SCHEMBL94506

SCHEMBL94506

CCCC(C)(C)OO[C](C)C

nearest known ligand 0.30

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.30
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9820415 0.81 GAA (0.37) LMNAHSD17B10
SCHEMBL4271612 0.79 TSHR (0.41)
SCHEMBL96705 0.78 TSHR (0.35) LMNAHSD17B10
SCHEMBL7025612 0.76 LMNA (0.36) LMNAHSD17B10
SCHEMBL12140595 0.75 LMNA (0.35) LMNAHSD17B10
SCHEMBL27338281 0.75 ALDH1A1 (0.36) LMNAHSD17B10
SCHEMBL4432964 0.74
SCHEMBL28476790 0.73 GAA (0.34) LMNAHSD17B10
SCHEMBL27338275 0.73 ALDH1A1 (0.44) LMNAHSD17B10
SCHEMBL27338230 0.73 LMNA (0.34) LMNAHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1229 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12018139-B2 Use of a mixture of organic peroxides for crosslinking a polyolefin elastomer ARKEMA FRANCE (FR) 2024-06-25 US claimed
US-20230323114-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF KANEKA CORPORATION (JP) 2023-10-12 US claimed
EP-4183828-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF Kaneka Corporation (JP) 2023-05-24 EP claimed
CN-115803381-A Aliphatic polyester resin composition and use thereof 株式会社钟化 2023-03-14 CN claimed
CN-113121825-B Poly (arylene ether) resin and preparation method thereof 山东圣泉新材料股份有限公司 2022-09-27 CN claimed
US-20210403701-A1 CURABLE RESIN COMPOSITION, AND FILM, MOLDED ARTICLE, PREPREG, AND FIBER-REINFORCED PLASTIC USING SAID CURABLE RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2021-12-30 US claimed
US-20200385545-A1 USE OF A MIXTURE OF ORGANIC PEROXIDES FOR CROSSLINKING A POLYOLEFIN ELASTOMER ARKEMA FRANCE (FR) 2020-12-10 US claimed
EP-3279226-B1 METHOD FOR PREPARING AROMATIC VINYL-UNSATURATED NITRILE-BASED COPOLYMER LG CHEMICAL LTD (KR) 2020-12-02 EP claimed
CN-105934478-B Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element 日立化成株式会社 2020-01-14 CN claimed
US-10519262-B2 Method of preparing aromatic vinyl-unsaturated nitrile-based copolymer and aromatic vinyl-unsaturated nitrile-based copolymer prepared using the same LG CHEM, LTD. (KR) 2019-12-31 US claimed
US-10308747-B2 Modified polypropylene-based resin, polypropylene-based resin expanded sheet, expanded resin-made container, and method for producing modified polypropylene-based resin SEKISUI PLASTICS CO., LTD. (JP) 2019-06-04 US claimed
US-20180142049-A1 METHOD OF PREPARING AROMATIC VINYL-UNSATURATED NITRILE-BASED COPOLYMER AND AROMATIC VINYL-UNSATURATED NITRILE-BASED COPOLYMER PREPARED USING THE SAME LG CHEM, LTD. (KR) 2018-05-24 US claimed
EP-3279226-A1 METHOD FOR PREPARING AROMATIC VINYL-UNSATURATED NITRILE-BASED COPOLYMER AND AROMATIC VINYL-UNSATURATED NITRILE-BASED COPOLYMER PREPARED THEREBY LG Chem, Ltd. (KR) 2018-02-07 EP claimed
US-9487682-B2 Curable resin composition, cured product thereof, laminate, and method for producing laminate MITSUBISHI RAYON CO., LTD. (JP) 2016-11-08 US claimed
US-20140120358-A1 Curable Resin Composition, Cured Product Thereof, Laminate, and Method For Producing Laminate MITSUBISHI RAYON CO., LTD. (JP) 2014-05-01 US claimed
US-20120157656-A1 POLYALKYLENE GLYCOL-BASED POLYMER AND PROCESS FOR PRODUCING THE SAME NIPPON SHOKUBAI CO, LTD (JP) 2012-06-21 US claimed
EP-0908450-B1 Novel polyfunctional peroxides, vinyl monomer polymerization initiators comprising the same and process for polymerizing vinyl monomers employing the same NOF CORP (JP) 2003-05-07 EP claimed
US-6111042-A HIGH POLYMERIZATION INITIATION EFFICIENCY NOF CORPORATION (JP) 2000-08-29 US claimed
EP-0908450-A2 Novel polyfunctional peroxides, vinyl monomer polymerization initiators comprising the same and process for polymerizing vinyl monomers employing the same NOF CORPORATION (JP) 1999-04-14 EP claimed
US-12043734-B2 Sheet-form insulating varnish and producing method therefor, electrical device, and rotary electric machine MITSUBISHI ELECTRIC CORPORATION (JP) 2024-07-23 US disclosed
WO-2024150766-A1 ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE 株式会社レゾナック 2024-07-18 WO disclosed
WO-2024150762-A1 ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE 株式会社レゾナック 2024-07-18 WO disclosed
WO-2024150767-A1 ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE 株式会社レゾナック 2024-07-18 WO disclosed
WO-2024150765-A1 ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE 株式会社レゾナック 2024-07-18 WO disclosed
US-12040491-B2 Binder for a secondary battery electrode and use thereof TOAGOSEI CO. LTD. (JP) 2024-07-16 US disclosed
CN-118339207-A Polymer emulsion, method for storing same, two-part thermosetting resin composition using same, resin cured film, and coating film 株式会社力森诺科 2024-07-12 CN disclosed
CN-118339216-A Silsesquioxane derivative, curable composition, hard coating agent, cured product, hard coating, and substrate 东亚合成株式会社 2024-07-12 CN disclosed
US-20240227256-A1 THERMOSETTING COMPOSITION FOR INJECTION MOLDING, METHOD FOR PRODUCING MOLDED ARTICLE USING THE SAME, AND CURED PRODUCT IDEMITSU KOSAN CO.,LTD. (JP) 2024-07-11 US disclosed
WO-2024147336-A1 POLYMER BLEND, CROSSLINKABLE COMPOSITION, AND ARTICLE ダイキン工業株式会社 2024-07-11 WO disclosed
CN-115003708-B Cured product, curable resin composition, optical member, lens, diffractive optical element, multilayer diffractive optical element, and compound 富士胶片株式会社 2024-07-09 CN disclosed
WO-2024143285-A1 COPOLYMER RUBBER, RUBBER COMPOSITION, AND CROSSLINKED RUBBER 日本ゼオン株式会社 2024-07-04 WO disclosed
WO-2024143341-A1 ADHESIVE TAPE 積水化学工業株式会社 2024-07-04 WO disclosed
US-12027666-B2 Electrolyte composition, electrolyte film, and method of manufacturing electrolyte film NIPPON SHOKUBAI CO., LTD. (JP) 2024-07-02 US disclosed
US-20240209182-A1 HARDENER, ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE RESONAC CORPORATION (JP) 2024-06-27 US disclosed
US-20240208116-A1 THERMOSETTING COMPOSITION FOR INJECTION MOLDING, METHOD FOR PRODUCING MOLDED ARTICLE USING THE SAME, AND CURED PRODUCT IDEMITSU KOSAN CO.,LTD. (JP) 2024-06-27 US disclosed
WO-2024135442-A1 POLYMERIZABLE COMPOSITION 株式会社レゾナック 2024-06-27 WO disclosed
WO-2024135615-A1 ELECTROLYTE COMPOSITION, ELECTROLYTE CURED ARTICLE OBTAINED BY CURING SAME, ELECTRODE, AND SECONDARY BATTERY 株式会社日本触媒 2024-06-27 WO disclosed
CN-114213333-B Thiol compound, method for synthesizing same, and use of thiol compound 四国化成工业株式会社 2024-06-25 CN disclosed
US-12018139-B2 Use of a mixture of organic peroxides for crosslinking a polyolefin elastomer ARKEMA FRANCE (FR) 2024-06-25 US disclosed
US-20240199782-A1 THERMOSETTING COMPOSITION, METHOD FOR PRODUCING MOLDED ARTICLE USING THE SAME, AND CURED PRODUCT IDEMITSU KOSAN CO.,LTD. (JP) 2024-06-20 US disclosed
WO-2024126332-A1 SACRIFICIAL ADDITIVELY MANUFACTURED MOLD WITH CONTROLLED MOISTURE AND LIQUID ABSORPTION PROPERTIES NEXA3D APS (DK) 2024-06-20 WO disclosed
CN-118202006-A Resin composition, cured product, optical member, ultraviolet absorber, compound, method for producing compound, and polymer 富士胶片株式会社 2024-06-14 CN disclosed
WO-2024122416-A1 METHOD FOR PRODUCING LAMINATED BODY WITH HARD COAT LAYER 東亞合成株式会社 2024-06-13 WO disclosed
WO-2024122417-A1 METHOD FOR PRODUCING LAMINATE WITH HARD COAT LAYER, AND LAMINATE WITH HARD COAT LAYER 東亞合成株式会社 2024-06-13 WO disclosed
WO-2024122205-A1 POLYMER FILM, LAMINATE, WIRING BOARD, SILSESQUIOXANE POLYMER, AND POLYMER COMPOSITION 富士フイルム株式会社 2024-06-13 WO disclosed
WO-2024116569-A1 RATTLE NOISE REDUCTION MATERIAL AND THERMOPLASTIC RESIN COMPOSITION テクノUMG株式会社 2024-06-06 WO disclosed
CN-114616261-B Thermosetting resin composition and electric and electronic component comprising cured product thereof 株式会社力森诺科 2024-06-04 CN disclosed
WO-2024111129-A1 METHOD FOR PRODUCING POLYIMIDE PRECURSOR, POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING PATTERN CURED PRODUCT, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2024-05-30 WO disclosed
WO-2024106337-A1 POLYMERIZABLE COMPOSITION 株式会社レゾナック 2024-05-23 WO disclosed
CN-111919291-B Power module 信越化学工业株式会社 2024-05-17 CN disclosed
US-20240158904-A1 UNDERCOAT AGENT COMPOSITION FOR LAYERING INORGANIC MATERIAL LAYER, CURED PRODUCT THEREOF AND PRODUCTION METHOD THEREOF TOAGOSEI CO., LTD. (JP) 2024-05-16 US disclosed
WO-2024095957-A1 ESTER COMPOUND-CONTAINING COMPOSITION, METHOD FOR PRODUCING SAME, POLYMERIZABLE COMPOSITION, (METH)ACRYLIC POLYMER, AND METHOD FOR PRODUCING SAME 三菱ケミカル株式会社 2024-05-10 WO disclosed
WO-2024095995-A1 ESTER-COMPOUND-CONTAINING COMPOSITION AND METHOD FOR PRODUCING SAME, POLYMERIZABLE COMPOSITION, AND (METH)ACRYLIC POLYMER AND METHOD FOR PRODUCING SAME 三菱ケミカル株式会社 2024-05-10 WO disclosed
CN-114746453-B Curable composition, cured product, optical member, and lens 富士胶片株式会社 2024-05-07 CN disclosed
WO-2024090544-A1 METHACRYLATE-CONTAINING COMPOSITION, METHOD FOR PRODUCING METHACRYLIC ESTER, POLYMERIZABLE COMPOSITION, AND METHOD FOR PRODUCING METHACRYLIC ACID POLYMER 三菱ケミカル株式会社 2024-05-02 WO disclosed
WO-2024090484-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2024-05-02 WO disclosed
US-20240141106-A1 POLYPHENYLENE ETHER, PRODUCTION METHOD, THERMOSETTING COMPOSITION, PREPREG, AND LAMINATE THEREOF ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-05-02 US disclosed
WO-2024085208-A1 COMPOUND, POLYMERIZABLE COMPOSITION, POLYMER, HOLOGRAM RECORDING MEDIUM, OPTICAL MATERIAL, AND OPTICAL COMPONENT 三菱ケミカル株式会社 2024-04-25 WO disclosed
WO-2024084636-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2024-04-25 WO disclosed
EP-3998252-B1 THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS SHIKOKU CHEM (JP) 2024-04-24 EP disclosed
WO-2024080263-A1 POLYLACTIC ACID RESIN COMPOSITION FOR INJECTION BLOW MOLDING, METHOD FOR PRODUCING POLYLACTIC ACID RESIN COMPOSITION, INJECTION BLOW MOLDED BODY, AND METHOD FOR PRODUCING INJECTION BLOW MOLDED BODY 日精樹脂工業株式会社 2024-04-18 WO disclosed
WO-2024080369-A1 PILLARARENE COMPLEX ダイキン工業株式会社 2024-04-18 WO disclosed
US-11958274-B2 Curable composition for polymer electrolyte, and layered body TOAGOSEI CO., LTD. (JP) 2024-04-16 US disclosed
CN-117882174-A Temporary fixing film, temporary fixing laminate, and method for manufacturing semiconductor device 株式会社力森诺科 2024-04-12 CN disclosed
WO-2024070553-A1 CHARGING ROLL FOR ELECTROPHOTOGRAPHIC APPARATUS 住友理工株式会社 2024-04-04 WO disclosed
CN-117795017-A Compound or tautomer thereof, composition, laminate, optical film, image forming material, and method for producing compound or tautomer thereof 富士胶片株式会社 2024-03-29 CN disclosed
US-20240105948-A1 SECONDARY BATTERY ELECTRODE BINDER, SECONDARY BATTERY ELECTRODE MIXTURE LAYER COMPOSITION, SECONDARY BATTERY ELECTRODE AND SECONDARY BATTERY TOAGOSEI CO., LTD. (JP) 2024-03-28 US disclosed
WO-2024062840-A1 RESIN COMPOSITION, MOLDED BODY, AND METHOD FOR PRODUCING RESIN COMPOSITION 三井化学株式会社 2024-03-28 WO disclosed
WO-2024063135-A1 COMPOUND, POLYMERIZABLE COMPOSITION, POLYMER, HOLOGRAM RECORDING MEDIUM, OPTICAL MATERIAL, AND OPTICAL COMPONENT 三菱ケミカル株式会社 2024-03-28 WO disclosed
US-20240101723-A1 METHOD FOR PRODUCING MODIFIED CONJUGATED DIENE POLYMER LATEX ZEON CORPORATION (JP) 2024-03-28 US disclosed
US-20240105950-A1 LITHIUM-SULFUR SECONDARY BATTERY ELECTRODE BINDER AND USE THEREOF TOAGOSEI CO., LTD. (JP) 2024-03-28 US disclosed
WO-2024058130-A1 POLYMERIZABLE COMPOSITION 株式会社レゾナック 2024-03-21 WO disclosed
WO-2024058218-A1 ADHESIVE AGENT COMPOSITION, ADHESIVE AGENT FILM, CONNECTION STRUCTURE BODY, AND METHOD FOR MANUFACTURING SAME 株式会社レゾナック 2024-03-21 WO disclosed
EP-4339243-A1 THERMOPLASTIC RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND MOLDED PRODUCT MANUFACTURED THEREFROM LG Chem, Ltd. (KR) 2024-03-20 EP disclosed
US-20240084062-A1 COMPOSITION, CURED SUBSTANCE OR MOLDED BODY, OPTICAL MEMBER, AND LENS FUJIFILM CORPORATION (JP) 2024-03-14 US disclosed
CN-115702170-B Curable resin composition, cured product, diffractive optical element, and multilayer diffractive optical element 富士胶片株式会社 2024-03-12 CN disclosed
US-11926683-B2 Curable material and method for molding said thermally curable material IDEMITSU KOSAN CO., LTD. (JP) 2024-03-12 US disclosed
CN-111263995-B Binder for secondary battery electrode and use thereof 东亚合成株式会社 2024-03-12 CN disclosed
CN-114051505-B Acrylic rubber bag excellent in storage stability and processability 日本瑞翁株式会社 2024-03-08 CN disclosed
US-11919842-B2 Polymercaptan compound and preparation method thereof, curing agent, resin composition and use thereof WELDTONE TECHNOLOGY CO., LTD (CN) 2024-03-05 US disclosed
CN-114127137-B Acrylic rubber bag excellent in strength characteristics and workability 日本瑞翁株式会社 2024-03-01 CN disclosed
CN-114258407-B Process for preparing polymers 株式会社LG化学 2024-02-23 CN disclosed
US-20240059929-A1 ORGANOSILICON COMPOUND, PRODUCTION METHOD THEREFOR, AND CURABLE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-02-22 US disclosed
CN-114051506-B Acrylic rubber bag excellent in storage stability and water resistance 日本瑞翁株式会社 2024-02-20 CN disclosed
US-20240052077-A1 Two-Component Curable Composition and Cured Product Thereof COSMO OIL LUBRICANTS CO., LTD. (JP) 2024-02-15 US disclosed
WO-2024034518-A1 POLYMER EMULSION, AND SINGLE-LIQUID TYPE THERMOSETTING RESIN COMPOSITION, TWO-LIQUID TYPE THERMOSETTING RESIN COMPOSITION, COATING MATERIAL, RESIN CURED FILM, AND COATING FILM USING SAID POLYMER EMULSION 株式会社レゾナック 2024-02-15 WO disclosed
