOLITHOGRAPHIC RESIN COMPOSITION San-Apro Ltd. (JP) 2017-09-13 EP disclosed
CN-107148662-A The manufacture method of n-type diffusion layer formation composition, the manufacture method of n-type diffusion layer and solar cell device 日立化成株式会社 2017-09-08 CN disclosed
US-20170246587-A1 CARBON DIOXIDE ABSORBENT COMPRISING TRIAMINE UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2017-08-31 US disclosed
EP-2562793-B1 METHOD FOR PRODUCING p-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING SOLAR CELL ELEMENT HITACHI CHEMICAL CO LTD (JP) 2017-08-30 EP disclosed
CN-107093550-A The manufacture method of n-type diffusion layer formation composition, the manufacture method of n-type diffusion layer and solar cell device 日立化成株式会社 2017-08-25 CN disclosed
CN-107074759-A Sulfonium salt, photoacid generator, and photosensitive composition 东京应化工业株式会社 2017-08-18 CN disclosed
CN-107068540-A The cleaning method of chip 中央硝子株式会社 2017-08-18 CN disclosed
US-20170233336-A1 SULFONATE COMPOUND, PHOTOACID GENERATOR, AND RESIN COMPOSITION FOR PHOTOLITHOGRAPHY SAN-APRO LIMITED (JP) 2017-08-17 US disclosed
US-20170225118-A1 CARBON DIOXIDE ABSORBENT COMPRISING OXYGEN-CONTAINING DIAMINE UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2017-08-10 US disclosed
EP-3203500-A1 COMPOSITION FOR FORMING P-TYPE DIFFUSION LAYER, METHOD FOR FORMING P-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL Hitachi Chemical Company, Ltd. (JP) 2017-08-09 EP disclosed
EP-2592120-B1 AQUEOUS INKJET INK, AND METHOD FOR FORMING INKJET IMAGE KONICA MINOLTA HOLDINGS INC (JP) 2017-08-02 EP disclosed
EP-3199520-A1 SULFONIUM SALT, PHOTOACID GENERATOR, AND PHOTOSENSITIVE COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2017-08-02 EP disclosed
CN-104488088-B Solar cell device and its manufacture method and solar module 日立化成株式会社 2017-08-01 CN disclosed
CN-102859659-B The manufacture method of p-diffusion layer formation composition, the manufacture method of p-diffusion layer and solar cell device 日立化成工业株式会社 2017-07-28 CN disclosed
US-9714262-B2 Composition for forming passivation layer, semiconductor substrate having passivation layer, method of producing semiconductor substrate having passivation layer, photovoltaic cell element, method of producing photovoltaic cell element and photovoltaic cell HITACHI CHEMICAL COMPANY, LTD. (JP) 2017-07-25 US disclosed
EP-2479199-B1 POLYETHER ESTER COMPOSITION, POLYURETHANE RESIN COMPOSITION, AND OPTICAL MATERIAL USING SAME DAINIPPON INK & CHEMICALS (JP) 2017-07-19 EP disclosed
CN-106935664-A Passivation layer is formed with composition, semiconductor substrate and manufacture method, solar cell device and manufacture method, solar cell 日立化成株式会社 2017-07-07 CN disclosed
US-20170154787-A1 CMP POLISHING LIQUID AND POLISHING METHOD RESONAC CORPORATION (JP) 2017-06-01 US disclosed
CN-104900724-B Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell 日立化成工业株式会社 2017-05-10 CN disclosed
CN-103155166-B Method for producing solar cell 日立化成株式会社 2017-05-03 CN disclosed
CN-104508831-B Solar cell element, production method therefor, and solar cell module 日立化成株式会社 2017-05-03 CN disclosed
CN-103283004-B Wafer Cleaning Method 中央硝子株式会社 2017-04-12 CN disclosed
US-9608143-B2 Composition for forming N-type diffusion layer, method of forming N-type diffusion layer, and method of producing photovoltaic cell HITACHI CHEMICAL CO., LTD. (JP) 2017-03-28 US disclosed
CN-106537559-A Method for manufacturing semiconductor substrate having n-type diffusion layer, and method for manufacturing solar cell element 日立化成株式会社 2017-03-22 CN disclosed
US-20170062203-A1 Method of Preparing Liquid Chemical for Forming Protective Film CENTRAL GLASS CO LTD (JP) 2017-03-02 US disclosed
CN-106471626-A Composition for forming passivation layer, semiconductor substrate with passivation layer and manufacturing method thereof, solar cell element and manufacturing method thereof, and solar cell 日立化成株式会社 2017-03-01 CN disclosed
US-20160368879-A1 PHOTOACID GENERATOR, AND RESIN COMPOSITION FOR PHOTOLITHOGRAPHY SAN-APRO LTD. (JP) 2016-12-22 US disclosed
US-9520529-B2 Composition for forming P-type diffusion layer, method of forming P-type diffusion layer, and method of producing photovoltaic cell HITACHI CHEMICAL CO., LTD. (JP) 2016-12-13 US disclosed
US-20160359078-A1 COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE WITH N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL ELEMENT HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-12-08 US disclosed
CN-104471715-B Composition for forming passivation layer, semiconductor substrate with passivation layer and method for manufacturing same, solar cell element and method for manufacturing same, and solar cell 日立化成株式会社 2016-12-07 CN disclosed
CN-106158603-A Form composition and the method for n-type diffusion layer, and the method preparing photovoltaic cell 日立化成工业株式会社 2016-11-23 CN disclosed
US-9496131-B2 Liquid chemical for forming protecting film CENTRAL GLASS COMPANY, LIMITED (JP) 2016-11-15 US disclosed
CN-106024918-A SEMICONDUCTOR SUBSTRATE PROVIDED WITH PASSIVATION FILM AND PRODUCTION METHOD, AND PHOTOVOLTAIC CELL ELEMENT AND PRODUCTION METHOD THEREFOR 日立化成株式会社 2016-10-12 CN disclosed
CN-102870197-B Composition for forming n-type diffusion layer, method for producing n-type diffusion layer, and method for producing solar cell element 日立化成工业株式会社 2016-10-12 CN disclosed
CN-103688341-B Composition for forming n-type diffusion layer, method for producing n-type diffusion layer, and method for producing solar cell element 日立化成株式会社 2016-09-28 CN disclosed
CN-105977143-A Composition for forming p-type diffusion layer, method for forming p-type diffusion layer, and method for producing photovoltaic cell 日立化成工业株式会社 2016-09-28 CN disclosed
EP-2345704-B1 AQUEOUS INKJET INK RISO KAGAKU CORP (JP) 2016-09-14 EP disclosed
US-20160254140-A1 METHOD FOR CLEANING WAFER CENTRAL GLASS COMPANY, LIMITED (JP) 2016-09-01 US disclosed
EP-3062336-A1 COMPOSITION FOR FORMING P-TYPE DIFFUSION LAYER, METHOD FOR FORMING P-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL Hitachi Chemical Co., Ltd. (JP) 2016-08-31 EP disclosed
EP-2497803-B1 AQUEOUS INK FOR INKJET AND INKJET RECORDING METHOD KONICA MINOLTA HOLDINGS INC (JP) 2016-08-17 EP disclosed
US-20160230016-A1 Liquid Chemical for Forming Water Repellent Protecting Film, and Process for Cleaning Wafers Using the Same CENTRAL GLASS COMPANY, LIMITED (JP) 2016-08-11 US disclosed
CN-103155164-B Method for manufacturing solar cell 日立化成株式会社 2016-08-10 CN disclosed
US-20160211389-A1 COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, PHOTOV OLTAIC CELL ELEMENT, METHOD OF PRODUCING PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-07-21 US disclosed
EP-3041030-A1 COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE WITH N-TYPE DIFFUSION LAYER, AND METHOD FOR MANUFACTURING SOLAR CELL ELEMENT Hitachi Chemical Company, Ltd. (JP) 2016-07-06 EP disclosed
EP-2665089-B1 COMPOSITION FOR FORMING p-TYPE DIFFUSION LAYER, METHOD OF PRODUCING SILICON SUBSTRATE HAVING p-TYPE DIFFUSION LAYER, METHOD FOR PRODUCING PHOTOVOLTAIC CELL , AND PHOTOVOLTAIC CELL HITACHI CHEMICAL CO LTD (JP) 2016-06-29 EP disclosed
CN-102844841-B N-type diffusion layer forms the manufacture method of compositions, the manufacture method of n-type diffusion layer and solar cell device 日立化成工业株式会社 2016-06-15 CN disclosed
CN-102834898-B N-type diffusion layer forms the manufacture method of constituent, the manufacture method of n-type diffusion layer and solar cell device 日立化成工业株式会社 2016-06-15 CN disclosed
US-20160152773-A1 POLYAMIDE-IMIDE RESIN, AND CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME DIC CORPORATION (JP) 2016-06-02 US disclosed
EP-2355137-B1 Use of a composition for forming p-type diffusion layer and method for forming p-type diffusion layer HITACHI CHEMICAL CO LTD (JP) 2016-05-25 EP disclosed
