Benzoin

Benzoin

SCHEMBL604169

CCO.O=C(c1ccccc1)C(O)c1ccccc1

nearest known ligand 0.81

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

MMP1MMP13MMP7MMP8polrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of Benzoin. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ LMNA P02545 5/20 0.81
▸ CES2 O00748 3/20 0.81
▸ CES1 P23141 3/20 0.81
▸ ALDH1A1 P00352 2/20 0.62
▸ KDM4E B2RXH2 1/20 0.62
▸ TDP1 Q9NUW8 1/20 0.53
▸ L3MBTL1 Q9Y468 1/20 0.53
▸ MAPK1 P28482 1/20 0.52
▸ HSD17B10 Q99714 1/20 0.49
▸ PGR P06401 1/20 0.49
▸ ADRA2A P08913 1/20 0.49
▸ ADRA2B P18089 1/20 0.49
▸ HTR2A P28223 1/20 0.49
▸ HRH1 P35367 1/20 0.49
▸ KCNH2 Q12809 1/20 0.49
▸ CYP3A4 P08684 1/20 0.47
▸ HPGD P15428 1/20 0.47
▸ NAAA Q02083 2/20 0.45
▸ ALKBH5 Q6P6C2 1/20 0.44
▸ MDM2 Q00987 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Benzoin SCHEMBL27526077 0.95 LMNA (0.72) LMNACES2CES1ALDH1A1KDM4E
Benzoin SCHEMBL1158965 0.93 LMNA (0.75) LMNACES2CES1ALDH1A1KDM4E
Benzoin SCHEMBL11101768 0.92 LMNA (0.68) LMNACES2CES1ALDH1A1KDM4E
Benzoin SCHEMBL27632524 0.91 LMNA (0.78) LMNACES2CES1ALDH1A1KDM4E
Benzoin SCHEMBL9490022 0.90 LMNA (0.84) LMNACES2CES1ALDH1A1KDM4E
Benzoin SCHEMBL27529138 0.90 LMNA (0.66) LMNACES2CES1ALDH1A1KDM4E
Benzoin SCHEMBL4557692 0.90 LMNA (0.91) LMNACES2CES1ALDH1A1KDM4E
Benzoin SCHEMBL901258 0.90 CES2 (1.00) LMNACES2CES1ALDH1A1KDM4E
Benzoin SCHEMBL145 0.90 CES2 (1.00) LMNACES2CES1ALDH1A1KDM4E
Benzoin SCHEMBL5833429 0.90 CES2 (1.00) LMNACES2CES1ALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 775 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8367745-B2 Includes alkaline earth metal oxide as acidity neutralization stabilizer; quick setting, mechanical strength; repairing prosthesis GC CORPORATION (JP) 2013-02-05 — — US claimed
US-7964684-B2 Polysiesquioxanes preferably comprising vinyl or ethynyl silanetriol; improved inhibition of film shrinkage and degassing during curing; uniform thickness, low refractive index FUJIFILM CORPORATION (JP) 2011-06-21 — — US claimed
EP-1770119-B1 Crosslinkabe elastomer compositions, process for preparation, and use thereof LANXESS DEUTSCHLAND GMBH (DE) 2009-11-25 — — EP claimed
WO-2009054621-A2 THE COMPOSITION OF DECOLORABLE INK AND DECOLORING METHOD HAN JONG-SOO (KR) 2009-04-30 — — WO claimed
US-20050042515-A1 Composition for protecting negative electrode for lithium metal battery, and lithium metal battery fabricated using same SAMSUNG SDI CO., LTD. (KR) 2005-02-24 — — US claimed
US-6855480-B2 Photoresist composition SHIPLEY COMPANY, L.L.C. (US) 2005-02-15 — — US claimed
US-6818375-B2 FOR MANUFACTURING PRINTED WIRING BOARDS ETERNAL TECHNOLOGY CORPORATION 2004-11-16 — — US claimed
US-20030059709-A1 Photoresist composition SHIPLEY COMPANY, L.L.C. 2003-03-27 — — US claimed
US-20030022098-A1 Photoresist composition SHIPLEY COMPANY, L.L.C. 2003-01-30 — — US claimed
EP-0719246-B2 SYNTHESIS OF VINYL ESTERS CIBA SPEC CHEM WATER TREAT LTD (GB) 2002-12-11 — — EP claimed
EP-1251399-A2 Photoresist composition Shipley Company LLC (US) 2002-10-23 — — EP claimed
US-20020132180-A1 Photoresist composition SHIPLEY COMPANY, L.L.C. (US) 2002-09-19 — — US claimed
US-5965300-A MIXING MONOMERS SUCH AS (METH)ACRYLAMIDES A CROSSLINKING AGENT, POLYMERIZATION INITIATOR AND ELECTROLYTE SOLUTION CONTAINING LITHIUM SALT AND SOLVENT, ADDING THE MIXTURE TO POLYVINYLIDENE AND /OR N,N-DIALKYLACRYLAMIDE; POLYMERIZING SAMSUNG ELECTROONICS CO., LTD. (KR) 1999-10-12 — — US claimed
EP-0683174-B1 Thioether containing photopolymerizable compositions EASTMAN KODAK CO (US) 1998-08-05 — — EP claimed
EP-0719246-B1 SYNTHESIS OF VINYL ESTERS ALLIED COLLOIDS LTD (GB) 1998-04-22 — — EP claimed
US-5532286-A BONDING STRENGTH EASTMAN KODAK COMPANY (US) 1996-07-02 — — US claimed
EP-0683174-A2 Thioether containing photopolymerizable compositions EASTMAN KODAK COMPANY (US) 1995-11-22 — — EP claimed
US-5137936-A Method for packaging electronic parts and adhesive for use in said method MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1992-08-11 — — US claimed
US-4611892-A Synthetic resin ophthalmic lens having a surface hard coat SEIKO EPSON CORPORATION (JP) 1986-09-16 — — US claimed
US-12631960-B2 Photosensitive resin composition, photosensitive resin film using same, color filter, and display device SAMSUNG SDI CO., LTD. (KR) 2026-05-19 — — US disclosed
US-20260121223-A1 SEPARATOR FOR RECHARGEABLE LITHIUM BATTERY AND RECHARGEABLE LITHIUM BATTERY INCLUDING THE SAME SAMSUNG SDI CO LTD (KR) 2026-04-30 — — US disclosed
EP-4711042-A1 TARGET OBJECT SEPARATION APPARATUS WITH IMPROVED QUALITY CONTROL, AND MANUFACTURING METHOD THEREOF CURIOSIS INC. (KR) 2026-03-18 — — EP disclosed
EP-4704757-A1 SEMICRYSTALLINE SULFUR CONTAINING POLYMERS FOR ORTHODONTIC APPLICATIONS Align Technology, Inc. (US) 2026-03-11 — — EP disclosed
EP-4247116-B1 WIRING SHEET AND SHEET-FORM HEATER LINTEC CORP (JP) 2026-02-25 — — EP disclosed
US-12563644-B2 Wiring sheet, and sheet-like heater LINTEC CORPORATION (JP) 2026-02-24 — — US disclosed
US-12562435-B2 Separator for lithium secondary battery, and lithium secondary battery comprising same SAMSUNG SDI CO., LTD. (KR) 2026-02-24 — — US disclosed
EP-4692164-A1 RESIN COMPOSITION, BINDER RESIN, POLYMER THIN FILM AND BATTERY LINTEC CORPORATION (JP) 2026-02-11 — — EP disclosed
US-20260001985-A1 RESIN COMPOSITION, BINDER RESIN, POLYMER THIN FILM AND BATTERY LINTEC CORP (JP) 2026-01-01 — — US disclosed
US-20250357634-A1 SEPARATOR FOR LITHIUM SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY COMPRISING SAME SAMSUNG SDI CO LTD (KR) 2025-11-20 — — US disclosed
US-20250224673-A1 PHOTORESIST AND METHOD OF FORMATION AND USE TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2025-07-10 — — US disclosed
US-20250189889-A1 POLYMER MATERIAL IN A REDISTRIBUTION STRUCTURE OF A SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2025-06-12 — — US disclosed
US-20250158230-A1 SEPARATOR FOR LITHIUM SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY COMPRISING SAME SAMSUNG SDI CO., LTD. (KR) 2025-05-15 — — US disclosed
US-12287575-B2 Photoresist and method of formation and use TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2025-04-29 — — US disclosed
US-12265330-B2 Polymer material in a redistribution structure of a semiconductor package and method of manufacture TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2025-04-01 — — US disclosed
EP-3358606-B1 THERMAL BONDING SHEET, AND THERMAL BONDING SHEET WITH DICING TAPE NITTO DENKO CORP (JP) 2025-02-26 — — EP disclosed
US-12237536-B2 Separator for lithium secondary battery and lithium secondary battery comprising same SAMSUNG SDI CO., LTD. (KR) 2025-02-25 — — US disclosed
US-12230834-B2 Separator including porous substrate and coating layer of acrylic copolymer, organic filler, and inorganic particles, and lithium secondary battery including the same SAMSUNG SDI CO., LTD. (KR) 2025-02-18 — — US disclosed
US-20250009476-A1 SEMICRYSTALLINE SULFUR CONTAINING POLYMERS FOR ORTHODONTIC APPLICATIONS ALIGN TECHNOLOGY, INC. 2025-01-09 — — US disclosed
US-20240396078-A1 SOLID ELECTROLYTE, PRODUCTION METHOD FOR SOLID ELECTROLYTE, AND BATTERY LINTEC CORPORATION (JP) 2024-11-28 — — US disclosed
US-20240393685-A1 SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2024-11-28 — — US disclosed
US-20240395566-A1 SEMICONDUCTOR DEVICE TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2024-11-28 — — US disclosed
US-20240387193-A1 SEMICONDUCTOR DEVICES WITH EXTERNAL CONNECTORS TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2024-11-21 — — US disclosed
WO-2024233367-A1 SEMICRYSTALLINE SULFUR CONTAINING POLYMERS FOR ORTHODONTIC APPLICATIONS ALIGN TECHNOLOGY, INC. (US) 2024-11-14 — — WO disclosed
US-20240375105-A1 DEVICE FOR SEPARATING TARGET OBJECT WITH IMPROVED QUALITY CONTROL AND MANUFACTURING METHOD THEREOF CURIOSIS INC. (KR) 2024-11-14 — — US disclosed
US-12142729-B2 Quasi-solid and solid-state electrolyte for lithium-ion and lithium metal batteries and manufacturing method HONEYCOMB BATTERY COMPANY (US) 2024-11-12 — — US disclosed
US-12116468-B2 Composite particles comprising a hydrophobic dye and an amphiphilic block copolymer and use thereof in optical applications COLOURSMITH LABS INC. (CA) 2024-10-15 — — US disclosed
EP-4091578-B1 METHOD FOR PRODUCING PLATE DENTURE TOKUYAMA DENTAL CORP (JP) 2024-10-09 — — EP disclosed
US-12094728-B2 Semiconductor device TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-09-17 — — US disclosed
CN-111863601-B Method for manufacturing semiconductor device and photoresist 台湾积体电路制造股份有限公司 2024-08-27 — — CN disclosed
EP-4407636-A1 SOLID ELECTROLYTE, PRODUCTION METHOD FOR SOLID ELECTROLYTE, AND BATTERY LINTEC Corporation (JP) 2024-07-31 — — EP disclosed
US-12041740-B2 Waterproof case for automobile components DENSO CORPORATION (JP) 2024-07-16 — — US disclosed
US-12006386-B2 Alkali soluble, photo-curable and thermo-curable copolymer, and photosensitive resin composition, photosensitive resin film and color filter using the same LG CHEM, LTD. (KR) 2024-06-11 — — US disclosed
US-11977333-B2 Semiconductor devices and methods of manufacturing TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-05-07 — — US disclosed
US-20240079235-A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2024-03-07 — — US disclosed
EP-3881818-B1 DENTAL PHOTOCURABLE COMPOSITIONS COMPRISING PHOTOPOLYMERIZATION INITIATOR COMPRISING AN ARYLIODONIUM SALT SHOFU KK (JP) 2024-03-06 — — EP disclosed
US-20240023205-A1 WIRING SHEET AND WIRING SHEET PRODUCTION METHOD LINTEC CORPORATION (JP) 2024-01-18 — — US disclosed
US-11868047-B2 Polymer layer in semiconductor device and method of manufacture TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2024-01-09 — — US disclosed
US-11857385-B2 Method of producing plate denture, curable composition for stereolithography, and plate denture production kit TOKUYAMA DENTAL CORPORATION (JP) 2024-01-02 — — US disclosed
US-20230413389-A1 WIRING SHEET AND SHEET-FORM HEATER LINTEC CORPORATION (JP) 2023-12-21 — — US disclosed
US-11842896-B2 Semiconductor devices and methods of manufacturing TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-12-12 — — US disclosed
US-20230384672-A1 Polymer Layer in Semiconductor Device and Method of Manufacture TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2023-11-30 — — US disclosed
US-11826963-B2 Active energy ray-curable resin composition and ink for three-dimensional molding support materials KJ CHEMICALS CORPORATION (JP) 2023-11-28 — — US disclosed
US-11817415-B2 Thermal bonding sheet and thermal bonding sheet with dicing tape NITTO DENKO CORPORATION (JP) 2023-11-14 — — US disclosed
US-20230343604-A1 SEMICONDUCTOR DEVICE AND METHOD TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2023-10-26 — — US disclosed
US-11779524-B2 Photopolymerization initiator comprising an aryliodonium salt for dental photocurable compositions KABUSHIKI KAISHA SHOFU (JP) 2023-10-10 — — US disclosed
US-20230307251-A1 Semiconductor Device TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2023-09-28 — — US disclosed
EP-4247116-A1 WIRING SHEET AND SHEET-FORM HEATER LINTEC CORPORATION (JP) 2023-09-20 — — EP disclosed
US-11764442-B2 Separator for rechargeable lithium battery and rechargeable lithium battery including the same SAMSUNG SDI CO., LTD. (KR) 2023-09-19 — — US disclosed
EP-3901966-B1 CONDUCTIVE ADHESIVE SHEET, LAMINATE, AND HEATING DEVICE LINTEC CORP (JP) 2023-09-13 — — EP disclosed
US-11728181-B2 Semiconductor device and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-08-15 — — US disclosed
US-20230251571-A1 Photoresist and Method of Formation and Use TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2023-08-10 — — US disclosed
US-20230236500-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM USING SAME, COLOR FILTER, AND DISPLAY DEVICE SAMSUNG SDI CO., LTD. (KR) 2023-07-27 — — US disclosed
US-11699598-B2 Semiconductor device TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-07-11 — — US disclosed
EP-4207940-A1 WIRING SHEET AND WIRING SHEET PRODUCTION METHOD LINTEC CORPORATION (JP) 2023-07-05 — — EP disclosed
US-20230147333-A1 WIRING SHEET, AND SHEET-LIKE HEATER LINTEC CORPORATION (JP) 2023-05-11 — — US disclosed
US-20230137898-A1 METHOD OF PRODUCING PLATE DENTURE, CURABLE COMPOSITION FOR STEREOLITHOGRAPHY, AND PLATE DENTURE PRODUCTION KIT TOKUYAMA DENTAL CORPORATION (JP) 2023-05-04 — — US disclosed
US-20230078492-A1 WIRING SHEET LINTEC CORPORATION (JP) 2023-03-16 — — US disclosed
EP-3517586-B1 HEAT BONDING SHEET, AND HEAT BONDING SHEET WITH DICING TAPE NITTO DENKO CORP (JP) 2023-03-15 — — EP disclosed
EP-4149205-A1 WIRING SHEET LINTEC CORPORATION (JP) 2023-03-15 — — EP disclosed
US-20230064162-A1 Semiconductor Device and Methods of Manufacture TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2023-03-02 — — US disclosed
US-11561468-B2 Pattern forming method CANON KABUSHIKI KAISHA (JP) 2023-01-24 — — US disclosed
EP-4091578-A1 METHOD FOR PRODUCING PLATE DENTURE, CURABLE STEREOLITHOGRAPHIC COMPOSITION, AND PLATE DENTURE PRODUCTION KIT Tokuyama Dental Corporation (JP) 2022-11-23 — — EP disclosed
US-20220367177-A1 Semiconductor Devices and Methods of Manufacturing TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2022-11-17 — — US disclosed
US-20220242099-A1 MANUFACTURING METHOD OF SHEET-LIKE CONDUCTIVE MEMBER, AND SHEET-LIKE CONDUCTIVE MEMBER LINTEC CORPORATION (JP) 2022-08-04 — — US disclosed
US-20220235197-A1 COMPOSITE PARTICLES COMPRISING A HYDROPHOBIC DYE AND AN AMPHIPHILIC BLOCK COPOLYMER AND USE THEREOF IN OPTICAL APPLICATIONS COLOURSMITH LABS INC. (CA) 2022-07-28 — — US disclosed
US-20220231333-A1 QUASI-SOLID AND SOLID-STATE ELECTROLYTE FOR LITHIUM-ION AND LITHIUM METAL BATTERIES AND MANUFACTURING METHOD HONEYCOMB BATTERY COMPANY 2022-07-21 — — US disclosed
WO-2022150849-A1 FLAME-RESISTANT QUASI-SOLID AND SOLID-STATE ELECTROLYTE FOR LITHIUM-ION AND LITHIUM METAL BATTERIES AND PRODUCTION METHOD GLOBAL GRAPHENE GROUP, INC. (US) 2022-07-14 — — WO disclosed
US-11370751-B2 Sulfonium salt, heat- or photo-acid generator, heat- or photo-curable composition, and cured product thereof SAN APRO LTD. (JP) 2022-06-28 — — US disclosed
US-20220183113-A1 SHEET-SHAPED CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREFOR LINTEC CORPORATION (JP) 2022-06-09 — — US disclosed
US-20220140441-A1 SEPARATOR FOR LITHIUM SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY COMPRISING SAME SAMSUNG SDI CO., LTD. (KR) 2022-05-05 — — US disclosed
EP-2853253-B1 Dental curable composition containing particles with different refractive indexes SHOFU INC (JP) 2022-04-27 — — EP disclosed
EP-3480205-B1 SULFONIUM SALT, PHOTOACID GENERATOR, PHOTOCURABLE COMPOSITION, AND CURED PRODUCT THEREOF SAN APRO LTD (JP) 2022-04-13 — — EP disclosed
EP-3976715-A1 COMPOSITE PARTICLES COMPRISING A HYDROPHOBIC DYE AND AN AMPHIPHILIC BLOCK COPOLYMER AND USE THEREOF IN OPTICAL APPLICATIONS Coloursmith Labs Inc. (CA) 2022-04-06 — — EP disclosed
US-20220102810-A1 SEPARATOR FOR LITHIUM SECONDARY BATTERY, AND LITHIUM SECONDARY BATTERY COMPRISING SAME SAMSUNG SDI CO., LTD. (KR) 2022-03-31 — — US disclosed
US-20220091505-A1 Semiconductor Device and Method of Manufacture TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2022-03-24 — — US disclosed
US-20220064500-A1 CONDUCTIVE ADHESIVE SHEET, LAMINATE, AND HEATING DEVICE LINTEC CORPORATION (JP) 2022-03-03 — — US disclosed