CN-117545808-A A resin composition method for producing resin composition and molded article 旭化成株式会社 2024-02-09 CN disclosed
WO-2024029507-A1 CURABLE COMPOSITION PREPARATION KIT, CURABLE COMPOSITION, CURED ARTICLE, AND DENTAL MATERIAL 三井化学株式会社 2024-02-08 WO disclosed
WO-2024029508-A1 KIT FOR PREPARING CURABLE COMPOSITION FOR DENTAL MATERIAL, CURABLE COMPOSITION FOR DENTAL MATERIAL, AND DENTAL MATERIAL 三井化学株式会社 2024-02-08 WO disclosed
EP-4317223-A1 ACRYLIC RUBBER, RUBBER COMPOSITION AND RUBBER CROSSLINKED PRODUCT Zeon Corporation (JP) 2024-02-07 EP disclosed
EP-4317209-A1 METHACRYLIC COPOLYMER, METHACRYLIC RESIN COMPOSITION AND METHOD FOR PRODUCING SAME, AND MOLDED BODY Kuraray Co., Ltd. (JP) 2024-02-07 EP disclosed
EP-4317212-A1 CURABLE COMPOSITION, AND CURED PRODUCT Cosmo Oil Lubricants Co., Ltd. (JP) 2024-02-07 EP disclosed
EP-4317155-A1 COMPOUND, METHOD FOR PRODUCING SAME, POLYMERIZABLE COMPOSITION, POLYMER, HOLOGRAPHIC RECORDING MEDIUM, OPTICAL MATERIAL, AND OPTICAL COMPONENT Mitsubishi Chemical Corporation (JP) 2024-02-07 EP disclosed
WO-2024024438-A1 CLATHRATE COMPOUND AND METHOD FOR PRODUCING SAME, POLYMERIZABLE COMPOSITION, RESIN COMPOSITION, POLYMER, CURED PRODUCT, AND LAMINATE 富士フイルム株式会社 2024-02-01 WO disclosed
WO-2024024772-A1 BINDER FOR NONAQUEOUS ELECTROLYTE SECONDARY BATTERY ELECTRODES 東亞合成株式会社 2024-02-01 WO disclosed
WO-2024024773-A1 METHOD FOR PRODUCING CROSSLINKED POLYMER OR SALT THEREOF 東亞合成株式会社 2024-02-01 WO disclosed
CN-114829492-B Thermoplastic resin composition, method for producing the same, and molded article produced using the same 株式会社LG化学 2024-01-30 CN disclosed
WO-2024018942-A1 METHOD FOR PRODUCING OLEFIN-MODIFIED FLUORINE-CONTAINING COMPOUND, AND COMPOSITION CONTAINING SAID COMPOUND ダイキン工業株式会社 2024-01-25 WO disclosed
EP-4310112-A1 RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED PLASTIC Mitsubishi Chemical Corporation (JP) 2024-01-24 EP disclosed
EP-3730550-B1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCT MANUFACTURED THEREFROM LOTTE CHEMICAL CORP (KR) 2024-01-24 EP disclosed
EP-4310113-A1 METHACRYLIC COPOLYMER AND METHOD FOR PRODUCING SAME Kuraray Co., Ltd. (JP) 2024-01-24 EP disclosed
US-20240018137-A1 COMPOUND, METHOD FOR PRODUCING SAME, POLYMERIZABLE COMPOSITION, POLYMER, HOLOGRAPHIC RECORDING MEDIUM, OPTICAL MATERIAL, AND OPTICAL COMPONENT MITSUBISHI CHEMICAL CORPORATION (JP) 2024-01-18 US disclosed
US-11873426-B2 Curable composition, cured product, optical member, lens, and compound FUJIFILM CORPORATION (JP) 2024-01-16 US disclosed
WO-2024004793-A1 COMPOUND, COMPOSITION, FILM, METHOD FOR PRODUCING COLORED COMPOSITION, AND METHOD FOR PRODUCING LAMINATE FOR DISPLAY ELEMENT 富士フイルム株式会社 2024-01-04 WO disclosed
WO-2024005140-A1 COMPOUND, POLYMERIZABLE COMPOSITION, POLYMER, HOLOGRAPHIC RECORDING MEDIUM, OPTICAL MATERIAL AND OPTICAL COMPONENT 三菱ケミカル株式会社 2024-01-04 WO disclosed
EP-4299272-A1 METHOD FOR PRODUCING MODIFIED CONJUGATED DIENE POLYMER LATEX Zeon Corporation (JP) 2024-01-03 EP disclosed
CN-117321092-A Methacrylic copolymer, methacrylic resin composition, method for producing same, and molded article 株式会社可乐丽 2023-12-29 CN disclosed
WO-2023248637-A1 CHARGING ROLL FOR ELECTROPHOTOGRAPHIC EQUIPMENT 住友理工株式会社 2023-12-28 WO disclosed
WO-2023243587-A1 FILLER-CONTAINING POLYPROPYLENE RESIN COMPOSITION 三井化学株式会社 2023-12-21 WO disclosed
US-20230407074-A1 Thermoplastic Resin Composition and Molded Article Manufactured Therefrom LOTTE CHEMICAL CORPORATION (KR) 2023-12-21 US disclosed
WO-2023238925-A1 RADICAL POLYMERIZABLE COMPOSITION AND POLYMERIZED PRODUCT THEREOF 株式会社日本触媒 2023-12-14 WO disclosed
WO-2023238835-A1 SILSESQUIOXANE DERIVATIVE AND METHOD FOR PRODUCING SAME, CURABLE COMPOSITION, HARD COAT AGENT, CURED PRODUCT, HARD COAT, AND BASE MATERIAL 東亞合成株式会社 2023-12-14 WO disclosed
WO-2023238519-A1 LAMINATE AND METHOD FOR MANUFACTURING LAMINATE 旭化成株式会社 2023-12-14 WO disclosed
US-20230399498-A1 RUBBER COMPOSITION, VULCANIZED SUBSTANCE, AND VULCANIZED MOLDED OBJECT DENKA COMPANY LIMITED (JP) 2023-12-14 US disclosed
WO-2023238253-A1 BUFFER SHEET, METHOD FOR MOUNTING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE 株式会社レゾナック 2023-12-14 WO disclosed
EP-4289618-A1 UNDERCOAT AGENT COMPOSITION FOR INORGANIC SUBSTANCE LAYER LAMINATION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME Toagosei Co., Ltd. (JP) 2023-12-13 EP disclosed
CN-117203251-A Composition, cured product or molded article, optical component, and lens 富士胶片株式会社 2023-12-08 CN disclosed
WO-2023234155-A1 PHOTORADIATION-RELEASABLE ADHESIVE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE 日産化学株式会社 2023-12-07 WO disclosed
US-20230391996-A1 CURABLE COMPOSITION AND SEALANT KURARAY CO., LTD. (JP) 2023-12-07 US disclosed
US-20230383097-A1 SURFACE-TREATED ULTRAFINE CALCIUM CARBONATE FOR IMPROVING THE MECHANICAL PROPERTIES OF POLYETHYLENE/POLYPROPYLENE COMPOSITIONS OMYA INTERNATIONAL AG (CH) 2023-11-30 US disclosed
US-20230383077-A1 RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED PLASTIC MITSUBISHI CHEMICAL CORPORATION (JP) 2023-11-30 US disclosed
EP-4282899-A1 POLY(PHENYLENE ETHER), PRODUCTION METHOD THEREFOR, THERMALLY CURABLE COMPOSITION, PREPREG, AND LAMINATE Asahi Kasei Kabushiki Kaisha (JP) 2023-11-29 EP disclosed
EP-4282653-A1 ORGANOSILICON COMPOUND, PRODUCTION METHOD THEREFOR, AND CURABLE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-29 EP disclosed
CN-117120497-A Ultraviolet-curable silicone composition for photoshaping, cured product thereof, and method for producing cured product 信越化学工业株式会社 2023-11-24 CN disclosed
CN-114080422-B Acrylic rubber sheet with excellent water resistance 日本瑞翁株式会社 2023-11-24 CN disclosed
US-20230373912-A1 POLYMERCAPTAN COMPOUND AND PREPARATION METHOD THEREOF, CURING AGENT, RESIN COMPOSITION AND USE THEREOF WELDTONE TECHNOLOGY CO., LTD (CN) 2023-11-23 US disclosed
WO-2023218862-A1 THIOL COMPOUND AND USES THEREOF 四国化成工業株式会社 2023-11-16 WO disclosed
US-20230365812-A1 KIT COMPRISING SURFACE-TREATED CALCIUM CARBONATE AND A PEROXIDE AGENT FOR IMPROVING THE MECHANICAL PROPERTIES OF POLYETHYLENE/POLYPROPYLENE COMPOSITIONS OMYA INTERNATIONAL AG (CH) 2023-11-16 US disclosed
WO-2023218702-A1 CURING AGENT AND USE THEREOF 四国化成工業株式会社 2023-11-16 WO disclosed
CN-117062845-A Curable composition and cured product 可舒磨润滑油株式会社 2023-11-14 CN disclosed
US-11807596-B2 Thiol compounds, synthesis method therefor, and utilization of said thiol compounds SHIKOKU CHEMICALS CORPORATION (JP) 2023-11-07 US disclosed
CN-114096574-B Acrylic rubber bag excellent in storage stability and processability 日本瑞翁株式会社 2023-11-03 CN disclosed
CN-116940600-A Resin composition, cured product, laminate, transparent antenna, method for producing transparent antenna, and image display device 株式会社力森诺科 2023-10-24 CN disclosed
US-20230331885-A1 METHOD FOR PREPARING POLYMER LG CHEM, LTD. (KR) 2023-10-19 US disclosed
CN-116891557-A Modified conjugated diene polymer, resin composition containing the same, and product 旭化成株式会社 2023-10-17 CN disclosed
US-11787986-B2 Adhesive film based transparent laminate CARIFLEX PTE. LTD. (SG) 2023-10-17 US disclosed
US-11787976-B2 Method of producing anisotropic conductive film and anisotropic conductive film DEXERIALS CORPORATION (JP) 2023-10-17 US disclosed
US-20230323114-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF KANEKA CORPORATION (JP) 2023-10-12 US disclosed
US-20230323162-A1 CONDUCTIVE ADHESIVE COMPOSITION KYOTO ELEX CO., LTD. (JP) 2023-10-12 US disclosed
WO-2023195202-A1 HYBRID BONDING INSULATION FILM-FORMING MATERIAL, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HDマイクロシステムズ株式会社 2023-10-12 WO disclosed
US-20230322985-A1 CURABLE RESIN COMPOSITION AND CEMENTED LENS FUJIFILM CORPORATION (JP) 2023-10-12 US disclosed
US-20230322981-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, DIFFRACTIVE OPTICAL ELEMENT, MULTILAYER DIFFRACTIVE OPTICAL ELEMENT, AND OXIDE NANOPARTICLES FUJIFILM CORPORATION (JP) 2023-10-12 US disclosed
WO-2023195398-A1 ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION STRUCTURE, AND METHOD OF PRODUCING SAME 株式会社レゾナック 2023-10-12 WO disclosed
EP-4258342-A1 TWO-COMPONENT CURABLE COMPOSITION AND CURED PRODUCT THEREOF Cosmo Oil Lubricants Co., Ltd. (JP) 2023-10-11 EP disclosed
US-11784154-B2 Anisotropic conductive film and method of producing the same DEXERIALS CORPORATION (JP) 2023-10-10 US disclosed
CN-116867811-A Resin composition, cured product, laminate, transparent antenna, method for producing transparent antenna, and image display device 株式会社力森诺科 2023-10-10 CN disclosed
WO-2023190183-A1 CROSSLINKED RESIN PARTICLES AND METHOD FOR PRODUCING SAME 株式会社カネカ 2023-10-05 WO disclosed
WO-2023190185-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2023-10-05 WO disclosed
WO-2023190184-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2023-10-05 WO disclosed
WO-2023190168-A1 CURED FILM FORMING METHOD, METHOD FOR MANUFACTURING SUBSTRATE FOR IMPRINT MOLD, METHOD FOR MANUFACTURING IMPRINT MOLD, METHOD FOR MANUFACTURING UNEVEN STRUCTURE, PATTERN FORMING METHOD, HARD MASK FORMING METHOD, INSULATING FILM FORMING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 大日本印刷株式会社 2023-10-05 WO disclosed
WO-2023190070-A1 COMPOUND, METHOD FOR PRODUCING SAME, POLYMERIZABLE COMPOSITION, RESIN COMPOSITION, POLYMER, CURED PRODUCT, AND LAMINATE 富士フイルム株式会社 2023-10-05 WO disclosed
WO-2023190719-A1 RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, TRANSPARENT ANTENNA AND IMAGE DISPLAY DEVICE 株式会社レゾナック 2023-10-05 WO disclosed
WO-2023189949-A1 MULTIFUNCTIONAL VINYL AROMATIC COPOLYMER 旭化成株式会社 2023-10-05 WO disclosed
WO-2023190741-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, TRANSPARENT ANTENNA, AND IMAGE DISPLAY DEVICE 株式会社レゾナック 2023-10-05 WO disclosed
WO-2023189908-A1 RUBBER COMPOSITION, VULCANIZATE, AND VULCANIZED MOLDED OBJECT デンカ株式会社 2023-10-05 WO disclosed
WO-2023190320-A1 ACRYLIC RUBBER, ACRYLIC RUBBER-CONTAINING COMPOSITION AND CROSSLINKED RUBBER PRODUCT 株式会社大阪ソーダ 2023-10-05 WO disclosed
CN-116836329-A Optical copolymerization type flame-retardant plate, preparation method thereof and reaction extrusion device 汤臣(江苏)材料科技股份有限公司 2023-10-03 CN disclosed
WO-2023181637-A1 HYBRID BONDING INSULATION FILM-FORMING MATERIAL, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HDマイクロシステムズ株式会社 2023-09-28 WO disclosed
WO-2023182519-A1 ASCORBIC ACID DERIVATIVE OR SALT THEREOF, ADDITIVE FOR INITIATING POLYMERIZATION, POLYMERIZATION INITIATOR, KIT FOR PREPARING CURABLE COMPOSITION, CURABLE COMPOSITION, CURED PRODUCT AND DENTAL MATERIAL 三井化学株式会社 2023-09-28 WO disclosed
WO-2023182518-A1 POLYMERIZATION ACCELERATOR, POLYMERIZATION INITIATOR, KIT FOR PREPARING CURABLE COMPOSITION, CURABLE COMPOSITION, CURED PRODUCT AND DENTAL MATERIAL 三井化学株式会社 2023-09-28 WO disclosed
WO-2023182276-A1 RESIN COMPOSITION, MOLDING MATERIAL AND MOLDED ARTICLE ジャパンコンポジット株式会社 2023-09-28 WO disclosed
CN-111655662-B Compound, resin, composition, resist pattern forming method, circuit pattern forming method, and resin purifying method 三菱瓦斯化学株式会社 2023-09-26 CN disclosed
CN-114222769-B Curable composition, cured product, optical member, and lens 富士胶片株式会社 2023-09-26 CN disclosed
CN-116802243-A Film-like adhesive and method for producing connection structure 株式会社力森诺科 2023-09-22 CN disclosed
CN-116802218-A Curable resin composition and bonded lens 富士胶片株式会社 2023-09-22 CN disclosed
EP-2216349-B1 USE OF A PHENOL TYPE COMPOUND IN A DENTAL CHEMICAL POLYMERIZATION CATALYST WITH IMPROVED POLYMERIZING ACTIVITY TOKUYAMA DENTAL CORP (JP) 2023-09-20 EP disclosed
WO-2023170891-A1 INSULATING RESIN COMPOSITION, CURED OBJECT, WIRE COIL, AND ROTATING MACHINE 三菱電機株式会社 2023-09-14 WO disclosed
WO-2023171014-A1 INSULATION FILM FORMING MATERIAL, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE HDマイクロシステムズ株式会社 2023-09-14 WO disclosed
WO-2023171083-A1 DISPERSING AGENT, DISPERSION, AND ARTICLE 第一工業製薬株式会社 2023-09-14 WO disclosed
US-20230279201-A1 REINFORCED ELASTOMER COMPOSITION OMYA INTERNATIONAL AG (CH) 2023-09-07 US disclosed
WO-2023167187-A1 POLYMERIZABLE COMPOSITION 株式会社日本触媒 2023-09-07 WO disclosed
WO-2023167186-A1 POLYMERIZABLE COMPOSITION 株式会社日本触媒 2023-09-07 WO disclosed
EP-4239001-A1 CURABLE COMPOSITION AND SEALANT Kuraray Co., Ltd. (JP) 2023-09-06 EP disclosed
US-11746205-B2 Heat-expandable microspheres and applications thereof MATSUMOTO YUSHI-SEIYAKU CO., LTD. (JP) 2023-09-05 US disclosed
US-11744782-B2 Separately packed curable composition MITSUI CHEMICALS, INC. (JP) 2023-09-05 US disclosed
WO-2023162777-A1 COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, DIFFRACTION OPTICAL ELEMENT, AND AUGMENTED REALITY GLASSES 富士フイルム株式会社 2023-08-31 WO disclosed
WO-2023162068-A1 SHEET-TYPE INSULATING VARNISH, METHOD FOR MANUFACTURING SAME, ELECTRIC APPARATUS, AND ROTARY ELECTRIC MACHINE 三菱電機株式会社 2023-08-31 WO disclosed
CN-114206957-B Process for preparing polymers 株式会社LG化学 2023-08-25 CN disclosed
WO-2023157827-A1 RUBBER COMPOSITION, VULCANIZATE, AND VULCANIZED MOLDED OBJECT デンカ株式会社 2023-08-24 WO disclosed
CN-113366053-B Polylactic acid resin foam sheet, resin molded article, and method for producing polylactic acid resin foam sheet 积水化成品工业株式会社 2023-08-18 CN disclosed
US-20230257503-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE MITSUBISHI CHEMICAL CORPORATION (JP) 2023-08-17 US disclosed