EP-3023449-A1 POLYAMIDE-IMIDE RESIN, AND CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME DIC Corporation (JP) 2016-05-25 EP disclosed
CN-105612606-A Wafer Cleaning Method CENTRAL GLASS CO LTD 2016-05-25 CN disclosed
US-9349582-B2 Liquid chemical for forming water repellent protecting film, and process for cleaning wafers using the same CENTRAL GLASS COMPANY, LIMITED (JP) 2016-05-24 US disclosed
EP-3018182-A1 PHOTOACID GENERATOR, AND RESIN COMPOSITION FOR PHOTOLITHOGRAPHY San-Apro Limited (JP) 2016-05-11 EP disclosed
CN-105551947-A Composition for forming n-type diffusion layer, method for producing n-type diffusion layer, and method for producing solar cell element HITACHI CHEMICAL CO LTD 2016-05-04 CN disclosed
CN-105542571-A Ink composition OCE TECH BV 2016-05-04 CN disclosed
US-20160107286-A1 CMP POLISHING SOLUTION AND POLISHING METHOD USING SAME HITACHI CHEMICAL COMPANY, LTD (JP) 2016-04-21 US disclosed
CN-105518828-A Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, method for producing semiconductor substrate with n-type diffusion layer, and method for manufacturing solar cell element HITACHI CHEMICAL CO LTD 2016-04-20 CN disclosed
EP-3007210-A2 COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD OF PRODUCING N-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL ELEMENT Hitachi Chemical Company, Ltd. (JP) 2016-04-13 EP disclosed
CN-105489662-A Composition that forms n-type diffusion layer, n-type diffusion layer manufacturing method and solar cell element manufacturing method HITACHI CHEMICAL CO LTD 2016-04-13 CN disclosed
CN-105448677-A Semiconductor substrate and method for producing the same, solar cell element, and solar cell HITACHI CHEMICAL CO LTD 2016-03-30 CN disclosed
US-20160086819-A1 CMP POLISHING SOLUTION AND POLISHING METHOD USING SAME HITACHI CHEMICAL COMPANY, LTD (JP) 2016-03-24 US disclosed
CN-105408394-A Polyamide-imide resin, and curable resin composition and cured product of same DAINIPPON INK & CHEMICALS 2016-03-16 CN disclosed
CN-104159983-B Ink composition OCE-TECHNOLOGIES B.V. (NL) 2016-03-09 CN disclosed
CN-105368239-A Stain-resistant matte aqueous coating composition and method for forming stain-resistant matte coating film KANSAI PAINT CO LTD 2016-03-02 CN disclosed
US-20160035915-A1 SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING THE SAME, PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-02-04 US disclosed
CN-103794478-B N-type diffusion layer is formed by composition, the manufacture method of n-type diffusion layer and the manufacture method of solar cell device HITACHI CHEMICAL CO., LTD. (JP) 2016-01-20 CN disclosed
CN-103299403-B Chemical solution for forming protective film CENTRAL GLASS CO.,LTD. (JP) 2016-01-20 CN disclosed
CN-105161404-A Composition for forming p-type diffusion layer, method of producing silicon substrate having p-type diffusion layer, method for producing photovoltaic cell , and photovoltaic cell HITACHI CHEMICAL CO LTD 2015-12-16 CN disclosed
CN-105118890-A Method for producing photovoltaic cell HITACHI CHEMICAL CO LTD 2015-12-02 CN disclosed
CN-105047545-A Method for producing solar cell HITACHI CHEMICAL CO LTD 2015-11-11 CN disclosed
CN-105006429-A Composition for forming n-type diffusion layer, method for producing n-type diffusion layer, and method for producing solar cell element HITACHI CHEMICAL CO LTD 2015-10-28 CN disclosed
US-20150303318-A1 COMPOSITION FOR FORMING PASSIVATION FILM, SEMICONDUCTOR SUBSTRATE PROVIDED WITH PASSIVATION FILM AND PRODUCTION METHOD THEREFOR, AND PHOTOVOLTAIC CELL ELEMENT AND PRODUCTION METHOD THEREFOR HITACHI CHEMICAL COMPANY, LTD. (JP) 2015-10-22 US disclosed
US-20150303317-A1 SEMICONDUCTOR SUBSTRATE PROVIDED WITH PASSIVATION FILM AND PRODUCTION METHOD, AND PHOTOVOLTAIC CELL ELEMENT AND PRODUCTION METHOD THEREFOR HITACHI CHEMICAL COMPANY, LTD. (JP) 2015-10-22 US disclosed
EP-2930740-A1 COMPOSITION FOR FORMING P-TYPE DIFFUSION LAYER, METHOD OF FORMING P-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL Hitachi Chemical Co., Ltd. (JP) 2015-10-14 EP disclosed
CN-104969364-A Composition for forming barrier layer, semiconductor substrate with barrier layer, method for producing substrate for solar cell, and method for producing solar cell element HITACHI CHEMICAL CO LTD 2015-10-07 CN disclosed
EP-2805977-B1 Thermosetting resin composition DAINIPPON INK & CHEMICALS (JP) 2015-09-30 EP disclosed
US-20150270123-A1 Liquid Chemical for Forming Protective Film CENTRAL GLASS COMPANY, LIMITED (JP) 2015-09-24 US disclosed
CN-104916531-A Composition that forms n-type diffusion layer, method for producing n-type diffusion layer, and method for producing solar cell element HITACHI CHEMICAL CO LTD 2015-09-16 CN disclosed
CN-104900724-A Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell HITACHI CHEMICAL CO LTD 2015-09-09 CN disclosed
CN-103059819-B A kind of non-aqueous coolant for engine composition SINOPEC CORP. (CN) 2015-08-26 CN disclosed
CN-104844268-A IMPURITIES DIFFUSION LAYER FORMING COMPOSITION, N-TYPE DIFFUSION LAYER FORMING COMPOSITION, METHOD FOR MANUFACTURING N-TYPE DIFFUSION LAYER, P-TYPE DIFFUSION LAYER FORMING COMPOSITION, METHOD FOR MANUFACTURING P-TYPE DIFFUSION LAYER, AND METHOD FOR MANUFACTURING SOLAR CELL ELEMENTS HITACHI CHEMICAL CO LTD 2015-08-19 CN disclosed
US-20150228812-A1 COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, PHOTOLOLTAIC CELL ELEMENT, METHOD OF PRODUCING PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2015-08-13 US disclosed
CN-104835723-A Composition for forming p-type diffusion layer, method for forming p-type diffusion layer, and method for producing photovoltaic cell HITACHI CHEMICAL CO LTD 2015-08-12 CN disclosed
CN-104835724-A Composition for forming p-type diffusion layer, method for forming p-type diffusion layer, and method for producing photovoltaic cell HITACHI CHEMICAL CO LTD 2015-08-12 CN disclosed
US-20150214390-A1 COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD OF FORMING N-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2015-07-30 US disclosed
US-20150214418-A1 COMPOSITION FOR FORMING P-TYPE DIFFUSION LAYER, METHOD OF FORMING P-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2015-07-30 US disclosed
CN-104810258-A Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell HITACHI CHEMICAL CO LTD 2015-07-29 CN disclosed
US-20150179433-A1 Water-Repellent Protective Film, and Chemical Solution for Forming Protective Film CENTRAL GLASS COMPANY, LIMITED (JP) 2015-06-25 US disclosed
US-20150179829-A1 COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE WITH PASSIVATION LAYER, METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE WITH PASSIVATION LAYER, PHOTOVOLTAIC CELL ELEMENT, METHOD OF PRODUCING PHOTOVOLTAIC CELL ELEMENT AND PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2015-06-25 US disclosed
US-9062223-B2 Aqueous inkjet ink and method for forming inkjet image Konica Minolta, Inc. (JP) 2015-06-23 US disclosed
US-20150166582-A1 COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, PHOTOVOLTAIC CELL ELEMENT, METHOD OF PRODUCING PHOTOVOLTAIC CELL ELEMENT AND PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. a corporation 2015-06-18 US disclosed
EP-2876670-A1 COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, SOLAR CELL ELEMENT, PRODUCTION METHOD FOR SOLAR CELL ELEMENT, AND SOLAR CELL Hitachi Chemical Co., Ltd. (JP) 2015-05-27 EP disclosed
EP-2876671-A1 COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE WITH PASSIVATION LAYER, METHOD FOR PRODUCING SAID SEMICONDUCTOR SUBSTRATE, SOLAR CELL ELEMENT, AND METHOD FOR PRODUCING SAME Hitachi Chemical Company, Ltd. (JP) 2015-05-27 EP disclosed
EP-2874181-A1 COMPOSITION FOR FORMATION OF PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE WITH PASSIVATION LAYER, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE WITH PASSIVATION LAYER, SOLAR CELL ELEMENT, METHOD FOR MANUFACTURING SOLAR CELL ELEMENT, AND SOLAR CELL Hitachi Chemical Company, Ltd. (JP) 2015-05-20 EP disclosed