US-20220052419-A1 SEPARATOR FOR LITHIUM SECONDARY BATTERY, AND LITHIUM SECONDARY BATTERY COMPRISING SAME SAMSUNG SDI CO., LTD. (KR) 2022-02-17 — — US disclosed
US-20220029244-A1 SEPARATOR FOR LITHIUM SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY COMPRISING SAME SAMSUNG SDI CO., LTD. (KR) 2022-01-27 — — US disclosed
EP-3943290-A1 SHEET-SHAPED CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREFOR LINTEC CORPORATION (JP) 2022-01-26 — — EP disclosed
US-20220015254-A2 WATERPROOF CASE FOR AUTOMOBILE COMPONENTS DENSO CORPORATION (JP) 2022-01-13 — — US disclosed
EP-3913703-A1 SEPARATOR FOR LITHIUM SECONDARY BATTERY, AND LITHIUM SECONDARY BATTERY COMPRISING SAME Samsung SDI Co., Ltd. (KR) 2021-11-24 — — EP disclosed
US-11177165-B2 Method of manufacturing a semiconductor device having redistribution layer including a dielectric layer made from a low-temperature cure polyimide TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2021-11-16 — — US disclosed
EP-3907781-A1 SEPARATOR FOR LITHIUM SECONDARY BATTERY, AND LITHIUM SECONDARY BATTERY COMPRISING SAME Samsung SDI Co., Ltd. (KR) 2021-11-10 — — EP disclosed
EP-3905381-A1 SEPARATOR FOR LITHIUM SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY COMPRISING SAME Samsung SDI Co., Ltd. (KR) 2021-11-03 — — EP disclosed
US-20210337632-A1 SHEET-LIKE CONDUCTIVE MEMBER LINTEC CORPORATION (JP) 2021-10-28 — — US disclosed
EP-3901966-A1 CONDUCTIVE ADHESIVE SHEET, LAMINATE, AND HEATING DEVICE LINTEC CORPORATION (JP) 2021-10-27 — — EP disclosed
US-20210328306-A1 SEPARATOR FOR RECHARGEABLE LITHIUM BATTERY AND RECHARGEABLE LITHIUM BATTERY INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2021-10-21 — — US disclosed
US-11145560-B2 Semiconductor device and methods of manufacturing TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2021-10-12 — — US disclosed
EP-3881818-A1 PHOTOPOLYMERIZATION INITIATOR COMPRISING AN ARYLIODONIUM SALT FOR DENTAL PHOTOCURABLE COMPOSITIONS Kabushiki Kaisha Shofu (JP) 2021-09-22 — — EP disclosed
US-20210283022-A1 PHOTOPOLYMERIZATION INITIATOR COMPRISING AN ARYLIODONIUM SALT FOR DENTAL PHOTOCURABLE COMPOSITIONS KABUSHIKI KAISHA SHOFU (JP) 2021-09-16 — — US disclosed
US-11094541-B2 Anti-reflective coating materials TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) 2021-08-17 — — US disclosed
US-20210251094-A1 WATERPROOF CASE FOR AUTOMOBILE COMPONENTS DENSO CORP (JP) 2021-08-12 — — US disclosed
US-11073763-B2 Photoresist and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2021-07-27 — — US disclosed
EP-3846583-A1 SHEET-LIKE CONDUCTIVE MEMBER LINTEC CORPORATION (JP) 2021-07-07 — — EP disclosed
US-20210198402-A1 ALKALI SOLUBLE, PHOTO-CURABLE AND THERMO-CURABLE COPOLYMER, AND PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM AND COLOR FILTER USING THE SAME LG CHEM, LTD. (KR) 2021-07-01 — — US disclosed
EP-3825102-A1 ACTIVE ENERGY RAY CURABLE RESIN COMPOSITION FOR THREE-DIMENSIONAL MOLDING SUPPORT MATERIALS, AND INK KJ Chemicals Corporation (JP) 2021-05-26 — — EP disclosed
US-20210134611-A1 Semiconductor Device TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2021-05-06 — — US disclosed
US-20210118697-A1 Methods of Manufacturing Semiconductor Devices TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2021-04-22 — — US disclosed
US-20210119195-A1 SEPARATOR FOR RECHARGEABLE LITHIUM BATTERY AND RECHARGEABLE LITHIUM BATTERY INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2021-04-22 — — US disclosed
US-10981356-B2 Adhesive sheet LINTEC CORPORATION (JP) 2021-04-20 — — US disclosed
EP-3269771-B1 COMPOSITE COMPRISING A PYRIDINIUM MODIFIED POLYMER, AND ARTICLE COMPRISING SAID COMPOSITE SAMSUNG ELECTRONICS CO LTD (KR) 2021-04-07 — — EP disclosed
EP-3800218-A1 TRANSPARENT RESIN COMPOSITION FOR MOLDING AND 3D MOLDED ARTICLE Nabtesco Corporation (JP) 2021-04-07 — — EP disclosed
US-20210035797-A1 Semiconductor Devices and Methods of Manufacturing TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2021-02-04 — — US disclosed
US-10867811-B2 Semiconductor device TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2020-12-15 — — US disclosed
US-20200384696-A1 ACTIVE ENERGY RAY-CURABLE RESIN COMPOSITION AND INK FOR THREE-DIMENSIONAL MOLDING SUPPORT MATERIALS KJ CHEMICALS CORPORATION (JP) 2020-12-10 — — US disclosed
US-10861710-B2 Methods of manufacturing semiconductor devices TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2020-12-08 — — US disclosed
WO-2020237363-A1 COMPOSITE PARTICLES COMPRISING A HYDROPHOBIC DYE AND AN AMPHIPHILIC BLOCK COPOLYMER AND USE THEREOF IN OPTICAL APPLICATIONS COLOURSMITH LABS INC. (CA) 2020-12-03 — — WO disclosed
US-20200350218-A1 Semiconductor Device and Methods of Manufacturing TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2020-11-05 — — US disclosed
US-20200350155-A1 Anti-Reflective Gap Filling Materials and Methods TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2020-11-05 — — US disclosed
US-10795259-B2 Photo-curable and heat-curable resin composition and dry film solder resist LG CHEM, LTD. (KR) 2020-10-06 — — US disclosed
US-20200279755-A1 Semiconductor Device and Method TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2020-09-03 — — US disclosed
US-10761443-B2 Charge transport molecule having hydrogen for an overcoat of a photoconductor LEXMARK INTERNATIONAL, INC. (US) 2020-09-01 — — US disclosed
US-10761427-B2 Photoresist and method of formation and use TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2020-09-01 — — US disclosed
US-10755927-B2 Anti-reflective gap filling materials and methods TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) 2020-08-25 — — US disclosed
US-10752833-B2 Optical element for correcting color blindness NITTO DENKO CORPORATION (JP) 2020-08-25 — — US disclosed
US-10732528-B2 Overcoat for a photoconductor with tetrafunctional radical polymerizable charge transport molecule having hydrogen LEXMARK INTERNATIONAL, INC. (US) 2020-08-04 — — US disclosed
EP-3477689-B1 HEAT BONDING SHEET, AND HEAT BONDING SHEET WITH DICING TAPE NITTO DENKO CORP (JP) 2020-07-29 — — EP disclosed
US-20200225581-A1 PHOTOSENSITIVE RESIN COMPOSITION, OPTICAL FILM, AND METHOD OF PRODUCING OPTICAL FILM ECHEM SOLUTIONS CORP. (TW) 2020-07-16 — — US disclosed
US-10683266-B2 Sulfonium salt, photoacid generator, photocurable composition, and cured product thereof SAN APRO LTD. (JP) 2020-06-16 — — US disclosed
US-10684565-B2 Photoconductor overcoat having a charge transport molecule with four radical polymerizable hydrophilic functional groups containing an oxygen atom and method of making the same LEXMARK INTERNATIONAL, INC. (US) 2020-06-16 — — US disclosed
US-20200166836-A1 PATTERN FORMING METHOD CANON KABUSHIKI KAISHA (JP) 2020-05-28 — — US disclosed
US-10658199-B2 Semiconductor device and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2020-05-19 — — US disclosed
US-10655037-B2 Adhesive composition for polarizing plate, adhesive film for polarizing plate comprising the same, polarizing plate comprising the same and display device comprising the same SAMSUNG SDI CO., LTD. (KR) 2020-05-19 — — US disclosed
EP-3143980-B1 DENTAL CURABLE COMPOSITION SHOFU KK (JP) 2020-05-13 — — EP disclosed
US-10643916-B2 Conductive line system and process TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2020-05-05 — — US disclosed
US-20200133125-A1 Photoresist and Method TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2020-04-30 — — US disclosed
US-10611856-B2 Curable composition TOAGOSEI CO., LTD. (JP) 2020-04-07 — — US disclosed
US-10589560-B2 Active energy ray curing inkjet ink, printed product, inkjet printing apparatus, and inkjet printing method DUPLO CORPORATION (JP) 2020-03-17 — — US disclosed
US-10481512-B2 Photoconductor having protective overcoat layer with a charge transport molecule with four radical polymerizable hydrophilic functional groups containing an oxygen atom and method of making the same LEXMARK INTERNATIONAL, INC. (US) 2019-11-19 — — US disclosed
US-10479908-B2 Method of manufacturing hard coat film FUJIFILM CORPORATION (JP) 2019-11-19 — — US disclosed
US-20190346766-A1 Photoresist and Method TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2019-11-14 — — US disclosed
EP-2979680-B1 DENTAL CURING COMPOSITION SHOFU KK (JP) 2019-11-13 — — EP disclosed
CN-110433104-A A kind of plant essential oil composition and its preparation method and application and skin care item KUNMING INST BOTANY CAS 2019-11-12 — — CN disclosed
US-10471760-B2 Multiple-image display body TOPPAN PRINTING CO., LTD. (JP) 2019-11-12 — — US disclosed
US-10454086-B2 Separator for rechargeable lithium battery and rechargeable lithium battery including the same SAMSUNG SDI CO., LTD. (KR) 2019-10-22 — — US disclosed
US-20190311936-A1 THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE NITTO DENKO CORPORATION (JP) 2019-10-10 — — US disclosed
US-20190300476-A1 SULFONIUM SALT, PHOTOACID GENERATOR, PHOTOCURABLE COMPOSITION, AND CURED PRODUCT THEREOF SAN-APRO LTD. (JP) 2019-10-03 — — US disclosed
US-10431798-B2 Separator for lithium secondary battery, and lithium secondary battery comprising same SAMSUNG SDI CO., LTD. (KR) 2019-10-01 — — US disclosed
US-20190284134-A1 SULFONIUM SALT, HEAT- OR PHOTO-ACID GENERATOR, HEAT- OR PHOTO-CURABLE COMPOSITION, AND CURED PRODUCT THEREOF SAN APRO LTD. (JP) 2019-09-19 — — US disclosed
US-20190271925-A1 CHARGE TRANSPORT MOLECULE HAVING HYDROGEN FOR AN OVERCOAT OF A PHOTOCONDUCTOR LEXMARK INTERNATIONAL, INC. 2019-09-05 — — US disclosed
US-20190271923-A1 OVERCOAT FOR A PHOTOCONDUCTOR WITH TETRAFUNCTIONAL RADICAL POLYMERIZABLE CHARGE TRANSPORT MOLECULE HAVING HYDROGEN LEXMARK INTERNATIONAL, INC. 2019-09-05 — — US disclosed
US-20190271924-A1 PHOTOCONDUCTOR HAVING AN OVERCOAT WITH TETRAFUNCTIONAL RADICAL POLYERMIZABLE CHARGE TRANSPORT MOLECULE AND NON-RADICAL POLYMERIZABLE ADDITIVE LEXMARK INTERNATIONAL, INC. 2019-09-05 — — US disclosed
US-20190252283-A1 Conductive Line System and Process TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2019-08-15 — — US disclosed
EP-3517586-A1 HEAT BONDING SHEET, AND HEAT BONDING SHEET WITH DICING TAPE Nitto Denko Corporation (JP) 2019-07-31 — — EP disclosed
US-10365561-B2 Photoresist and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2019-07-30 — — US disclosed
US-20190206825-A1 THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE NITTO DENKO CORPORATION (JP) 2019-07-04 — — US disclosed
US-20190194535-A1 OPTICAL ELEMENT FOR CORRECTING COLOR BLINDNESS NITTO DENKO CORPORATION (JP) 2019-06-27 — — US disclosed
US-10330831-B2 Anisotropic optical film TOMOEGAWA CO., LTD. (JP) 2019-06-25 — — US disclosed
US-10331051-B2 Method to make a photoconductor having an overcoat with tetrafunctional radical polymerizable charge transport molecule LEXMARK INTERNATIONAL, INC. (US) 2019-06-25 — — US disclosed
EP-3492476-A1 SULFONIUM SALT, HEAT- OR PHOTO-ACID GENERATOR, HEAT-CURABLE OR PHOTOCURABLE COMPOSITION, AND CURED PRODUCT THEREOF San-Apro Ltd. (JP) 2019-06-05 — — EP disclosed
US-10304700-B2 Semiconductor device and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2019-05-28 — — US disclosed
US-10305081-B2 Separator for rechargeable battery and rechargeable battery including the same SAMSUNG SDI CO., LTD. (KR) 2019-05-28 — — US disclosed
US-20190148331-A1 THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE NITTO DENKO CORPORATION (JP) 2019-05-16 — — US disclosed
EP-3480205-A1 SULFONIUM SALT, PHOTOACID GENERATOR, PHOTOCURABLE COMPOSITION, AND CURED PRODUCT THEREOF San-Apro Ltd. (JP) 2019-05-08 — — EP disclosed
EP-3477689-A1 HEAT BONDING SHEET, AND HEAT BONDING SHEET WITH DICING TAPE Nitto Denko Corporation (JP) 2019-05-01 — — EP disclosed
EP-3477688-A1 HEAT BONDING SHEET, AND HEAT BONDING SHEET WITH DICING TAPE Nitto Denko Corporation (JP) 2019-05-01 — — EP disclosed
US-20190122882-A1 Gap Filling Materials and Methods TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2019-04-25 — — US disclosed
US-10269675-B2 Conductive line system and process TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2019-04-23 — — US disclosed
US-10236490-B2 Separator for rechargeable lithium battery and rechargeable lithium battery including the same SAMSUNG SDI CO., LTD. (KR) 2019-03-19 — — US disclosed
US-20190056658-A1 PHOTO-CURABLE AND HEAT-CURABLE RESIN COMPOSITION AND DRY FILM SOLDER RESIST LG CHEM, LTD. (KR) 2019-02-21 — — US disclosed
US-20190041749-A1 Photoresist and Method TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2019-02-07 — — US disclosed
US-20190035680-A1 Semiconductor Device and Method TAIWAN SEMICONDUCTOR MFG COMAPNY LTD (TW) 2019-01-31 — — US disclosed
US-10163631-B2 Polymer resin comprising gap filling materials and methods TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2018-12-25 — — US disclosed
US-20180364599-A1 PHOTOCONDUCTOR HAVING PROTECTIVE OVERCOAT LAYER WITH A CHARGE TRANSPORT MOLECULE WITH FOUR RADICAL POLYMERIZABLE HYDROPHILIC FUNCTIONAL GROUPS CONTAINING AN OXYGEN ATOM AND METHOD OF MAKING THE SAME BANK TRUST COMPANY, NATIONAL ASSOCIATION 2018-12-20 — — US disclosed
US-20180354293-A1 MULTIPLE-IMAGE DISPLAY BODY TOPPAN PRINTING CO LTD (JP) 2018-12-13 — — US disclosed
EP-1600822-B1 ELECTROPHOTOGRAPHIC PHOTORECEPTOR AND IMAGE FORMING METHOD, APPARATUS AND PROCESS CARTRIDGE THEREFOR USING THE PHOTORECEPTOR RICOH CO LTD (JP) 2018-12-12 — — EP disclosed
US-20180350629-A1 Semiconductor Device and Method TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2018-12-06 — — US disclosed
US-20180341189-A1 PHOTOCONDUCTOR OVERCOAT HAVING A CHARGE TRANSPORT MOLECULE WITH FOUR RADICAL POLYMERIZABLE HYDROPHILIC FUNCTIONAL GROUPS CONTAINING AN OXYGEN ATOM AND METHOD OF MAKING THE SAME BANK TRUST COMPANY, NATIONAL ASSOCIATION 2018-11-29 — — US disclosed
US-10138307-B2 Antimicrobial polymer Fachhochschule Münster (DE) 2018-11-27 — — US disclosed
US-20180335709-A1 PHOTOCONDUCTOR HAVING PROTECTIVE OVERCOAT LAYER WITH A CHARGE TRANSPORT MOLECULE WITH FOUR RADICAL POLYMERIZABLE HYDROPHILIC FUNCTIONAL GROUPS CONTAINING AN OXYGEN ATOM AND METHOD OF MAKING THE SAME BANK TRUST COMPANY, NATIONAL ASSOCIATION 2018-11-22 — — US disclosed
US-20180315729-A1 Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape NITTO DENKO CORPORATION (JP) 2018-11-01 — — US disclosed
US-10114286-B2 Photoresist and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) 2018-10-30 — — US disclosed
US-10109833-B2 Separator for rechargeable battery and rechargeable battery including the same SAMSUNG SDI CO., LTD. (KR) 2018-10-23 — — US disclosed
US-10093125-B2 Multiple-image display body TOPPAN PRINTING CO., LTD. (JP) 2018-10-09 — — US disclosed
US-10095113-B2 Photoresist and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) 2018-10-09 — — US disclosed
US-10086594-B2 Sheet having adhesive resin layer attached thereto, and method for producing semiconductor device LINTEC CORPORATION (JP) 2018-10-02 — — US disclosed
US-10090194-B2 Semiconductor device and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2018-10-02 — — US disclosed
US-20180223127-A1 ANTI-FINGERPRINGING COMPOSITION WITH SELF-HEALING PROPERTY, FILM, LAMINATE, AND DEVICE SAMSUNG ELECTRONICS CO LTD (KR) 2018-08-09 — — US disclosed