US-20230259026-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF PRODUCING PATTERNED CURED PRODUCT USING THE SAME, AND CURED PRODUCT OF PHOTOSENSITIVE RESIN COMPOSITION RESONAC CORPORATION (JP) 2023-08-17 US disclosed
WO-2023153435-A1 PREPREG, CARBON FIBER-REINFORCED PLASTIC, AND METHOD FOR MANUFACTURING PREPREG 三菱ケミカル株式会社 2023-08-17 WO disclosed
WO-2023153405-A1 RUBBER COMPOSITION, VULCANIZATE, AND VULCANIZED MOLDED BODY デンカ株式会社 2023-08-17 WO disclosed
EP-4225840-A1 KIT COMPRISING SURFACE-TREATED CALCIUM CARBONATE AND A PEROXIDE AGENT FOR IMPROVING THE MECHANICAL PROPERTIES OF POLYETHYLENE/POLYPROPYLENE COMPOSITIONS Omya International AG (CH) 2023-08-16 EP disclosed
EP-4225843-A1 SURFACE-TREATED ULTRAFINE CALCIUM CARBONATE FOR IMPROVING THE MECHANICAL PROPERTIES OF POLYETHYLENE/POLYPROPYLENE COMPOSITIONS Omya International AG (CH) 2023-08-16 EP disclosed
EP-4227353-A1 RUBBER COMPOSITION, VULCANIZED SUBSTANCE, AND VULCANIZED MOLDED OBJECT Denka Company Limited (JP) 2023-08-16 EP disclosed
CN-116569328-A Two-component curable composition and cured product 可舒磨润滑油株式会社 2023-08-08 CN disclosed
US-20230242681-A1 POLYMERIZATION INITIATOR, KIT FOR PREPARING CURABLE COMPOSITION, CURABLE COMPOSITION, CURED PRODUCT, AND DENTAL MATERIAL MITSUI CHEMICALS, INC. (JP) 2023-08-03 US disclosed
EP-3581609-B1 ACRYLIC RESIN BIAXIALLY STRETCHED FILM AND METHOD FOR MANUFACTURING THE SAME KURARAY CO (JP) 2023-08-02 EP disclosed
CN-116529302-A Rubber composition, sulfide of the rubber composition, and vulcanized molded article of the rubber composition 电化株式会社 2023-08-01 CN disclosed
US-20230235151-A1 USE OF A POROUS FILLER FOR REDUCING THE GAS PERMEABILITY OF AN ELASTOMER COMPOSITION OMYA INTERNATIONAL AG (CH) 2023-07-27 US disclosed
WO-2023136286-A1 ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, AND METHOD FOR PRODUCING CONNECTION STRUCTURE 株式会社レゾナック 2023-07-20 WO disclosed
WO-2023136273-A1 ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, AND METHOD FOR PRODUCING CONNECTION STRUCTURE 株式会社レゾナック 2023-07-20 WO disclosed
WO-2023136274-A1 ADHESIVE AGENT COMPOSITION, ADHESIVE AGENT FILM FOR CIRCUIT CONNECTION, AND MANUFACTURING METHOD FOR CONNECTION STRUCTURE 株式会社レゾナック 2023-07-20 WO disclosed
WO-2023136318-A1 COMPOSITION, VULCANIZATE, AND VULCANIZED MOLDED BODY デンカ株式会社 2023-07-20 WO disclosed
EP-4212256-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE Mitsubishi Chemical Corporation (JP) 2023-07-19 EP disclosed
US-11702540-B2 Thermoplastic resin composition and molded article manufactured therefrom LOTTE CHEMICAL CORPORATION (KR) 2023-07-18 US disclosed
CN-116457409-A Chloroprene rubber composition, sulfide of the chloroprene rubber composition, and vulcanized molded article of the chloroprene rubber composition 电化株式会社 2023-07-18 CN disclosed
US-20230220212-A1 A COMPOSITION FORMED FROM A CALCIUM OR MAGNESIUM CARBONATE-COMPRISING MATERIAL AND A SURFACE-TREATMENT COMPOSITION COMPRISING AT LEAST ONE CROSS-LINKABLE COMPOUND OMYA INTERNATIONAL AG (CH) 2023-07-13 US disclosed
US-20230220185-A1 REINFORCED FLUOROPOLYMER OMYA INTERNATIONAL AG (CH) 2023-07-13 US disclosed
US-20230220142-A1 ACTIVE-ENERGY-RAY-CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON SHOKUBAI CO., LTD. (JP) 2023-07-13 US disclosed
US-20230212136-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, DIFFRACTIVE OPTICAL ELEMENT, AND MULTILAYER DIFFRACTIVE OPTICAL ELEMENT FUJIFILM CORPORATION (JP) 2023-07-06 US disclosed
US-20230216022-A1 COMPOSITE ACTIVE MATERIAL FOR LITHIUM SECONDARY BATTERY, ELECTRODE COMPOSITION FOR LITHIUM SECONDARY BATTERY, LITHIUM SECONDARY BATTERY ELECTRODE, AND METHOD FOR MANUFACTURING COMPOSITE ACTIVE MATERIAL FOR LITHIUM SECONDARY BATTERY TOSOH CORPORATION (JP) 2023-07-06 US disclosed
CN-116391001-A Curable composition and cured product thereof 日产化学株式会社 2023-07-04 CN disclosed
CN-111801382-B Thermoplastic resin composition, method for preparing the same, and molded article comprising the same 株式会社LG化学 2023-06-30 CN disclosed
CN-116348549-A Thermoplastic resin composition, method for producing the same, and molded article produced using the same 株式会社LG化学 2023-06-27 CN disclosed
CN-116323750-A Temporary fixing film, temporary fixing laminate, and method for manufacturing semiconductor device 株式会社力森诺科 2023-06-23 CN disclosed
WO-2023106419-A1 DENTAL CURABLE COMPOSITION クラレノリタケデンタル株式会社 2023-06-15 WO disclosed
US-20230183406-A1 COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, OPTICAL MEMBER, AND LENS FUJIFILM CORPORATION (JP) 2023-06-15 US disclosed
CN-116239974-A Film material and conductive adhesive film using the same 南通德聚半导体材料有限公司 2023-06-09 CN disclosed
WO-2023100943-A1 RESIN FIBER SHEET, PREPREG AND METHOD FOR PRODUCING PREPREG 旭化成株式会社 2023-06-08 WO disclosed
US-20230174696-A1 ACRYLIC COPOYMER, ACRYLIC COPOYMER-CONTAINING COMPOSITION AND CROSSLINKED PRODUCT OF SAME OSAKA SODA CO., LTD. (JP) 2023-06-08 US disclosed
WO-2023100992-A1 SILSESQUIOXANE DERIVATIVE, CURABLE COMPOSITION, CURED PRODUCT, AND BASE MATERIAL 東亞合成株式会社 2023-06-08 WO disclosed
WO-2023100991-A1 SILSESQUIOXANE DERIVATIVE, CURABLE COMPOSITION, HARD COAT AGENT, CURED PRODUCT, HARD COAT, AND BASE MATERIAL 東亞合成株式会社 2023-06-08 WO disclosed
WO-2023100828-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF ENEOS株式会社 2023-06-08 WO disclosed
CN-111684038-B Thermally expandable microspheres and use thereof 松本油脂制药株式会社 2023-06-02 CN disclosed
US-11661510-B2 Thermoplastic resin composition and molded product manufactured therefrom LOTTE CHEMICAL CORPORATION (KR) 2023-05-30 US disclosed
US-20230159682-A1 ACRYLIC RUBBER EXCELLENT IN STORAGE STABILITY ZEON CORPORATION (JP) 2023-05-25 US disclosed
EP-4182386-A1 REINFORCED FLUOROPOLYMER Omya International AG (CH) 2023-05-24 EP disclosed
EP-4182387-A1 REINFORCED ELASTOMER COMPOSITION Omya International AG (CH) 2023-05-24 EP disclosed
EP-4183847-A1 CONDUCTIVE ADHESIVE COMPOSITION Kyoto Elex Co., Ltd. (JP) 2023-05-24 EP disclosed
EP-4182392-A1 A COMPOSITION FORMED FROM A CALCIUM OR MAGNESIUM CARBONATE-COMPRISING MATERIAL AND A SURFACE-TREATMENT COMPOSITION COMPRISING AT LEAST ONE CROSS-LINKABLE COMPOUND Omya International AG (CH) 2023-05-24 EP disclosed
EP-4182388-A1 USE OF A POROUS FILLER FOR REDUCING THE GAS PERMEABILITY OF AN ELASTOMER COMPOSITION Omya International AG (CH) 2023-05-24 EP disclosed
EP-3971224-B1 METHOD FOR PREPARING POLYMER LG CHEMICAL LTD (KR) 2023-05-24 EP disclosed
EP-4183828-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF Kaneka Corporation (JP) 2023-05-24 EP disclosed
CN-116157424-A Acrylic rubber excellent in injection moldability 日本瑞翁株式会社 2023-05-23 CN disclosed
CN-114206960-B Polymerizable composition, compound, polymer, resin composition, ultraviolet shielding film, and laminate 富士胶片株式会社 2023-05-23 CN disclosed
WO-2023085154-A1 COPOLYMER EMULSION, AND ONE-PACK TYPE THERMOSETTING RESIN COMPOSITION, TWO-PACK TYPE THERMOSETTING RESIN COMPOSITION, COATING MATERIAL, RESIN CURED FILM AND COATING FILM EACH USING SAID COPOLYMER EMULSION 株式会社レゾナック 2023-05-19 WO disclosed
CN-116113646-A Acrylic rubber bag excellent in Banbury workability and water resistance 日本瑞翁株式会社 2023-05-12 CN disclosed
EP-4067075-B1 ADHESIVE FILM BASED TRANSPARENT LAMINATE CARIFLEX PTE LTD (SG) 2023-05-10 EP disclosed
CN-116096759-A Acrylic rubber excellent in injection moldability and banbury processability 日本瑞翁株式会社 2023-05-09 CN disclosed
CN-116097129-A Compound, curable resin composition, cured product, optical component, and lens 富士胶片株式会社 2023-05-09 CN disclosed
CN-116057073-A Acrylic rubber bag excellent in Banbury processability 日本瑞翁株式会社 2023-05-02 CN disclosed
CN-116034118-A Acrylic rubber bag excellent in Banbury processability and injection moldability 日本瑞翁株式会社 2023-04-28 CN disclosed
CN-116018373-A Ultraviolet absorber, resin composition, cured product, optical member, method for producing ultraviolet absorber, and compound 富士胶片株式会社 2023-04-25 CN disclosed
CN-111662414-B Rubbery polymer, graft copolymer and thermoplastic resin composition 大科能宇菱通株式会社 2023-04-25 CN disclosed
CN-115996966-A Curable resin composition, electric and electronic component, and method for producing electric and electronic component 昭和电工株式会社 2023-04-21 CN disclosed
CN-115996965-A Curable resin composition, electric and electronic component, and method for producing electric and electronic component 昭和电工株式会社 2023-04-21 CN disclosed
WO-2023063188-A1 CROSSLINKED RUBBER COMPOSITION AND METHOD FOR PRODUCING CROSSLINKED RUBBER COMPOSITION 日本エラストマー株式会社 2023-04-20 WO disclosed
WO-2023062671-A1 ELECTRONIC COMPONENT DEVICE MANUFACTURING METHOD, ELECTRONIC COMPONENT MOUNTING METHOD, AND BUFFER SHEET 株式会社レゾナック 2023-04-20 WO disclosed
WO-2023062670-A1 BUFFER SHEET, METHOD FOR MOUNTING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE 株式会社レゾナック 2023-04-20 WO disclosed
EP-4166578-A1 POLYMERIZATION INITIATOR, KIT FOR PREPARING CURABLE COMPOSITION, CURABLE COMPOSITION, CURED PRODUCT, AND DENTAL MATERIAL Mitsui Chemicals, Inc. (JP) 2023-04-19 EP disclosed
CN-115956109-A Conductive adhesive composition 京都一来电子化学股份有限公司 2023-04-11 CN disclosed
US-20230109397-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE MANUFACTURED USING THE SAME LG CHEM, LTD. (KR) 2023-04-06 US disclosed
EP-4159779-A1 ACTIVE-ENERGY-RAY-CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF Nippon Shokubai Co., Ltd. (JP) 2023-04-05 EP disclosed
CN-113272338-B Binder for secondary battery electrode and use thereof 东亚合成株式会社 2023-04-04 CN disclosed
US-20230096868-A1 CURABLE RESIN COMPOSITION FOR LENS, CURED PRODUCT, DIFFRACTIVE OPTICAL ELEMENT, AND MULTILAYER DIFFRACTIVE OPTICAL ELEMENT FUJIFILM CORPORATION (JP) 2023-03-30 US disclosed
CN-113474415-B Resin composition, cured product, diffractive optical element, multilayer diffractive optical element 富士胶片株式会社 2023-03-28 CN disclosed
WO-2023042727-A1 RUBBER COMPOSITION, VULCANIZATE, AND VULCANIZED MOLDED OBJECT デンカ株式会社 2023-03-23 WO disclosed
CN-115819654-A Curable resin composition for lens, cured product, diffractive optical element, and multilayer diffractive optical element 富士胶片株式会社 2023-03-21 CN disclosed
CN-113631239-B Composition containing fluorine-containing copolymer and defoaming agent 第一工业制药株式会社 2023-03-17 CN disclosed
CN-115803381-A Aliphatic polyester resin composition and use thereof 株式会社钟化 2023-03-14 CN disclosed
CN-115776992-A Polymerizable composition, polymer, ultraviolet shielding material, laminate, compound, ultraviolet absorber, and method for producing compound 富士胶片株式会社 2023-03-10 CN disclosed
WO-2023032981-A1 FILM FOR TEMPORARY FIXATION, LAYERED PRODUCT FOR TEMPORARY FIXATION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 株式会社レゾナック 2023-03-09 WO disclosed
WO-2023032165-A1 FILM FOR TEMPORARY FIXING, LAMINATE FOR TEMPORARY FIXING, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 昭和電工マテリアルズ株式会社 2023-03-09 WO disclosed
US-20230057580-A1 STYRENE COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, AND METHOD OF PREPARING STYRENE COPOLYMER AND THERMOPLASTIC RESIN COMPOSITION LG CHEM, LTD. (KR) 2023-02-23 US disclosed
CN-112480682-B Addition-curable silicone composition, cured product thereof, sheet, and optical element 信越化学工业株式会社 2023-02-17 CN disclosed
CN-115702170-A Curable resin composition, cured product, diffractive optical element, and multilayer diffractive optical element 富士胶片株式会社 2023-02-14 CN disclosed
EP-4130054-A1 ACRYLIC COPOLYMER, ACRYLIC COPOLYMER-CONTAINING COMPOSITION AND CROSSLINKED PRODUCT OF SAME Osaka Soda Co., Ltd. (JP) 2023-02-08 EP disclosed
EP-4130067-A1 ACRYLIC RUBBER, ACRYLIC RUBBER-CONTAINING COMPOSITION, AND CROSSLINKED RUBBER Osaka Soda Co., Ltd. (JP) 2023-02-08 EP disclosed
EP-4131488-A1 COMPOSITE ACTIVE MATERIAL FOR LITHIUM SECONDARY BATTERY, ELECTRODE COMPOSITION FOR LITHIUM SECONDARY BATTERY, LITHIUM SECONDARY BATTERY ELECTRODE, AND METHOD FOR MANUFACTURING COMPOSITE ACTIVE MATERIAL FOR LITHIUM SECONDARY BATTERY Tosoh Corporation (JP) 2023-02-08 EP disclosed
EP-4130058-A1 METHACRYLIC COPOLYMER, COMPOSITION, SHAPED OBJECT, METHOD FOR PRODUCING FILM OR SHEET, AND LAYERED PRODUCT Kuraray Co., Ltd. (JP) 2023-02-08 EP disclosed
CN-115698109-A Active energy ray-curable resin composition and cured product thereof 株式会社日本触媒 2023-02-03 CN disclosed
WO-2023008482-A1 THERMOPLASTIC MATERIAL COMPOSITION 株式会社大阪ソーダ 2023-02-02 WO disclosed
WO-2023008424-A1 RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, AND MOLDED BODY 旭化成株式会社 2023-02-02 WO disclosed
CN-115668457-A Method for producing electronic component, resin composition for temporary protection, and resin film for temporary protection 昭和电工材料株式会社 2023-01-31 CN disclosed
CN-110997804-B Thermoplastic resin composition and molded article produced therefrom 乐天尖端材料株式会社 2023-01-24 CN disclosed
CN-115626981-A Novel poly (arylene ether) resin and preparation method thereof 山东圣泉新材料股份有限公司 2023-01-20 CN disclosed
US-11542417-B2 Conductive resin composition, conductive adhesive, and semiconductor device NAMICS CORPORATION 2023-01-03 US disclosed
CN-115551909-A Thermosetting silicone composition, sheet, and silicone cured product 信越化学工业株式会社 2022-12-30 CN disclosed
WO-2022270316-A1 RESIN COMPOSITION, CURED PRODUCT, RESIN SHEET, CIRCUIT SUBSTRATE, AND SEMICONDUCTOR CHIP PACKAGE 味の素株式会社 2022-12-29 WO disclosed