US-20150099352-A1 COMPOSITION FOR FORMING n-TYPE DIFFUSION LAYER, METHOD OF PRODUCING n-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL ELEMENT HITACHI CHEMICAL COMPANY, LTD. 2015-04-09 US disclosed
CN-104508830-A Composition for forming passivation layer, semiconductor substrate with passivation layer, method for manufacturing semiconductor substrate with passivation layer, solar cell element, method for manufacturing solar cell element, and solar cell HITACHI CHEMICAL CO LTD 2015-04-08 CN disclosed
CN-104508831-A Solar cell element, production method therefor, and solar cell module HITACHI CHEMICAL CO LTD 2015-04-08 CN disclosed
CN-104488070-A Semiconductor substrate with passivation layer and method of manufacturing same HITACHI CHEMICAL CO LTD 2015-04-01 CN disclosed
CN-104488088-A Solar cell element, production method therefor, and solar cell module HITACHI CHEMICAL CO LTD 2015-04-01 CN disclosed
CN-104488089-A Passivation-layer-forming composition, semiconductor substrate having passivation layer, method for manufacturing semiconductor substrate having passivation layer, solar-cell element, method for manufacturing solar-cell element, and solar cell HITACHI CHEMICAL CO LTD 2015-04-01 CN disclosed
CN-104488069-A Composition for forming passivation layer, semiconductor substrate with passivation layer, method for manufacturing semiconductor substrate with passivation layer, solar cell element, method for manufacturing solar cell element, and solar cell HITACHI CHEMICAL CO LTD 2015-04-01 CN disclosed
CN-104471719-A Composition for forming passivation layer, semiconductor substrate with passivation layer and method for manufacturing same, and solar cell element and method for manufacturing same HITACHI CHEMICAL CO LTD 2015-03-25 CN disclosed
CN-104471718-A Solar cell element, method for manufacturing solar cell element, and solar cell module HITACHI CHEMICAL CO LTD 2015-03-25 CN disclosed
CN-104471715-A Composition for forming passivation layer, semiconductor substrate with passivation layer and method for manufacturing same, solar cell element and method for manufacturing same, and solar cell HITACHI CHEMICAL CO LTD 2015-03-25 CN disclosed
CN-104471717-A Composition for forming passivation layer, semiconductor substrate having passivation layer, production method for semiconductor substrate having passivation layer, solar cell element, production method for solar cell element, and solar cell HITACHI CHEMICAL CO LTD 2015-03-25 CN disclosed
CN-104471720-A Passivation-layer-forming composition, semiconductor substrate having passivation layer, method for manufacturing semiconductor substrate having passivation layer, solar-cell element, method for manufacturing solar-cell element, and solar cell HITACHI CHEMICAL CO LTD 2015-03-25 CN disclosed
CN-102352187-B Polishing slurry for metal films and polishing method HITACHI CHEMICAL CO LTD 2015-03-18 CN disclosed
CN-104428901-A Solar-cell element and method for manufacturing same HITACHI CHEMICAL CO LTD 2015-03-18 CN disclosed
CN-104379684-A Ink composition OCE TECH BV 2015-02-25 CN disclosed
US-8960883-B2 Aqueous ink for inkjet and inkjet recording method KONICA MINOLTA HOLDINGS, INC. (JP) 2015-02-24 US disclosed
US-8946374-B2 Polyether ester composition, polyurethane resin composition, and optical material using the same DIC CORPORATION (JP) 2015-02-03 US disclosed
CN-104319296-A Mask forming composition, production method for solar cell substrate, and production method for solar cell element HITACHI CHEMICAL CO LTD 2015-01-28 CN disclosed
US-8932390-B2 Liquid chemical for forming protecting film CENTRAL GLASS COMPANY, LIMITED (JP) 2015-01-13 US disclosed
EP-2819149-A1 COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE HAVING N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING SOLAR CELL ELEMENT Hitachi Chemical Company, Ltd. (JP) 2014-12-31 EP disclosed
US-20140373870-A1 Liquid Chemical for Forming Protecting Film CENTRAL GLASS CO LTD (JP) 2014-12-25 US disclosed
CN-104176393-A PRESSURE FEED CONTAINER, STORAGE METHOD USING THE PRESSURE FEED CONTAINER, AND METHOD FOR TRANSFERRING LIQUID USING THE PRESSURE FEED CONTAINER CENTRAL GLASS CO LTD 2014-12-03 CN disclosed
US-8901002-B2 Polishing slurry for metal films and polishing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-12-02 US disclosed
EP-2805977-A2 Thermosetting resin composition DIC Corporation (JP) 2014-11-26 EP disclosed
US-20140339321-A1 PRESSURE FEED CONTAINER, STORAGE METHOD USING THE PRESSURE FEED CONTAINER, AND METHOD FOR TRANSFERRING LIQUID USING THE PRESSURE FEED CONTAINER CENTRAL GLASS COMPANY, LIMITED (JP) 2014-11-20 US disclosed
CN-104159983-A Ink composition OCE TECH BV 2014-11-19 CN disclosed
CN-104137227-A Composition for forming n-type diffusion layer, method for producing semiconductor substrate having n-type diffusion layer, and method for producing solar cell element HITACHI CHEMICAL CO LTD 2014-11-05 CN disclosed
US-20140311379-A1 Method for Preparing Liquid Chemical for Forming Water Repellent Protective Film CENTRAL GLASS COMPANY, LIMITED (JP) 2014-10-23 US disclosed
CN-104081504-A Composition for forming passivation film, semiconductor substrate provided with passivation film and method for producing same, and solar cell element and method for producing same HITACHI CHEMICAL CO LTD 2014-10-01 CN disclosed
CN-104067395-A Composition for forming mask, method for producing substrate for solar cell, and method for producing solar cell element HITACHI CHEMICAL CO LTD 2014-09-24 CN disclosed
CN-104040701-A Semiconductor substrate with passivation film and method for manufacturing same, and solar cell element and method for manufacturing same HITACHI CHEMICAL CO LTD 2014-09-10 CN disclosed
US-8828144-B2 Process for cleaning wafers Central Grass Company, Limited (JP) 2014-09-09 US disclosed
CN-104025306-A Method for manufacturing substrate for solar cell and method for manufacturing solar cell element HITACHI CHEMICAL CO LTD 2014-09-03 CN disclosed
US-8821750-B2 Metal polishing slurry and polishing method HITACHI CHEMICAL CO., LTD. (JP) 2014-09-02 US disclosed
CN-102498144-B Polyether ester composition, polyurethane resin composition, and optical material using same DAINIPPON INK & CHEMICALS 2014-08-20 CN disclosed
US-20140227821-A1 P-TYPE DIFFUSION LAYER FORMING COMPOSITION HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-08-14 US disclosed
EP-2540759-B1 Thermosetting resin composition and cured product of the same DAINIPPON INK & CHEMICALS (JP) 2014-08-06 EP disclosed
EP-2436734-B1 THERMOSETTING RESIN COMPOSITE AND CURED PRODUCT THEREOF DAINIPPON INK & CHEMICALS (JP) 2014-07-23 EP disclosed
US-8778217-B2 Polishing slurry for CMP, and polishing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-07-15 US disclosed
CN-103890960-A Element and solar cell HITACHI CHEMICAL CO LTD 2014-06-25 CN disclosed
EP-2743967-A1 COMPOSITION THAT FORMS N-TYPE DIFFUSION LAYER, N-TYPE DIFFUSION LAYER MANUFACTURING METHOD AND SOLAR CELL ELEMENT MANUFACTURING METHOD Hitachi Chemical Company, Ltd. (JP) 2014-06-18 EP disclosed
US-20140158196-A1 ELEMENT AND PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-06-12 US disclosed
CN-103839787-A Composition for forming n-type diffusion layer, method for producing n-type diffusion layer, and method for producing solar cell element HITACHI CHEMICAL CO LTD 2014-06-04 CN disclosed
CN-103794478-A Composition that forms n-type diffusion layer, n-type diffusion layer manufacturing method and solar cell element manufacturing method HITACHI CHEMICAL CO LTD 2014-05-14 CN disclosed
EP-2728624-A1 SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD THEREFOR, SOLAR-CELL ELEMENT, AND SOLAR CELL Hitachi Chemical Company, Ltd. (JP) 2014-05-07 EP disclosed
US-20140120648-A1 COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD OF FORMING N-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-05-01 US disclosed