EP-2682816-B1 OVERCOAT COMPOSITION FOR ELECTROPHOTOGRAPHY, ELECTROPHOTOGRAPHIC IMAGE FORMING METHOD AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS RICOH CO LTD (JP) 2018-08-08 — — EP disclosed
EP-3358606-A1 THERMAL BONDING SHEET, AND THERMAL BONDING SHEET WITH DICING TAPE Nitto Denko Corporation (JP) 2018-08-08 — — EP disclosed
US-10036953-B2 Photoresist system and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) 2018-07-31 — — US disclosed
US-20180173122-A1 METHOD TO MAKE A PHOTOCONDUCTOR HAVING AN OVERCOAT WITH TETRAFUNCTIONAL RADICAL POLYMERIZABLE CHARGE TRANSPORT MOLECULE BANK TRUST COMPANY, NATIONAL ASSOCIATION 2018-06-21 — — US disclosed
US-20180171038-A1 CURABLE COMPOSITION TOAGOSEI CO., LTD. (JP) 2018-06-21 — — US disclosed
US-9989850-B2 Photoresist system and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2018-06-05 — — US disclosed
US-9989678-B2 Anisotropic optical film TOMOEGAWA CO., LTD. (JP) 2018-06-05 — — US disclosed
US-9951235-B2 Ink composition, ink jet recording device, ink jet recording method, and method for reusing recording medium MIMAKI ENGINEERING CO., LTD. (JP) 2018-04-24 — — US disclosed
US-20180108590-A1 Conductive Line System and Process TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2018-04-19 — — US disclosed
US-9927727-B2 Method to make a photoconductor having an overcoat with tetrafunctional radical polymerizable charge transport molecule LEXMARK INTERNATIONAL, INC. (US) 2018-03-27 — — US disclosed
US-20180061669-A1 Semiconductor Device and Method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2018-03-01 — — US disclosed
US-20180043659-A1 ADHESIVE SHEET LINTEC OF AMERICA, INC. (US) 2018-02-15 — — US disclosed
US-20180044547-A1 METHOD OF MANUFACTURING HARD COAT FILM FUJIFILM CORPORATION (JP) 2018-02-15 — — US disclosed
US-20180044563-A1 ADHESIVE COMPOSITION FOR POLARIZING PLATE, ADHESIVE FILM FOR POLARIZING PLATE COMPRISING THE SAME, POLARIZING PLATE COMPRISING THE SAME AND DISPLAY DEVICE COMPRISING THE SAME Wuxi Hengxin Optoelectronic Materials Co., Ltd. (CN) 2018-02-15 — — US disclosed
US-9890466-B2 Method for producing mold for nanoimprinting and anti-reflective article MITSUBISHI CHEMICAL CORPORATION (JP) 2018-02-13 — — US disclosed
US-9885883-B2 Optical element for correcting color blindness NITTO DENKO CORPORATION (JP) 2018-02-06 — — US disclosed
US-9880467-B2 Photo-curable and thermo-curable resin composition and dry film solder resist LG CHEM, LTD. (KR) 2018-01-30 — — US disclosed
EP-3269771-A1 PYRIDINIUM MODIFIED COMPOSITE, AND ARTICLE INCLUDING SAME Samsung Electronics Co., Ltd (KR) 2018-01-17 — — EP disclosed
US-20180006285-A1 SEPARATOR FOR LITHIUM SECONDARY BATTERY, AND LITHIUM SECONDARY BATTERY COMPRISING SAME SAMSUNG SDI CO., LTD. (KR) 2018-01-04 — — US disclosed
EP-3263330-A1 ADHESIVE SHEET Lintec of America, Inc. (US) 2018-01-03 — — EP disclosed
US-9855195-B2 Dental curable composition KABUSHIKI KAISHA SHOFU (JP) 2018-01-02 — — US disclosed
US-20170372892-A1 Gap Filling Materials and Methods TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2017-12-28 — — US disclosed
US-20170369724-A1 IMAGE RECORDING METHOD AND INK JET INK COMPOSITION SEIKO EPSON CORPORATION (JP) 2017-12-28 — — US disclosed
US-9842790-B2 Conductive line system and process TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2017-12-12 — — US disclosed
US-9834708-B2 Adhesive composition for polarizing plate, adhesive film for polarizing plate comprising the same, polarizing plate comprising the same and display device comprising the same SAMSUNG SDI CO., LTD. (KR) 2017-12-05 — — US disclosed
EP-2963070-B1 CURABLE COMPOSITION, TRANSPARENT HEAT-RESISTANT MATERIAL, AND USE THEREOF SHOWA DENKO KK (JP) 2017-10-11 — — EP disclosed
US-9786541-B2 Dicing sheet with protective film forming layer and chip fabrication method LINTEC CORPORATION (JP) 2017-10-10 — — US disclosed
US-20170271203-A1 Semiconductor Device and Method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2017-09-21 — — US disclosed
EP-2857471-B1 PRODUCTION METHOD FOR AN ORGANIC ELECTRONIC DEVICE LG CHEMICAL LTD (KR) 2017-09-13 — — EP disclosed
US-9761449-B2 Gap filling materials and methods TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2017-09-12 — — US disclosed
US-9754811-B2 Dicing sheet with protective film forming layer and method for producing chip LINTEC CORPORATION (JP) 2017-09-05 — — US disclosed
US-20170192368-A1 METHOD TO MAKE A PHOTOCONDUCTOR HAVING AN OVERCOAT WITH TETRAFUNCTIONAL RADICAL POLYMERIZABLE CHARGE TRANSPORT MOLECULE BANK TRUST COMPANY, NATIONAL ASSOCIATION 2017-07-06 — — US disclosed
US-20170192137-A1 ANISOTROPIC OPTICAL FILM TOMOEGAWA CO., LTD. (JP) 2017-07-06 — — US disclosed
US-20170184984-A1 PHOTOCONDUCTOR HAVING CROSSLINKABLE TRANSPORT MOLECULES HAVING FOUR RADICAL POLYMERIZABLE GROUPS AND METHOD TO MAKE THE SAME LEXMARK INTERNATIONAL, INC. 2017-06-29 — — US disclosed
US-20170184986-A1 PHOTOCONDUCTOR OVERCOAT HAVING CROSSLINKABLE HOLE TRANSPORT MOLECULES HAVING FOUR RADICAL POLYMERIZBLE GROUPS AND METHOD TO MAKE THE SAME LEXMARK INTERNATIONAL, INC. 2017-06-29 — — US disclosed
US-20170184987-A1 PHOTOCONDUCTOR OVERCOAT HAVING CROSSLINKABLE HOLE TRANSPORT MOLECULES HAVING FOUR RADICAL POLYMERIZBLE GROUPS AND METHOD TO MAKE THE SAME LEXMARK INTERNATIONAL, INC. 2017-06-29 — — US disclosed
US-20170184985-A1 PHOTOCONDUCTOR HAVING CROSSLINKABLE TRANSPORT MOLECULES HAVING FOUR RADICAL POLYMERIZABLE GROUPS AND METHOD TO MAKE THE SAME LEXMARK INTERNATIONAL, INC. 2017-06-29 — — US disclosed
US-20170176857-A1 Photoresist and Method TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2017-06-22 — — US disclosed
US-9668943-B2 Dental conditioning composition KABUSHIKI KAISHA SHOFU (JP) 2017-06-06 — — US disclosed
US-20170133654-A1 SEPARATOR FOR RECHARGEABLE BATTERY AND RECHARGEABLE BATTERY INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2017-05-11 — — US disclosed
US-20170133653-A1 SEPARATOR FOR RECHARGEABLE BATTERY AND RECHARGEABLE BATTERY INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2017-05-11 — — US disclosed
US-20170110421-A1 Semiconductor Device and Method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2017-04-20 — — US disclosed
US-20170088771-A1 OPTICAL ELEMENT FOR CORRECTING COLOR BLINDNESS NITTO DENKO CORPORATION (JP) 2017-03-30 — — US disclosed
US-20170079890-A1 DENTAL CURABLE COMPOSITION KABUSHIKI KAISHA SHOFU (JP) 2017-03-23 — — US disclosed
EP-3143980-A1 DENTAL CURABLE COMPOSITION KABUSHIKI KAISHA SHOFU (JP) 2017-03-22 — — EP disclosed
US-9599896-B2 Photoresist system and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2017-03-21 — — US disclosed
EP-2951620-B1 OPTICAL ELEMENT FOR CORRECTING COLOR BLINDNESS NITTO DENKO CORP (JP) 2017-03-01 — — EP disclosed
US-9581908-B2 Photoresist and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2017-02-28 — — US disclosed
US-9574067-B2 Optical element for correcting color blindness NITTO DENKO CORPORATION (JP) 2017-02-21 — — US disclosed
CN-106350021-A Benzoin component-containing water heating blanket energy liquid 镇江市正源塑胶有限公司 2017-01-25 — — CN disclosed
US-9543147-B2 Photoresist and method of manufacture TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2017-01-10 — — US disclosed
US-20170003422-A1 ANISOTROPIC OPTICAL FILM TOMOEGAWA CO., LTD. (JP) 2017-01-05 — — US disclosed
US-9526677-B2 Dental curing composition KABUSHIKI KAISHA SHOFU (JP) 2016-12-27 — — US disclosed
US-9513591-B2 Photoconductor overcoat having a radical polymerizable charge transport molecule containing two ethyl acrylate functional groups and urethane acrylate resins containing six radical polymerizable functional groups LEXMARK INTERNATIONAL, INC. (US) 2016-12-06 — — US disclosed
US-9511005-B2 Dental curable composition containing particles with different refractive indexes SHOFU INC. (JP) 2016-12-06 — — US disclosed
US-9502231-B2 Photoresist layer and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2016-11-22 — — US disclosed
US-20160319434-A9 UV CURABLE CATALYST COMPOSITIONS ROHM & HAAS ELECT MAT (US) 2016-11-03 — — US disclosed
EP-2790042-B1 DISPLAY BODY, TRANSFER FOIL, AND ARTICLE WITH DISPLAY BODY TOPPAN PRINTING CO LTD (JP) 2016-10-26 — — EP disclosed
US-20160293920-A1 SEPARATOR FOR RECHARGEABLE LITHIUM BATTERY AND RECHARGEABLE LITHIUM BATTERY INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2016-10-06 — — US disclosed
US-20160293511-A1 Conductive Line System and Process TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2016-10-06 — — US disclosed
US-9460909-B2 Method for manufacturing semiconductor device TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2016-10-04 — — US disclosed
US-20160282528-A1 Photosensitive Resin Composition, Black Column Spacer Using the Same and Color Filter SAMSUNG SDI CO., LTD. (KR) 2016-09-29 — — US disclosed
US-20160285063-A1 SEPARATOR FOR RECHARGEABLE LITHIUM BATTERY AND RECHARGEABLE LITHIUM BATTERY INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2016-09-29 — — US disclosed
US-9441064-B2 Curable composition, transparent heat-resistant material, and use thereof SHOWA DENKO K.K. (JP) 2016-09-13 — — US disclosed
US-20160259246-A1 Photoresist and Method of Formation and Use TAIWAN SEMICONDUCTOR MANUFATURING COMPANY LTD (TW) 2016-09-08 — — US disclosed
US-9436086-B2 Anti-reflective layer and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2016-09-06 — — US disclosed
US-9417537-B2 Photo conductor overcoat comprising radical polymerizable charge transport molecules and hexa-functional urethane acrylates LEXMARK INTERNATIONAL, INC. (US) 2016-08-16 — — US disclosed
US-9417538-B2 Photo conductor overcoat comprising radical polymerizable charge transport molecules and hexa-functional urethane acrylates LEXMARK INTERNATIONAL, INC. (US) 2016-08-16 — — US disclosed
EP-2436056-B1 Electronic device comprising organic crosslinkable dielectrics and method of preparation thereof BASF SE (DE) 2016-08-03 — — EP disclosed
US-20160218077-A1 Composite Sheet for Resin Film Formation LINTEC CORPORATION (JP) 2016-07-28 — — US disclosed
US-20160194778-A1 METHOD FOR PRODUCING MOLD FOR NANOIMPRINTING AND ANTI-REFLECTIVE ARTICLE MITSUBISHI CHEMICAL CORPORATION (JP) 2016-07-07 — — US disclosed
CN-103116246-B A kind of photosensitive polymer combination and application thereof 村上精密制版(昆山)有限公司 2016-07-06 — — CN disclosed
US-20160184213-A1 ARTIFICIAL NAIL COMPOSITION, ARTIFICIAL NAIL, ARTIFICIAL NAIL FORMING METHOD, AND NAIL ART KIT FUJIFILM CORPORATION (JP) 2016-06-30 — — US disclosed
CN-105682787-A Apparatus for manufacturing high absorbent resin and method for manufacturing high absorbent resin using same 韩化石油化学公司 2016-06-15 — — CN disclosed
US-9368402-B2 Conductive line system and process TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2016-06-14 — — US disclosed
EP-2739997-B1 OPTICAL ELEMENT FOR CORRECTING COLOR BLINDNESS NITTO DENKO CORP (JP) 2016-06-08 — — EP disclosed
US-9360822-B2 Photoconductor overcoat having radical polymerizable charge transport molecules containing two ethyl acrylate functional groups and urethane acrylate resins containing six radical polymerizable functional groups LEXMARK INTERNATIONAL, INC. (US) 2016-06-07 — — US disclosed
US-9360758-B2 Semiconductor device process filter and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2016-06-07 — — US disclosed
US-20160155626-A1 Method for Manufacturing Semiconductor Device TAIWAN SEMICONDUCTOR MFG (TW) 2016-06-02 — — US disclosed
US-20160155632-A1 Anti-Reflective Layer and Method TAIWAN SEMICONDUCTOR MFG (TW) 2016-06-02 — — US disclosed
EP-1676937-B1 UV curable catalyst compositions ROHM & HAAS ELECT MAT (US) 2016-06-01 — — EP disclosed
CN-105622835-A Composition for preparing anti-blue-violet contact lens and anti-blue-violet contact lens JIUYANG TRADING CO LTD 2016-06-01 — — CN disclosed
CN-105607422-A Alkali-soluble resin, photosensitive resin composition containing same and application CHI MEI CORP 2016-05-25 — — CN disclosed
EP-1835033-B1 PROCESS FOR PRODUCING AMIDE COMPOUND DIA NITRIX CO LTD (JP) 2016-05-11 — — EP disclosed
CN-105556624-A Embedded multilayer ceramic capacitor and method for manufacturing embedded multilayer ceramic capacitor SHIN YU SEON 2016-05-04 — — CN disclosed
CN-102906867-B Printed circuit board including dam for underfilling and method of manufacturing the same LG CHEM, LTD. (KR) 2016-04-27 — — CN disclosed
EP-1992984-B1 Liquid crystal display GOLD CHARM LTD (WS) 2016-04-20 — — EP disclosed
CN-103389620-B Photosensitive resin composition for color filter and application thereof CHI MEI CORP. (CN) 2016-04-20 — — CN disclosed
CN-105487336-A Resin composition, black matrix, optical filter and its manufacturing method, and display device CHI MEI CORP 2016-04-13 — — CN disclosed
US-20160090496-A1 INK COMPOSITION, INK JET RECORDING DEVICE, INK JET RECORDING METHOD, AND METHOD FOR REUSING RECORDING MEDIUM MIMAKI ENGINEERING CO., LTD. (JP) 2016-03-31 — — US disclosed
US-20160089924-A1 MULTIPLE-IMAGE DISPLAY BODY TOPPAN PRINTING CO., LTD. (JP) 2016-03-31 — — US disclosed
US-9296925-B2 Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device LINTEC CORPORATION (JP) 2016-03-29 — — US disclosed
US-20160086908-A1 ADHESIVE AGENT COMPOSITION, ADHESIVE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE LINTEC CORPORATION (JP) 2016-03-24 — — US disclosed
US-20160085162-A1 PHOTOCONDUCTOR OVERCOAT HAVING A RADICAL POLYMERIZABLE CHARGE TRANSPORT MOLECULE CONTAINING TWO ETHYL ACRYLATE FUNCTIONAL GROUPS AND URETHANE ACRYLATE RESINS CONTAINING SIX RADICAL POLYMERIZABLE FUNCTIONAL GROUPS BANK TRUST COMPANY, NATIONAL ASSOCIATION 2016-03-24 — — US disclosed
US-20160085090-A1 OPTICAL ELEMENT FOR CORRECTING COLOR BLINDNESS NITTO DENKO CORPORATION (JP) 2016-03-24 — — US disclosed
CN-105425541-A Photosensitive resin composition for color filter and application thereof CHI MEI CORP 2016-03-23 — — CN disclosed
CN-105425542-A Photosensitive resin composition for color filter and application thereof CHI MEI CORP 2016-03-23 — — CN disclosed
EP-1992985-B1 Method of driving a liquid crystal display GOLD CHARM LTD (WS) 2016-03-16 — — EP disclosed
US-9256128-B2 Method for manufacturing semiconductor device TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2016-02-09 — — US disclosed
US-9256143-B2 Photoconductor overcoat having tetrafunctional radical polymerizable charge transport molecule LEXMARK INTERNATIONAL, INC. (US) 2016-02-09 — — US disclosed
US-20160030299-A1 DENTAL CURING COMPOSITION KABUSHIKI KAISHA SHOFU (JP) 2016-02-04 — — US disclosed
US-20160030294-A1 DENTAL CONDITIONING COMPOSITION KABUSHIKI KAISHA SHOFU 2016-02-04 — — US disclosed
EP-2979686-A1 ARTIFICIAL NAIL COMPOSITION, ARTIFICIAL NAIL, METHOD FOR FORMING ARTIFICIAL NAIL, METHOD FOR REMOVING ARTIFICIAL NAIL, AND NAIL ART KIT FUJIFILM Corporation (JP) 2016-02-03 — — EP disclosed
EP-2979687-A1 ARTIFICIAL NAIL COMPOSITION, ARTIFICIAL NAIL, METHOD FOR FORMING ARTIFICIAL NAIL, AND NAIL ART KIT FUJIFILM Corporation (JP) 2016-02-03 — — EP disclosed
EP-2979678-A1 DENTAL CONDITIONING COMPOSITION Kabushiki Kaisha Shofu (JP) 2016-02-03 — — EP disclosed
EP-2979680-A1 DENTAL CURING COMPOSITION Kabushiki Kaisha Shofu (JP) 2016-02-03 — — EP disclosed
CN-105278248-A Photosensitive resin composition, color filter and manufacturing method thereof, and liquid crystal display device CHI MEI CORP 2016-01-27 — — CN disclosed