WO-2022270601-A1 DENTAL ADHESIVE KIT クラレノリタケデンタル株式会社 2022-12-29 WO disclosed
CN-111315719-B Thiol compound, method for synthesizing same, and use of thiol compound 四国化成工业株式会社 2022-12-27 CN disclosed
CN-115516057-A Conductive adhesive, method for manufacturing circuit connection structure, and circuit connection structure 昭和电工材料株式会社 2022-12-23 CN disclosed
US-20220403245-A1 CURED PRODUCT, CURABLE RESIN COMPOSITION, OPTICAL MEMBER, LENS, DIFFRACTIVE OPTICAL ELEMENT, MULTILAYER DIFFRACTIVE OPTICAL ELEMENT, AND COMPOUND FUJIFILM CORPORATION (JP) 2022-12-22 US disclosed
CN-113227247-B Thermoplastic resin composition, method for preparing the same, and molded article comprising the same 株式会社LG化学 2022-12-09 CN disclosed
CN-112004889-B Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device 三菱瓦斯化学株式会社 2022-12-09 CN disclosed
US-20220389141-A1 ACRYLIC RUBBER EXCELLENT IN WATER RESISTANCE ZEON CORPORATION (JP) 2022-12-08 US disclosed
WO-2022255228-A1 COMPOSITION, CURED PRODUCT OR COMPACT, OPTICAL MEMBER, AND LENS 富士フイルム株式会社 2022-12-08 WO disclosed
US-11518916-B2 Lens adhesive, cemented lens, and imaging module FUJIFILM CORPORATION (JP) 2022-12-06 US disclosed
CN-115195217-A Transparent laminate based on adhesive film 卡里福热师私人有限公司 2022-10-18 CN disclosed
CN-110603273-B Modified block copolymer, method for producing modified block copolymer, and resin composition 旭化成株式会社 2022-10-14 CN disclosed
WO-2022215711-A1 THERMOSETTING COMPOSITION FOR INJECTION MOLDING, PRODUCTION METHOD FOR MOLDED ARTICLE USING SAME, AND CURED OBJECT 出光興産株式会社 2022-10-13 WO disclosed
US-20220315686-A1 CURABLE COMPOSITION, CURED SUBSTANCE, OPTICAL MEMBER, AND LENS FUJIFILM CORPORATION (JP) 2022-10-06 US disclosed
WO-2022210869-A1 METHOD FOR PRODUCING SEMI-CURED PRODUCT COMPOSITE, METHOD FOR PRODUCING CURED PRODUCT COMPOSITE, AND SEMI-CURED PRODUCT COMPOSITE デンカ株式会社 2022-10-06 WO disclosed
CN-108727997-B Thermal adhesive tape and method for manufacturing thermal adhesive tape 麦克赛尔株式会社 2022-10-04 CN disclosed
CN-115136072-A Pellicle and method for manufacturing same 三井化学株式会社 2022-09-30 CN disclosed
EP-4063454-A1 STYRENE COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, AND METHODS FOR PRODUCING SAME Lg Chem, Ltd. (KR) 2022-09-28 EP disclosed
CN-113121825-B Poly (arylene ether) resin and preparation method thereof 山东圣泉新材料股份有限公司 2022-09-27 CN disclosed
WO-2022190497-A1 POLYPHENYLENE ETHER, METHOD FOR PRODUCING SAME, THERMALLY CURABLE COMPOSITION, PREPREG, AND MULTILAYER BODY 旭化成株式会社 2022-09-15 WO disclosed
CN-113912523-B Polythiol compound, preparation method thereof, curing agent, resin composition, adhesive and sealant 韦尔通(厦门)科技股份有限公司 2022-09-06 CN disclosed
CN-115003708-A Cured product, curable resin composition, optical component, lens, diffractive optical element, multilayer diffractive optical element, and compound 富士胶片株式会社 2022-09-02 CN disclosed
CN-114975098-A Nanoimprint liquid material, method for producing pattern of cured product, and method for producing circuit board 佳能株式会社 2022-08-30 CN disclosed
US-20220267491-A1 ACRYLIC RUBBER BALE EXCELLENT IN STORAGE STABILITY AND PROCESSABILITY ZEON CORPORATION (JP) 2022-08-25 US disclosed
US-20220259345-A1 ACRYLIC RUBBER BALE EXCELLENT IN STORAGE STABILITY AND PROCESSABILITY ZEON CORPORATION (JP) 2022-08-18 US disclosed
EP-4043503-A1 SECONDARY BATTERY ELECTRODE BINDER, SECONDARY BATTERY ELECTRODE MIXTURE LAYER COMPOSITION, SECONDARY BATTERY ELECTRODE, AND SECONDARY BATTERY Toagosei Co., Ltd. (JP) 2022-08-17 EP disclosed
EP-3817119-B1 ELECTROLYTE COMPOSITION, ELECTROLYTE FILM, AND METHOD OF MANUFACTURING ELECTROLYTE FILM NIPPON CATALYTIC CHEM IND (JP) 2022-08-17 EP disclosed
US-20220251330-A1 ACRYLIC RUBBER BALE EXCELLENT IN STORAGE STABILITY AND WATER RESISTANCE ZEON CORPORATION (JP) 2022-08-11 US disclosed
CN-114854064-A Prepreg, method for producing same, and fiber-reinforced plastic molded body 三菱化学株式会社 2022-08-05 CN disclosed
WO-2022162805-A1 INSULATING RESIN COMPOSITION, CURED PRODUCT, ROTARY MACHINE COIL, AND ROTARY MACHINE 三菱電機株式会社 2022-08-04 WO disclosed
WO-2022163795-A1 CURABLE COMPOSITION, AND CURED PRODUCT THEREOF ENEOS株式会社 2022-08-04 WO disclosed
US-11404391-B2 Anisotropic conductive film and method of producing the same DEXERIALS CORPORATION (JP) 2022-08-02 US disclosed
CN-114829492-A Thermoplastic resin composition, method for producing same, and molded article produced using same 株式会社LG化学 2022-07-29 CN disclosed
EP-4029883-A1 METHOD FOR PRODUCING ACRYLIC RUBBER Osaka Soda Co., Ltd. (JP) 2022-07-20 EP disclosed
CN-114761486-A Styrene copolymer, thermoplastic resin composition, and method for producing styrene copolymer and thermoplastic resin composition 株式会社LG化学 2022-07-15 CN disclosed
EP-3733772-B1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MANUFACTURED THEREFROM LOTTE CHEMICAL CORP (KR) 2022-07-13 EP disclosed
CN-114746392-A Alicyclic acrylate compound, alicyclic epoxy acrylate compound, curable composition, and cured product 引能仕株式会社 2022-07-12 CN disclosed
US-11384231-B2 Propylene polymer composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2022-07-12 US disclosed
CN-114746453-A Curable composition, cured product, optical component, and lens 富士胶片株式会社 2022-07-12 CN disclosed
CN-112992406-B Insulating sheet, method for producing same, and rotating electrical machine 三菱电机株式会社 2022-07-01 CN disclosed
US-20220204737-A1 OXAZOLINE-MODIFIED POLYPROPYLENE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2022-06-30 US disclosed
EP-4019556-A1 OXAZOLINE-MODIFIED POLYPROPYLENE Sumitomo Chemical Company, Limited (JP) 2022-06-29 EP disclosed
US-11370744-B2 Compound, curable composition, cured product, optical member, and lens FUJIFILM CORPORATION (JP) 2022-06-28 US disclosed
CN-111757910-B Sealing resin composition 味之素株式会社 2022-06-24 CN disclosed
US-11364663-B2 Thermosetting composition, and method for manufacturing thermoset resin IDEMITSU KOSAN CO., LTD. (JP) 2022-06-21 US disclosed
CN-107251193-B Nanoimprint liquid material, method for producing pattern of cured product, method for producing optical component, and method for producing circuit board 佳能株式会社 2022-06-21 CN disclosed
US-20220185913-A1 METHOD FOR PRODUCING ACRYLIC RUBBER OSAKA SODA CO., LTD. (JP) 2022-06-16 US disclosed
CN-110088163-B Curable resin composition, and film, molded article, prepreg, and fiber-reinforced plastic using same 三菱化学株式会社 2022-06-14 CN disclosed
CN-114616261-A Thermosetting resin composition and electrical/electronic component comprising cured product thereof 昭和电工株式会社 2022-06-10 CN disclosed
CN-110770299-B Resin composition, method for producing resin composition, and molded article 旭化成株式会社 2022-06-07 CN disclosed
US-20220169817-A1 METHOD FOR PRODUCING BIODEGRADABLE RESIN EXPANDED SHEET SEKISUI KASEI CO., LTD. (JP) 2022-06-02 US disclosed
US-20220169766-A1 CURABLE COMPOSITION, CURED SUBSTANCE, OPTICAL MEMBER, AND LENS FUJIFILM CORPORATION (JP) 2022-06-02 US disclosed
US-11348891-B2 2022-05-31 US disclosed
CN-114552840-A Insulating sheet, method for producing same, and rotating electrical machine 三菱电机株式会社 2022-05-27 CN disclosed
CN-113788935-B Epoxy resin composition and preparation method and application thereof 韦尔通(厦门)科技股份有限公司 2022-05-27 CN disclosed
EP-4001323-A1 ACRYLIC RUBBER SHEET HAVING GOOD PRESERVATION STABILITY AND PROCESSABILITY Zeon Corporation (JP) 2022-05-25 EP disclosed
EP-4001319-A1 ACRYLIC RUBBER SHEET HAVING EXCELLENT WATER RESISTANCE Zeon Corporation (JP) 2022-05-25 EP disclosed
EP-4001316-A1 ACRYLIC-RUBBER BALE WITH EXCELLENT STORAGE STABILITY AND PROCESSABILITY Zeon Corporation (JP) 2022-05-25 EP disclosed
EP-4001324-A1 ACRYLIC RUBBER BALE HAVING EXCELLENT STORAGE STABILITY AND WATER RESISTANCE Zeon Corporation (JP) 2022-05-25 EP disclosed
EP-4001318-A1 ACRYLIC RUBBER HAVING EXCELLENT WATER RESISTANCE Zeon Corporation (JP) 2022-05-25 EP disclosed
EP-4001326-A1 ACRYLIC RUBBER WITH EXCELLENT STORAGE STABILITY Zeon Corporation (JP) 2022-05-25 EP disclosed
EP-4001320-A1 ACRYLIC RUBBER BALE HAVING EXCELLENT WORKABILITY AND WATER RESISTANCE Zeon Corporation (JP) 2022-05-25 EP disclosed
EP-4001315-A1 ACRYLIC RUBBER BALE HAVING EXCELLENT STORAGE STABILITY AND WORKABILITY Zeon Corporation (JP) 2022-05-25 EP disclosed
EP-4000839-A1 ACRYLIC-RUBBER BALE WITH EXCELLENT STORAGE STABILITY AND PROCESSABILITY Zeon Corporation (JP) 2022-05-25 EP disclosed
EP-4001317-A1 ACRYLIC RUBBER HAVING SUPERIOR WATER RESISTANCE Zeon Corporation (JP) 2022-05-25 EP disclosed
EP-4000840-A1 ACRYLIC RUBBER BALE WITH SUPERIOR STRENGTH CHARACTERISTICS AND WORKABILITY Zeon Corporation (JP) 2022-05-25 EP disclosed
EP-3998252-A1 THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS Shikoku Chemicals Corporation (JP) 2022-05-18 EP disclosed
US-11331891-B2 Method of producing laminated structure FUJIMORI KOGYO CO., LTD. (JP) 2022-05-17 US disclosed
CN-114514639-A Binder for secondary battery electrode, composition for secondary battery electrode mixture layer, secondary battery electrode, and secondary battery 东亚合成株式会社 2022-05-17 CN disclosed
CN-113788936-B Light/heat dual-curing resin composition and preparation method and application thereof 韦尔通(厦门)科技股份有限公司 2022-05-10 CN disclosed
US-20220137260-A1 POLYMERIZABLE COMPOSITION, COMPOUND, POLYMER, RESIN COMPOSITION, ULTRAVIOLET CUT FILM, AND LAMINATE FUJIFILM CORPORATION (JP) 2022-05-05 US disclosed
CN-110431168-B Curable composition and structure 味之素株式会社 2022-04-29 CN disclosed
EP-3988589-A1 METHOD FOR PREPARING POLYMER LG Chem, Ltd. (KR) 2022-04-27 EP disclosed
CN-114341213-A Polypropylene resin composition, method for producing same, method for producing pre-expanded beads, and method for producing foamed molded article 株式会社钟化 2022-04-12 CN disclosed
CN-109196696-B Binder for nonaqueous electrolyte secondary battery electrode and use thereof 东亚合成株式会社 2022-04-08 CN disclosed
CN-114276298-A Thiol compound, method for synthesizing same, and use of thiol compound 四国化成工业株式会社 2022-04-05 CN disclosed
CN-114258407-A Process for the preparation of polymers 株式会社LG化学 2022-03-29 CN disclosed
EP-3971224-A1 METHOD FOR PREPARING POLYMER LG Chem, Ltd. (KR) 2022-03-23 EP disclosed
CN-114213333-A Thiol compound, method for synthesizing same, and use of thiol compound 四国化成工业株式会社 2022-03-22 CN disclosed
CN-114222769-A Curable composition, cured product, optical component, and lens 富士胶片株式会社 2022-03-22 CN disclosed
CN-114206957-A Process for the preparation of polymers 株式会社LG化学 2022-03-18 CN disclosed
CN-114206960-A Polymerizable composition, compound, polymer, resin composition, ultraviolet shielding film, and laminate 富士胶片株式会社 2022-03-18 CN disclosed
CN-114127137-A Acrylic rubber bale with excellent strength characteristic and processability 日本瑞翁株式会社 2022-03-01 CN disclosed
CN-114127174-A Rubber composition for torsional damper NOK株式会社 2022-03-01 CN disclosed
CN-111164106-B Method for producing polymer latex 日本瑞翁株式会社 2022-03-01 CN disclosed
CN-109334132-B Anisotropic conductive film and method for producing same 迪睿合电子材料有限公司 2022-02-25 CN disclosed
CN-114096574-A Acrylic rubber bale with excellent storage stability and processability 日本瑞翁株式会社 2022-02-25 CN disclosed
CN-114080422-A Acrylic rubber sheet having excellent water resistance 日本瑞翁株式会社 2022-02-22 CN disclosed
CN-114080403-A Acrylic rubber bale with excellent processability and water resistance 日本瑞翁株式会社 2022-02-22 CN disclosed
CN-114072431-A Acrylic rubber bale with excellent storage stability and processability 日本瑞翁株式会社 2022-02-18 CN disclosed
CN-114072460-A Acrylic rubber sheet having excellent storage stability and processability 日本瑞翁株式会社 2022-02-18 CN disclosed
EP-3954732-A1 RUBBER COMPOSITION, VULCANIZED PRODUCT, AND VULCANIZED MOLDED ARTICLE Denka Company Limited (JP) 2022-02-16 EP disclosed
CN-114051506-A Acrylic rubber bag with excellent storage stability and water resistance 日本瑞翁株式会社 2022-02-15 CN disclosed
CN-114051505-A Acrylic rubber bale with excellent storage stability and processability 日本瑞翁株式会社 2022-02-15 CN disclosed
EP-3950255-A1 METHOD FOR PRODUCING BIODEGRADABLE RESIN EXPANDED SHEET Sekisui Kasei Co., Ltd. (JP) 2022-02-09 EP disclosed
EP-3950793-A1 POLYLACTIC ACID RESIN EXPANDED SHEET, RESIN MOLDED ARTICLE, AND METHOD FOR PRODUCING POLYLACTIC ACID RESIN EXPANDED SHEET Sekisui Kasei Co., Ltd. (JP) 2022-02-09 EP disclosed
CN-114026137-A Acrylic rubber having excellent water resistance 日本瑞翁株式会社 2022-02-08 CN disclosed
CN-114026138-A Acrylic rubber having excellent storage stability 日本瑞翁株式会社 2022-02-08 CN disclosed
CN-113993916-A Coating agent and article treated with the coating agent 第一工业制药株式会社 2022-01-28 CN disclosed
WO-2022013332-A1 REINFORCED FLUOROPOLYMER OMYA INTERNATIONAL AG (CH) 2022-01-20 WO disclosed
WO-2022013333-A1 REINFORCED ELASTOMER COMPOSITION OMYA INTERNATIONAL AG (CH) 2022-01-20 WO disclosed
WO-2022013344-A1 A COMPOSITION FORMED FROM A CALCIUM OR MAGNESIUM CARBONATE-COMPRISING MATERIAL AND A SURFACE-TREATMENT COMPOSITION COMPRISING AT LEAST ONE CROSS-LINKABLE COMPOUND OMYA INTERNATIONAL AG (CH) 2022-01-20 WO disclosed
WO-2022013336-A1 USE OF A POROUS FILLER FOR REDUCING THE GAS PERMEABILITY OF AN ELASTOMER COMPOSITION OMYA INTERNATIONAL AG (CH) 2022-01-20 WO disclosed