CN-103718309-A Semiconductor substrate, method for manufacturing same, solar cell element, and solar cell HITACHI CHEMICAL CO LTD 2014-04-09 CN disclosed
CN-102453148-B Olefin polymerization catalyst component, olefin polymerization catalyst and olefin polymerization method CHINA PETROLEUM & CHEMICAL 2014-04-02 CN disclosed
CN-103688367-A Solar-cell substrate, method for manufacturing solar-cell substrate, solar-cell element, and solar cell HITACHI CHEMICAL CO LTD 2014-03-26 CN disclosed
CN-103688341-A Composition for forming n-type diffusion layer, method for producing n-type diffusion layer, and method for producing solar cell element HITACHI CHEMICAL CO LTD 2014-03-26 CN disclosed
US-20140076396-A1 SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING THE SAME, PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-03-20 US disclosed
CN-103650111-A Composition for forming n-type diffusion layer, method for producing n-type diffusion layer, and method for producing solar cell element HITACHI CHEMICAL CO LTD 2014-03-19 CN disclosed
US-20140065761-A1 COMPOSITION FOR FORMING P-TYPE DIFFUSION LAYER, METHOD OF FORMING P-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-03-06 US disclosed
US-20140065826-A1 POLISHING SLURRY FOR METAL FILMS AND POLISHING METHOD HITACHI CHEMICAL CO., LTD. (JP) 2014-03-06 US disclosed
US-20140060385-A1 COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-03-06 US disclosed
CN-102449069-B Thermosetting resin composite and cured product thereof DAINIPPON INK & CHEMICALS 2014-02-12 CN disclosed
CN-103492499-A Silica-coating-forming composition for use with inkjets, method for forming silica coating, semiconductor device, and solar-cell system HITACHI CHEMICAL CO LTD 2014-01-01 CN disclosed
US-8609541-B2 Polishing slurry for metal films and polishing method HITACHI CHEMICAL CO., LTD. (JP) 2013-12-17 US disclosed
EP-2671920-A1 THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND INTERLAYER ADHESIVE FILM FOR PRINTED WIRING BOARD DIC Corporation (JP) 2013-12-11 EP disclosed
US-20130309489-A1 THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THE SAME, AND INTERLAMINAR ADHESIVE FILM USED FOR PRINTED WIRING BOARD DIC CORPORATION (JP) 2013-11-21 US disclosed
EP-2665089-A1 COMPOSITION FOR FORMING p-TYPE DIFFUSION LAYER, METHOD OF PRODUCING SILICON SUBSTRATE HAVING p-TYPE DIFFUSION LAYER, METHOD FOR PRODUCING PHOTOVOLTAIC CELL , AND PHOTOVOLTAIC CELL Hitachi Chemical Company, Ltd. (JP) 2013-11-20 EP disclosed
US-8585197-B2 Method for printing non-aqueous ink and printing substrate for non-aqueous ink RISO KAGAKU CORPORATION (JP) 2013-11-19 US disclosed
EP-2662883-A1 Composition for forming p-type diffusion layer, method for forming p-type diffusion layer, and method for producing photovoltaic cell Hitachi Chemical Company, Ltd. (JP) 2013-11-13 EP disclosed
CN-103370371-A Thermosetting resin composition, cured product thereof, and interlayer adhesive film for printed wiring board DAINIPPON INK & CHEMICALS 2013-10-23 CN disclosed
CN-103348449-A Composition for forming n-type diffusion layer, process for producing n-type diffusion layer, and process for producing solar cell HITACHI CHEMICAL CO LTD 2013-10-09 CN disclosed
US-20130255534-A1 Method of Preparing Liquid Chemical for Forming Protective Film CENTRAL GLASS COMPANY, LIMITED (JP) 2013-10-03 US disclosed
EP-2642527-A1 METHOD FOR PRODUCING PHOTOVOLTAIC CELL Hitachi Chemical Company, Ltd. (JP) 2013-09-25 EP disclosed
EP-2642529-A1 METHOD FOR PRODUCING PHOTOVOLTAIC CELL Hitachi Chemical Company, Ltd. (JP) 2013-09-25 EP disclosed
EP-2642528-A1 METHOD FOR PRODUCING SOLAR CELL Hitachi Chemical Co., Ltd. (JP) 2013-09-25 EP disclosed
US-8534820-B2 Ink for ink-jet recording, ink cartridge, ink-jet recording apparatus, method of determining, and method of ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2013-09-17 US disclosed
CN-103299400-A P-type diffusion layer formation composition, method for producing silicon substrate having p-type diffusion layer, method for producing solar cell element, and solar cell HITACHI CHEMICAL CO LTD 2013-09-11 CN disclosed
CN-103299399-A Composition for forming p-type diffusion layer, method for producing p-type diffusion layer, and method for producing solar cell element HITACHI CHEMICAL CO LTD 2013-09-11 CN disclosed
CN-103299403-A Chemical solution for forming protective film CENTRAL GLASS CO LTD 2013-09-11 CN disclosed
CN-103283004-A Wafer Cleaning Method CENTRAL GLASS CO LTD 2013-09-04 CN disclosed
CN-103201849-A Method for manufacturing solar cell HITACHI CHEMICAL CO LTD 2013-07-10 CN disclosed
US-8481428-B2 Polishing slurry and polishing method HITACHI CHEMICAL CO., LTD. (JP) 2013-07-09 US disclosed
US-8470913-B2 Thermosetting resin composition and cured product of the same DIC CORPORATION (JP) 2013-06-25 US disclosed
CN-103155164-A Method for manufacturing solar cell HITACHI CHEMICAL CO LTD 2013-06-12 CN disclosed
CN-103155166-A Method for producing solar cell HITACHI CHEMICAL CO LTD 2013-06-12 CN disclosed
EP-2592120-A1 AQUEOUS INKJET INK, AND METHOD FOR FORMING INKJET IMAGE Konica Minolta Holdings, Inc. (JP) 2013-05-15 EP disclosed
US-8440010-B2 Inkjet printing method and ink set RISO KAGAKU CORPORATION (JP) 2013-05-14 US disclosed
CN-101551589-B Silica based positive type photosensitive organic compound HITACHI CHEMICAL CO LTD 2013-05-08 CN disclosed
US-20130106945-A1 AQUEOUS INKJET INK AND METHOD FOR FORMING INKJET IMAGE KONICA MINOLTA HOLDINGS, INC. (JP) 2013-05-02 US disclosed
CN-103059819-A Non-aqueous coolant composition for engine CHINA PETROLEUM & CHEMICAL 2013-04-24 CN disclosed
US-8410000-B2 Method for producing photovoltaic cell HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-04-02 US disclosed
US-20130078759-A1 COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD OF FORMING N-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL Hitachi Chemical Company ,Ltd. 2013-03-28 US disclosed
US-8404599-B2 Method for producing photovoltaic cell HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-03-26 US disclosed
US-20130071968-A1 COMPOSITION FOR FORMING P-TYPE DIFFUSION LAYER, METHOD OF FORMING P-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-03-21 US disclosed
US-8393728-B2 Method for forming ink-jet image KONICA MINOLTA HOLDINGS, INC. (JP) 2013-03-12 US disclosed
CN-102959684-A Composition for forming impurity diffusion layer, composition for forming n-type diffusion layer, method for producing n-type diffusion layer, composition for forming p-type diffusion layer, method for producing p-type diffusion layer, and method for producing solar cell element SATO TETSUYA 2013-03-06 CN disclosed
EP-2562793-A1 COMPOSITION THAT FORMS p-TYPE DIFFUSION LAYER, METHOD FOR PRODUCING p-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING SOLAR CELL ELEMENT Hitachi Chemical Company, Ltd. (JP) 2013-02-27 EP disclosed
EP-2562792-A1 COMPOSITION THAT FORMS n-TYPE DIFFUSION LAYER, METHOD FOR PRODUCING n-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING SOLAR CELL ELEMENT Hitachi Chemical Company, Ltd. (JP) 2013-02-27 EP disclosed
EP-2284165-B1 SULFONIUM SALT, PHOTOACID GENERATOR, PHOTO-CURABLE COMPOSITION, AND CURED PRODUCT OF THE PHOTO-CURABLE COMPOSITION SAN APRO LTD (JP) 2013-02-20 EP disclosed
CN-102934205-A Composition for forming impurity diffusion layer, process for producing impurity diffusion layer, and process for producing solar cell element HITACHI CHEMICAL CO LTD 2013-02-13 CN disclosed
US-20130025669-A1 PHOTOVOLTAIC CELL SUBSTRATE, METHOD OF PRODUCING PHOTOVOLTAIC CELL SUBSTRATE, PHOTOVOLTAIC CELL ELEMENT AND PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. 2013-01-31 US disclosed
US-20130025670-A1 SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING THE SAME, PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. 2013-01-31 US disclosed
CN-102888208-A Abrasive and substrate polishing method HITACHI CHEMICAL CO LTD 2013-01-23 CN disclosed