CN-105278244-A Photosensitive resin composition for color filter and application thereof CHI MEI CORP 2016-01-27 — — CN disclosed
US-9245751-B2 Anti-reflective layer and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2016-01-26 — — US disclosed
US-9242442-B2 Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus DENKA COMPANY LIMITED (JP) 2016-01-26 — — US disclosed
US-20160017076-A1 CURABLE COMPOSITION, TRANSPARENT HEAT-RESISTANT MATERIAL, AND USE THEREOF SHOWA DENKO K.K. (JP) 2016-01-21 — — US disclosed
CN-103246103-B Color liquid crystal display device CHI MEI CORP. (CN) 2016-01-20 — — CN disclosed
US-9239520-B2 Photoresist defect reduction system and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2016-01-19 — — US disclosed
US-20160013041-A1 Photoresist Layer and Method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2016-01-14 — — US disclosed
CN-105246962-A Metal nanowire-containing composition SEIKO PMC CORP 2016-01-13 — — CN disclosed
US-20160005595-A1 Photoresist and Method of Manufacture TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2016-01-07 — — US disclosed
EP-2963070-A1 CURABLE COMPOSITION, TRANSPARENT HEAT-RESISTANT MATERIAL, AND USE THEREOF Showa Denko K.K. (JP) 2016-01-06 — — EP disclosed
US-20150368380-A1 ANTIMICROBIAL POLYMER Fachhochschule Münster (DE) 2015-12-24 — — US disclosed
CN-105182685-A Photosensitive resin composition for color filter and application thereof CHI MEI CORP 2015-12-23 — — CN disclosed
US-20150364369-A1 Conductive Line System and Process TAIWAN SEMICONDUCTOR MFG (TW) 2015-12-17 — — US disclosed
US-20150352032-A1 ARTIFICIAL NAIL COMPOSITION, ARTIFICIAL NAIL, METHOD FOR FORMING ARTIFICIAL NAIL, AND NAIL ART KIT FUJIFILM CORPORATION (JP) 2015-12-10 — — US disclosed
EP-2951620-A1 OPTICAL ELEMENT FOR CORRECTING COLOR BLINDNESS Nitto Denko Corporation (JP) 2015-12-09 — — EP disclosed
US-20150342320-A1 ARTIFICIAL NAIL COMPOSITION, ARTIFICIAL NAIL, METHOD FOR FORMING ARTIFICIAL NAIL, METHOD FOR REMOVING ARTIFICIAL NAIL, AND NAIL ART KIT FUJIFILM CORPORATION (JP) 2015-12-03 — — US disclosed
US-20150331317-A1 Photoresist and Method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) 2015-11-19 — — US disclosed
US-9175173-B2 Unlocking layer and method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2015-11-03 — — US disclosed
US-20150275028-A1 METHOD OF MANUFACTURING HARD COAT FILM FUJIFILM CORPORATION (JP) 2015-10-01 — — US disclosed
US-20150261087-A1 Photoresist System and Method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) 2015-09-17 — — US disclosed
US-20150228526-A1 DICING SHEET WITH PROTECTIVE FILM FORMING LAYER AND METHOD FOR PRODUCING CHIP LINTEC CORPORATION (JP) 2015-08-13 — — US disclosed
US-20150227051-A1 Photoresist Defect Reduction System and Method TAIWAN SEMICONDUCTOR MFG (TW) 2015-08-13 — — US disclosed
US-20150225613-A1 Film-Like Adhesive, Adhesive Sheet for Semiconductor Junction, and Method for Producing Semiconductor Device LINTEC CORPORATION (JP) 2015-08-13 — — US disclosed
US-20150205202-A1 PHOTO-CURABLE AND THERMO-CURABLE RESIN COMPOSITION AND DRY FILM SOLDER RESIST LG CHEM, LTD. (KR) 2015-07-23 — — US disclosed
EP-1209528-B1 Photoresist composition ETERNAL TECHNOLOGY CORP (US) 2015-07-22 — — EP disclosed
US-20150185631-A1 Photoconductor Overcoat Having Radical Polymerizable Charge Transport Molecules and Hexa-Functional Urethane Acrylates Having a Hexyl Backbone LEXMARK INTERNATIONAL, INC. (US) 2015-07-02 — — US disclosed
US-20150187565-A1 Gap Filling Materials and Methods TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) 2015-07-02 — — US disclosed
US-20150185628-A1 Photoconductor Overcoat Having Tetrafunctional Radical Polymerizable Charge Transport Molecule LEXMARK INTERNATIONAL, INC. (US) 2015-07-02 — — US disclosed
US-9068104-B2 Dual curing composition and use thereof DELO INDUSTRIE KLEBSTOFFE GMBH & CO. KGAA (DE) 2015-06-30 — — US disclosed
US-9061485-B2 Method of manufacturing translucent rigid substrate laminate DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2015-06-23 — — US disclosed
US-20150168908-A1 Photoconductor Overcoat Having Radical Polymerizable Charge Transport Molecules Containing Two Ethyl Acrylate Functional Groups and Urethane Acrylate Resins Containing Six Radical Polymerizable Functional Groups LEXMARK INTERNATIONAL, INC. (US) 2015-06-18 — — US disclosed
US-20150165743-A1 Sheet Having Adhesive Resin Layer Attached Thereto, and Method for Producing Semiconductor Device LINTEC CORPORATION (JP) 2015-06-18 — — US disclosed
US-20150160558-A1 Semiconductor Device Process Filter and Method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) 2015-06-11 — — US disclosed
US-20150160552-A1 Photoresist and Method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2015-06-11 — — US disclosed
US-20150132701-A1 Photoresist System and Method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TW) 2015-05-14 — — US disclosed
US-20150111150-A1 Tough Wear Resistant Urethane Hexaacrylate Materials for Overcoats LEXMARK INTERNATIONAL, INC. 2015-04-23 — — US disclosed
US-20150111138-A1 Tough Wear Resistant Urethane Hexaacrylate Materials for Overcoats LEXMARK INTERNATIONAL, INC. 2015-04-23 — — US disclosed
US-20150099219-A1 Photo Conductor Overcoat Comprising Radical Polymerizable Charge Transport Molecules and Hexa-Functional Urethane Acrylates BANK TRUST COMPANY, NATIONAL ASSOCIATION 2015-04-09 — — US disclosed
US-20150099225-A1 Photo Conductor Overcoat Comprising Radical Polymerizable Charge Transport Molecules and Hexa-Functional Urethane Acrylates BANK TRUST COMPANY, NATIONAL ASSOCIATION 2015-04-09 — — US disclosed
US-20150098056-A1 Optical Element for Correcting Color Blindness NITTO DENKO CORPORATION (JP) 2015-04-09 — — US disclosed
EP-2857471-A1 PRODUCTION METHOD FOR AN ORGANIC ELECTRONIC DEVICE LG Chem, Ltd. (KR) 2015-04-08 — — EP disclosed
US-20150094396-A1 DENTAL CURABLE COMPOSITION CONTAINING PARTICLES WITH DIFFERENT REFRACTIVE INDEXES SHOFU INC. (JP) 2015-04-02 — — US disclosed
EP-2853253-A2 Dental curable composition containing particles with different refractive indexes Shofu Inc. (JP) 2015-04-01 — — EP disclosed
US-20150086924-A1 Photoresist System and Method TAIWAN SEMICONDUCTOR MFG (TW) 2015-03-26 — — US disclosed
US-8951703-B2 Wear resistant urethane hexaacrylate materials for photoconductor overcoats LEXMARK INTERNATIONAL, INC. (US) 2015-02-10 — — US disclosed
US-8940466-B2 Photo conductor overcoat comprising radical polymerizable charge transport molecules and hexa-functional urethane acrylates LEXMARK INTERNATIONAL, INC. (US) 2015-01-27 — — US disclosed
EP-1974713-B1 Dental composite resin for core build-up G C DENTAL IND CORP (JP) 2014-11-19 — — EP disclosed
US-8889570-B2 Light-transmitting electromagnetic-shielding laminate and method for producing the same, light-transmitting radio wave absorber, and adhesive composition MITSUBISHI GAS CHEMICAL COMPANY, INC (JP) 2014-11-18 — — US disclosed
US-20140336303-A1 Optical Element for Correcting Color Blindness NITTO DENKO CORPORATION (JP) 2014-11-13 — — US disclosed
EP-2790042-A1 DISPLAY BODY, TRANSFER FOIL, AND ARTICLE WITH DISPLAY BODY Toppan Printing Co., Ltd. (JP) 2014-10-15 — — EP disclosed
US-20140295646-A1 Dicing Sheet with Protective Film Forming Layer and Chip Fabrication Method LINTEC CORPORATION (JP) 2014-10-02 — — US disclosed
US-8848159-B2 Method of fabricating liquid crystal display device LG DISPLAY CO., LTD. (KR) 2014-09-30 — — US disclosed
US-20140273457-A1 Anti-Reflective Layer and Method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2014-09-18 — — US disclosed
US-20140273506-A1 Unlocking Layer and Method TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2014-09-18 — — US disclosed
EP-1710273-B1 OPTICAL COMPONENT-USE MOLDING AND PRODUCTION METHOD THEREFOR MITSUBISHI RAYON CO (JP) 2014-09-10 — — EP disclosed
US-8828283-B2 Method of producing a shaped article for use as an optical component MITSUBISHI RAYON CO., LTD. (JP) 2014-09-09 — — US disclosed
EP-2380946-B1 Resin-type lightguide plate composition, backlight unit including lightguide plate formed using the composition, and liquid crystal display including the backlight unit DONGWOO FINE CHEM CO LTD (KR) 2014-08-20 — — EP disclosed
WO-2014120809-A1 OPTICAL ELEMENT FOR CORRECTING COLOR BLINDNESS NITTO DENKO CORPORATION (JP) 2014-08-07 — — WO disclosed
WO-2014120681-A2 OPTICAL ELEMENT FOR CORRECTING COLOR BLINDNESS NITTO DENKO CORPORATION (JP) 2014-08-07 — — WO disclosed
US-20140186758-A1 Photo Conductor Overcoat Comprising Radical Polymerizable Charge Transport Molecules and Hexa-Functional Urethane Acrylates LEXMARK INTERNATIONAL, INC. (US) 2014-07-03 — — US disclosed
US-20140186757-A1 Wear resistant urethane hexaacrylate materials for photoconductor overcoats LEXMARK INTERNATIONAL, INC. (US) 2014-07-03 — — US disclosed
EP-2739997-A2 OPTICAL ELEMENT FOR CORRECTING COLOR BLINDNESS Nitto Denko Corporation (JP) 2014-06-11 — — EP disclosed
US-20140141570-A1 RESIN FILM FORMING SHEET FOR CHIP, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP LINTEC CORPORATION (JP) 2014-05-22 — — US disclosed
EP-2724705-A2 Dental visible-light curable composition and method of identifying presence of same Shofu Inc. (JP) 2014-04-30 — — EP disclosed
US-8673105-B2 Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2014-03-18 — — US disclosed
US-8674349-B2 Resin film forming sheet for chip, and method for manufacturing semiconductor chip LINTEC CORPORATION (JP) 2014-03-18 — — US disclosed
US-20140065411-A1 UV CURABLE CATALYST COMPOSITIONS ROHM & HAAS ELECT MAT (US) 2014-03-06 — — US disclosed
US-8617928-B2 Dicing/die bonding film NITTO DENKO CORPORATION (JP) 2013-12-31 — — US disclosed
US-8597786-B2 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and method for producing the same NITTO DENKO CORPORATION (JP) 2013-12-03 — — US disclosed
EP-2305451-B1 BENDABLE POLYCARBONATE RESIN LAMINATE, OPTICALLY TRANSPARENT ELECTROMAGNETIC WAVE SHIELD LAMINATE, AND MANUFACTURING METHOD THEREOF MITSUBISHI GAS CHEMICAL CO (JP) 2013-11-20 — — EP disclosed
US-8580143-B2 Lyotropic chromonic liquid crystal composition, method for manufacture of lyotropic chromonic liquid crystal coating film, and lyotropic chromonic liquid crystal coating film manufactured thereby KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2013-11-12 — — US disclosed
US-8575057-B2 UV curable catalyst compositions ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2013-11-05 — — US disclosed
EP-2241587-B1 HYDROPHILIC POLYSILOXANE MONOMER, AND PRODUCTION METHOD AND APPLICATION THEREOF COOPERVISION INT HOLDING CO LP (BB) 2013-09-25 — — EP disclosed
US-8524850-B2 Hydrophilic polysiloxane macromonomer, and production and use of the same COOPERVISION INTERNATIONAL HOLDING COMPANY, LP (BB) 2013-09-03 — — US disclosed
EP-1989595-B1 ELECTROPHOTOGRAPHIC PHOTOCONDUCTOR, PRODUCTION METHOD THEREOF, IMAGE FORMING METHOD AND IMAGE FORMING APPARATUS USING PHOTOCONDUCTOR, AND PROCESS CARTRIDGE RICOH CO LTD (JP) 2013-08-14 — — EP disclosed
US-8465337-B2 Radiation curable arts and crafts toy NORTH SEA RESINS, LLC 2013-06-18 — — US disclosed
WO-2013022744-A9 OPTICAL ELEMENT FOR CORRECTING COLOR BLINDNESS NITTO DENKO CORPORATION (JP) 2013-05-30 — — WO disclosed
US-20130081752-A1 METHOD OF MANUFACTURING TRANSLUCENT RIGID SUBSTRATE LAMINATE DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2013-04-04 — — US disclosed
WO-2013035891-A2 RADICALLY POLYMERIZABLE COMPOUND AND RADICALLY CURABLE COMPOSITION SHOWA DENKO K.K. (JP) 2013-03-14 — — WO disclosed
EP-1906400-B1 ULTRAVIOLET-CURABLE RESIN COMPOSITION AND OPTICAL INFORMATION RECORDING MEDIUM DAINIPPON INK & CHEMICALS (JP) 2013-02-20 — — EP disclosed
US-20130037204-A1 METHOD OF MANUFACTURING TRANSLUCENT RIGID SUBSTRATE LAMINATE AND TRANSLUCENT RIGID SUBSTRATE BONDING APPARATUS DENKA COMPANY LIMITED (JP) 2013-02-14 — — US disclosed
WO-2013022744-A2 OPTICAL ELEMENT FOR CORRECTING COLOR BLINDNESS NITTO DENKO CORPORATION (JP) 2013-02-14 — — WO disclosed
US-20130011998-A1 Resin Film Forming Sheet for Chip, and Method for Manufacturing Semiconductor Chip LINTEC CORPORATION (JP) 2013-01-10 — — US disclosed
US-20120329897-A1 DUAL CURING COMPOSITION AND USE THEREOF DELO INDUSTRIE KLEBSTOFFE GMBH & CO. KGAA (DE) 2012-12-27 — — US disclosed
US-20120298285-A1 METHOD OF MANUFACTURING TRANSLUCENT RIGID SUBSTRATE LAMINATE AND TRANSLUCENT RIGID SUBSTRATE BONDING APPARATUS DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2012-11-29 — — US disclosed
CN-102236258-B Photosensitive resin composition, color filter formed by same and liquid crystal display assembly comprising color filter CHI MEI CORP 2012-11-28 — — CN disclosed
CN-101634807-B Photosensitive resin composition for black matrix and liquid crystal display element CHI MEI CORP 2012-08-08 — — CN disclosed
US-20120184698-A1 Hydrophilic Polysiloxane Macromonomer, And Production And Use Of The Same COOPERVISION INTERNATIONAL HOLDING COMPANY, LP (BB) 2012-07-19 — — US disclosed
EP-2447740-A1 ANTIREFLECTION ARTICLE AND DISPLAY DEVICE Mitsubishi Rayon Co., Ltd. (JP) 2012-05-02 — — EP disclosed
EP-1983017-B1 CURABLE COMPOSITION CONTAINING THIOL COMPOUND SHOWA DENKO KK (JP) 2012-04-18 — — EP disclosed
EP-2129207-B1 LIGHT-TRANSMITTING ELECTROMAGNETIC-SHIELDING LAMINATE AND METHOD FOR PRODUCING THE SAME, LIGHT-TRANSMITTING RADIO WAVE ABSORBER, AND ADHESIVE COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2012-04-18 — — EP disclosed
US-20120070960-A1 DICING DIE BOND FILM, METHOD OF MANUFACTURING DICING DIE BOND FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE NITTO DENKO CORPORATION (JP) 2012-03-22 — — US disclosed
US-8114563-B2 Forming photosensitive layer on electroconductive substrate wherein the crosslinked surface layer has a surface roughness (Ra) not greater than 0.2 mu m and a peel strength not less than 0.2 N/mm; durability, stable electrical properties, good cleanability, and producing high-quality images RICOH COMPANY, LIMITED (JP) 2012-02-14 — — US disclosed
US-20110272629-A1 LYOTROPIC CHROMONIC LIQUID CRYSTAL COMPOSITION, METHOD FOR MANUFACTURE OF LYOTROPIC CHROMONIC LIQUID CRYSTAL COATING FILM, AND LYOTROPIC CHROMONIC LIQUID CRYSTAL COATING FILM MANUFACTURED THEREBY INDUSTRIAL COOPERATION FOUNDATION CHONBUK NATIONAL UNIVERSITY (KR) 2011-11-10 — — US disclosed
CN-102236258-A Photosensitive resin composition, color filter formed by same and liquid crystal display assembly comprising color filter CHI MEI CORP 2011-11-09 — — CN disclosed
EP-2380946-A2 Resin-type lightguide plate composition, backlight unit including lightguide plate formed using the composition, and liquid crystal display including the backlight unit Dongwoo Fine-Chem Co., Ltd. (KR) 2011-10-26 — — EP disclosed
EP-1577884-B1 OPTICAL RECORDING MEDIUM, OPTICAL RECORDING MEDIUM RECORDING/REPRODUCTION METHOD, AND RECORDING/REPRODUCTION DEVICE MITSUBISHI KAGAKU MEDIA CO LTD (JP) 2011-10-19 — — EP disclosed
US-20110157538-A1 METHOD OF FABRICATING LIQUID CRYSTAL DISPLAY DEVICE LG DISPLAY CO., LTD. (KR) 2011-06-30 — — US disclosed
US-7964684-B2 Polysiesquioxanes preferably comprising vinyl or ethynyl silanetriol; improved inhibition of film shrinkage and degassing during curing; uniform thickness, low refractive index FUJIFILM CORPORATION (JP) 2011-06-21 — — US disclosed