CN-113943420-A UV (ultraviolet) light-cured resin composition and preparation method and application thereof 韦尔通(厦门)科技股份有限公司 2022-01-18 CN disclosed
US-20220013785-A1 BINDER FOR A SECONDARY BATTERY ELECTRODE AND USE THEREOF TOAGOSEI CO., LTD. (JP) 2022-01-13 US disclosed
CN-113912523-A Polythiol compound, preparation method thereof, curing agent, resin composition, adhesive and sealant 韦尔通(厦门)科技股份有限公司 2022-01-11 CN disclosed
WO-2022004801-A1 CURABLE RESIN COMPOSITION, CURED ARTICLE, DIFFRACTIVE OPTICAL ELEMENT AND MULTILAYER DIFFRACTIVE OPTICAL ELEMENT 富士フイルム株式会社 2022-01-06 WO disclosed
US-11215935-B2 Electrophotographic photoreceptor, process cartridge, and image forming apparatus FUJIFILM BUSINESS INNOVATION CORP. (JP) 2022-01-04 US disclosed
WO-2021261212-A1 ACRYLIC RUBBER HAVING EXCELLENT INJECTION MOLDABILITY 日本ゼオン株式会社 2021-12-30 WO disclosed
WO-2021261213-A1 ACRYLIC RUBBER HAVING EXCELLENT INJECTION MOLDABILITY AND BANBURY PROCESSABILITY 日本ゼオン株式会社 2021-12-30 WO disclosed
WO-2021261214-A1 ACRYLIC RUBBER BALE HAVING EXCELLENT BANBURY PROCESSABILITY 日本ゼオン株式会社 2021-12-30 WO disclosed
WO-2021261216-A1 ACRYLIC RUBBER BALE HAVING EXCELLENT BANBURY PROCESSABILITY AND INJECTION MOLDABILITY 日本ゼオン株式会社 2021-12-30 WO disclosed
WO-2021261196-A1 RADICAL CURABLE RESIN COMPOSITION, FIBER-REINFORCED MOLDING MATERIAL, AND MOLDED ARTICLE USING SAME DIC株式会社 2021-12-30 WO disclosed
US-20210403701-A1 CURABLE RESIN COMPOSITION, AND FILM, MOLDED ARTICLE, PREPREG, AND FIBER-REINFORCED PLASTIC USING SAID CURABLE RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2021-12-30 US disclosed
US-20210403438-A1 CURABLE COMPOSITION, CURED PRODUCT, OPTICAL MEMBER, LENS, AND METHOD FOR MANUFACTURING OPTICAL MEMBER FUJIFILM CORPORATION (JP) 2021-12-30 US disclosed
WO-2021261215-A1 ACRYLIC RUBBER BALE HAVING EXCELLENT BANBURY PROCESSABILITY AND WATER RESISTANCE 日本ゼオン株式会社 2021-12-30 WO disclosed
CN-113840891-A Method for manufacturing semiconductor device 昭和电工材料株式会社 2021-12-24 CN disclosed
US-20210395418-A1 RESIN COMPOSITION, CURED PRODUCT, DIFFRACTIVE OPTICAL ELEMENT, AND MULTILAYER DIFFRACTIVE OPTICAL ELEMENT FUJIFILM CORPORATION (JP) 2021-12-23 US disclosed
US-20210399306-A1 BINDER FOR SECONDARY BATTERY ELECTRODE AND USE THEREOF TOAGOSEI CO. LTD. (JP) 2021-12-23 US disclosed
CN-113788936-A Light/heat dual-curing resin composition and preparation method and application thereof 韦尔通(厦门)科技股份有限公司 2021-12-14 CN disclosed
CN-113788935-A Epoxy resin composition and preparation method and application thereof 韦尔通(厦门)科技股份有限公司 2021-12-14 CN disclosed
US-20210380850-A1 CONDUCTIVE RESIN COMPOSITION, CONDUCTIVE ADHESIVE, AND SEMICONDUCTOR DEVICE NAMICS CORPORATION (JP) 2021-12-09 US disclosed
US-20210382391-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT HD MICROSYSTEMS, LTD. (JP) 2021-12-09 US disclosed
EP-3919523-A1 PHOTOCURABLE RESIN COMPOSITION, INK AND COATING MATERIAL Osaka Soda Co., Ltd. (JP) 2021-12-08 EP disclosed
US-20210371706-A1 METHOD OF PRODUCING ANISOTROPIC CONDUCTIVE FILM AND ANISOTROPIC CONDUCTIVE FILM DEXERIALS CORPORATION (JP) 2021-12-02 US disclosed
US-20210363320-A1 HEAT-EXPANDABLE MICROSPHERES AND APPLICATION THEREOF MATSUMOTO YUSHI-SEIYAKU CO., LTD. (JP) 2021-11-25 US disclosed
US-11180650-B2 Thermoplastic resin composition and molded product manufactured therefrom LOTTE ADVANCED MATERIALS CO., LTD. (KR) 2021-11-23 US disclosed
US-20210355318-A1 Thermoplastic Resin Composition and Article Produced Therefrom LOTTE CHEMICAL CORPORATION (KR) 2021-11-18 US disclosed
EP-3909766-A1 MODIFIED CONJUGATED DIENE POLYMER, MODIFIED CONJUGATED DIENE POLYMER COMPOSITION, MULTILAYER ARTICLE, METHOD FOR PRODUCING MULTILAYER ARTICLE, AND MOLDED ARTICLE Asahi Kasei Kabushiki Kaisha (JP) 2021-11-17 EP disclosed
US-11173350-B2 Golf ball BRIDGESTONE SPORTS CO., LTD. (JP) 2021-11-16 US disclosed
US-11177478-B2 Crosslinked polymer binder from crosslinkable monomer for nonaqueous electrolyte secondary battery and use thereof TOAGOSEI CO. LTD. (JP) 2021-11-16 US disclosed
US-11169455-B2 Electrophotographic photoreceptor, process cartridge, and image forming apparatus FUJIFILM BUSINESS INNOVATION CORP. (JP) 2021-11-09 US disclosed
CN-113632219-A Thermally conductive composition and semiconductor device 住友电木株式会社 2021-11-09 CN disclosed
CN-113631675-A Semiconductor package, method for manufacturing semiconductor package, and thermally conductive composition used therefor 住友电木株式会社 2021-11-09 CN disclosed
CN-113631239-A Composition containing fluorine-containing copolymer and defoaming agent 第一工业制药株式会社 2021-11-09 CN disclosed
EP-3467047-B1 THERMOPLASTIC RESIN, MOLDED PRODUCT, FILM AND LAYERED PRODUCT KURARAY CO (JP) 2021-11-03 EP disclosed
US-11161975-B2 Curable resin composition, and film, molded article, prepreg, and fiber-reinforced plastic using said curable resin composition MITSUBISHI CHEMICAL CORPORATION (JP) 2021-11-02 US disclosed
US-11155021-B2 Method of producing molded article FUJIMORI KOGYO CO., LTD. (JP) 2021-10-26 US disclosed
CN-111032704-B Cured product, optical component, lens, compound, and curable composition 富士胶片株式会社 2021-10-26 CN disclosed
CN-111051363-B Compound, curable composition, cured product, optical component, and lens 富士胶片株式会社 2021-10-22 CN disclosed
CN-108456495-B Thermal adhesive tape and method for producing thermal adhesive tape 麦克赛尔控股株式会社 2021-10-22 CN disclosed
US-11149162-B2 Aqueous dispersion, coating film, and laminate SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2021-10-19 US disclosed
CN-113490720-A Composition containing fluorine-containing copolymer 第一工业制药株式会社 2021-10-08 CN disclosed
US-20210309846-A1 ACRYLIC COPOLYMER AND RUBBER MATERIAL OSAKA SODA CO., LTD. (JP) 2021-10-07 US disclosed
EP-3889217-A1 THERMOPLASTIC RESIN COMPOSITION AND ARTICLE PRODUCED THEREFROM Lotte Chemical Corporation (KR) 2021-10-06 EP disclosed
US-11136476-B2 Method of producing anisotropic conductive film and anisotropic conductive film DEXERIALS CORPORATION (JP) 2021-10-05 US disclosed
CN-113474415-A Resin composition, cured product, diffractive optical element, and multilayer diffractive optical element 富士胶片株式会社 2021-10-01 CN disclosed
CN-108699343-B Curable composition for producing resin sheet providing tough cured product 东亚合成株式会社 2021-10-01 CN disclosed
US-20210296700-A1 ELECTROLYTE COMPOSITION, ELECTROLYTE FILM, AND METHOD OF MANUFACTURING ELECTROLYTE FILM NIPPON SHOKUBAI CO., LTD. (JP) 2021-09-23 US disclosed
EP-3222643-B1 ETHYLENE-VINYL ACETATE COPOLYMER RESIN COMPOSITION, GRAFT COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED RESIN ARTICLE NOF CORP (JP) 2021-09-22 EP disclosed
US-11124593-B2 Modified block copolymer, method for producing modified block copolymer, and resin composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2021-09-21 US disclosed
US-20210280548-A1 ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF DEXERIALS CORPORATION (JP) 2021-09-09 US disclosed
CN-113366053-A Polylactic acid resin foamed sheet, resin molded article, and method for producing polylactic acid resin foamed sheet 积水化成品工业株式会社 2021-09-07 CN disclosed
CN-113272274-A Thiol compound, synthesis method thereof and application of thiol compound 四国化成工业株式会社 2021-08-17 CN disclosed
CN-113272338-A Binder for secondary battery electrode and use thereof 东亚合成株式会社 2021-08-17 CN disclosed
CN-113227248-A Thermoplastic resin composition, method for preparing the same, and molded article comprising the same 株式会社LG化学 2021-08-06 CN disclosed
CN-113227247-A Thermoplastic resin composition, method for preparing the same, and molded article comprising the same 株式会社LG化学 2021-08-06 CN disclosed
US-11078180-B2 Cured product, optical member, lens, compound, and curable composition FUJIFILM CORPORATION (JP) 2021-08-03 US disclosed
CN-113196170-A Photosensitive resin composition, method for producing patterned cured product, interlayer insulating film, covercoat, surface protective film, and electronic component 艾曲迪微系统股份有限公司 2021-07-30 CN disclosed
CN-113196169-A Photosensitive resin composition, method for producing patterned cured product, interlayer insulating film, covercoat, surface protective film, and electronic component 艾曲迪微系统股份有限公司 2021-07-30 CN disclosed
WO-2021149763-A1 CURABLE COMPOSITION FOR PRODUCTION OF RESIN SHEET 東亞合成株式会社 2021-07-29 WO disclosed
CN-113168092-A Photosensitive resin composition, method for producing patterned cured product, interlayer insulating film, covercoat, surface protective film, and electronic component 艾曲迪微系统股份有限公司 2021-07-23 CN disclosed
CN-113169038-A Method for manufacturing semiconductor device, light absorbing laminate, and laminate for temporary fixation 昭和电工材料株式会社 2021-07-23 CN disclosed
CN-113168102-A Photosensitive resin composition, method for producing patterned cured product, interlayer insulating film, covercoat, surface protective film, and electronic component 艾曲迪微系统股份有限公司 2021-07-23 CN disclosed
CN-113121825-A Novel poly (arylene ether) resin and preparation method thereof 山东圣泉新材料股份有限公司 2021-07-16 CN disclosed
EP-2963085-B1 TRANSPARENT AND TOUGH RUBBER COMPOSITION CARIFLEX PTE LTD (SG) 2021-07-14 EP disclosed
CN-108473436-B Compound, curable composition, cured product, optical component, and lens 富士胶片株式会社 2021-07-06 CN disclosed
WO-2021132693-A1 CURABLE COMPOSITION 東亞合成株式会社 2021-07-01 WO disclosed
WO-2021131933-A1 POLYPROPYLENE RESIN COMPOSITION, METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING PRE-FOAMED PARTICLES, AND METHOD FOR PRODUCING FOAM MOLDED ARTICLES 株式会社カネカ 2021-07-01 WO disclosed
WO-2021131571-A1 SHEET MOLDING COMPOUND RESIN COMPOSITION, SHEET MOLDING COMPOUND, MOLDED ARTICLE, AND METHOD FOR PRODUCING SHEET MOLDING COMPOUND DIC株式会社 2021-07-01 WO disclosed
WO-2021125292-A1 METHACRYLIC COPOLYMER, PRODUCTION METHOD THEREFOR, METHACRYLIC COPOLYMER COMPOSITION, AND MOLDED BODY 株式会社クラレ 2021-06-24 WO disclosed
CN-112992406-A Insulating sheet, method for producing same, and rotating electrical machine 三菱电机株式会社 2021-06-18 CN disclosed
US-20210183535-A1 INSULATION SHEET AND PRODUCING METHOD THEREFOR, AND ROTARY ELECTRIC MACHINE MITSUBISHI ELECTRIC CORPORATION (JP) 2021-06-17 US disclosed
WO-2021117903-A1 METHACRYLIC COPOLYMER AND MANUFACTURING METHOD SUITABLE FOR MANUFACTURING SAME 株式会社クラレ 2021-06-17 WO disclosed
EP-3835331-A1 ACRYLIC COPOLYMER AND RUBBER MATERIAL Osaka Soda Co., Ltd. (JP) 2021-06-16 EP disclosed
US-11034863-B2 2021-06-15 US disclosed
US-20210169749-A1 SEPARATELY PACKED CURABLE COMPOSITION MITSUI CHEMICALS, INC. (JP) 2021-06-10 US disclosed
US-20210171766-A1 Thermoplastic Resin Composition and Molded Article Manufactured Therefrom LOTTE CHEMICAL CORPORATION (KR) 2021-06-10 US disclosed
CN-112930584-A Method for manufacturing semiconductor device and adhesive film for processing semiconductor wafer 昭和电工材料株式会社 2021-06-08 CN disclosed
CN-112912247-A Thermoplastic resin laminate 三菱瓦斯化学株式会社 2021-06-04 CN disclosed
WO-2021106588-A1 RESIN COMPOSITION FOR PREPREG, PREPREG AND MOLDED ARTICLE DIC株式会社 2021-06-03 WO disclosed
CN-106977754-B Prepreg and method for producing same 三菱化学株式会社 2021-05-28 CN disclosed
US-11015011-B2 Method for producing maleimide block copolymer NIPPON SHOKUBAI CO., LTD. (JP) 2021-05-25 US disclosed
WO-2021095688-A1 UNSATURATED POLYESTER RESIN COMPOSITION, MOLDING MATERIAL, AND MOLDED ARTICLE ジャパンコンポジット株式会社 2021-05-20 WO disclosed
EP-3819338-A1 PROPYLENE POLYMER COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2021-05-12 EP disclosed
CN-112778462-A Curable composition, molded article, and laminate 株式会社菱晃 2021-05-11 CN disclosed
US-20210130603-A1 THERMOSETTING RESIN COMPOSITION, SHEET-FORM INSULATING VARNISH AND PRODUCING METHOD THEREFOR, ELECTRICAL DEVICE, AND ROTARY ELECTRIC MACHINE MITSUBISHI ELECTRIC CORPORATION (JP) 2021-05-06 US disclosed
EP-3817119-A1 ELECTROLYTE COMPOSITION, ELECTROLYTE FILM, AND METHOD OF MANUFACTURING ELECTROLYTE FILM Nippon Shokubai Co., Ltd. (JP) 2021-05-05 EP disclosed
CN-112745742-A Thermosetting resin composition, sheet-type insulating varnish, method for producing same, electrical device, and rotating electrical machine 三菱电机株式会社 2021-05-04 CN disclosed
CN-112703214-A Unsaturated polyester resin composition, molding material, molded article, and battery pack case for electric vehicle 日本复合材料株式会社 2021-04-23 CN disclosed
US-20210115234-A1 PROPYLENE POLYMER COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2021-04-22 US disclosed
US-20210116809-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF MANUFACTURING PATTERN CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER-COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT HD MICROSYSTEMS, LTD. (JP) 2021-04-22 US disclosed
CN-105026482-B Transparent and tough rubber composition and method for producing same 卡里福热师私人有限公司 2021-04-20 CN disclosed
US-20210108012-A1 CURABLE COMPOSITION, CURED PRODUCT, OPTICAL MEMBER, LENS, AND COMPOUND FUJIFILM CORPORATION (JP) 2021-04-15 US disclosed
CN-109166649-B Anisotropic conductive film and method for producing same 迪睿合电子材料有限公司 2021-04-13 CN disclosed
CN-108884296-B Curable composition, cured product thereof, and rotary machine 三菱电机株式会社 2021-04-09 CN disclosed
WO-2021060237-A1 ADDITIVE FOR RESINS 第一工業製薬株式会社 2021-04-01 WO disclosed
CN-109071913-B Aqueous dispersion, coating film, and laminate 住友化学株式会社 2021-03-30 CN disclosed