CN-102870197-A Composition for forming n-type diffusion layer, method for producing n-type diffusion layer, and method for producing solar cell element HITACHI CHEMICAL CO LTD 2013-01-09 CN disclosed
EP-2540759-A2 Thermosetting resin composition and cured product of the same DIC Corporation (JP) 2013-01-02 EP disclosed
CN-102859659-A Composition that forms p-type diffusion layer, method for producing p-type diffusion layer, and method for producing solar cell element HITACHI CHEMICAL CO LTD 2013-01-02 CN disclosed
US-8342670-B2 Inkjet printing method and ink set RISO KAGAKU CORPORATION (JP) 2013-01-01 US disclosed
CN-102844841-A N-type diffusion layer-forming composition, n-type diffusion layer production method and solar cell component production method HITACHI CHEMICAL CO LTD 2012-12-26 CN disclosed
CN-102834898-A N-type diffusion layer forming composition, method of producing n-type diffusion layer, and method of producing solar cell element HITACHI CHEMICAL CO LTD 2012-12-19 CN disclosed
CN-102131910-B Cleaning agent composition for removing lead-free flux and system for removing lead-free flux ARAKAWA CHEM IND 2012-12-19 CN disclosed
US-20120293581-A1 METHOD FOR PRINTING NON-AQUEOUS INK AND PRINTING SUBSTRATE FOR NON-AQUEOUS INK RISO KAGAKU CORPORATION (JP) 2012-11-22 US disclosed
US-20120272999-A1 Liquid Chemical for Forming Water Repellent Protecting Film, and Process for Cleaning Wafers Using the Same CENTRAL GLASS COMPANY, LIMITED (JP) 2012-11-01 US disclosed
US-8278030-B2 Sulfonium salt, photoacid generator, and photocurable composition and cured body thereof SAN-APRO LIMITED (JP) 2012-10-02 US disclosed
CN-102690607-A Metal polishing slurry and application thereof HITACHI CHEMICAL CO LTD 2012-09-26 CN disclosed
US-20120231575-A1 METHOD FOR PRODUCING SOLAR CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-09-13 US disclosed
EP-2497803-A1 AQUEOUS INK FOR INKJET AND INKJET RECORDING METHOD Konica Minolta Holdings, Inc. (JP) 2012-09-12 EP disclosed
EP-2495771-A1 SOLAR CELL Hitachi Chemical Company, Ltd. (JP) 2012-09-05 EP disclosed
EP-2495770-A1 METHOD FOR PRODUCING SOLAR CELL Hitachi Chemical Company, Ltd. (JP) 2012-09-05 EP disclosed
US-20120218342-A1 AQUEOUS INK FOR INKJET AND INKJET RECORDING METHOD KONICA MINOLTA HOLDINGS, INC. (JP) 2012-08-30 US disclosed
US-20120211076-A1 SOLAR CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-08-23 US disclosed
US-20120211025-A1 PROCESS FOR CLEANING WAFERS CENTRAL GLASS COMPANY, LIMITED (JP) 2012-08-23 US disclosed
CN-1903968-B Aqueous dispersion composition for abrasive particles YUSHIRO CHEM IND 2012-08-22 CN disclosed
CN-101517487-B Radiation-sensitive composition, method for forming silica-based coating film, device and member having silica-based coating film, and photosensitizer for insulating film HITACHI CHEMICAL CO LTD 2012-08-08 CN disclosed
EP-2479199-A1 POLYETHER ESTER COMPOSITION, POLYURETHANE RESIN COMPOSITION, AND OPTICAL MATERIAL USING SAME DIC Corporation (JP) 2012-07-25 EP disclosed
US-8226223-B2 Ink set for ink-jet recording, ink-jet recording apparatus, and method of ink-jet recording Broker Kogyo Kabushiki Kaisha (JP) 2012-07-24 US disclosed
US-20120184062-A1 COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. 2012-07-19 US disclosed
CN-102598291-A Method for manufacturing solar cell HITACHI CHEMICAL CO LTD 2012-07-18 CN disclosed
US-8221534-B2 Ink-jet ink set, producing method of ink-jet ink set, image forming method, and ink-jet recording apparatus BROTHER KOGYO KABUSHIKI KAISHA (JP) 2012-07-17 US disclosed
US-20120174945-A1 Liquid Chemical for Forming Protecting Film CENTRAL GLASS COMPANY, LIMITED (JP) 2012-07-12 US disclosed
US-20120178201-A1 COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. 2012-07-12 US disclosed
CN-102576751-A Solar cell unit HITACHI CHEMICAL CO LTD 2012-07-11 CN disclosed
US-20120172567-A1 POLYETHER ESTER COMPOSITION, POLYURETHANE RESIN COMPOSITION, AND OPTICAL MATERIAL USING THE SAME DIC CORPORATION (JP) 2012-07-05 US disclosed
US-8211845-B2 Cleaning composition for removing lead-free solder flux and system for removing lead-free solder flux ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2012-07-03 US disclosed
CN-102498144-A Polyether ester composition, polyurethane resin composition, and optical material using same DAINIPPON INK & CHEMICALS 2012-06-13 CN disclosed
US-20120142829-A1 THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT OF THE SAME DIC CORPORATION (JP) 2012-06-07 US disclosed
US-20120122265-A1 METHOD FOR PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. 2012-05-17 US disclosed
US-20120122264-A1 METHOD FOR PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. 2012-05-17 US disclosed
US-20120122263-A1 METHOD FOR PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. 2012-05-17 US disclosed
CN-102453148-A Olefin polymerization catalyst component, olefin polymerization catalyst, and olefin polymerization method CHINA PETROLEUM & CHEMICAL 2012-05-16 CN disclosed
CN-102449069-A Thermosetting resin composite and cured product thereof DAINIPPON INK & CHEMICALS 2012-05-09 CN disclosed
US-8168729-B2 Thermosetting resin composition DIC CORPORATION (JP) 2012-05-01 US disclosed
US-20120100718-A1 CMP Fluid and Method for Polishing Palladium HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-04-26 US disclosed
US-8158981-B2 Radiation-sensitive composition, method of forming silica-based coating film, silica-based coating film, apparatus and member having silica-based coating film and photosensitizing agent for insulating film HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-04-17 US disclosed
US-20120064721-A1 POLISHING SLURRY AND POLISHING METHOD HITACHI CHEMICAL CO., LTD. (JP) 2012-03-15 US disclosed
CN-102352187-A Polishing slurry for metal films and polishing method HITACHI CHEMICAL CO LTD 2012-02-15 CN disclosed
US-20120021190-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING SILICA COATING FILM, AND APPARATUS AND MEMBER EACH COMPRISING SILICA COATING FILM HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-01-26 US disclosed
US-20110318929-A1 CMP POLISHING SOLUTION AND POLISHING METHOD HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-12-29 US disclosed
US-8084363-B2 Polishing slurry and polishing method HITACHI CHEMICAL CO., LTD. (JP) 2011-12-27 US disclosed
US-8084362-B2 Polishing slurry and polishing method HITACHI CHEMICAL CO., LTD. (JP) 2011-12-27 US disclosed
US-8066808-B2 formed from plurality of color inks; ozone resistance BROTHER KOGYO KABUSHIKI KAISHA (JP) 2011-11-29 US disclosed
EP-2239146-B1 Method for forming ink-jet image KONICA MINOLTA HOLDINGS INC (JP) 2011-11-16 EP disclosed
US-20110256658-A1 METHOD FOR PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. 2011-10-20 US disclosed
US-8034545-B2 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2011-10-11 US disclosed
CN-102194672-A Composition and method for forming n-type diffusion layer, and method for manufacturing photovoltaic cell HITACHI CHEMICAL CO LTD 2011-09-21 CN disclosed
CN-102187278-A Photosensitive resin composition, method for forming silica-based coating film, and device and member having silica-based coating film HITACHI CHEMICAL CO LTD 2011-09-14 CN disclosed
CN-1664707-B Scouring agent and flushing fluid for the planography DAICEL CHEM 2011-09-14 CN disclosed
US-20110212564-A1 METHOD FOR PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. 2011-09-01 US disclosed
CN-102169738-A Composition and method for forming p-type diffusion layer and method for preparing photovoltaic cell HITACHI CHEMICAL CO LTD 2011-08-31 CN disclosed
CN-1698018-B Radiation-curable composition, method for storing same, method for forming cured film, method for forming pattern, method for using pattern, electronic component, and optical waveguide HITACHI CHEMICAL CO LTD 2011-08-31 CN disclosed
CN-102159653-A Aqueous inkjet ink RISO KAGAKU CORP 2011-08-17 CN disclosed