US-7960081-B2 Electrophotographic photoreceptor having N-alkoxymethylated nylon intermediate layer, and image forming apparatus having the electrophotographic photoreceptor RICOH COMPANY, LTD. (JP) 2011-06-14 — — US disclosed
US-20110104873-A1 DICING/DIE BONDING FILM NITTO DENKO CORPORATION (JP) 2011-05-05 — — US disclosed
EP-2310435-A1 POLYURETHANE AND PRODUCTION METHOD THEREOF Showa Denko K.K. (JP) 2011-04-20 — — EP disclosed
EP-2305451-A1 BENDABLE POLYCARBONATE RESIN LAMINATE, OPTICALLY TRANSPARENT ELECTROMAGNETIC WAVE SHIELD LAMINATE, AND MANUFACTURING METHOD THEREOF Mitsubishi Gas Chemical Company, Inc. (JP) 2011-04-06 — — EP disclosed
US-20110053346-A1 DICING/DIE BONDING FILM NITTO DENKO CORPORATION (JP) 2011-03-03 — — US disclosed
US-20110042838-A1 SHAPED ARTICLE FOR USE AS AN OPTICAL COMPONENT AND METHOD OF PRODUCING THE SHAPED ARTICLE MITSUBISHI RAYON CO., LTD. (JP) 2011-02-24 — — US disclosed
EP-2287206-A1 POLYROTAXANE, AQUEOUS POLYROTAXANE DISPERSION COMPOSITION, CROSSLINKED BODY OF POLYROTAXANE AND POLYMER AND METHOD FOR PRODUCING THE SAME Advanced Softmaterials Inc. (JP) 2011-02-23 — — EP disclosed
US-7888399-B2 Curable composition containing thiol compound SHOWA DENKO K.K. (JP) 2011-02-15 — — US disclosed
WO-2011013844-A2 PRODUCTION METHOD OF ALLYL ALCOHOL COPOLYMER SHOWA DENKO K.K. (JP) 2011-02-03 — — WO disclosed
US-7871747-B2 Electrophotographic photoconductor having charge blocking and moire preventing layers RICOH COMPANY, LTD. (JP) 2011-01-18 — — US disclosed
US-20100304092-A1 METHOD OF MANUFACTURING DICING DIE-BONDING FILM NITTO DENKO CORPORATION (JP) 2010-12-02 — — US disclosed
US-7839737-B2 Optical recording medium with power calibration areas and a recording method therefor with optimum power control MITSUBISHI KAGAKU MEDIA CO., LTD. (JP) 2010-11-23 — — US disclosed
US-7820416-B2 Process for producing amide compound and acrylamide polymer DIA-NITRIX CO., LTD. (JP) 2010-10-26 — — US disclosed
EP-2241587-A1 HYDROPHILIC POLYSILOXANE MONOMER, AND PRODUCTION METHOD AND APPLICATION THEREOF Asahi Kasei Aime Co., Ltd. (JP) 2010-10-20 — — EP disclosed
EP-2242089-A1 DICING/DIE BONDING FILM Nitto Denko Corporation (JP) 2010-10-20 — — EP disclosed
US-7815320-B2 Antiglare light diffusing member and method for producing same, and display TOPPAN PRINTING CO., LTD. (JP) 2010-10-19 — — US disclosed
US-7815322-B2 Antiglare light diffusing member and display having antiglare light diffusing member TOPPAN PRINTING CO., LTD. (JP) 2010-10-19 — — US disclosed
EP-2239763-A1 DICING/DIE BONDING FILM Nitto Denko Corporation (JP) 2010-10-13 — — EP disclosed
US-20100239866-A1 DICING DIE-BONDING FILM NITTO DENKO CORPORATION (JP) 2010-09-23 — — US disclosed
EP-2229412-A1 ALLYL ALCOHOL COPOLYMER AND PRODUCTION METHOD THEREOF Showa Denko K.K. (JP) 2010-09-22 — — EP disclosed
US-7801000-B2 Recording/reading method for an optical recording medium using an irradiating a laser beam MITSUBISHI KAGAKU MEDIA CO., LTD. (JP) 2010-09-21 — — US disclosed
US-20100209842-A1 ELECTROPHOTOGRAPHIC PHOTORECEPTOR AND METHOD OF PREPARING THE PHOTORECEPTOR, AND IMAGE FORMING METHOD, IMAGE FORMING APPARATUS AND PROCESS CARTRIDGE THEREFOR USING THE PHOTORECEPTOR YANAGAWA YOSHIKI 2010-08-19 — — US disclosed
EP-1739667-B1 OPTICAL RECORDING MEDIUM MITSUBISHI KAGAKU MEDIA CO LTD (JP) 2010-07-28 — — EP disclosed
US-20100147578-A1 LIGHT-TRANSMITTING ELECTROMAGNETIC-SHIELDING LAMINATE AND METHOD FOR PRODUCING THE SAME, LIGHT-TRANSMITTING RADIO WAVE ABSORBER, AND ADHESIVE COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2010-06-17 — — US disclosed
US-7708414-B2 Antiglare film TOPPAN PRINTING CO., LTD. (JP) 2010-05-04 — — US disclosed
EP-2174960-A1 POLYROTAXANE, CROSSLINKED STRUCTURE COMPRISING POLYROTAXANE AND POLYMER, AND PROCESSES FOR PRODUCING THESE Advanced Softmaterials Inc. (JP) 2010-04-14 — — EP disclosed
EP-1575035-B1 OPTICAL RECORDING MEDIUM, METHOD FOR RECORDING OPTICAL RECORDING MEDIUM, AND RECORDER MITSUBISHI KAGAKU MEDIA CO LTD (JP) 2010-03-10 — — EP disclosed
US-20100052222-A1 METHOD AND DEVICE FOR CREATING THREE-DIMENSIONAL HOLLOW OBJECTS FROM RADIATION CURABLE RESIN KIMMEL ANDREW 2010-03-04 — — US disclosed
US-7672215-B2 Optical recording medium and recording/reading method therefor MITSUBISHI KAGAKU MEDIA CO., LTD. (JP) 2010-03-02 — — US disclosed
US-7670640-B2 Curable fluorine-containing polymer, curable resin composition prepared from same and antireflection film DAIKIN INDUSTRIES, LTD. (JP) 2010-03-02 — — US disclosed
WO-2010016600-A1 POLYURETHANE AND PRODUCTION METHOD THEREOF SHOWA DENKO K.K. (JP) 2010-02-11 — — WO disclosed
CN-101634807-A Photosensitive resin composition for black matrix and liquid crystal display element CHI MEI CORP 2010-01-27 — — CN disclosed
EP-2135908-A2 Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet to be attached to metal surface NITTO DENKO CORPORATION (JP) 2009-12-23 — — EP disclosed
EP-2135907-A2 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and method for producing the same Nitto Denko Corporation (JP) 2009-12-23 — — EP disclosed
EP-2135906-A2 Pressure-sensitive adhesive composition and use thereof NITTO DENKO CORPORATION (JP) 2009-12-23 — — EP disclosed
US-7628496-B2 Antiglare film and transmission-type liquid crystal display TOPPAN PRINTING CO., LTD. (JP) 2009-12-08 — — US disclosed
US-7629094-B2 Electrophotographic photoreceptor, and image forming method, image forming apparatus and process cartridge therefor using the electrophotographic photoreceptor RICOH COMPANY, LTD. (JP) 2009-12-08 — — US disclosed
EP-2129207-A1 LIGHT-TRANSMITTING ELECTROMAGNETIC-SHIELDING LAMINATE AND METHOD FOR PRODUCING THE SAME, LIGHT-TRANSMITTING RADIO WAVE ABSORBER, AND ADHESIVE COMPOSITION Mitsubishi Gas Chemical Company, Inc. (JP) 2009-12-02 — — EP disclosed
US-20090292095-A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET TO BE ATTACHED TO METAL SURFACE NITTO DENKO CORPORATION (TW) 2009-11-26 — — US disclosed
US-20090291227-A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET, AND METHOD FOR PRODUCING THE SAME NITTO DENKO CORPORATION (JP) 2009-11-26 — — US disclosed
US-20090262429-A1 Antiglare Light Diffusing Member and Display Having Antiglare Light Diffusing Member TOPPAN PRINTING CO., LTD. (JP) 2009-10-22 — — US disclosed
US-20090234089-A1 Hydrophilic Polysiloxane Macromonomer, and Production and Use of the same ASAHI KASEI AIME CO., LTD. (JP) 2009-09-17 — — US disclosed
US-7589897-B2 Antiglare film TOPPAN PRINTING CO., LTD. (JP) 2009-09-15 — — US disclosed
US-20090209089-A1 DICING DIE-BONDING FILM NITTO DENKO CORPORATION (JP) 2009-08-20 — — US disclosed
EP-2090633-A1 Dicing Die-Bonding Film Nitto Denko Corporation (JP) 2009-08-19 — — EP disclosed
EP-1798264-B1 ACTIVE ENERGY RAY-CURABLE COATING COMPOSITION AND METHOD FOR FORMING COATING FILM KANSAI PAINT CO LTD (JP) 2009-08-05 — — EP disclosed
US-7556903-B2 Electrophotographic photoreceptor, and image forming method, apparatus and process cartridge therefor using the photoreceptor RICOH COMPANY LIMITED (JP) 2009-07-07 — — US disclosed
WO-2009082022-A1 ALLYL ALCOHOL COPOLYMER AND PRODUCTION METHOD THEREOF SHOWA DENKO K.K. (JP) 2009-07-02 — — WO disclosed
EP-2063425-A1 Optical recording medium and recording/reproducing method therefor Mitsubishi Kagaku Media Co., Ltd. (JP) 2009-05-27 — — EP disclosed
US-7534538-B2 Coating liquid for intermediate layer in electrophotographic photoconductor, electrophotographic photoconductor utilizing the same, image forming apparatus and process cartridge for image forming apparatus RICOH COMPANY, LTD. (JP) 2009-05-19 — — US disclosed
WO-2009054621-A2 THE COMPOSITION OF DECOLORABLE INK AND DECOLORING METHOD HAN JONG-SOO (KR) 2009-04-30 — — WO disclosed
US-7525731-B2 Antiglare light diffusing member TOPPAN PRINTING CO., LTD. (JP) 2009-04-28 — — US disclosed
US-7517625-B2 Electrophotographic photoreceptor with improved durability and wear resistance; high quality latent images; crosslinked charge transport layer has a hardened monomer having three or more functional groups without charge transport structure and one with charge transport-containing (meth)acryloyloxy groups RICOH COMPANY, LTD. (JP) 2009-04-14 — — US disclosed
EP-1530098-B1 Photoconductor, image forming apparatus, image forming process, and process cartridge RICOH KK (JP) 2009-04-01 — — EP disclosed
US-7507511-B2 Electrophotographic photoreceptor, and image forming apparatus and process cartridge therefor using the electrophotographic photoreceptor RICOH COMPANY LTD. (JP) 2009-03-24 — — US disclosed
US-7507509-B2 Electrophotographic photoreceptor, and image forming method, image forming apparatus and process cartridge using the electrophotographic photoreceptor RICOH COMPANY, LTD. (JP) 2009-03-24 — — US disclosed
US-7494747-B2 Holographic recording medium KABUSHIKI KAISHA TOSHIBA (JP) 2009-02-24 — — US disclosed
US-20090023831-A1 Curable Composition Containing Thiol Compound SHOWA DENKO K.K. (JP) 2009-01-22 — — US disclosed
US-7473504-B2 Electrophotographic photoreceptor, and image forming method, apparatus and process cartridge therefor using the photoreceptor RICOH COMPANY, LTD. (JP) 2009-01-06 — — US disclosed
US-20080318489-A1 Radiation curable arts and crafts toy NORTH SEA RESINS, LLC 2008-12-25 — — US disclosed
US-20080316602-A1 Antiglare film TOPPAN PRINTING CO., LTD. (JP) 2008-12-25 — — US disclosed
EP-1674940-B1 Electrophotographic photoreceptor, and image forming method, image forming apparatus and process cartridge therefor using the electrophotographic photoreceptor RICOH KK (JP) 2008-11-26 — — EP disclosed
EP-1992984-A2 Liquid crystal display NEC Corporation (JP) 2008-11-19 — — EP disclosed
EP-1992985-A2 Liquid crystal display NEC Corporation (JP) 2008-11-19 — — EP disclosed
EP-1989595-A1 ELECTROPHOTOGRAPHIC PHOTOCONDUCTOR, PRODUCTION METHOD THEREOF, IMAGE FORMING METHOD AND IMAGE FORMING APPARATUS USING PHOTOCONDUCTOR, AND PROCESS CARTRIDGE Ricoh Company, Ltd. (JP) 2008-11-12 — — EP disclosed
US-7449272-B2 Electrophotographic photoreceptor and method of preparing the photoreceptor, and image forming method, image forming apparatus and process cartridge therefor using the photoreceptor RICOH COMPANY, LTD. (JP) 2008-11-11 — — US disclosed
EP-1742112-B1 Electrophotographic photoreceptor and method of preparing the photoreceptor, and image forming method, image forming apparatus and process cartridge therefor using the photoreceptor RICOH KK (JP) 2008-11-05 — — EP disclosed
EP-1986186-A1 Recording method for optical recording medium Mitsubishi Kagaku Media Co., Ltd. (JP) 2008-10-29 — — EP disclosed
EP-1983017-A1 CURABLE COMPOSITION CONTAINING THIOL COMPOUND Showa Denko K.K. (JP) 2008-10-22 — — EP disclosed
US-7436743-B2 Optical recording method and medium on which recording and/or reading are performed from one side MITSUBISHI KAGAKU MEDIA CO., LTD. (JP) 2008-10-14 — — US disclosed
WO-2008117977-A1 DECORATION PLATE COMPRISING DECORATED 3-D LAYER MOGEM CO., LTD. 2008-10-02 — — WO disclosed
EP-1974713-A2 Dental composite resin for core build-up GC Corporation (JP) 2008-10-01 — — EP disclosed
EP-1748311-B1 Liquid crystal display NEC CORP (JP) 2008-09-10 — — EP disclosed
US-20080213602-A1 ANTIREFLECTION FILM FORMING COMPOSITION, ANITREFLECTION FILM AND OPTICAL DEVICE FUJIFILM CORPORATION (JP) 2008-09-04 — — US disclosed
US-20080212190-A1 ANTIGLARE FILM TOPPAN PRINTING CO., LTD. (JP) 2008-09-04 — — US disclosed
US-20080205256-A1 OPTICAL RECORDING MEDIUM, AND RECORDING METHOD AND RECORDING APPARATUS FOR OPTICAL RECORDING MEDIUM MITSUBISHI KAGAKU MEDIA CO., LTD. (JP) 2008-08-28 — — US disclosed
US-20080186582-A1 Antiglare film and transmission-type liquid crystal display TOPPAN PRINTING CO., LTD. (JP) 2008-08-07 — — US disclosed
US-7399563-B2 Electrophotographic photoconductor, and image forming process, image forming apparatus and process cartridge for an image forming apparatus using the same RICOH COMPANY, LTD. (JP) 2008-07-15 — — US disclosed
WO-2008082224-A1 WATER-SOLUBLE PHOTOINITIATORS INKTEC CO., LTD. (KR) 2008-07-10 — — WO disclosed
US-7390600-B2 Latent electrostatic image bearing member, process cartridge, image forming apparatus, and image forming process RICOH COMPANY, LTD. (JP) 2008-06-24 — — US disclosed
US-20080121850-A1 COMPOSITION FOR PREPARING BUS-ELECTRODE OF PLASMA DISPLAY PANEL, AND PLASMA DISPLAY PANEL INCLUDING BUS-ELECTRODE PREPARED FROM SAME SAMSUNG SDI CO., LTD. (KR) 2008-05-29 — — US disclosed
EP-1359201-B1 Use of a printing ink and printing method TOPPAN PRINTING CO LTD (JP) 2008-05-28 — — EP disclosed
EP-1054269-B1 Optical water-absorptive gel and ophthalmic material using the same MENICON CO LTD (JP) 2008-05-28 — — EP disclosed
EP-1375589-B1 OPTICAL MATERIAL CONTAINING FUNCTIONAL FLUOROPOLYMER DAIKIN IND LTD (JP) 2008-05-21 — — EP disclosed
US-20080112055-A1 Antiglare light diffusing member TOPPAN PRINTING CO., LTD. (JP) 2008-05-15 — — US disclosed
EP-1657041-B1 PROCESS FOR PRODUCING CONTACT LENS WITH MARKING AND CONTACT LENS WITH MARKING OBTAINED THEREBY MENICON CO LTD (JP) 2008-05-14 — — EP disclosed
US-7371490-B2 Photoconductor, image forming apparatus, image forming process, and process cartridge RICOH COMPANY, LTD. (JP) 2008-05-13 — — US disclosed
US-20080108770-A1 Process For Producing Amide Compound And Acrylamide Polymer DIA-NITRIX CO., LTD. (JP) 2008-05-08 — — US disclosed
US-7361438-B2 Electrophotographic photoconductor, and image forming process, image forming apparatus and process cartridge for an image forming apparatus using the same RICOH COMPANY, LTD. (JP) 2008-04-22 — — US disclosed
EP-1906400-A1 ULTRAVIOLET-CURABLE RESIN COMPOSITION AND OPTICAL INFORMATION RECORDING MEDIUM Dainippon Ink and Chemicals, Incorporated (JP) 2008-04-02 — — EP disclosed
US-20080038649-A1 ELECTROPHOTOGRAPHIC PHOTORECEPTOR AND METHOD OF PREPARING THE PHOTORECEPTOR, AND IMAGE FORMING METHOD, IMAGE FORMING APPARATUS AND PROCESS CARTRIDGE THEREFOR USING THE PHOTORECEPTOR RICOH COMPANY, LIMITED (JP) 2008-02-14 — — US disclosed
US-20080030861-A1 Antiglare light diffusing member and method for producing same, and display TOPPAN PRINTING CO., LTD. (JP) 2008-02-07 — — US disclosed
US-20080020305-A1 ELECTROPHOTOGRAPHIC PHOTOCONDUCTOR, AND IMAGE FORMING PROCESS, IMAGE FORMING APPARATUS AND PROCESS CARTRIDGE FOR AN IMAGE FORMING APPARATUS USING THE SAME SUZUKI TETSURO 2008-01-24 — — US disclosed
US-20080002550-A1 Recording/reading method for an optical recording medium using an irradiating a laser beam MITSUBISHI CHEMICAL CORPORATION (JP) 2008-01-03 — — US disclosed
US-7315722-B2 Image forming apparatus and image forming method RICOH COMPANY, LTD. (JP) 2008-01-01 — — US disclosed
EP-1870771-A2 Photosensitive paste composition, barrier rib prepared using the composition and plasma display panel comprising the barrier rib Samsung SDI Co., Ltd. (KR) 2007-12-26 — — EP disclosed
US-20070264440-A1 Active Energy Ray-Curable Coating Composition and Method for Forming Coating Film KANSAI PAINT CO., LTD. (JP) 2007-11-15 — — US disclosed
US-20070253064-A1 Antiglare light diffusing member and display having antiglare light diffusing member TOPPAN PRINTING CO., LTD. (JP) 2007-11-01 — — US disclosed
EP-1440984-B1 Method of manufacturing water-absorbing shaped body NIPPON CATALYTIC CHEM IND (JP) 2007-10-17 — — EP disclosed
EP-1835033-A1 PROCESS FOR PRODUCING AMIDE COMPOUND AND ACRYLAMIDE POLYMER Dia-Nitrix Co., Ltd. (JP) 2007-09-19 — — EP disclosed