WO-2021053922-A1 THERMOSETTING RESIN COMPOSITION AND ELECTRICAL/ELECTRONIC COMPONENT WHICH CONTAINS CURED PRODUCT OF SAME 昭和電工株式会社 2021-03-25 WO disclosed
US-10954183-B2 Curable composition, semi-cured product, cured product, optical member, lens, and compound FUJIFILM CORPORATION (JP) 2021-03-23 US disclosed
EP-3124535-B1 USE OF A COMPOSITION FOR DIP MOLDING AND DIP-MOLDED ARTICLE ZEON CORP (JP) 2021-03-17 EP disclosed
CN-112513113-A Graft copolymer, thermoplastic resin composition and molded article thereof 大科能宇菱通株式会社 2021-03-16 CN disclosed
CN-112480681-A Addition-curable silicone composition, cured product thereof, light-reflecting material, and optical semiconductor device 信越化学工业株式会社 2021-03-12 CN disclosed
US-20210070909-A1 THERMOSETTING RESIN COMPOSITION OSAKA SODA CO., LTD. (JP) 2021-03-11 US disclosed
EP-3789411-A2 POLYMER RESIN Sumitomo Chemical Company, Limited (JP) 2021-03-10 EP disclosed
CN-112470318-A Electrolyte composition, electrolyte membrane, and method for producing electrolyte membrane 株式会社日本触媒 2021-03-09 CN disclosed
WO-2021039396-A1 RUBBER COMPOSITION, VULCANIZED PRODUCT, AND VULCANIZED MOLDED ARTICLE デンカ株式会社 2021-03-04 WO disclosed
CN-107849188-B Methacrylic resin, method for producing methacrylic resin, molded article, and automobile 三菱化学株式会社 2021-03-02 CN disclosed
WO-2021029146-A1 POLYMERIZABLE COMPOSITION, COMPOUND, POLYMER, RESIN COMPOSITION, UV SHIELDING FILM, AND LAMINATE 富士フイルム株式会社 2021-02-18 WO disclosed
EP-3778680-A1 THERMOSETTING RESIN COMPOSITION Osaka Soda Co., Ltd. (JP) 2021-02-17 EP disclosed
CN-112352003-A Curable composition, cured product, optical member, lens, and compound 富士胶片株式会社 2021-02-09 CN disclosed
WO-2021020426-A1 METHACRYL RESIN COMPOSITION, RESIN MODIFIER, MOLDED BODY, FILM, AND FILM MANUFACTURING METHOD 株式会社クラレ 2021-02-04 WO disclosed
CN-109072029-B Radical-curable adhesive composition and adhesive 昭和电工株式会社 2021-01-26 CN disclosed
US-20210017315-A1 CURED PRODUCT, OPTICAL MEMBER, LENS, AND COMPOUND FUJIFILM CORPORATION (JP) 2021-01-21 US disclosed
US-20210008859-A1 CURABLE COMPOSITION FOR POLYMER ELECTROLYTE, AND LAYERED BODY TOAGOSEI CO., LTD. (JP) 2021-01-14 US disclosed
EP-3763788-A1 CURABLE COMPOSITION FOR POLYMER ELECTROLYTE, AND LAMINATE Toagosei Co., Ltd. (JP) 2021-01-13 EP disclosed
US-10875996-B2 Methacrylic copolymer and molded article KURARAY CO., LTD. (JP) 2020-12-29 US disclosed
US-20200398116-A1 GOLF BALL BRIDGESTONE SPORTS CO, LTD. (JP) 2020-12-24 US disclosed
WO-2020255763-A1 COATING AGENT AND ARTICLE TREATED WITH SAID COATING AGENT 第一工業製薬株式会社 2020-12-24 WO disclosed
CN-107540797-B Composition for non-conductive adhesive film and non-conductive adhesive film comprising same 利诺士尖端材料有限公司 2020-12-15 CN disclosed
US-20200385545-A1 USE OF A MIXTURE OF ORGANIC PEROXIDES FOR CROSSLINKING A POLYOLEFIN ELASTOMER ARKEMA FRANCE (FR) 2020-12-10 US disclosed
US-10858488-B2 Thermoplastic resin, molded product, film, and layered product KURARAY CO., LTD. (JP) 2020-12-08 US disclosed
EP-3279226-B1 METHOD FOR PREPARING AROMATIC VINYL-UNSATURATED NITRILE-BASED COPOLYMER LG CHEMICAL LTD (KR) 2020-12-02 EP disclosed
CN-112004889-A Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device 三菱瓦斯化学株式会社 2020-11-27 CN disclosed
US-20200369606-A1 THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS SHIKOKU CHEMICALS CORPORATION (JP) 2020-11-26 US disclosed
CN-111989363-A Rubber composition NOK株式会社 2020-11-24 CN disclosed
US-10847837-B2 Binder for nonaqueous electrolyte secondary battery electrode, manufacturing method thereof, and use thereof TOAGOSEI CO. LTD. (JP) 2020-11-24 US disclosed
WO-2020230662-A1 FIBER-REINFORCED MOLDING MATERIAL AND MOLDED ARTICLE USING SAME DIC株式会社 2020-11-19 WO disclosed
CN-107001524-B Polymer and method of making same 住友化学株式会社 2020-11-17 CN disclosed
EP-3345964-B1 TIRE BRIDGESTONE CORP (JP) 2020-11-11 EP disclosed
CN-111919291-A Power module 信越化学工业株式会社 2020-11-10 CN disclosed
US-20200347220-A1 Thermoplastic Resin Composition and Molded Product Manufactured Therefrom LOTTE CHEMICAL CORPORATION (KR) 2020-11-05 US disclosed
EP-3733772-A1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MANUFACTURED THEREFROM Lotte Chemical Corporation (KR) 2020-11-04 EP disclosed
EP-3121219-B1 PREPREG ROLL MITSUBISHI CHEM CORP (JP) 2020-11-04 EP disclosed
US-10821692-B2 Tire BRIDGESTONE CORPORATION (JP) 2020-11-03 US disclosed
US-20200341393-A1 ELECTROPHOTOGRAPHIC PHOTORECEPTOR, PROCESS CARTRIDGE, AND IMAGE FORMING APPARATUS FUJI XEROX CO., LTD. (JP) 2020-10-29 US disclosed
WO-2020218365-A1 CURABLE COMPOSITION 東亞合成株式会社 2020-10-29 WO disclosed
US-20200341392-A1 ELECTROPHOTOGRAPHIC PHOTORECEPTOR, PROCESS CARTRIDGE, AND IMAGE FORMING APPARATUS FUJI XEROX CO., LTD. (JP) 2020-10-29 US disclosed
EP-3730550-A2 THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCT MANUFACTURED THEREFROM Lotte Chemical Corporation (KR) 2020-10-28 EP disclosed
EP-3178854-B1 METHOD FOR PRODUCING (METH)ACRYLIC RESIN COMPOSITION KURARAY CO (JP) 2020-10-28 EP disclosed
WO-2020213414-A1 FIBER-REINFORCED MOLDING MATERIAL AND MOLDED ARTICLE USING THE SAME DIC株式会社 2020-10-22 WO disclosed
US-20200335791-A1 BINDER FOR SECONDARY BATTERY ELECTRODE, AND USE THEREOF TOAGOSEI CO. LTD. (JP) 2020-10-22 US disclosed
EP-3235836-B1 POLYMER SUMITOMO CHEMICAL CO (JP) 2020-10-21 EP disclosed
US-10808150-B2 Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element HITACHI CHEMICAL COMPANY, LTD. (JP) 2020-10-20 US disclosed
CN-108431652-B Optical film, polarizing plate and display device 柯尼卡美能达株式会社 2020-10-20 CN disclosed
CN-111801382-A Thermoplastic resin composition, method for preparing the same, and molded article comprising the same 株式会社LG化学 2020-10-20 CN disclosed
CN-107922687-B Tyre for vehicle wheels 株式会社普利司通 2020-10-16 CN disclosed
US-20200325367-A1 LENS ADHESIVE, CEMENTED LENS, AND IMAGING MODULE FUJIFILM CORPORATION (JP) 2020-10-15 US disclosed
US-10800209-B2 Tire BRIDGESTONE CORPORATION (JP) 2020-10-13 US disclosed
CN-111770938-A Photocurable resin composition, ink, and coating material 株式会社大阪曹達 2020-10-13 CN disclosed
CN-111757910-A Sealing resin composition 味之素株式会社 2020-10-09 CN disclosed
US-20200317902-A1 METHACRYLIC COPOLYMER AND MOLDED ARTICLE KURARAY CO., LTD. (JP) 2020-10-08 US disclosed
EP-3438200-B1 CURABLE COMPOSITION, CURED OBJECT OBTAINED THEREFROM, AND ROTARY DEVICE MITSUBISHI ELECTRIC CORP (JP) 2020-10-07 EP disclosed
US-10793719-B2 Elastomeric compositions providing improved wet grip KRATON POLYMERS LLC (US) 2020-10-06 US disclosed
WO-2020195916-A1 COMPOSITION THAT CONTAINS FLUORINE-CONTAINING COPOLYMER, AND DEFOAMER 第一工業製薬株式会社 2020-10-01 WO disclosed
US-10790542-B2 2020-09-29 US disclosed
WO-2020189486-A1 ACTIVE ENERGY RAY-CROSSLINKABLE THERMOPLASTIC POLYMER AND COMPOSITION CONTAINING SAME 株式会社クラレ 2020-09-24 WO disclosed
CN-111690093-A Rubbery polymer, graft copolymer and thermoplastic resin composition 大科能宇菱通株式会社 2020-09-22 CN disclosed
CN-111684038-A Thermally expandable microspheres and use thereof 松本油脂制药株式会社 2020-09-18 CN disclosed
WO-2020184585-A1 ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING CIRCUIT CONNECTED STRUCTURE, AND ADHESIVE FILM HOUSING SET 日立化成株式会社 2020-09-17 WO disclosed
WO-2020184636-A1 ADHESIVE FILM FOR CIRCUIT CONNECTION, METHOD FOR PRODUCING CIRCUIT CONNECTED STRUCTURE, AND ADHESIVE FILM HOUSING SET 日立化成株式会社 2020-09-17 WO disclosed
CN-111662414-A Rubbery polymer, graft copolymer and thermoplastic resin composition 大科能宇菱通株式会社 2020-09-15 CN disclosed
CN-111655662-A Compound, resin, composition, resist pattern forming method, circuit pattern forming method, and resin purifying method 三菱瓦斯化学株式会社 2020-09-11 CN disclosed
EP-3370288-B1 BINDER FOR NONAQUEOUS ELECTROLYTE SECONDARY CELL ELECTRODE, METHOD FOR PRODUCING BINDER, AND USE THEREOF TOAGOSEI CO LTD (JP) 2020-09-09 EP disclosed
CN-107849332-B Conductive composition, conductor and flexible printed circuit board 太阳油墨制造株式会社 2020-09-04 CN disclosed
EP-3702348-A1 THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS Shikoku Chemicals Corporation (JP) 2020-09-02 EP disclosed
CN-111615507-A Compound, resin, composition, and pattern forming method 三菱瓦斯化学株式会社 2020-09-01 CN disclosed
US-10754266-B2 Electrophotographic photoreceptor, process cartridge, and image forming apparatus FUJI XEROX CO., LTD. (JP) 2020-08-25 US disclosed
WO-2020162288-A1 UNSATURATED POLYESTER RESIN COMPOSITION, MOLDING MATERIAL, MOLDED ARTICLE AND BATTERY PACK CASE FOR ELECTRIC VEHICLES ジャパンコンポジット株式会社 2020-08-13 WO disclosed
US-20200247019-A1 THERMOSETTING COMPOSITION, AND METHOD FOR MANUFACTURING THERMOSET RESIN IDEMITSU KOSAN CO., LTD.. (JP) 2020-08-06 US disclosed
US-20200247934-A1 METHOD FOR PRODUCING MALEIMIDE BLOCK COPOLYMER NIPPON SHOKUBAI CO., LTD. (JP) 2020-08-06 US disclosed
EP-3689951-A1 PREPREG RESIN COMPOSITION, PREPREG AND MOLDED ARTICLE DIC Corporation (JP) 2020-08-05 EP disclosed
CN-108602328-B Stretched film of thermoplastic resin laminate 三菱瓦斯化学株式会社 2020-07-31 CN disclosed
WO-2020149504-A1 THERMOPLASTIC RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND MOLDED PRODUCT COMPRISING SAME (주) 엘지화학 2020-07-23 WO disclosed
WO-2020149193-A1 CURABLE COMPOSITION AND CURED MATERIAL コスモ石油ルブリカンツ株式会社 2020-07-23 WO disclosed
US-20200231799-A1 Thermoplastic Resin Composition and Molded Product Manufactured Therefrom LOTTE ADVANCED MATERIALS CO., LTD. (KR) 2020-07-23 US disclosed
US-10717792-B2 Polymer SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2020-07-21 US disclosed
WO-2020145111-A1 THIOL COMPOUND, METHOD FOR SYNTHESIZING SAME, AND USES FOR SAID THIOL COMPOUND 四国化成工業株式会社 2020-07-16 WO disclosed
EP-3288105-B1 BINDER FOR NONAQUEOUS ELECTROLYTE SECONDARY BATTERY ELECTRODES AND USE OF SAME TOAGOSEI CO LTD (JP) 2020-07-15 EP disclosed
US-20200216595-A1 POLYMER, GRAFT POLYMER, AND THERMOPLASTIC RESIN COMPOSITION TECHNO-UMG CO., LTD. (JP) 2020-07-09 US disclosed
WO-2020138501-A1 MULTILAYER-STRUCTURED POLYMER PARTICLE, AND THERMOPLASTIC RESIN COMPOSITION, MOLDED BODY, AND FILM INCLUDING SAME 株式会社クラレ 2020-07-02 WO disclosed
WO-2020138363-A1 CURABLE COMPOSITION FOR DENTAL USE AND METHOD FOR PRODUCING SAME クラレノリタケデンタル株式会社 2020-07-02 WO disclosed
WO-2020137781-A1 EPIHALOHYDRIN RUBBER COMPOSITION 日本ゼオン株式会社 2020-07-02 WO disclosed
EP-3277733-B1 A CURED TRANSPARENT RUBBER ARTICLE, AND MANUFACTURING PROCESS FOR THE SAME CARIFLEX PTE LTD (SG) 2020-07-01 EP disclosed
US-20200199095-A1 CURED PRODUCT, OPTICAL MEMBER, LENS, COMPOUND, AND CURABLE COMPOSITION FUJIFILM CORPORATION (JP) 2020-06-25 US disclosed
US-20200199282-A1 Modified Block Copolymer, Method for Producing Modified Block Copolymer, and Resin Composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-06-25 US disclosed
EP-3668925-A1 ELASTOMERIC COMPOSITIONS PROVIDING IMPROVED WET GRIP Kraton Polymers LLC (US) 2020-06-24 EP disclosed
EP-3127927-B1 HEAT RESISTANT SAN RESIN, PREPARATION METHOD THEREFOR, AND HEAT RESISTANT SAN RESIN COMPOSITION CONTAINING SAME LG CHEMICAL LTD (KR) 2020-06-24 EP disclosed
CN-111315719-A Thiol compound, method for synthesizing same, and use of thiol compound 四国化成工业株式会社 2020-06-19 CN disclosed
CN-106957392-B Curable resin composition for blind road sticker, and method for producing blind road sticker 株式会社菱晃 2020-06-19 CN disclosed
EP-3666247-A1 DIVIDED CURABLE COMPOSITION Mitsui Chemicals, Inc. (JP) 2020-06-17 EP disclosed
CN-105623166-B Halogen-free flame-retardant resin composition and high-voltage cable 日立金属株式会社 2020-06-12 CN disclosed
US-20200181061-A1 COMPOUND, CURABLE COMPOSITION, CURED PRODUCT, OPTICAL MEMBER, AND LENS FUJIFILM CORPORATION (JP) 2020-06-11 US disclosed
US-10680246-B2 Binder for nonaqueous electrolyte secondary battery electrode, manufacturing method therefor and use therefor TOAGOSEI CO., LTD. (JP) 2020-06-09 US disclosed
CN-111263995-A Binder for secondary battery electrode and use thereof 东亚合成株式会社 2020-06-09 CN disclosed
US-10668650-B2 Thermosetting composition, and method for manufacturing thermoset resin IDEMISTU KOSAN CO., LTD. (JP) 2020-06-02 US disclosed
US-20200157257-A1 CURABLE MATERIAL AND METHOD FOR MOLDING SAID THERMALLY CURABLE MATERIAL IDEMITSU KOSAN CO., LTD. (JP) 2020-05-21 US disclosed
US-20200155421-A1 TWO-PASTE DENTAL CURABLE COMPOSITION KURARAY NORITAKE DENTAL INC. (JP) 2020-05-21 US disclosed
CN-111164106-A Method for producing polymer latex 日本瑞翁株式会社 2020-05-15 CN disclosed
CN-105385362-B Adhesive composition and connection structure 日立化成株式会社 2020-05-15 CN disclosed
EP-3650477-A1 POLYMER, GRAFT POLYMER, AND THERMOPLASTIC RESIN COMPOSITION Techno-UMG Co., Ltd. (JP) 2020-05-13 EP disclosed
US-10647828-B2 Prepreg and method for producing same MITSUBISHI CHEMICAL CORPORATION (JP) 2020-05-12 US disclosed
EP-3646847-A1 TWO-PASTE TYPE DENTAL CURABLE COMPOSITION Kuraray Noritake Dental Inc. (JP) 2020-05-06 EP disclosed
WO-2020085286-A1 THERMOPLASTIC RESIN LAMINATE 三菱瓦斯化学株式会社 2020-04-30 WO disclosed
EP-3229046-B1 LIGHT CONTROL PANEL AND OPTICAL IMAGING DEVICE SHOWA DENKO KK (JP) 2020-04-29 EP disclosed
CN-111051363-A Compound, curable composition, cured product, optical component, and lens 富士胶片株式会社 2020-04-21 CN disclosed
CN-111032704-A Cured product, optical component, lens, compound, and curable composition 富士胶片株式会社 2020-04-17 CN disclosed