US-20110192318-A1 AQUEOUS INKJET INK RISO KAGAKU CORPORATION (JP) 2011-08-11 US disclosed
US-20110195541-A1 COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. 2011-08-11 US disclosed
US-20110195540-A1 COMPOSITION FOR FORMING P-TYPE DIFFUSION LAYER, METHOD FOR FORMING P-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL HITACHI CHEMICAL COMPANY, LTD. 2011-08-11 US disclosed
EP-2355137-A1 Composition for forming p-type diffusion layer, method for forming p-type diffusion layer, and method for producing photovoltaic cell Hitachi Chemical Co., Ltd. (JP) 2011-08-10 EP disclosed
EP-2348546-A2 Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell Hitachi Chemical Co., Ltd. (JP) 2011-07-27 EP disclosed
EP-2345704-A1 AQUEOUS INKJET INK Riso Kagaku Corporation (JP) 2011-07-20 EP disclosed
CN-102131910-A Cleaning agent composition for removing lead-free flux and system for removing lead-free flux ARAKAWA CHEM IND 2011-07-20 CN disclosed
US-7971983-B2 Ink set for ink-jet recording, ink-jet recording method, and ink-jet recording apparatus BROTHER KOGYO KABUSHIKI KAISHA (JP) 2011-07-05 US disclosed
US-20110148980-A1 OIL INKJET PRINTING METHOD AND INK SET RISO KAGAKU CORPORATION (JP) 2011-06-23 US disclosed
US-7942959-B2 Ink for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2011-05-17 US disclosed
US-20110094545-A1 CLEANING COMPOSITION FOR REMOVING LEAD-FREE SOLDER FLUX AND SYSTEM FOR REMOVING LEAD-FREE SOLDER FLUX ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2011-04-28 US disclosed
CN-102008729-A Composition for external use ROHTO PHARMA 2011-04-13 CN disclosed
US-7915524-B2 Sealing agent for photoelectric conversion device and photoelectric conversion device using the same NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2011-03-29 US disclosed
CN-101370847-B Thermosetting resin composition DAINIPPON INK & CHEMICALS 2011-03-16 CN disclosed
US-20110039205-A1 SULFONIUM SALT, PHOTOACID GENERATOR, AND PHOTOCURABLE COMPOSITION AND CURED BODY THEREOF SAN-APRO LIMITED (JP) 2011-02-17 US disclosed
EP-2284165-A1 PHOSPHONIUM SALT, PHOTOACID GENERATOR, PHOTO-CURABLE COMPOSITION, AND CURED PRODUCT OF THE PHOTO-CURABLE COMPOSITION San-Apro Limited (JP) 2011-02-16 EP disclosed
CN-101058713-B Polishing slurry and polishing method HITACHI CHEMICAL CO LTD 2011-02-09 CN disclosed
US-20110009033-A1 POLISHING SLURRY FOR METAL FILMS AND POLISHING METHOD HITACHI CHEMICAL CO., LTD. (JP) 2011-01-13 US disclosed
CN-101037646-B Cleaning agent for removing solder flux and method for cleaning solder flux KAKEN TECH CO LTD 2010-12-08 CN disclosed
EP-2239146-A1 Method for forming ink-jet image Konica Minolta Holdings, Inc. (JP) 2010-10-13 EP disclosed
US-20100253734-A1 METHOD FOR FORMING INK-JET IMAGE KONICA MINOLTA HOLDINGS, INC. (JP) 2010-10-07 US disclosed
EP-1333061-B1 Thermosetting polymide resin composition and process for producing polymide resin DAINIPPON INK & CHEMICALS (JP) 2010-08-25 EP disclosed
US-7776808-B2 Being lead-free or high melting, with a mixture of benzyl alcohol, a glycol, and an amino alcohol such as diethanolamine; electronics KAKEN TECH CO., LTD. (JP) 2010-08-17 US disclosed
US-7766471-B2 Ink set for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2010-08-03 US disclosed
US-20100120250-A1 METAL POLISHING SLURRY AND POLISHING METHOD HITACHI CHEMICAL CO., LTD. (JP) 2010-05-13 US disclosed
US-20100102321-A1 RADIATION-SENSITIVE COMPOSITION, METHOD OF FORMING SILICA-BASED COATING FILM, SILICA-BASED COATING FILM, APPARATUS AND MEMBER HAVING SILICA-BASED COATING FILM AND PHOTOSENSITIZING AGENT FOR INSULATING FILM HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-04-29 US disclosed
US-7690762-B2 Water base ink for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2010-04-06 US disclosed
US-20100033524-A1 Inkjet Printing Method and Ink Set RISO KAGAKU CORPORATION (JP) 2010-02-11 US disclosed
US-20090324831-A1 CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING CURED COATING USING THE SAME DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2009-12-31 US disclosed
US-7637993-B2 Water base ink for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2009-12-29 US disclosed
US-20090251652-A1 Silica based positive type photosensitive organic compound HITACHI CHEMICAL CO., LTD. 2009-10-08 US disclosed
CN-101551589-A Silica based positive type photosensitive organic compound HITACHI CHEMICAL CO LTD (JP) 2009-10-07 CN disclosed
US-20090220897-A1 RADIATION CURABLE COMPOSITION, STORING METHOD THEREOF, FORMING METHOD OF CURED FILM, PATTERNING METHOD, USE OF PATTERN, ELECTRONIC COMPONENTS AND OPTICAL WAVEGUIDE HITACHI CHEMICAL CO., LTD. (JP) 2009-09-03 US disclosed
US-20090214796-A1 Method for Forming Antireflection Film MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 2009-08-27 US disclosed
CN-101517487-A Radiation-sensitive composition, method for forming silica-based coating film, device and member having silica-based coating film, and photosensitizer for insulating film HITACHI CHEMICAL CO LTD (JP) 2009-08-26 CN disclosed
US-20090209104-A1 POLISHING SLURRY FOR CMP, AND POLISHING METHOD RESONAC CORPORATION (JP) 2009-08-20 US disclosed
US-7571977-B2 Ink-jet recording apparatus BROTHER KOGYO KABUSHIKI KAISHA (JP) 2009-08-11 US disclosed
US-20090195571-A1 Ink Set for Ink-Jet Recording, Ink-Jet Recording Apparatus, and Method of Ink-Jet Recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2009-08-06 US disclosed
US-20090196994-A1 Inkjet printing method and ink set RISO KAGAKU CORPORATION (JP) 2009-08-06 US disclosed
US-20090192273-A1 THERMOSETTING RESIN COMPOSITION DIC CORPORATION (JP) 2009-07-30 US disclosed
US-20090186155-A1 INK FOR INK-JET RECORDING, INK CARTRIDGE, INK-JET RECORDING APPARATUS, METHOD OF DETERMINING, AND METHOD OF INK-JET RECORDING BROTHER KOGYO KABUSHIKI KAISHA (JP) 2009-07-23 US disclosed
CN-101490170-A Curable resin composition and method for forming cured coating film DAICEL CHEM (JP) 2009-07-22 CN disclosed
CN-100510961-C Radiation-curing composition, method for storing same, method for forming cured film, method for forming pattern, method for using pattern, electronic component, and optical waveguide HITACHI CHEMICAL CO LTD (JP) 2009-07-08 CN disclosed
US-7553361-B2 Water base ink for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2009-06-30 US disclosed
US-20090156007-A1 Polishing slurry and polishing method HITACHI CHEMICAL CO., LTD. (JP) 2009-06-18 US disclosed
EP-2048196-A1 CURABLE RESIN COMPOSITION AND METHOD FOR FORMING CURED COATING FILM Daicel Chemical Industries, Ltd. (JP) 2009-04-15 EP disclosed
CN-101398498-A Coloring composite for color filter, color filter, and displaying device for color filter FUJIFILM CORP (JP) 2009-04-01 CN disclosed
CN-101370847-A Thermosetting resin composition DAINIPPON INK & CHEMICALS (JP) 2009-02-18 CN disclosed
US-7479182-B2 Black Ink for ink-jet printing KONICA MINOLTA HOLDINGS, INC. (JP) 2009-01-20 US disclosed
US-7468100-B2 Ink for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-12-23 US disclosed
US-7465345-B2 Ink-jet ink set BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-12-16 US disclosed
US-20080305979-A1 Cleaning agent for removing solder flux and method for cleaning solder flux KAKEN TECH CO., LTD 2008-12-11 US disclosed
US-20080302270-A1 Ink Set For Ink-Jet Recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-12-11 US disclosed
US-20080274305-A1 Liquid Crystal Sealant and Liquid Crystal Display Cell Utilizing the Same NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2008-11-06 US disclosed
US-20080260956-A1 Film, Silica Film and Method of Forming the Same, Composition for Forming Silica Film, and Electronic Part HITACHI CHEMICAL CO., LTD. (JP) 2008-10-23 US disclosed
EP-1724314-B1 Ink-jet ink KONICA MINOLTA HOLDINGS INC (JP) 2008-10-22 EP disclosed