US-20070212627-A1 ELECTROPHOTOGRAPHIC PHOTORECEPTOR AND METHOD OF PREPARING THE PHOTORECEPTOR, AND IMAGE FORMING METHOD, IMAGE FORMING APPARATUS AND PROCESS CARTRIDGE THEREFOR USING THE PHOTORECEPTOR RICOH COMPANY, LTD. (JP) 2007-09-13 — — US disclosed
WO-2007100132-A1 ELECTROPHOTOGRAPHIC PHOTOCONDUCTOR, PRODUCTION METHOD THEREOF, IMAGE FORMING METHOD AND IMAGE FORMING APPARATUS USING PHOTOCONDUCTOR, AND PROCESS CARTRIDGE RICOH COMPANY, LTD. (JP) 2007-09-07 — — WO disclosed
US-7262252-B2 Nonlinear optical materials comprising fluorine-containing polymer DAIKIN INDUSTRIES, LTD. (JP) 2007-08-28 — — US disclosed
US-20070197718-A1 Photofunctional optical material comprising fluorine-containing acrylate polymer DAIKIN INDUSTRIES LTD. 2007-08-23 — — US disclosed
US-20070177271-A1 Antireflection film, polarizing plate and image display FUJIFILM CORPORATION (JP) 2007-08-02 — — US disclosed
US-20070160520-A1 Calcined silica particle and manufacturing method of same NIPPON SHOKUBAI CO., LTD. (JP) 2007-07-12 — — US disclosed
EP-1798264-A1 ACTIVE ENERGY RAY-CURABLE COATING COMPOSITION AND METHOD FOR FORMING COATING FILM KANSAI PAINT CO., LTD. (JP) 2007-06-20 — — EP disclosed
US-7232646-B2 Low-viscous, radiation curable formulation, particularly for the stereo-lithographical production of earpiece DREVE-OTOPLASTIK GMBH (DE) 2007-06-19 — — US disclosed
US-20070122724-A1 ELECTROPHOTOGRAPHIC PHOTOCONDUCTOR, AND IMAGE FORMING PROCESS, IMAGE FORMING APPARATUS AND PROCESS CARTRIDGE FOR AN IMAGE FORMING APPARATUS USING THE SAME SUZUKI TETSURO 2007-05-31 — — US disclosed
US-7220809-B1 Optical material containing fluorine-containing polymer having functional group DAIKIN INDUSTRIES, LTD. (JP) 2007-05-22 — — US disclosed
EP-1112995-B1 ALICYCLIC COMPOUNDS AND CURABLE RESIN COMPOSITION NISSAN CHEMICAL IND LTD (JP) 2007-04-11 — — EP disclosed
US-20070059619-A1 Electrophotographic photoconductor, image forming apparatus, image forming method, and process cartridge RICOH COMPANY, LTD. (JP) 2007-03-15 — — US disclosed
EP-1566684-B1 LENS FOR EYE AND METHOD FOR MARKING THEREOF MENICON CO LTD (JP) 2007-03-14 — — EP disclosed
US-7189766-B2 Ink for printing, printed matter, printing method and printer TOPPAN PRINTING CO., LTD. (JP) 2007-03-13 — — US disclosed
US-20070048457-A1 Producing method of film having coated layer, film having coated layer, optical film, polarizing plate and liquid crystal display FUJI FILM CORPORATION (JP) 2007-03-01 — — US disclosed
US-20070042281-A1 Electrophotographic photoreceptor, and image forming apparatus and process cartridge therefor using the electrophotographic photoreceptor RICOH COMPANY, LTD. (JP) 2007-02-22 — — US disclosed
US-7179573-B2 Electrophotographic photoconductor, and image forming process, image forming apparatus and process cartridge for an image forming apparatus using the same RICOH COMPANY, LTD. (JP) 2007-02-20 — — US disclosed
US-7175957-B2 Electrophotographic photoconductor, and image forming process, image forming apparatus and process cartridge for an image forming apparatus using the same RICOH COMPANY, LTD. (JP) 2007-02-13 — — US disclosed
EP-1748311-A2 Liquid crystal display NEC Corporation (JP) 2007-01-31 — — EP disclosed
US-7165840-B2 Process for producing contact lens having a mark and contact lens having a mark obtained thereby MENICON CO., LTD. (JP) 2007-01-23 — — US disclosed
US-20070009818-A1 Electrophotographic photoreceptor and method of preparing the photoreceptor, and image forming method, image forming apparatus and process cartridge therefor using the photoreceptor RICOH COMPANY, LTD. (JP) 2007-01-11 — — US disclosed
EP-1742112-A1 Electrophotographic photoreceptor and method of preparing the photoreceptor, and image forming method, image forming apparatus and process cartridge therefor using the photoreceptor Ricoh Company, Ltd. (JP) 2007-01-10 — — EP disclosed
EP-1739667-A1 OPTICAL RECORDING MEDIUM Mitsubishi Kagaku Media Co., Ltd. (JP) 2007-01-03 — — EP disclosed
EP-1734074-A1 PHOTOFUNCTIONAL OPTICAL MATERIAL COMPRISING FLUORINATED ACRYLATE POLYMER Daikin Industries, Ltd. (JP) 2006-12-20 — — EP disclosed
EP-0805373-B1 Liquid crystal display NEC CORP (JP) 2006-11-29 — — EP disclosed
CN-1287167-C Photosensitive resin composition QIMEI IND CO LTD (CN) 2006-11-29 — — CN disclosed
US-20060264526-A1 Low-viscous, radiation curable formulation, particularly for the stereo-lithographical production of earpiece DREVE-OTOPLASTIK GMBH (DE) 2006-11-23 — — US disclosed
US-20060263715-A1 Block copolymer composition for photosensitive flexographic plate ZEON CORPORATION (JP) 2006-11-23 — — US disclosed
US-20060263583-A1 Shaped article for use as an optical component and method of producing the shaped article MITSUBISHI RAYON CO., LTD. (JP) 2006-11-23 — — US disclosed
EP-1710273-A1 OPTICAL COMPONENT-USE MOLDING AND PRODUCTION METHOD THEREFOR Mitsubishi Rayon Co., Ltd. (JP) 2006-10-11 — — EP disclosed
CN-1277132-C Light sensitive resin composition for color filter QIMEI IND CO LTD (CN) 2006-09-27 — — CN disclosed
US-7106402-B2 Method for driving a reflection liquid crystal display wherein the liquid crystal display having particular cholesteric color filters NEC CORPORATION (JP) 2006-09-12 — — US disclosed
US-7106940-B2 Fluorine-containing material for optical waveguide DAIKIN INDUSTRIES, LTD. (JP) 2006-09-12 — — US disclosed
US-20060177749-A1 Electrophotographic photoreceptor, and image forming apparatus and process cartridge therefor using the electrophotographic photoreceptor RICOH COMPANY, LTD. (JP) 2006-08-10 — — US disclosed
US-20060160003-A1 Electrophotographic photoreceptor, and image forming method, image forming apparatus and process cartridge therefor using the electrophotographic photoreceptor RICOH COMPANY, LTD. (JP) 2006-07-20 — — US disclosed
US-20060153990-A1 UV curable catalyst compositions ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2006-07-13 — — US disclosed
EP-1676937-A1 UV curable catalyst compositions Rohm and Haas Electronic Materials, L.L.C. (US) 2006-07-05 — — EP disclosed
EP-1674940-A1 Electrophotographic photoreceptor, and image forming method, image forming apparatus and process cartridge therefor using the electrophotographic photoreceptor Ricoh Company, Ltd. (JP) 2006-06-28 — — EP disclosed
US-7063938-B2 filling a monomer solution into interstices of colloidal crystals for photopolymerization inside them; masking; not only more simplified two-dimensional patterns but also complicated two- or three-dimensional patterns can be obtained KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2006-06-20 — — US disclosed
US-20060126016-A1 Process for producing contact lens with mark and contact lens with mark obtained thereby MENICON CO., LTD. (JP) 2006-06-15 — — US disclosed
EP-0803241-B1 Dental material G C DENTAL PRODUCTS CORP (JP) 2006-06-14 — — EP disclosed
US-20060110668-A1 Electrophotographic photoreceptor and method of preparing the photoreceptor, and image forming method, image forming apparatus and process cartridge therefor using the photoreceptor RICOH COMPANY, LTD. (JP) 2006-05-25 — — US disclosed
EP-1657041-A1 PROCESS FOR PRODUCING CONTACT LENS WITH MARKING AND CONTACT LENS WITH MARKING OBTAINED THEREBY MENICON CO., LTD. (JP) 2006-05-17 — — EP disclosed
US-7044598-B2 Lens for eye and method for marking thereof MENICON CO., LTD.. (JP) 2006-05-16 — — US disclosed
WO-2006046733-A1 THIOL COMPOUND, AND PHOTOSENSITIVE COMPOSITION AND BLACK MATRIX RESIST COMPOSITION USING THE COMPOUND SHOWA DENKO K.K (JP) 2006-05-04 — — WO disclosed
EP-1347001-B1 CURABLE FLUOROPOLYMER, CURABLE RESIN COMPOSITION CONTAINING THE SAME, AND ANTIREFLEXION FILM DAIKIN IND LTD (JP) 2006-04-19 — — EP disclosed
US-20060078809-A1 Electrophotographic photoreceptor, and image forming method, image forming apparatus and process cartridge using the electrophotographic photoreceptor RICOH COMPANY, LTD. (JP) 2006-04-13 — — US disclosed
US-20060068308-A1 Image forming process, image forming apparatus, and process cartridge RICOH COMPANY, LTD. (JP) 2006-03-30 — — US disclosed
US-20060057479-A1 Coating liquid for intermediate layer in electrophotographic photoconductor, electrophotographic photoconductor utilizing the same, image forming apparatus and process cartridge for image forming apparatus RICOH COMPANY, LTD. (JP) 2006-03-16 — — US disclosed
US-20060058472-A1 Functionalized polymer SHIPLEY COMPANY, L.L.C. (US) 2006-03-16 — — US disclosed
US-20060051689-A1 Image forming apparatus and process cartridge RICOH COMPANY, LTD. (JP) 2006-03-09 — — US disclosed
US-20060051688-A1 Latent electrostatic image bearing member, process cartridge, image forming apparatus, and image forming process RICOH COMPANY, LTD. (JP) 2006-03-09 — — US disclosed
US-7006180-B2 Method for producing a reflection liquid crystal display NEC CORPORATION (JO) 2006-02-28 — — US disclosed
US-6999822-B2 Medical electrode NIHON KOHDEN CORPORATION (JP) 2006-02-14 — — US disclosed
US-20060014096-A1 Image forming method, image forming apparatus and process cartridge therefor RICOH COMPANY, LTD. (JP) 2006-01-19 — — US disclosed
US-20060008652-A1 Curable fluorine-containing polymer, curable resin composition prepared from same and antireflection film DAIKIN INDUSTRIES, LTD. 2006-01-12 — — US disclosed
EP-1615214-A1 OPTICAL RECORDING MEDIUM AND RECORDING/REPRODUCING METHOD THEREFOR MITSUBISHI CHEMICAL CORPORATION (JP) 2006-01-11 — — EP disclosed
US-20050287452-A1 Photoconductor, image forming process, image forming apparatus, and process cartridge RICOH COMPANY, LTD. (JP) 2005-12-29 — — US disclosed
US-20050282040-A1 Magnetic recording medium FUJI PHOTO FILM CO., LTD. 2005-12-22 — — US disclosed
US-20050266325-A1 Outer layer is the crosslinked product of a urethane oligomer having radical polymerizing functional group (e.g., from di(meth)acrylated 1,2,9,10-tetrahydroxy-4,7-dioxadecane), a crosslinking agent, and a reactive charge transport agent, especially acrylated di- or triarylamine; performance & reliability RICOH COMPANY, LTD. (JP) 2005-12-01 — — US disclosed
US-20050266328-A1 Electrophotographic photoreceptor, and image forming method, apparatus and process cartridge therefor using the photoreceptor RICOH COMPANY LIMITED (JP) 2005-12-01 — — US disclosed
EP-1600822-A2 Electrophotographic photoreceptor and image forming method, apparatus and process cartridge therefor using the photoreceptor Ricoh Company, Ltd. (JP) 2005-11-30 — — EP disclosed
US-20050243699-A1 Optical recording medium and recording/reading method therefor CMC MAGNETICS CORPORATION (TW) 2005-11-03 — — US disclosed
US-20050226116-A1 Optical recording medium, and recording method and recording apparatus for optical recording medium CMC MAGNETICS CORPORATION (TW) 2005-10-13 — — US disclosed
US-20050228162-A1 Novel polyether compound containing acid group and unsaturated group, process for producing the same, and resin composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-10-13 — — US disclosed
US-20050213467-A1 Optical recording medium, and recording/reading method and recording/reading apparatus for optical recording medium MITSUBISHI KAGAKU MEDIA CO., LTD. (JP) 2005-09-29 — — US disclosed
US-20050206843-A1 Lens for eye and method for marking thereof MENICON CO., LTD. (JP) 2005-09-22 — — US disclosed
EP-1577884-A1 OPTICAL RECORDING MEDIUM, OPTICAL RECORDING MEDIUM RECORDING/REPRODUCTION METHOD, AND RECORDING/REPRODUCTION DEVICE MITSUBISHI CHEMICAL CORPORATION (JP) 2005-09-21 — — EP disclosed
EP-1575035-A1 OPTICAL RECORDING MEDIUM, METHOD RECORDING OPTICAL RECORDING MEDIUM, AND RECORDER Mitsubishi Chemical Engineering Corporation (JP) 2005-09-14 — — EP disclosed
US-20050196679-A1 Holographic recording medium KABUSHIKI KAISHA TOSHIBA 2005-09-08 — — US disclosed
EP-1566684-A1 LENS FOR EYE AND METHOD FOR MARKING THEREOF MENICON CO., LTD. (JP) 2005-08-24 — — EP disclosed
US-20050175911-A1 Photoconductor, image forming apparatus, image forming process, and process cartridge RICOH COMPANY, LTD. (JP) 2005-08-11 — — US disclosed
US-20050158004-A1 Fluorine-containing material for optical waveguide DAIKIN INDUSTRIES, LTD. 2005-07-21 — — US disclosed
US-20050141919-A1 Image forming apparatus and image forming method RICOH COMPANY, LTD. (JP) 2005-06-30 — — US disclosed
US-6901205-B2 Fluorine-containing material for optical waveguide DAIKIN INDUSTRIES, LTD. (JP) 2005-05-31 — — US disclosed
US-6900003-B2 Photoresist processing aid and method SHIPLEY COMPANY, L.L.C. (US) 2005-05-31 — — US disclosed
US-20050107007-A1 Polishing pad process for producing the same and method of polishing ASAHI KASEI EMD CORPORATION (JP) 2005-05-19 — — US disclosed
US-6894749-B2 Reflection liquid crystal display NEC LCD TECHNOLOGIES, LTD. (JP) 2005-05-17 — — US disclosed
US-20050100833-A1 Reduced photolithography residues; using diphenyl oxide and antifoam agents ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. (US) 2005-05-12 — — US disclosed
EP-1530098-A2 Photoconductor image forming apparatus image forming process and process cartridge Ricoh Company (JP) 2005-05-11 — — EP disclosed
US-6887654-B2 Residue and scum reducing composition and method SHIPLEY COMPANY, L.L.C. (US) 2005-05-03 — — US disclosed
US-20050084231-A1 Fluorine-containing optical material containing fluorine-containing polymer having functional group capable of forming complex with rare earth metal ion DAIKIN INDUSTRIES, LTD. 2005-04-21 — — US disclosed
EP-0927911-B1 Photoimageable compositions containing photopolymerizable urethane oligomers NICHIGO MORTON CO LTD (JP) 2005-03-02 — — EP disclosed
US-20050042515-A1 Composition for protecting negative electrode for lithium metal battery, and lithium metal battery fabricated using same SAMSUNG SDI CO., LTD. (KR) 2005-02-24 — — US disclosed
CN-1580835-A Photosensitive resin composition QIMEI IND CO LTD (CN) 2005-02-16 — — CN disclosed
US-6855480-B2 Photoresist composition SHIPLEY COMPANY, L.L.C. (US) 2005-02-15 — — US disclosed
US-6853394-B2 Radiation-curable thermal printing ink and ink ribbons and methods of making, using and printing using the same SONY CHEMICALS CORPORATION OF AMERICA (US) 2005-02-08 — — US disclosed
US-6850263-B2 Methods of thermal transfer printing and thermal transfer printers SONY CHEMICALS CORPORATION OF AMERICA (US) 2005-02-01 — — US disclosed
EP-1498459-A1 FLUORINATED OPTICAL MATERIAL COMPRISING FLUOROPOLYMER HAVING FUNCTIONAL GROUP CAPABLE OF FORMING COMPLEX WITH RARE EARTH METAL ION Daikin Industries, Ltd. (JP) 2005-01-19 — — EP disclosed
EP-1496077-A1 NOVEL POLYETHER COMPOUND CONTAINING ACID GROUP AND UNSATURATED GROUP, PROCESS FOR PRODUCING THE SAME, AND RESIN COMPOSITION DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2005-01-12 — — EP disclosed
US-20050004253-A1 Nonlinear optical materials comprising fluorine-containing polymer DAIKIN INDUSTRIES, LTD 2005-01-06 — — US disclosed
US-20040253527-A1 Electrophotographic photoconductor, and image forming process, image forming apparatus and process cartridge for an image forming apparatus using the same RICOH COMPANY, LTD. (JP) 2004-12-16 — — US disclosed
CN-1554959-A Light sensitive resin composition for color filter 奇美实业股份有限公司 2004-12-15 — — CN disclosed
US-20040248024-A1 Electrophotographic photoconductor, and image forming process, image forming apparatus and process cartridge for an image forming apparatus using the same RICOH COMPANY, LTD. (JP) 2004-12-09 — — US disclosed