CN-108136832-B Tyre for vehicle wheels 株式会社普利司通 2020-04-17 CN disclosed
US-20200115316-A1 CURABLE COMPOSITION, SEMI-CURED PRODUCT, CURED PRODUCT, OPTICAL MEMBER, LENS, AND COMPOUND FUJIFILM CORPORATION (JP) 2020-04-16 US disclosed
US-10619058-B2 Curable composition TOAGOSEI CO., LTD. (JP) 2020-04-14 US disclosed
CN-110997804-A Thermoplastic resin composition and molded article produced therefrom 乐天尖端材料株式会社 2020-04-10 CN disclosed
WO-2020071204-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT 日立化成デュポンマイクロシステムズ株式会社 2020-04-09 WO disclosed
WO-2020071201-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT 日立化成デュポンマイクロシステムズ株式会社 2020-04-09 WO disclosed
WO-2020070924-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED PATTERN, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM AND ELECTRONIC COMPONENT 日立化成デュポンマイクロシステムズ株式会社 2020-04-09 WO disclosed
WO-2020071437-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN-CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATION FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT 日立化成デュポンマイクロシステムズ株式会社 2020-04-09 WO disclosed
US-10611856-B2 Curable composition TOAGOSEI CO., LTD. (JP) 2020-04-07 US disclosed
WO-2020066149-A1 COPOLYMER AND WATER- AND OIL-REPELLENT AGENT 第一工業製薬株式会社 2020-04-02 WO disclosed
WO-2020066150-A1 COPOLYMER AND WATER- AND OIL-REPELLENT AGENT 第一工業製薬株式会社 2020-04-02 WO disclosed
EP-3186287-B1 TRANSPARENT, TOUGH AND HEATPROOF RUBBER COMPOSITION COMPRISING NEODYMIUM-CATALYZED ISOPRENE COMPONENT, AND MANUFACTURING PROCESS FOR THE SAME KRATON POLYMERS US LLC (US) 2020-04-01 EP disclosed
CN-110941154-A Electrophotographic photoreceptor, process cartridge, and image forming apparatus 富士施乐株式会社 2020-03-31 CN disclosed
US-10604503-B2 Curable composition, cured product, optical member, lens, and compound FUJIFILM CORPORATION (JP) 2020-03-31 US disclosed
US-20200096884-A1 ELECTROPHOTOGRAPHIC PHOTORECEPTOR, PROCESS CARTRIDGE, AND IMAGE FORMING APPARATUS FUJI XEROX CO.,LTD. (JP) 2020-03-26 US disclosed
WO-2020059715-A1 FILM FOR MANUFACTURING MOLD, MOLDING METHOD, MOLDED ARTICLE, AND CURABLE COMPOSITION FOR MANUFACTURING MOLD 富士フイルム株式会社 2020-03-26 WO disclosed
CN-105273670-B Circuit connecting material and circuit connecting structure 日立化成株式会社 2020-03-24 CN disclosed
US-20200091105-A1 ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME DEXERIALS CORPORATION (JP) 2020-03-19 US disclosed
EP-3623398-A1 MODIFIED BLOCK COPOLYMER, METHOD FOR PRODUCING MODIFIED BLOCK COPOLYMER, AND RESIN COMPOSITION Asahi Kasei Kabushiki Kaisha (JP) 2020-03-18 EP disclosed
CN-106700965-B Anisotropic conductive adhesive, method for producing same, circuit connection structure, and application 日立化成株式会社 2020-03-06 CN disclosed
EP-3130635-B1 RESIN COMPOSITION, CROSS-LINKED PRODUCT, AND METHOD FOR MANUFACTURING CROSS-LINKED PRODUCT SUMITOMO CHEMICAL CO (JP) 2020-02-26 EP disclosed
EP-3263610-B1 PROCESS FOR PRODUCING (METH)ACRYLIC RESIN COMPOSITION KURARAY CO (JP) 2020-02-12 EP disclosed
CN-110770299-A Resin composition, method for producing resin composition, and molded article 旭化成株式会社 2020-02-07 CN disclosed
WO-2020026702-A1 ELECTROLYTE COMPOSITION, ELECTROLYTE FILM, AND METHOD OF MANUFACTURING ELECTROLYTE FILM 株式会社日本触媒 2020-02-06 WO disclosed
US-10550287-B2 Solvent-free silicone-modified polyimide resin composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-02-04 US disclosed
US-20200032046-A1 CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND ROTARY DEVICE MITSUBISHI ELECTRIC CORPORATION (JP) 2020-01-30 US disclosed
WO-2020017418-A1 BINDER FOR SECONDARY BATTERY ELECTRODES AND USE OF SAME 東亞合成株式会社 2020-01-23 WO disclosed
CN-107001888-B Adhesive composition, adhesive sheet, double-sided adhesive sheet, adhesive for transparent electrode, touch panel, and image display device 三菱化学株式会社 2020-01-21 CN disclosed
CN-105934478-B Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element 日立化成株式会社 2020-01-14 CN disclosed
WO-2020009053-A1 CURABLE COMPOSITION, CURED PRODUCT, OPTICAL MEMBER, LENS, AND COMPOUND 富士フイルム株式会社 2020-01-09 WO disclosed
US-10519262-B2 Method of preparing aromatic vinyl-unsaturated nitrile-based copolymer and aromatic vinyl-unsaturated nitrile-based copolymer prepared using the same LG CHEM, LTD. (KR) 2019-12-31 US disclosed
CN-110637256-A Material for forming film for lithography, composition for forming film for lithography, underlayer film for lithography, and pattern formation method 三菱瓦斯化学株式会社 2019-12-31 CN disclosed
CN-110603273-A Modified block copolymer, method for producing modified block copolymer, and resin composition 旭化成株式会社 2019-12-20 CN disclosed
CN-108137947-B Solvent-free varnish composition, insulated coil and method for producing same, rotary machine, and sealed electric compressor 三菱电机株式会社 2019-12-13 CN disclosed
CN-106459329-B Curable composition 东亚合成株式会社 2019-12-10 CN disclosed
CN-107531832-B Method for producing diene rubber composition and rubber product constructed to be vulcanized at low temperature 科腾聚合物美国有限责任公司 2019-12-06 CN disclosed
US-10483418-B2 Primer for solar cell module and solar cell module KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) 2019-11-19 US disclosed
EP-3564275-A1 METHACRYLIC COPOLYMER AND MOLDED ARTICLE Kuraray Co., Ltd. (JP) 2019-11-06 EP disclosed
US-20190330464-A1 CURABLE RESIN COMPOSITION, AND FILM, MOLDED ARTICLE, PREPREG, AND FIBER-REINFORCED PLASTIC USING SAID CURABLE RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2019-10-31 US disclosed
EP-2894190-B1 PREPREG AND METHOD FOR PRODUCING SAME MITSUBISHI CHEM CORP (JP) 2019-10-30 EP disclosed
US-10442922-B2 Tire BRIDGESTONE CORPORATION (JP) 2019-10-15 US disclosed
US-20190309109-A1 POLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2019-10-10 US disclosed
EP-3103819-B1 PRODUCTION METHOD OF (METH)ACRYLIC RESIN COMPOSITION KURARAY CO (JP) 2019-10-09 EP disclosed
WO-2019189542-A1 SILICONE RUBBER-SILICONE MODIFIED POLYIMIDE RESIN LAMINATED BODY 信越化学工業株式会社 2019-10-03 WO disclosed
WO-2019189543-A1 POWER MODULE 信越化学工業株式会社 2019-10-03 WO disclosed
EP-2840096-B1 THERMOPLASTIC RESIN MITSUBISHI GAS CHEMICAL CO (JP) 2019-10-02 EP disclosed
EP-2957579-B1 COPOLYMER AND MOLDED BODY KURARAY CO (JP) 2019-10-02 EP disclosed
US-10421840-B2 Silicone-modified polyimide resin composition of solvent free type SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-09-24 US disclosed
WO-2019176972-A1 CURED PRODUCT, OPTICAL MEMBER, LENS AND COMPOUND 富士フイルム株式会社 2019-09-19 WO disclosed
US-10414908-B2 Composition for dip molding and dip-molded article ZEON CORPORATION (JP) 2019-09-17 US disclosed
US-20190276717-A1 ADHESIVE RESIN COMPOSITION AND ADHESIVE SHEET MITSUBISHI CHEMICAL CORPORATION (JP) 2019-09-12 US disclosed
WO-2019172347-A1 CURABLE COMPOSITION FOR POLYMER ELECTROLYTE, AND LAMINATE 東亞合成株式会社 2019-09-12 WO disclosed
US-10407524-B2 Copolymer and molded article KURARAY CO., LTD. (JP) 2019-09-10 US disclosed
WO-2019150951-A1 HEAT-EXPANDABLE MICROSPHERES AND USE THEREOF 松本油脂製薬株式会社 2019-08-08 WO disclosed
WO-2019151400-A1 COMPOUND, RESIN, COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR FORMING CIRCUIT PATTERN, AND METHOD FOR PURIFYING RESIN 三菱瓦斯化学株式会社 2019-08-08 WO disclosed
US-10370473-B2 Compound, curable composition, cured product, optical member, and lens FUJIFILM CORPORATION (JP) 2019-08-06 US disclosed
US-10370467-B2 Polymer SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2019-08-06 US disclosed
WO-2019142897-A1 COMPOUND, RESIN, COMPOSITION, AND PATTERN FORMING METHOD 三菱瓦斯化学株式会社 2019-07-25 WO disclosed
US-10358580-B2 Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element HITACHI CHEMICAL COMPANY, LTD. (JP) 2019-07-23 US disclosed
EP-3031856-B1 CROSSLINKABLE FLUORINATED ELASTOMER COMPOSITION AND CROSSLINKED PRODUCT THEREOFa AGC INC (JP) 2019-07-10 EP disclosed
EP-3173860-B1 LIQUID CRYSTAL DISPLAY DEVICE DAINIPPON INK & CHEMICALS (JP) 2019-06-26 EP disclosed
EP-3360695-B1 TIRE BRIDGESTONE CORP (JP) 2019-06-26 EP disclosed
US-20190177568-A1 AQUEOUS DISPERSION, COATING FILM, AND LAMINATE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2019-06-13 US disclosed
US-20190169161-A1 CURABLE COMPOSITION, CURED PRODUCT, OPTICAL MEMBER, LENS, AND COMPOUND FUJIFILM CORPORATION (JP) 2019-06-06 US disclosed
US-10308747-B2 Modified polypropylene-based resin, polypropylene-based resin expanded sheet, expanded resin-made container, and method for producing modified polypropylene-based resin SEKISUI PLASTICS CO., LTD. (JP) 2019-06-04 US disclosed
US-20190153175-A1 THERMOPLASTIC RESIN, MOLDED PRODUCT, FILM, AND LAYERED PRODUCT KURARAY CO., LTD. (JP) 2019-05-23 US disclosed
US-20190148731-A1 BINDER FOR NONAQUEOUS ELECTROLYTE SECONDARY BATTERY AND USE THEREOF TOAGOSEI CO., LTD. (JP) 2019-05-16 US disclosed
EP-3202793-B1 METHOD FOR PRODUCING (METH)ACRYLIC RESIN KURARAY CO (JP) 2019-05-08 EP disclosed
WO-2019078238-A1 CROSSLINKABLE ELASTOMER COMPOSITION AND FLUORORUBBER MOLDED ARTICLE ダイキン工業株式会社 2019-04-25 WO disclosed
EP-3467047-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED BODY, FILM, AND LAMINATE Kuraray Co., Ltd. (JP) 2019-04-10 EP disclosed
EP-2213275-B1 CURABLE COMPOSITION FOR DENTAL APPLICATIONS TOKUYAMA DENTAL CORP (JP) 2019-04-10 EP disclosed
WO-2019068056-A1 ELASTOMERIC COMPOSITIONS PROVIDING IMPROVED WET GRIP KRATON POLYMERS LLC (US) 2019-04-04 WO disclosed
US-20190100652-A1 ELASTOMERIC COMPOSITIONS PROVIDING IMPROVED WET GRIP KRATON POLYMERS LLC (US) 2019-04-04 US disclosed
EP-3255097-B1 TIRE BRIDGESTONE CORP (JP) 2019-04-03 EP disclosed
US-20190096844-A1 ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF DEXERIALS CORPORATION (JP) 2019-03-28 US disclosed
US-20190084215-A1 METHOD OF PRODUCING MOLDED ARTICLE ZACROS CORPORATION (JP) 2019-03-21 US disclosed
US-20190084283-A1 METHOD OF PRODUCING LAMINATED STRUCTURE ZACROS CORPORATION (JP) 2019-03-21 US disclosed
EP-2985313-B1 ACRYLIC RESIN FILM KURARAY CO (JP) 2019-03-20 EP disclosed
EP-3088424-B1 METHOD FOR MANUFACTURING (METH)ACRYLIC RESIN COMPOSITION KURARAY CO (JP) 2019-03-20 EP disclosed
EP-3456780-A1 AQUEOUS DISPERSION, COATING FILM, AND LAMINATE Sumitomo Chemical Company Limited (JP) 2019-03-20 EP disclosed
EP-3438200-A1 CURABLE COMPOSITION, CURED OBJECT OBTAINED THEREFROM, AND ROTARY DEVICE Mitsubishi Electric Corporation (JP) 2019-02-06 EP disclosed
US-10196510-B2 Methacrylic resin composition and molded body thereof KURARAY CO., LTD. (JP) 2019-02-05 US disclosed
US-20190036164-A1 BINDER FOR NONAQUEOUS ELECTROLYTE SECONDARY BATTERY ELECTRODE, MANUFACTURING METHOD THEREOF, AND USE THEREOF TOAGOSEI CO., LTD. (JP) 2019-01-31 US disclosed
US-20190035960-A1 PRIMER FOR SOLAR CELL MODULE AND SOLAR CELL MODULE KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) 2019-01-31 US disclosed
EP-3434746-A1 PRIMER FOR SOLAR CELL MODULE AND SOLAR CELL MODULE Kabushiki Kaisha Toyota Jidoshokki (JP) 2019-01-30 EP disclosed
US-10189781-B2 Onium salt and composition comprising the same ASAHI KASEI E-MATERIALS CORPORATION (JP) 2019-01-29 US disclosed
US-10184015-B2 Process for producing (meth)acrylic resin composition KURARAY CO., LTD. (JP) 2019-01-22 US disclosed
EP-3428230-A1 FLUORORESIN COMPOSITION, MOLDING MATERIAL, AND MOLDED OBJECT AGC INC. (JP) 2019-01-16 EP disclosed
US-20180371228-A1 FLUORORESIN COMPOSITION, MOLDING MATERIAL AND MOLDED PRODUCT AGC Inc. (JP) 2018-12-27 US disclosed
EP-3416796-A1 A CURABLE TRANSPARENT RUBBER COMPOSITION, A CURED TRANSPARENT RUBBER COMPOSITION MADE THEREOF, AND MANUFACTURING PROCESS FOR THE SAME Kraton Polymers U.S. LLC (US) 2018-12-26 EP disclosed
US-10131778-B2 Ethylene vinyl acetate copolymer resin composition, graft copolymer, thermoplastic resin composition, and molded resin article NOF CORPORATION (JP) 2018-11-20 US disclosed
US-20180312723-A1 SOLVENT-FREE SILICONE-MODIFIED POLYIMIDE RESIN COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-11-01 US disclosed
US-20180305486-A1 COMPOUND, CURABLE COMPOSITION, CURED PRODUCT, OPTICAL MEMBER, AND LENS FUJIFILM CORPORATION (JP) 2018-10-25 US disclosed
WO-2018186798-A1 POLYPROPYLENE COMPOSITION SUITABLE FOR EXTRUSION COATING APPLICATION THE POLYOLEFIN COMPANY (SINGAPORE) PTE LTD (SG) 2018-10-11 WO disclosed
US-20180281329-A1 TIRE BRIDGESTONE CORPORATION (JP) 2018-10-04 US disclosed
EP-2998355-B1 METHACRYLIC RESIN COMPOSITION AND MOLDED BODY THEREOF KURARAY CO (JP) 2018-09-19 EP disclosed
US-20180250983-A1 TIRE BRIDGESTONE CORPORATION (JP) 2018-09-06 US disclosed
EP-3370288-A1 BINDER FOR NONAQUEOUS ELECTROLYTE SECONDARY CELL ELECTRODE, METHOD FOR PRODUCING BINDER, AND USE THEREOF Toagosei Co., Ltd. (JP) 2018-09-05 EP disclosed
US-10066077-B2 Crosslinkable fluorinated elastomer composition and crosslinked product thereof ASAHI GLASS COMPANY, LIMITED (JP) 2018-09-04 US disclosed
EP-3366721-A1 METHOD FOR PRODUCING CROSSLINKED PRODUCT AND FLUOROELASTOMER COMPOSITION Asahi Glass Company, Limited (JP) 2018-08-29 EP disclosed
US-10059083-B2 Method of manufacturing resin impregnated material, composite material and copper-clad laminate TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (JP) 2018-08-28 US disclosed
US-20180237629-A1 CURABLE COMPOSITION TOAGOSEI CO., LTD. (JP) 2018-08-23 US disclosed