US-7438751-B2 Black ink comprising a black pigment, yellow dye, magenta dye, and cyan dye; storage stability; rub fastness against a plain paper surface, color balance after fading (fading stability), and/or water resistance BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-10-21 US disclosed
US-7438750-B2 Ink-jet ink set BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-10-21 US disclosed
US-7438749-B2 Ink-jet ink set BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-10-21 US disclosed
US-20080250968-A1 Water base ink for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-10-16 US disclosed
US-7435711-B2 Cleaning agent for removing solder flux and method for cleaning solder flux KAKEN TECH CO., LTD. (JP) 2008-10-14 US disclosed
EP-1964869-A1 THERMOSETTING RESIN COMPOSITION DIC Corporation (JP) 2008-09-03 EP disclosed
US-20080207560-A1 Composition For External Use ROHTO PHARMACEUTICAL CO., LTD. (JP) 2008-08-28 US disclosed
CN-100414398-C Liquid crystal sealing agent, liquid crystal display device using the same, and method of manufacturing the display device NIPPON KAYAKU KK (JP) 2008-08-27 CN disclosed
CN-100412183-C Cleaning agent for removing soldering flux and method for cleaning soldering flux KAKEN TECH CO LTD (JP) 2008-08-20 CN disclosed
US-7407537-B2 Ink set for ink-jet recording, method for producing the same, and the ink-jet printer BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-08-05 US disclosed
CN-100407494-C Sealing agent for photoelectric conversion element and photoelectric conversion element using the same NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2008-07-30 CN disclosed
US-20080171148-A1 Ink Set for Ink-Jet Recording, Ink-Jet Recording Method, and Ink-Jet Recording Apparatus BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-07-17 US disclosed
US-7393399-B2 Ink for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-07-01 US disclosed
CN-100395294-C Water base ink for ink-jet recording BROTHER IND LTD (JP) 2008-06-18 CN disclosed
EP-1607455-B1 Water base ink for ink-jet recording BROTHER IND LTD (JP) 2008-06-11 EP disclosed
CN-101194187-A Method for forming antireflection film HITACHI CHEMICAL CO LTD (JP) 2008-06-04 CN disclosed
US-20080102258-A1 INK-JET INK SET, PRODUCING METHOD OF INK-JET INK SET, IMAGE FORMING METHOD, AND INK-JET RECORDING APPARATUS BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-05-01 US disclosed
US-20080079793-A1 Ink Set For Ink-Jet Recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-04-03 US disclosed
US-20080079794-A1 Ink for Ink-Jet Recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-04-03 US disclosed
US-20080072786-A1 Ink-Jet Ink Set BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-03-27 US disclosed
US-20080072787-A1 Ink-Jet Ink Set BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-03-27 US disclosed
US-20080072789-A1 Ink-Jet Ink Set BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-03-27 US disclosed
US-20080072788-A1 Ink-Jet Ink Set BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-03-27 US disclosed
US-20080066645-A1 Ink For Ink-Jet Recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-03-20 US disclosed
US-20080066643-A1 Ink For Ink-Jet Recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-03-20 US disclosed
EP-1890172-A1 METHOD FOR FORMING ANTIREFLECTION FILM Hitachi Chemical Co., Ltd. (JP) 2008-02-20 EP disclosed
US-7328989-B2 Water base ink set for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2008-02-12 US disclosed
CN-101102797-A External composition ROHTO PHARMA (JP) 2008-01-09 CN disclosed
US-7297464-B2 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2007-11-20 US disclosed
EP-1849481-A1 COMPOSITION FOR EXTERNAL USE ROHTO PHARMACEUTICAL CO., LTD. (JP) 2007-10-31 EP disclosed
CN-101058713-A Polishing slurry and polishing method HITACHI CHEMICAL CO LTD (JP) 2007-10-24 CN disclosed
US-20070232197-A1 Polishing slurry and polishing method HITACHI CHEMICAL CO., LTD. (JP) 2007-10-04 US disclosed
CN-101037646-A Cleaning agent for removing solder flux and method for cleaning solder flux KAKEN TECH CO LTD (JP) 2007-09-19 CN disclosed
US-20070200880-A1 Ink-Jet Recording Apparatus BROTHER KOGYO KABUSHIKI KAISHA (JP) 2007-08-30 US disclosed
US-7250078-B2 Ink-jet ink and ink-jet recording method KONICA MINOLTA HOLDINGS, INC. (JP) 2007-07-31 US disclosed
US-7247192-B2 Water base ink for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2007-07-24 US disclosed
CN-101002137-A Liquid crystal sealant and liquid crystal display cell utilizing the same NIPPON KAYAKU KK (JP) 2007-07-18 CN disclosed
EP-1780587-A1 LIQUID CRYSTAL SEALANT AND LIQUID CRYSTAL DISPLAY CELL UTILIZING THE SAME Nippon Kayaku Kabushiki Kaisha (JP) 2007-05-02 EP disclosed
US-20070068419-A1 Blank ink for ink-jet printing KONICA MINOLTA HOLDINGS, INC. (JP) 2007-03-29 US disclosed
CN-1903968-A Aqueous dispersion composition for abrasive particles YUSHIRO CHEM IND (JP) 2007-01-31 CN disclosed
US-7159976-B2 Water base ink set for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2007-01-09 US disclosed
US-20060263399-A1 Preparation for external use on skin VIVIER CANADA INC. (CA) 2006-11-23 US disclosed
US-20060260506-A1 Water-based ink for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2006-11-23 US disclosed
EP-1724314-A1 Ink-jet ink KONICA MINOLTA HOLDINGS, INC. (JP) 2006-11-22 EP disclosed
CN-1867861-A Liquid crystal sealing agent, liquid crystal display device using the same, and method of manufacturing the display device NIPPON KAYAKU KK (JP) 2006-11-22 CN disclosed
US-20060254459-A1 Ink-jet ink KONICA MINOLTA HOLDINGS, INC. (JP) 2006-11-16 US disclosed
US-20060223732-A1 Cleaning agent for removing solder flux and method for cleaning solder flux KAKEN TECH CO., LTD. (JP) 2006-10-05 US disclosed
US-7101596-B2 Liquid crystal sealant, liquid crystal display device using the same and method for producing the device NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2006-09-05 US disclosed
US-20060192828-A1 Water base ink for ink-jet recording OHIRA HIDEO 2006-08-31 US disclosed
US-20060162771-A1 Sealing agent for photoelectric conversion element and photoelectric conversion device element using the same NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2006-07-27 US disclosed
CN-1264924-C Thermosetting polyimide resin composition and method for producing polyimide resin DAINIPPON INK & CHEMICALS (JP) 2006-07-19 CN disclosed
CN-1798826-A Cleaning agent for removing soldering flux and method for cleaning soldering flux KAKEN TECH CO LTD (JP) 2006-07-05 CN disclosed
EP-1674919-A1 SEALANT FOR LIQUID CRYSTAL, LIQUID-CRYSTAL DISPLAY MADE WITH THE SAME, AND PROCESS FOR PRODUICNG THE DISPLAY Nippon Kayaku Kabushiki Kaisha (JP) 2006-06-28 EP disclosed
EP-1672427-A1 RADIATION-CURING COMPOSITION, METHOD FOR STORING SAME, METHOD FOR FORMING CURED FILM, METHOD FOR FORMING PATTERN, METHOD FOR USING PATTERN, ELECTRONIC COMPONENT, AND OPTICAL WAVEGUIDE Hitachi Chemical Co., Ltd. (JP) 2006-06-21 EP disclosed
EP-1672426-A1 RADIATION CURABLE COMPOSITION, STORING METHOD THEREOF, FORMING METHOD OF CURED FILM, PATTERNING METHOD, USE OF PATTERN, ELECTRONIC COMPONENTS AND OPTICAL WAVEGUIDE HITACHI CHEMICAL COMPANY, LTD. (JP) 2006-06-21 EP disclosed
CN-1751410-A Sealing agent for photoelectric conversion element and photoelectric conversion element using the same NIPPON KAYAKU KK (JP) 2006-03-22 CN disclosed
US-20060050114-A1 Ink cartridge for ink-jet recording apparatus and method for manufacturing the same BROTHER KOGYO KABUSHIKI KAISHA (JP) 2006-03-09 US disclosed
US-20060005743-A1 Water base ink for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2006-01-12 US disclosed
EP-1614728-A1 Water-based ink for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2006-01-11 EP disclosed
CN-1715345-A Water base ink for ink-jet recording BROTHER IND LTD (JP) 2006-01-04 CN disclosed
US-20050279246-A1 Ink set for ink-jet recording, method for producing the same, and ink-jet printer BROTHER KOGYO KABUSHIKI KAISHA (JP) 2005-12-22 US disclosed