US-20040233355-A1 Reflection liquid crystal display NEC CORPORATION (JP) 2004-11-25 — — US disclosed
US-20040233356-A1 Method for producing a reflection liquid crystal display NEC CORPORATION (JP) 2004-11-25 — — US disclosed
US-6822712-B2 Reflection liquid crystal display, method for producing the same, and method for driving the same NEC CORPORATION (JP) 2004-11-23 — — US disclosed
US-6818375-B2 FOR MANUFACTURING PRINTED WIRING BOARDS ETERNAL TECHNOLOGY CORPORATION 2004-11-16 — — US disclosed
US-20040222960-A1 Method for driving a reflection liquid crystal display NEC CORPORATION (JP) 2004-11-11 — — US disclosed
US-20040224259-A1 Functionalized polymer SHIPLEY COMPANY, L.L.C. 2004-11-11 — — US disclosed
WO-2004091915-A2 METHODS OF THERMAL TRANSFER PRINTING AND THERMAL TRANSFER PRINTERS SONY CHEMICALS CORPORATION OF AMERICA (US) 2004-10-28 — — WO disclosed
EP-1469466-A2 Optical recording medium-producing sheet and optical recording medium Lintec Corporation (JP) 2004-10-20 — — EP disclosed
EP-1467403-A1 POLISHING PAD, PROCESS FOR PRODUCING THE SAME, AND METHOD OF POLISHING Asahi Kasei EMD Corporation (JP) 2004-10-13 — — EP disclosed
US-20040183235-A1 Method of manufacturing water-absorbing shaped body NIPPON SHOKUBAI CO., LTD. (JP) 2004-09-23 — — US disclosed
EP-0961170-B1 Aqueous developable photoimageable composition having improved adhesion and stripping characteristics NICHIGO MORTON CO LTD (JP) 2004-08-04 — — EP disclosed
US-20040146811-A1 filling a monomer solution into interstices of colloidal crystals for photopolymerization inside them; masking; not only more simplified two-dimensional patterns but also complicated two- or three-dimensional patterns can be obtained KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2004-07-29 — — US disclosed
US-20040147664-A1 Overcoat layer composition and organic photoreceptor using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-07-29 — — US disclosed
EP-1440984-A1 Method of manufacturing water-absorbing shaped body Nippon Shokubai Co., Ltd. (JP) 2004-07-28 — — EP disclosed
US-20040143056-A1 Overcoating composition and organic photoreceptor using the same SAMSUNG ELECTRONICS CO., LTD (KR) 2004-07-22 — — US disclosed
US-6759119-B2 HAVING EXCELLENT COATING FILM SMOOTHNESS, ELECTROMAGNETIC CHARACTERISTICS AND RUNNING DURABILITY; USING VINYL CHLORIDE COPOLYMERS OF DIFFERENT TYPES AS BINDER FOR THE NONMAGNETIC AND MAGNETIC LAYERS FUJI PHOTO FILM CO., LTD. (JP) 2004-07-06 — — US disclosed
EP-1429184-A1 Functionalized copolymer for photopolymerizable composition Shipley Company, L.L.C. (US) 2004-06-16 — — EP disclosed
US-20040101778-A1 Water soluble activators bonded to hydrophilic carriers selected from oligomers, polymers, plasticizers or surfactants, for use in light sensitive elements such as photoresists SHIPLEY COMPANY, L.L.C. 2004-05-27 — — US disclosed
EP-1406116-A1 NONLINEAR OPTICAL MATERIAL CONTAINING FLUOROPOLYMER Daikin Industries, Ltd. (JP) 2004-04-07 — — EP disclosed
US-20040063030-A1 Photoresist SHIPLEY COMPANY, L.L.C. (US) 2004-04-01 — — US disclosed
EP-1403709-A2 Photoinitiator Shipley Co. L.L.C. (US) 2004-03-31 — — EP disclosed
EP-1403708-A2 Photoresist Shipley Co. L.L.C. (US) 2004-03-31 — — EP disclosed
EP-1403668-A1 FLUORINE-CONTAINING MATERIAL FOR OPTICAL WAVEGUIDE Daikin Industries, Ltd. (JP) 2004-03-31 — — EP disclosed
US-20040052496-A1 Fluorine-containing material for optical waveguide DAIKIN INDUSTRIES, LTD. 2004-03-18 — — US disclosed
US-20040054030-A1 Ink for printing, printed matter, printing method and printer TOPPAN PRINTING CO., LTD. (JP) 2004-03-18 — — US disclosed
US-20040018453-A1 Photoresist processing aid and method SHIPLEY COMPANY, L.L.C. 2004-01-29 — — US disclosed
US-20040019176-A1 Curable fluoropolymer, curable resin composition containing the same, and antireflection film DAIKIN INDUSTRIES, LTD. (JP) 2004-01-29 — — US disclosed
US-20040012665-A1 Methods of thermal transfer printing and thermal transfer printers SONY CHEMICALS CORPORATION OF AMERICA 2004-01-22 — — US disclosed
EP-1375589-A1 OPTICAL MATERIAL CONTAINING FUNCTIONAL FLUOROPOLYMER Daikin Industries, Ltd. (JP) 2004-01-02 — — EP disclosed
US-20030215754-A1 Residue reducing stable concentrate SHIPLEY COMPANY, L.L.C. 2003-11-20 — — US disclosed
US-20030215755-A1 Residue and scum reducing composition and method SHIPLEY COMPANY, L.L.C. 2003-11-20 — — US disclosed
EP-1361480-A1 Residue reducing stable concentrate Shipley Co. L.L.C. (US) 2003-11-12 — — EP disclosed
EP-1359201-A1 INK FOR PRINTING, PRINTED MATTER, PRINTING METHOD, AND PRINTER Toppan Printing Co., Ltd (JP) 2003-11-05 — — EP disclosed
EP-0899091-B1 Transparent coated molded product and method for producing the same ASAHI GLASS CO LTD (JP) 2003-10-29 — — EP disclosed
US-20030199406-A1 A cleaning composition composed of a non-chelating organic acid, salt or ester thereof, and a chelating organic acid, salt or ester thereof that may be used to clean residue and scum from a substrate. The cleaning composition is suitable SHIPLEY COMPANY, L.L.C. (US) 2003-10-23 — — US disclosed
US-20030196685-A1 Cleaning composition and method SHIPLEY COMPANY, L.L.C. 2003-10-23 — — US disclosed
EP-0939109-B1 UV curable resin composition for coating FUJIKURA KASEI KK (JP) 2003-09-24 — — EP disclosed
EP-1347001-A1 CURABLE FLUOROPOLYMER, CURABLE RESIN COMPOSITION CONTAINING THE SAME, AND ANTIREFLECTION FILM Daikin Industries, Ltd. (JP) 2003-09-24 — — EP disclosed
US-20030162123-A1 Functionalized polymer SHIPLEY COMPANY, L.L.C. 2003-08-28 — — US disclosed
US-6610426-B2 Durability, smoothness, magnetic layer of uniform thickness, electromagnetic characteristics FUJI PHOTO FILM CO., LTD. (JP) 2003-08-26 — — US disclosed
EP-1336630-A2 Functionalized polymer Shipley Co. L.L.C. (US) 2003-08-20 — — EP disclosed
US-6608119-B2 Photo polymerization ink, comprising a colorant, a photo polymerization resin includes oligomer particles in emulsion state, a photoinitiator, and a polarizing solvent containing 2-pyrrolidone, N-acrylonitrile morpholine, SEIKO EPSON CORPORATION (JP) 2003-08-19 — — US disclosed
EP-1335016-A1 Cleaning composition Shipley Company LLC (US) 2003-08-13 — — EP disclosed
EP-1321510-A2 Cleaning composition and method Shipley Company LLC (US) 2003-06-25 — — EP disclosed
US-20030069347-A1 Calcined silica particle and manufacturing method of same NIPPON SHOKUBAI CO., LTD. (JP) 2003-04-10 — — US disclosed
US-20030064252-A1 Magnetic recording medium FUJI PHOTO FILM CO., INC. 2003-04-03 — — US disclosed
US-20030059709-A1 Photoresist composition SHIPLEY COMPANY, L.L.C. 2003-03-27 — — US disclosed
EP-0896328-B1 Information recording carrier and manufacturing method thereof VICTOR COMPANY OF JAPAN (JP) 2003-03-19 — — EP disclosed
US-6515869-B2 Supporting substrate for a semiconductor bare chip NEC CORPORATION (JP) 2003-02-04 — — US disclosed
US-20030020798-A1 Radiation-curable thermal printing ink and ink ribbons and methods of making, using and printing using the same TAYLOR JEFFREY F (US) 2003-01-30 — — US disclosed
US-20030022098-A1 Photoresist composition SHIPLEY COMPANY, L.L.C. 2003-01-30 — — US disclosed
US-6506823-B2 Protective coatings RAFFI & SWANSON, INCORPORATED 2003-01-14 — — US disclosed
US-6476840-B1 Radiation-curable thermal printing ink and ink ribbons and methods of making, using and printing using the same SONY CHEMICAL CORPORATION OF AMERICA 2002-11-05 — — US disclosed
EP-1251399-A2 Photoresist composition Shipley Company LLC (US) 2002-10-23 — — EP disclosed
US-20020137818-A1 Ink composition for solder resist KOLON INDUSTRIES INC. (KR) 2002-09-26 — — US disclosed
US-20020135714-A1 Optical diffusion element and display device equipped with the optical diffusion element FUJIFILM CORPORATION (JP) 2002-09-26 — — US disclosed
US-20020132885-A1 Nitrocellulose based coating compositions RAFFI & SWANSON, INC. 2002-09-19 — — US disclosed
US-20020132180-A1 Photoresist composition SHIPLEY COMPANY, L.L.C. (US) 2002-09-19 — — US disclosed
EP-1240023-A1 RADIATION-CURABLE THERMAL PRINTING INK AND INK RIBBONS, METHODS OF MAKING, USING AND PRINTING Sony Chemicals Corporation of America (US) 2002-09-18 — — EP disclosed
US-6447118-B1 CROSSLINKED POLYMER WITH FINELY DISPERSED METAL OXIDE PARTICLES; TRANSPARENCY, DIMENSIONAL STABILITY, ULTRAVIOLET RADIATION ABSORBANCY; CONTACT OR INTRAOCULAR LENSES; ARTIFICIAL CORNEAS MENICON CO., LTD. (JP) 2002-09-10 — — US disclosed
US-20020122957-A1 Magnetic recording medium FUJIFILM CORPORATION (JP) 2002-09-05 — — US disclosed
US-20020092610-A1 SUPPORTING SUBSTRATE TO BE BONDED WITH SEMICONDUCTOR BARE CHIP AND METHOD OF THERMOCOMPRESSION-BONDING THE SAME GODO KAISHA IP BRIDGE 1 (JP) 2002-07-18 — — US disclosed
EP-1209527-A1 Photoresist composition Shipley Company LLC (US) 2002-05-29 — — EP disclosed
EP-1209528-A1 Photoresist composition Shipley Co. L.L.C. (US) 2002-05-29 — — EP disclosed
US-6383641-B1 CURED INTERIOR LAYER FROM POLYFUNCTIONAL COMPOUND; EXTERIOR SILICA COATING CURED FROM POLYSILAZANE; WEAR RESISTANCE, WEATHERPROOF ASAHI GLASS COMPANY LTD. (JP) 2002-05-07 — — US disclosed
US-20020047965-A1 Reflection liquid crystal display, method for producing the same, and method for driving the same NEC CORPORATION 2002-04-25 — — US disclosed
US-6365771-B1 CURABLE VINYL ETHER OR METHACRYLATE DERIVATIVES OF 4,7 METHANOINDENE OR INDANE; PHOTORESISTS, OPTICS, AND COATINGS NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2002-04-02 — — US disclosed
US-20020024627-A1 Liquid crystal display device and method of manufacturing the same NEC CORPORATION (JP) 2002-02-28 — — US disclosed
WO-2002009944-A1 RADIATION-CURABLE THERMAL PRINTING INK AND INK RIBBONS, METHODS OF MAKING, USING AND PRINTING SONY CHEMICALS CORPORATION OF AMERICA (US) 2002-02-07 — — WO disclosed
EP-0716102-B1 TRANSPARENT PLASTIC MATERIAL, OPTICAL ARTICLE MADE THEREFROM, AND PRODUCTION PROCESS SEIKO EPSON CORP (JP) 2002-02-06 — — EP disclosed
EP-1172423-A1 WATER-BASED INK, PROCESS FOR PRODUCING THE SAME, AND METHOD OF PRINTING WITH THE SAME SEIKO EPSON CORPORATION (JP) 2002-01-16 — — EP disclosed
US-6329123-B1 A PHOTOPOLYMERIZABLE ACRYLATE-FUNCTIONAL URETHANE OLIGOMER, WHEREIN THE ACRYLATE FUNCTIONALITY IS SEPARATED FROM THE URETHANE LINKAGE BY AT LEAST TWO ALKYLENE OXIDE GROUPS AND AT LEAST ONE RING-OPENED LACTONE GROUP; NEGATIVE; PRINTED CIRCUIT MORTON INTERNATIONAL INC. 2001-12-11 — — US disclosed
US-20010047044-A1 Water-base ink, method of manufacturing the ink, and method of printing using the ink SEIKO EPSON CORPORATION (JP) 2001-11-29 — — US disclosed
EP-0822608-B1 Polymeric solid electrolyte and lithium secondary cell adopting the same SAMSUNG ELECTRONICS CO LTD (KR) 2001-11-28 — — EP disclosed
US-6322951-B1 PHOTOPOLYMERIZABLE COMPONENT COMPRISES A (METH)ACRYLATE FUNCTIONAL URETHANE OLIGOMER SEPARATED FROM THE URETHANE LINKAGE BY AT LEAST TWO ALKYLENE OXIDE GROUPS AND AT LEAST ONE RING-OPENED LACTONE GROUP FOR IMPROVED FLEXIBILITY NORTON INTERNATIONAL, INC. 2001-11-27 — — US disclosed
US-6319653-B1 FOR DRY FILM PHOTORESISTS USEFUL IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS MORTON INTERNATIONAL INC. 2001-11-20 — — US disclosed
US-6303730-B1 NONHYDROLYTIC CONDENSATION OF CHLOROSILANES WITH POLYMERIZABLE GROUPS AND OPTIONALLY FLUORINATED GROUPS, WITH THE HELP OF A CONDENSATION AGENT AND THERMAL AND/OR PHOTOCHEMICAL POLYMERIZATION OF THE OBTAINED CONDENSATION PRODUCT INSTITUT FUR NEUE MATERIALIEN GEMEINNUTZIGE GMBH (DE) 2001-10-16 — — US disclosed
US-20010026344-A1 Liquid crystal display device and method of manufacturing the same NEC CORPORATION (JP) 2001-10-04 — — US disclosed
CN-1311458-A Photosensitive resin composition QIMEI IND CO LTD (CN) 2001-09-05 — — CN disclosed
US-20010008691-A1 UV CURABLE RESIN COMPOSITION FOR COATING FUJIKURA KASEI CO., LTD. (JP) 2001-07-19 — — US disclosed
EP-1112995-A1 ALICYCLIC COMPOUNDS AND CURABLE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2001-07-04 — — EP disclosed
CN-1301993-A Photosensitive resin composition QIMEI IND CO LTD (CN) 2001-07-04 — — CN disclosed
EP-1107336-A2 Nonaqueous electrolyte battery SONY CORPORATION (JP) 2001-06-13 — — EP disclosed
US-6207347-B1 URETHANE BIURET OLIGOMER. NICHIGO-MORTON CO. LTD. (JP) 2001-03-27 — — US disclosed
US-6203723-B1 Microencapsulated liquid crystal having multidomains induced by the polymer network and method HSU YING YEN (US) 2001-03-20 — — US disclosed
US-6177976-B1 Liquid crystal display NEC CORPORATION (JP) 2001-01-23 — — US disclosed
US-6166245-A Photoimageable compositions having improved chemical resistance and stripping ability SHIPLEY COMPANY, L.L.C. (US) 2000-12-26 — — US disclosed
US-6160604-A Liquid crystal display with pixel electrode having aperture containing additional electrode NEC CORPORATION (JP) 2000-12-12 — — US disclosed
EP-1054269-A2 Optical water-absorptive gel and ophthalmic material using the same Menicon Co., Ltd. (JP) 2000-11-22 — — EP disclosed
US-6083597-A Information recording carrier and manufacturing method thereof VICTOR COMPANY OF JAPAN, LTD. (JP) 2000-07-04 — — US disclosed
EP-1008911-A1 Photoimageable compositions having improved flexibility and stripping ability Shipley Company LLC (US) 2000-06-14 — — EP disclosed
EP-1008912-A1 Photoimageable compositions having improved chemical resistance and stripping ability Shipley Company LLC (US) 2000-06-14 — — EP disclosed
EP-1008910-A1 Photoimageable compositions having improved stripping ability and resolution Shipley Company LLC (US) 2000-06-14 — — EP disclosed
US-6054252-A NEGATIVES; DRY FILM PHOTORESIST MORTON INTERNATIONAL, INC. (US) 2000-04-25 — — US disclosed
US-6045973-A AN ACID-FUNCTIONAL BINDER POLYMER FOR USE IN ALKALINE DEVELOPING SOLUTIONS, ACID ETCHING SOLUTIONS, AND ACID PLATING BATHS MORTON INTERNATIONAL, INC. (US) 2000-04-04 — — US disclosed
US-6042682-A Method of thermocompression bonding a supporting substrate to a semiconductor bare chip NEC CORPORATION (JP) 2000-03-28 — — US disclosed
US-6004725-A IMPROVED ADHESION AND RESOLUTION, NEGATIVE ACTING, ACRYLATE FUNCTIONAL ISOCYANATE TRIMER MORTON INTERNATIONAL, INC. (US) 1999-12-21 — — US disclosed
EP-0962827-A2 Photoimageable composition having improved photoinitiator system Nichigo-Morton Co Ltd (JP) 1999-12-08 — — EP disclosed
EP-0961171-A1 Photoimageable composition having improved flexibility Nichigo-Morton Co Ltd (JP) 1999-12-01 — — EP disclosed
EP-0961170-A1 Aqueous developable photoimageable composition having improved adhesion and stripping characteristics Nichigo-Morton Co Ltd (JP) 1999-12-01 — — EP disclosed
US-5965300-A MIXING MONOMERS SUCH AS (METH)ACRYLAMIDES A CROSSLINKING AGENT, POLYMERIZATION INITIATOR AND ELECTROLYTE SOLUTION CONTAINING LITHIUM SALT AND SOLVENT, ADDING THE MIXTURE TO POLYVINYLIDENE AND /OR N,N-DIALKYLACRYLAMIDE; POLYMERIZING SAMSUNG ELECTROONICS CO., LTD. (KR) 1999-10-12 — — US disclosed
US-5963290-A Liquid crystal display NEC CORPORATION (JP) 1999-10-05 — — US disclosed
US-5959707-A Liquid crystal display having domains with different tilted-up directions as well as domains with different twist directions of lc molecules NEC CORPORATION (JP) 1999-09-28 — — US disclosed