EP-1607454-A1 Ink set for ink-jet recording, method for producing the same, and ink-jet printer BROTHER KOGYO KABUSHIKI KAISHA (JP) 2005-12-21 EP disclosed
EP-1607455-A1 Water base ink for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2005-12-21 EP disclosed
CN-1709993-A Ink set for ink-jet recording, method for producing the same, and ink-jet printer BROTHER IND LTD (JP) 2005-12-21 CN disclosed
US-20050275701-A1 Water base ink for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2005-12-15 US disclosed
US-20050266344-A1 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2005-12-01 US disclosed
EP-1598897-A1 SEALING AGENT FOR PHOTOELECTRIC CONVERSION ELEMENT AND PHOTOELECTRIC CONVERSION ELEMENT USING THE SAME Nippon Kayaku Kabushiki Kaisha (JP) 2005-11-23 EP disclosed
CN-1698017-A Radiation-curing composition, method for storing same, method for forming cured film, method for forming pattern, method for using pattern, electronic component, and optical waveguide HITACHI CHEMICAL CO LTD (JP) 2005-11-16 CN disclosed
CN-1698018-A Radiation-curable composition, method for storing same, method for forming cured film, method for forming pattern, method for using pattern, electronic component, and optical waveguide HITACHI CHEMICAL CO LTD (JP) 2005-11-16 CN disclosed
US-20050239953-A1 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2005-10-27 US disclosed
CN-1664707-A Scouring agent and flushing fluid for the planography DAICEL CHEM (JP) 2005-09-07 CN disclosed
US-20050181145-A1 Liquid crystal sealant, liquid crystal display device using the same and method for producing the device SHARP KABUSHIKI KAISHA (JP) 2005-08-18 US disclosed
US-20050172855-A1 Ink-jet ink and ink-jet recording method KONICA MINOLTA HOLDINGS, INC. (JP) 2005-08-11 US disclosed
US-6887967-B2 Thermosetting polyimide resin composition process for producing polyimide resin, and polyimide resin DAINIPPON INK AND CHEMICALS, INC. (JP) 2005-05-03 US disclosed
US-20050050803-A1 Polishing fluid and polishing method HITACHI CHEMICAL CO., LTD. (JP) 2005-03-10 US disclosed
US-20040227800-A1 Water base ink set for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2004-11-18 US disclosed
US-20040080594-A1 Water base ink for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2004-04-29 US disclosed
US-20030189627-A1 Water base ink set for ink-jet recording BROTHER KOGYO KABUSHIKI KAISHA (JP) 2003-10-09 US disclosed
CN-1435448-A Thermosetting polyimide resin composition and method for producing polyimide resin DAINIPPON INK & CHEMICALS (JP) 2003-08-13 CN disclosed
US-20030149222-A1 Thermosetting polyimide resin composition and process for producing polyimide resin DAINIPPON INK AND CHEMICALS, INC (JP) 2003-08-07 US disclosed
EP-1333061-A1 Thermosetting polymide resin composition and process for producing polymide resin DAINIPPON INK AND CHEMICALS, INC. (JP) 2003-08-06 EP disclosed
US-6120858-A COMPRISING AN EPOXY RESIN, A NOVOLAC RESIN, A CURING ACCELERATOR AND A TITANIUM BLACK PIGMENT NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2000-09-19 US disclosed
EP-0608132-B1 Coating varnish composition and antifouling coating composition HITACHI CHEMICAL CO LTD (JP) 1998-05-20 EP disclosed
EP-0582451-B1 Refrigerator oil composition for fluoroalkane refrigerant NIPPON OIL CO LTD (JP) 1997-12-10 EP disclosed
US-5512198-A WEAR RESISTANCE NIPPON OIL CO., LTD. (JP) 1996-04-30 US disclosed
US-5439511-A Composition containing polymer obtained by polymerizing unsaturated acid anhydride and another unsaturated compound, specified additive HITACHI CHEMICAL COMPANY, LTD. (JP) 1995-08-08 US disclosed
EP-0608132-A1 Coating varnish composition and antifouling coating composition HITACHI CHEMICAL CO., LTD. (JP) 1994-07-27 EP disclosed
EP-0582451-A1 Refrigerator oil composition for fluoroalkane refrigerant NIPPON OIL CO. LTD. (JP) 1994-02-09 EP disclosed
US-5071454-A Absorption with alkylene glycol ethers HOECHST AKTIENGESELLSCHAFT (DE) 1991-12-10 US disclosed
US-5071454-A Absorption with alkylene glycol ethers HOECHST AKTIENGESELLSCHAFT (DE) 1991-12-10 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (22 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20220020582-A1 BEVEL PORTION TREATMENT AGENT COMPOSITION AND METHOD OF MANUFACTURING WAFER SGMS1, SGMS2, SEM1 TDP1 4522/4885LPAR1 586/4885LPAR3 1209/4885
US-20220081575-A1 SUBSTRATE, SELECTIVE FILM DEPOSITION METHOD, DEPOSITION FILM OF ORGANIC MATTER, AND ORGANIC MATTER C5, C1S, C9 TDP1 1837/4885LPAR1 2420/4885LPAR3 2456/4885
US-20240317788-A1 PRECIOUS METAL COMPLEXES WITH DIHYDROAZULENYL LIGANDS AND USE THEREOF PIN1, PDS5A, IDH1 TDP1 4350/4885LPAR1 3965/4885LPAR3 3337/4885
US-20170305848-A1 SULFONIUM SALT, PHOTOACID GENERATOR, AND PHOTOSENSITIVE COMPOSITION ARSA, SPIN1, ASIC1 TDP1 4091/4885LPAR1 1007/4885LPAR3 532/4885
US-12545862-B2 Method for producing decomposing/cleaning composition ITGAV, ITGA8, TLN1 TDP1 1945/4885LPAR1 2340/4885LPAR3 2514/4885
US-10059662-B2 Sulfonium salt, photoacid generator, and photosensitive composition ARSA, SPIN1, ASIC1 TDP1 4091/4885LPAR1 1007/4885LPAR3 532/4885
US-11817310-B2 Bevel portion treatment agent composition and method of manufacturing wafer SGMS1, SGMS2, SEM1 TDP1 4522/4885LPAR1 586/4885LPAR3 1209/4885
US-20190074173-A1 Water-Repellent Protective Film Forming Agent, Liquid Chemical for Forming Water-Repellent Protective Film, and Wafer Cleaning Method SMURF2, SMURF1, SLFN12 TDP1 2515/4885LPAR1 3596/4885LPAR3 3955/4885
US-10037882-B2 Method for cleaning wafer POT1, UCHL5, USP30 TDP1 675/4885LPAR1 3171/4885LPAR3 2961/4885
US-20260018421-A1 SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD ESPL1, SMS, SGMS1 TDP1 4078/4885LPAR1 720/4885LPAR3 839/4885
US-20240287103-A1 WATER-REPELLENT PROTECTIVE FILM-FORMING AGENT, WATER-REPELLENT PROTECTIVE FILM-FORMING CHEMICAL SOLUTION, AND WAFER SURFACE TREATMENT METHOD SMS, SRM, GUCY1A2 TDP1 1035/4885LPAR1 2826/4885LPAR3 3595/4885
US-20250215024-A1 CHEMICAL LIQUID, MANUFACTURING METHOD OF MODIFIED SUBSTRATE, AND MANUFACTURING METHOD OF LAMINATE EPM2A, AKR7A2, ALDOA TDP1 4313/4885LPAR1 1198/4885LPAR3 1576/4885
US-20060263399-A1 Preparation for external use on skin CUTA, SLC6A12, PROC TDP1 3097/4885LPAR1 1028/4885LPAR3 3101/4885
US-20110039205-A1 SULFONIUM SALT, PHOTOACID GENERATOR, AND PHOTOCURABLE COMPOSITION AND CURED BODY THEREOF ARSA, ASIC1, TST TDP1 4498/4885LPAR1 1603/4885LPAR3 1022/4885
US-20090186155-A1 INK FOR INK-JET RECORDING, INK CARTRIDGE, INK-JET RECORDING APPARATUS, METHOD OF DETERMINING, AND METHOD OF INK-JET RECORDING NOX4, NOX3, NOXO1 TDP1 1375/4885LPAR1 2132/4885LPAR3 1728/4885
US-12577508-B2 Composition, and method for cleaning adhesive polymer POT1, DNMT1, EHMT1 TDP1 230/4885LPAR1 2633/4885LPAR3 3494/4885
US-20200339611-A1 WATER-REPELLENT PROTECTIVE FILM-FORMING AGENT, WATER-REPELLENT PROTECTIVE FILM-FORMING CHEMICAL SOLUTION, AND WAFER SURFACE TREATMENT METHOD SMS, SRM, GUCY1A2 TDP1 1035/4885LPAR1 2826/4885LPAR3 3595/4885
US-20160368879-A1 PHOTOACID GENERATOR, AND RESIN COMPOSITION FOR PHOTOLITHOGRAPHY ARL1, GARS1, SPTBN1 TDP1 4488/4885LPAR1 899/4885LPAR3 690/4885
US-20150166582-A1 COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, PHOTOVOLTAIC CELL ELEMENT, METHOD OF PRODUCING PHOTOVOLTAIC CELL ELEMENT AND PHOTOVOLTAIC CELL MB, CD81, AP2M1 TDP1 2931/4885LPAR1 2081/4885LPAR3 3698/4885
US-20240317779-A1 METAL COMPLEXES HAVING 4-H,6-H OR 8-H DIHYDROAZULENYL LIGANDS AND USE THEREOF DOHH, CPNE4, MDH2 TDP1 4472/4885LPAR1 4778/4885LPAR3 4834/4885
US-20170233336-A1 SULFONATE COMPOUND, PHOTOACID GENERATOR, AND RESIN COMPOSITION FOR PHOTOLITHOGRAPHY ASIC1, ASIC3, SULT1A1 TDP1 4052/4885LPAR1 3270/4885LPAR3 3317/4885
US-10450266-B2 Sulfonate compound, photoacid generator, and resin composition for photolithography ASIC1, ASIC3, SULT1A1 TDP1 4052/4885LPAR1 3270/4885LPAR3 3317/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.