US-5952126-A COPOLYMER OF A (METH)ACRYLAMIDE MONOMER AND A CROSSLINKING AGENT COMPRISING A DI(METH)ACRYLATE ENDCAPPED ETHYLENE GLYCOL HAVING 3-30 REPEATING ETHYLENE OXIDE UNITS; NONLEAKING, EXCELLENT CONDUCTIVITY, EASILY PROCESSED SAMSUNG ELECTRONICS CO., LTD. (KR) 1999-09-14 — — US disclosed
US-5952154-A NEGATIVE-ACTING PHOTORESISTS USE IN PRINTED CIRCUITS; COMPRISING AN ADDITION-POLYMERIZEABLE, NON-GASEOUS ETHYLENICALLY UNSATURATED COMPOUNDS CAPABLE FORMING A POLYMER BY FREE-RADICAL INITIATED CHAIN-PROPAGATION MORTON INTERNATIONAL, INC. (US) 1999-09-14 — — US disclosed
EP-0939109-A1 UV curable resin composition for coating FUJIKURA KASEI CO., LTD. (JP) 1999-09-01 — — EP disclosed
US-5939238-A Photoimageable composition having improved photoinitiator system MORTON INTERNATIONAL, INC. (US) 1999-08-17 — — US disclosed
EP-0927911-A2 Photoimageable compositions containing photopolymerizable urethane oligomers Nichigo-Morton Co Ltd (JP) 1999-07-07 — — EP disclosed
EP-0899091-A2 Transparent coated molded product and method for producing the same Asahi Glass Company Ltd. (JP) 1999-03-03 — — EP disclosed
EP-0896968-A1 MODIFIED COPOLYMER, PROCESS FOR PREPARING THE SAME, AND CURABLE RESIN COMPOSITION DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 1999-02-17 — — EP disclosed
EP-0896328-A1 Information recording carrier and manufacturing method thereof VICTOR COMPANY OF JAPAN, LTD. (JP) 1999-02-10 — — EP disclosed
US-5869548-A POROUS CERAMIC BLOCK HAVING BEEN SURFACE TREATED WITH COUPLING AGENT AND IMPREGNATED WITH RESIN BY IN SITU POLYMERIZATION GC DENTAL PRODUCTS CORPORATION (JP) 1999-02-09 — — US disclosed
US-5792822-A COMPRISING A METAL COMPLEXES AS ULTRAVIOLET LIGHT ADSORBER AND BLOCKING AGENT; RADIATION RESISTANCE, LIGHTWEIGHT, STABILITY; EYEGLASS LENS, CONTACT LENS, DISPLAY FILTER SEIKO EPSON CORPORATION (JP) 1998-08-11 — — US disclosed
EP-0683174-B1 Thioether containing photopolymerizable compositions EASTMAN KODAK CO (US) 1998-08-05 — — EP disclosed
EP-0611754-B1 Dimerized thiourea derivatives, near-infrared absorbents comprising the same, and heat wave shielding materials comprising the same JUJO PAPER CO LTD (JP) 1998-04-22 — — EP disclosed
US-5723075-A HEAT RESISTANT ABSORBERS WITH RESINS FOR SHIELDS NIPPON PAPER INDUSTRIES CO., LTD. (JP) 1998-03-03 — — US disclosed
EP-0822608-A2 Polymeric solid electrolyte and lithium secondary cell adopting the same Samsung Electronics Co., Ltd. (KR) 1998-02-04 — — EP disclosed
EP-0805373-A2 Liquid crystal display NEC CORPORATION (JP) 1997-11-05 — — EP disclosed
EP-0745620-B1 Polymerisable compositions based on thio(meth)acrylate monomers, polymers having low yellowness index made from these compositions and ophthalmic lenses made therefrom ESSILOR INT (FR) 1997-10-29 — — EP disclosed
EP-0803241-A2 Dental material GC Dental Products Corporation (JP) 1997-10-29 — — EP disclosed
US-5629066-A A COATED RESIN LAYER COVERING THE SURFACE OF FILM OR SHEET, IS MADE OF AN AMINO GROUP CONTAINING POLYMER AND/OR A POLYMER OF METHACRYLATE OF ISOCYANURIC ACID, HAVING AN EXPOSED SURFACE QUATERNIZED WITH ALKYL SULFATE OR SULFONATES TEIJIN LIMITED (JP) 1997-05-13 — — US disclosed
EP-0507633-B1 Curable coating resin composition and information recording medium using the same MITSUI PETROCHEMICAL IND (JP) 1997-03-12 — — EP disclosed
EP-0745620-A1 Polymerisable compositions based on thio(meth)acrylate monomers, polymers having low yellowness index made from these compositions and ophthalmic lenses made therefrom ESSILOR INTERNATIONAL COMPAGNIE GENERALE D'OPTIQUE (FR) 1996-12-04 — — EP disclosed
US-5545281-A FORMING METAL BUMPS ON SURFACE; COVERING WITH RADIATION CURABLE RESIN; PATTERNING; THERMOCOMPRESSION NEC CORPORATION (JP) 1996-08-13 — — US disclosed
US-5532286-A BONDING STRENGTH EASTMAN KODAK COMPANY (US) 1996-07-02 — — US disclosed
EP-0716102-A1 TRANSPARENT PLASTIC MATERIAL, OPTICAL ARTICLE MADE THEREFROM, AND PRODUCTION PROCESS SEIKO EPSON CORPORATION (JP) 1996-06-12 — — EP disclosed
US-5518789-A ACRYLIC ESTER OR AMIDE, OPTICAL RECORDING EASTMAN KODAK COMPANY (US) 1996-05-21 — — US disclosed
EP-0488231-B1 Sulfur compound-coordinate bonded organic coloring matter, compositions of same, and photorecording media containing same TEIJIN LTD (JP) 1996-05-01 — — EP disclosed
EP-0544294-B1 Method of bonding circuit boards NEC CORP (JP) 1996-02-28 — — EP disclosed
EP-0519420-B1 Resin article having anti-static property TEIJIN LTD (JP) 1995-12-20 — — EP disclosed
EP-0353924-B1 Method of forming photosetting film NIPPON PETROCHEMICALS CO LTD (JP) 1995-11-22 — — EP disclosed
EP-0683174-A2 Thioether containing photopolymerizable compositions EASTMAN KODAK COMPANY (US) 1995-11-22 — — EP disclosed
US-5439956-A Blend of a vinylester of an urethaned epoxy resins, acrylic diluent, photoinitiator and an epoxy curing agent CANON KABUSHIKI KAISHA (JP) 1995-08-08 — — US disclosed
EP-0378144-B1 Photocurable compositions CIBA GEIGY AG (CH) 1995-03-08 — — EP disclosed
US-5380772-A Modelling liquid for dental porcelain G-C TOSHI KOGYO CORPORATION (JP) 1995-01-10 — — US disclosed
EP-0611754-A1 Dimerized thiourea derivatives, near-infrared absorbents comprising the same, and heat wave shielding materials comprising the same NIPPON PAPER INDUSTRIES CO., LTD. (JP) 1994-08-24 — — EP disclosed
US-5318651-A Applying light-sensitive adhesive, selectively exposing, removing portions, heat treating to impact bond, thermo compressing to form single circuit board NEC CORPORATION (JP) 1994-06-07 — — US disclosed
US-5300558-A Urethane meth(acrylate), alcohol solvent, pentavalent phosphoryl compound, polymerization initiator; wear resistance MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1994-04-05 — — US disclosed
US-5268478-A Radiation resistance to ultraviolet rays TEIJIN LIMITED (JP) 1993-12-07 — — US disclosed
EP-0544294-A2 Method of bonding circuit boards NEC CORPORATION (JP) 1993-06-02 — — EP disclosed
EP-0519420-A1 Resin article having anti-static property TEIJIN LIMITED (JP) 1992-12-23 — — EP disclosed
EP-0507633-A2 Curable coating resin composition and information recording medium using the same MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1992-10-07 — — EP disclosed
US-5137936-A Method for packaging electronic parts and adhesive for use in said method MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1992-08-11 — — US disclosed
EP-0488231-A1 Sulfur compound-coordinate bonded organic coloring matter, compositions of same, and photorecording media containing same TEIJIN LIMITED (JP) 1992-06-03 — — EP disclosed
EP-0153700-B1 METHOD FOR CURING ORGANOPOLYSILOXANE COMPOSITIONS AND THE COMPOSITIONS Toray Silicone Company Limited (JP) 1992-01-02 — — EP disclosed
US-5057400-A METHOD OF FORMING PHOTOSETTING FILM NIPPON PETROCHEMICAL CO., LTD. (JP) 1991-10-15 — — US disclosed
US-5054872-A POLYMERIC OPTICAL WAVEGUIDES AND METHODS OF FORMING THE SAME IBM CORPORATION (US) 1991-10-08 — — US disclosed
EP-0446672-A1 Polymeric optical waveguides and methods of forming the same International Business Machines Corporation (US) 1991-09-18 — — EP disclosed
EP-0353924-A2 Method of forming photosetting film NIPPON PETROCHEMICALS COMPANY, LIMITED (JP) 1990-02-07 — — EP disclosed
EP-0295944-A2 Photosensitive resin composition and printing plate prepared therefrom NAPP SYSTEMS (USA) INC. (US) 1988-12-21 — — EP disclosed
EP-0146130-B1 GLYCIDYL COMPOUND AND PROCESS FOR PREPARING THE SAME KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1988-10-26 — — EP disclosed
US-4774163-A LITHOGRAPHIC PRINTING PLATES FUJI PHOTO FILM CO., LTD. (JP) 1988-09-27 — — US disclosed
US-4721703-A Sublimation transfer system color hard copy printing paper SONY CORPORATION (JP) 1988-01-26 — — US disclosed
US-4709062-A Glycidyl compound KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1987-11-24 — — US disclosed
US-4707431-A MULTILAYER, LIGHT CURABLE ACRYLATE MONOMER RICOH CO., LTD. (JP) 1987-11-17 — — US disclosed
EP-0114581-B1 REACTIVE POLYMERS FOR DERMAL AND TRANSDERMAL THERAPY SOGIMI S.r.l. (IT) 1987-08-26 — — EP disclosed
EP-0226153-A2 Ionic polymers BASF Aktiengesellschaft (DE) 1987-06-24 — — EP disclosed
US-4671978-A PROTECTIVE COATING AROUND CENTRAL CIRCULAR HOLE COMPRISING RADIATION POLY,ERIZED POLYMER AND MATTING AGENT FUJI PHOTO FILM CO., LTD. (JP) 1987-06-09 — — US disclosed
US-4614705-A UNDER LAYER OF RADIATION-CURED DIACRYLATE; SOLVENT RESISTANCE RICOH CO., LTD. (JP) 1986-09-30 — — US disclosed
US-4611892-A Synthetic resin ophthalmic lens having a surface hard coat SEIKO EPSON CORPORATION (JP) 1986-09-16 — — US disclosed
US-4560555-A CROSSLINKABLE POLYURETHANES BONDING TO PROTEIN OF SKIN SOGIMI S.R.L. (IT) 1985-12-24 — — US disclosed
EP-0059970-B1 EMBEDDING MEDIUM SUITABLE FOR THE PREPARATION OF THIN SECTIONS OF EMBEDDED BIOLOGICAL MATERIALS Chemische Werke Lowi GmbH (DE) 1985-07-24 — — EP disclosed
EP-0146130-A2 Glycidyl compound and process for preparing the same KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1985-06-26 — — EP disclosed
US-4501588-A Instant thread dyeing method for sewing machine JANOME SEWING MACHINE INDUSTRY CO., LTD. (JP) 1985-02-26 — — US disclosed
EP-0111011-A1 PHOTOGRAPHIC PAPER FOR USE IN SUBLIMATION TRANSFER COLOR HARD COPYING SONY CORPORATION (JP) 1984-06-20 — — EP disclosed
US-4424329-A ALKYL AND/OR HYDROXYALKYL ACRYLATES, TRIETHYLENE GLYCOL DIMETHACRYLATE CHEMISCHE WERKE LOWI G.M.B.H. (DE) 1984-01-03 — — US disclosed
US-4419438-A PHOTOCHROMIC COMPOUND, FREE RADICALS, UNSATURATED MONOMER, ACTINIC RADIATION ABSORBER TOYO BOSEKI KABUSHIKI KAISHA (JP) 1983-12-06 — — US disclosed
US-4368312-A FOR STUDY UNDER A MICROSCOPE CHEMISCHE WERKE LOWI G.M.B.H. (DE) 1983-01-11 — — US disclosed
EP-0059970-A1 Embedding medium suitable for the preparation of thin sections of embedded biological materials Chemische Werke Lowi GmbH (DE) 1982-09-15 — — EP disclosed
US-4348427-A Coating method and composition ANIC, S.P.A. (IT) 1982-09-07 — — US disclosed
US-4231742-A Manufacture and use of heat transfer printings MICHAEL HUBER MUNCHEN, GMBH (DE) 1980-11-04 — — US disclosed
US-4201442-A Liquid crystal switching coupler matrix SPERRY CORPORATION (US) 1980-05-06 — — US disclosed
US-4118366-A Compositions for the production of opaque coatings by radiation BASF FARBEN & FASERN AG (DE) 1978-10-03 — — US disclosed
US-4111692-A ALIPHATIC NITROGEN COMPOUND, HALOGEN COMPOUND AS FREE RADICAL GENERATOR TOYO BOSEKI KABUSHIKI KAISHA (JP) 1978-09-05 — — US disclosed
US-4018333-A Metal fastener sticks and process of preparing same by curing polymeric binder for said under conditions of U.V. irradiation STEPAN CHEMICAL COMPANY (US) 1977-04-19 — — US disclosed
US-3984584-A Opaque coatings and films produced by the hardening of synthetic resins with light BASF FARBEN & FASERN AKTIENGESELLSCHAFT 1976-10-05 — — US disclosed
US-3980483-A Photocurable composition NIPPON OIL SEAL INDUSTRY CO., LTD. (JA) 1976-09-14 — — US disclosed
US-3980483-A Photocurable composition NIPPON OIL SEAL INDUSTRY CO., LTD. (JA) 1976-09-14 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (26 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12631960-B2 Photosensitive resin composition, photosensitive resin film using same, color filter, and display device TAS1R1, TAS1R2, TAS1R3 LMNA 2916/4885CES2 1442/4885CES1 1784/4885
US-20190271924-A1 PHOTOCONDUCTOR HAVING AN OVERCOAT WITH TETRAFUNCTIONAL RADICAL POLYERMIZABLE CHARGE TRANSPORT MOLECULE AND NON-RADICAL POLYMERIZABLE ADDITIVE DRD4, TIPRL, SRP54 LMNA 4422/4885CES2 640/4885CES1 4068/4885
US-20190271923-A1 OVERCOAT FOR A PHOTOCONDUCTOR WITH TETRAFUNCTIONAL RADICAL POLYMERIZABLE CHARGE TRANSPORT MOLECULE HAVING HYDROGEN SLC43A1, DRD4, SLC7A5 LMNA 4363/4885CES2 739/4885CES1 3747/4885
US-20190284134-A1 SULFONIUM SALT, HEAT- OR PHOTO-ACID GENERATOR, HEAT- OR PHOTO-CURABLE COMPOSITION, AND CURED PRODUCT THEREOF TST, MPST, ASIC1 LMNA 4781/4885CES2 3876/4885CES1 3442/4885
US-11370751-B2 Sulfonium salt, heat- or photo-acid generator, heat- or photo-curable composition, and cured product thereof TST, MPST, ASIC1 LMNA 4781/4885CES2 3876/4885CES1 3442/4885
US-10138307-B2 Antimicrobial polymer PUF60, PARG, DPM1 LMNA 3607/4885CES2 3630/4885CES1 4632/4885
US-20150342320-A1 ARTIFICIAL NAIL COMPOSITION, ARTIFICIAL NAIL, METHOD FOR FORMING ARTIFICIAL NAIL, METHOD FOR REMOVING ARTIFICIAL NAIL, AND NAIL ART KIT POLR1C, PIK3C3, PRKDC LMNA 2127/4885CES2 4781/4885CES1 4824/4885
US-20180171038-A1 CURABLE COMPOSITION KAT2B, ACR, GK LMNA 861/4885CES2 1185/4885CES1 2138/4885
US-20150352032-A1 ARTIFICIAL NAIL COMPOSITION, ARTIFICIAL NAIL, METHOD FOR FORMING ARTIFICIAL NAIL, AND NAIL ART KIT NACA, PIK3C3, POLR1C LMNA 3617/4885CES2 4834/4885CES1 4871/4885
US-10331051-B2 Method to make a photoconductor having an overcoat with tetrafunctional radical polymerizable charge transport molecule SLC43A1, SLC7A5, RFT1 LMNA 4650/4885CES2 983/4885CES1 4079/4885
US-20160184213-A1 ARTIFICIAL NAIL COMPOSITION, ARTIFICIAL NAIL, ARTIFICIAL NAIL FORMING METHOD, AND NAIL ART KIT PIK3C3, POLR1C, PRKDC LMNA 2360/4885CES2 4663/4885CES1 4861/4885
US-20090234089-A1 Hydrophilic Polysiloxane Macromonomer, and Production and Use of the same HAO2, RAD54L, UFL1 LMNA 757/4885CES2 2940/4885CES1 3075/4885
US-20210283022-A1 PHOTOPOLYMERIZATION INITIATOR COMPRISING AN ARYLIODONIUM SALT FOR DENTAL PHOTOCURABLE COMPOSITIONS PHF6, BRD1, BRPF3 LMNA 3679/4885CES2 2198/4885CES1 3397/4885
US-20190271925-A1 CHARGE TRANSPORT MOLECULE HAVING HYDROGEN FOR AN OVERCOAT OF A PHOTOCONDUCTOR SLC43A1, SLC46A1, SLC3A2 LMNA 4409/4885CES2 740/4885CES1 3973/4885
US-10611856-B2 Curable composition ACR, KAT2B, KAT5 LMNA 618/4885CES2 845/4885CES1 1668/4885
US-10761443-B2 Charge transport molecule having hydrogen for an overcoat of a photoconductor SLC43A1, SLC46A1, SLC3A2 LMNA 4409/4885CES2 740/4885CES1 3973/4885
US-11779524-B2 Photopolymerization initiator comprising an aryliodonium salt for dental photocurable compositions PHF6, BRD1, BRD7 LMNA 3667/4885CES2 2963/4885CES1 3953/4885
US-20260121223-A1 SEPARATOR FOR RECHARGEABLE LITHIUM BATTERY AND RECHARGEABLE LITHIUM BATTERY INCLUDING THE SAME HAO2, KAT2A, RAD23B LMNA 3532/4885CES2 346/4885CES1 2988/4885
US-12563644-B2 Wiring sheet, and sheet-like heater SCN1B, SCN1A, SCN2B LMNA 1391/4885CES2 3816/4885CES1 3997/4885
US-20190300476-A1 SULFONIUM SALT, PHOTOACID GENERATOR, PHOTOCURABLE COMPOSITION, AND CURED PRODUCT THEREOF ASIC1, TST, SPIN2B LMNA 4021/4885CES2 1640/4885CES1 2216/4885
US-10683266-B2 Sulfonium salt, photoacid generator, photocurable composition, and cured product thereof ASIC1, TST, SPIN2B LMNA 4021/4885CES2 1640/4885CES1 2216/4885
US-20160030294-A1 DENTAL CONDITIONING COMPOSITION DSG1, H1-10, H1-5 LMNA 3962/4885CES2 3024/4885CES1 4055/4885
US-10732528-B2 Overcoat for a photoconductor with tetrafunctional radical polymerizable charge transport molecule having hydrogen SLC43A1, DRD4, SLC7A5 LMNA 4363/4885CES2 739/4885CES1 3747/4885
US-20260001985-A1 RESIN COMPOSITION, BINDER RESIN, POLYMER THIN FILM AND BATTERY TAF1, ARCN1, TAF1L LMNA 1846/4885CES2 1495/4885CES1 1623/4885
US-12562435-B2 Separator for lithium secondary battery, and lithium secondary battery comprising same AS3MT, ILK, CD44 LMNA 1095/4885CES2 216/4885CES1 3628/4885
US-20150368380-A1 ANTIMICROBIAL POLYMER PUF60, PARG, DPM1 LMNA 3607/4885CES2 3630/4885CES1 4632/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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