US-20180208742-A1 METHOD FOR PRODUCING CROSSLINKED PRODUCT AND FLUOROELASTOMER COMPOSITION ASAHI GLASS COMPANY, LIMITED (JP) 2018-07-26 US disclosed
US-20180208807-A1 RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING RESIN COMPOSITION, AND SOLID-STATE IMAGING ELEMENT RESONAC CORPORATION (JP) 2018-07-26 US disclosed
US-10030081-B2 Method for producing (meth)acrylic resin composition KURARAY CO., LTD. (JP) 2018-07-24 US disclosed
EP-3345964-A1 TIRE Bridgestone Corporation (JP) 2018-07-11 EP disclosed
US-10017587-B2 Process for producing (meth)acrylic resin composition KURARAY CO., LTD. (JP) 2018-07-10 US disclosed
US-20180187026-A1 CURABLE COMPOSITION TOAGOSEI CO., LTD. (JP) 2018-07-05 US disclosed
US-10005718-B2 Catalyst, and method for producing oxidation product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2018-06-26 US disclosed
US-20180171038-A1 CURABLE COMPOSITION TOAGOSEI CO., LTD. (JP) 2018-06-21 US disclosed
EP-3333225-A1 ELECTROCONDUCTIVE COMPOSITION, CONDUCTOR, AND FLEXIBLE PRINTED WIRING BOARD Taiyo Ink Mfg. Co., Ltd. (JP) 2018-06-13 EP disclosed
US-9994661-B2 Curable composition, cured product, optical component, lens, and compound FUJIFILM CORPORATION (JP) 2018-06-12 US disclosed
US-20180142049-A1 METHOD OF PREPARING AROMATIC VINYL-UNSATURATED NITRILE-BASED COPOLYMER AND AROMATIC VINYL-UNSATURATED NITRILE-BASED COPOLYMER PREPARED USING THE SAME LG CHEM, LTD. (KR) 2018-05-24 US disclosed
US-20180108917-A1 ELECTRODE MIXTURE LAYER COMPOSITION FOR NONAQUEOUS ELECTROLYTE SECONDARY BATTERY, MANUFACTURING METHOD THEREOF AND USE THEREFOR TOAGOSEI CO., LTD. (JP) 2018-04-19 US disclosed
US-9944776-B2 Transparent, tough and heatproof rubber composition comprising neodymium-catalyzed isoprene component, and manufacturing process for the same KRATON POLYMERS U.S. LLC (US) 2018-04-17 US disclosed
US-20180102542-A1 BINDER FOR NONAQUEOUS ELECTROLYTE SECONDARY BATTERY ELECTRODE, AND USE THEREOF TOAGOSEI CO., LTD. (JP) 2018-04-12 US disclosed
US-9932463-B2 Curable transparent rubber composition, a cured transparent rubber composition made thereof, and manufacturing process for the same KRATON POLYMERS U.S. LLC (US) 2018-04-03 US disclosed
US-20180086025-A1 METHOD OF MANUFACTURING RESIN IMPREGNATED MATERIAL, COMPOSITE MATERIAL AND COPPER-CLAD LAMINATE TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (JP) 2018-03-29 US disclosed
US-9920227-B2 Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element HITACHI CHEMICAL COMPANY, LTD. (JP) 2018-03-20 US disclosed
US-9920142-B2 Production method of (meth)acrylic resin composition KURARAY CO., LTD. (JP) 2018-03-20 US disclosed
US-9909002-B2 Resin composition, cross-linked product, and method for manufacturing cross-linked product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2018-03-06 US disclosed
EP-3288105-A1 BINDER FOR NONAQUEOUS ELECTROLYTE SECONDARY BATTERY ELECTRODES AND USE OF SAME Toagosei Co., Ltd. (JP) 2018-02-28 EP disclosed
US-9902794-B2 Curable composition, optical component and compound FUJIFILM CORPORATION (JP) 2018-02-27 US disclosed
EP-3279226-A1 METHOD FOR PREPARING AROMATIC VINYL-UNSATURATED NITRILE-BASED COPOLYMER AND AROMATIC VINYL-UNSATURATED NITRILE-BASED COPOLYMER PREPARED THEREBY LG Chem, Ltd. (KR) 2018-02-07 EP disclosed
EP-3277735-A1 A CURABLE TRANSPARENT RUBBER COMPOSITION, A CURED TRANSPARENT RUBBER COMPOSITION MADE THEREOF, AND MANUFACTURING PROCESS Kraton Polymers U.S. LLC (US) 2018-02-07 EP disclosed
US-20180030164-A1 PROCESS FOR PRODUCING (METH)ACRYLIC RESIN COMPOSITION KURARAY CO., LTD. (JP) 2018-02-01 US disclosed
US-20180030175-A1 POLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2018-02-01 US disclosed
EP-3275922-A1 METHOD OF MANUFACTURING RESIN IMPREGNATED MATERIAL, COMPOSITE MATERIAL AND COPPER-CLAD LAMINATE Tatsuta Electric Wire & Cable Co., Ltd. (JP) 2018-01-31 EP disclosed
EP-2755234-B1 COMPOSITION FOR ELECTRONIC DEVICE HENKEL AG & CO KGAA (DE) 2018-01-24 EP disclosed
US-20180016427-A1 TIRE BRIDGESTONE CORPORATION (JP) 2018-01-18 US disclosed
EP-3050923-B1 FLUORINATED ELASTOMER COMPOSITION AND METHOD FOR ITS PRODUCTION, MOLDED PRODUCT, CROSS-LINKED PRODUCT, AND COVERED ELECTRIC WIRE ASAHI GLASS CO LTD (JP) 2018-01-17 EP disclosed
US-9868884-B2 Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element HITACHI CHEMICAL COMPANY, LTD. (JP) 2018-01-16 US disclosed
US-20180009913-A1 PROCESS FOR PRODUCING (METH)ACRYLIC RESIN COMPOSITION KURARAY CO., LTD. (JP) 2018-01-11 US disclosed
EP-3263610-A1 PROCESS FOR PRODUCING (METH)ACRYLIC RESIN COMPOSITION Kuraray Co., Ltd. (JP) 2018-01-03 EP disclosed
US-9856342-B2 Copolymer and molded body KURARAY CO., LTD. (JP) 2018-01-02 US disclosed
US-20170355825-A1 SILICONE-MODIFIED POLYIMIDE RESIN COMPOSITION OF SOLVENT FREE TYPE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-12-14 US disclosed
US-20170352886-A1 BINDER FOR NONAQUEOUS ELECTROLYTE SECONDARY BATTERY ELECTRODE, MANUFACTURING METHOD THEREFOR AND USE THEREFOR TOAGOSEI CO. LTD. (JP) 2017-12-07 US disclosed
US-20170342181-A1 CURABLE COMPOSITION, CURED PRODUCT, OPTICAL COMPONENT, LENS, AND COMPOUND FUJIFILM CORPORATION (JP) 2017-11-30 US disclosed
US-20170341342-A1 LIGHT CONTROL PANEL AND OPTICAL IMAGING DEVICE SHOWA DENKO K.K. (JP) 2017-11-30 US disclosed
US-20170321052-A1 ETHYLENE VINYL ACETATE COPOLYMER RESIN COMPOSITION, GRAFT COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED RESIN ARTICLE NOF CORPORATION (JP) 2017-11-09 US disclosed
EP-3239191-A1 PROCESS FOR PRODUCING (METH)ACRYLIC RESIN COMPOSITION Kuraray Co., Ltd. (JP) 2017-11-01 EP disclosed
EP-3235836-A1 POLYMER Sumitomo Chemical Company, Ltd. (JP) 2017-10-25 EP disclosed
US-20170298157-A1 METHOD FOR PRODUCING (METH)ACRYLIC RESIN KURARAY CO., LTD. (JP) 2017-10-19 US disclosed
EP-3228640-A1 CURABLE COMPOSITION CONTAINING SEMICONDUCTOR NANOPARTICLES, CURED PRODUCT, OPTICAL MATERIAL AND ELECTRONIC MATERIAL Showa Denko K.K. (JP) 2017-10-11 EP disclosed
EP-3229046-A1 LIGHT CONTROL PANEL AND OPTICAL IMAGING DEVICE Showa Denko K.K. (JP) 2017-10-11 EP disclosed
WO-2017171903-A1 A CURABLE TRANSPARENT RUBBER COMPOSITION, A CURED TRANSPARENT RUBBER COMPOSITION MADE THEREOF, AND MANUFACTURING PROCESS FOR THE SAME KRATON POLYMERS U.S. LLC (US) 2017-10-05 WO disclosed
US-9777088-B2 Heat-resistant SAN resin, method of producing the same and heat-resistant SAN resin composition comprising the same LG CHEM, LTD. (KR) 2017-10-03 US disclosed
US-9780068-B2 Adhesive for electronic component HENKEL AG & CO. KGAA (DE) 2017-10-03 US disclosed
EP-3222643-A1 ETHYLENE-VINYL ACETATE COPOLYMER RESIN COMPOSITION, GRAFT COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED RESIN ARTICLE NOF Corporation (JP) 2017-09-27 EP disclosed
US-9771500-B2 Sealant composition for electronic device HENKEL AG & CO. KGAA (DE) 2017-09-26 US disclosed
EP-2395030-B1 Vinylidene fluoride homopolymer DAIKIN IND LTD (JP) 2017-09-20 EP disclosed
EP-2395031-B1 Vinylidene fluoride homopolymer DAIKIN IND LTD (JP) 2017-09-13 EP disclosed
US-9758649-B2 Cured transparent rubber article, and manufacturing process for the same KRATON POLYMERS U.S. LLC (US) 2017-09-12 US disclosed
US-9758648-B2 Curable transparent rubber composition, a cured transparent rubber composition made thereof, and manufacturing process for the same KRATON POLYMERS U.S. LLC (US) 2017-09-12 US disclosed
EP-3214101-A1 MODIFIED POLYPROPYLENE-BASED RESIN, FOAMED POLYPROPYLENE-BASED RESIN SHEET, CONTAINER CONSTITUTED OF FOAMED RESIN, AND PROCESS FOR PRODUCING MODIFIED POLYPROPYLENE-BASED RESIN Sekisui Plastics Co., Ltd. (JP) 2017-09-06 EP disclosed
US-20170226249-A1 COPOLYMER AND MOLDED ARTICLE KURARAY CO., LTD. (JP) 2017-08-10 US disclosed
US-20170226237-A1 METHOD FOR PRODUCING (METH)ACRYLIC RESIN COMPOSITION KURARAY CO., LTD. (JP) 2017-08-10 US disclosed
EP-3202793-A1 METHOD FOR PRODUCING (METH)ACRYLIC RESIN Kuraray Co., Ltd. (JP) 2017-08-09 EP disclosed
US-20170218109-A1 MODIFIED POLYPROPYLENE-BASED RESIN, POLYPROPYLENE-BASED RESIN EXPANDED SHEET, EXPANDED RESIN-MADE CONTAINER, AND METHOD FOR PRODUCING MODIFIED POLYPROPYLENE-BASED RESIN SEKISUI PLASTICS CO., LTD. (JP) 2017-08-03 US disclosed
US-20170223843-A1 MULTILAYER CURABLE RESIN FILM, PREPREG, LAMINATE, CURED PRODUCT, COMPOSITE, AND MULTILAYER CIRCUIT BOARD ZEON CORPORATION (JP) 2017-08-03 US disclosed
EP-2568010-B1 THERMOPLASTIC TRANSPARENT RESIN COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2017-08-02 EP disclosed
US-9718895-B2 Process for producing acrylic rubber/fluorinated rubber composition, crosslinkable composition, laminate and heat resistant air rubber hose ASAHI GLASS COMPANY, LIMITED (JP) 2017-08-01 US disclosed
US-9714335-B2 Curable resin composition, optical component, lens, and method for manufacturing optical component FUJIFILM CORPORATION (JP) 2017-07-25 US disclosed
US-20170203476-A1 THERMOSETTING COMPOSITION, AND METHOD FOR MANUFACTURING THERMOSET RESIN IDEMITSU KOSAN CO., LTD. (JP) 2017-07-20 US disclosed
US-9711257-B2 Fluorinated elastomer composition and method for its production, molded product, cross-linked product, and covered electric wire ASAHI GLASS COMPANY, LIMITED (JP) 2017-07-18 US disclosed
US-9701828-B2 Fluorinated elastomer composition and method for its production, molded product, cross-linked product, and covered electric wire ASAHI GLASS COMPANY, LIMITED (JP) 2017-07-11 US disclosed
US-9704616-B2 Fluorinated elastomer composition and method for its production, molded product, cross-linked product, and covered electric wire ASAHI GLASS COMPANY, LIMITED (JP) 2017-07-11 US disclosed
US-20170183428-A1 METHACRYLIC RESIN OR METHACRYLIC RESIN COMPOSITION KURARAY CO., LTD. (JP) 2017-06-29 US disclosed
US-20170174802-A1 COPOLYMER AND MOLDED ARTICLE KURARAY CO., LTD. (JP) 2017-06-22 US disclosed
EP-3181602-A1 COPOLYMER AND MOLDED ARTICLE Kuraray Co., Ltd. (JP) 2017-06-21 EP disclosed
EP-3178854-A1 METHOD FOR PRODUCING (METH)ACRYLIC RESIN COMPOSITION Kuraray Co., Ltd. (JP) 2017-06-14 EP disclosed
EP-3173860-A1 LIQUID CRYSTAL DISPLAY DEVICE DIC Corporation (JP) 2017-05-31 EP disclosed
US-9657168-B2 Thermoplastic transparent resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2017-05-23 US disclosed
US-20170130035-A1 WAVELENGTH CONVERSION MATERIAL AND SOLAR CELL SEALING FILM CONTAINING THE SAME BRIDGESTONE CORPORATION (JP) 2017-05-11 US disclosed
US-20170121516-A1 RESIN COMPOSITION, CROSS-LINKED PRODUCT, AND METHOD FOR MANUFACTURING CROSS-LINKED PRODUCT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2017-05-04 US disclosed
US-20170121436-A1 HEAT-RESISTANT SAN RESIN, METHOD OF PRODUCING THE SAME AND HEAT-RESISTANT SAN RESIN COMPOSITION COMPRISING THE SAME LG CHEM, LTD. (KR) 2017-05-04 US disclosed
US-20170121597-A1 WAVELENGTH CONVERSION MATERIAL AND SOLAR CELL SEALING FILM CONTAINING THE SAME BRIDGESTONE CORPORATION (JP) 2017-05-04 US disclosed
EP-3162818-A1 METHACRYLIC RESIN OR METHACRYLIC RESIN COMPOSITION Kuraray Co., Ltd. (JP) 2017-05-03 EP disclosed
US-9624327-B2 Method for manufacturing (meth)acrylic resin composition KURARAY CO., LTD. (JP) 2017-04-18 US disclosed
US-20170102347-A1 BIOCHEMICAL TEST CHIP APEX BIOTECHNOLOGY CORP. (TW) 2017-04-13 US disclosed
EP-3153857-A1 BIOCHEMICAL TEST CHIP Apex Biotechnology Corporation (TW) 2017-04-12 EP disclosed
US-20170088700-A1 COMPOSITION FOR DIP MOLDING AND DIP-MOLDED ARTICLE ZEON CORPORATION (JP) 2017-03-30 US disclosed
EP-2199309-B1 METHOD FOR PRODUCING FINE PARTICLE-DISPERSED POLYOL AND METHOD FOR PRODUCING POLYURETHANE RESIN SANYO CHEMICAL IND LTD (JP) 2017-03-08 EP disclosed
US-20170058160-A1 LIQUID CRYSTAL DISPLAY DEVICE DIC Corporation (Tokyo) (JP) 2017-03-02 US disclosed
US-9585247-B2 Anisotropic conductive film and method of producing the same DEXERIALS CORPORATION (JP) 2017-02-28 US disclosed
US-9576871-B2 Composition for electronic device HENKEL AG & CO. KGAA (DE) 2017-02-21 US disclosed
EP-3130635-A1 RESIN COMPOSITION, CROSS-LINKED PRODUCT, AND METHOD FOR MANUFACTURING CROSS-LINKED PRODUCT Sumitomo Chemical Company Limited (JP) 2017-02-15 EP disclosed
US-9566750-B2 Compound lens and method for manufacturing same FUJIFILM CORPORATION (JP) 2017-02-14 US disclosed
EP-2755232-B1 SEALANT COMPOSITION FOR ELECTRONIC DEVICE HENKEL AG & CO KGAA (DE) 2017-02-08 EP disclosed
EP-3127927-A1 HEAT RESISTANT SAN RESIN, PREPARATION METHOD THEREFOR, AND HEAT RESISTANT SAN RESIN COMPOSITION CONTAINING SAME LG Chem, Ltd. (KR) 2017-02-08 EP disclosed
EP-3124535-A1 COMPOSITION FOR DIP MOLDING AND DIP-MOLDED ARTICLE Zeon Corporation (JP) 2017-02-01 EP disclosed
EP-3121219-A1 PREPREG ROLL Mitsubishi Rayon Co. Ltd. (JP) 2017-01-25 EP disclosed
EP-2808906-B1 SEALING FILM FOR SOLAR CELLS, AND SOLAR CELL USING SAME BRIDGESTONE CORP (JP) 2017-01-11 EP disclosed
US-20170002124-A1 CURABLE COMPOSITION, OPTICAL COMPONENT AND COMPOUND FUJIFILM CORPORATION (JP) 2017-01-05 US disclosed
EP-2805988-B1 METHOD FOR PRODUCING ACRYLIC RUBBER/FLUORO-RUBBER COMPOSITION, CROSSLINKED COMPOSITION, LAMINATE BODY, AND HEAT-RESISTANT AIR RUBBER HOSE ASAHI GLASS CO LTD (JP) 2017-01-04 EP disclosed
EP-2003701-B1 SEALING FILM FOR SOLAR CELL AND SOLAR CELL USING SUCH SEALING FILM BRIDGESTONE CORP (JP) 2016-12-21 EP disclosed
WO-2016200335-A1 MOULDED ARTICLE FROM POLYPROPYLENE COMPOSITION THE POLYOLEFIN COMPANY (SINGAPORE) PTE LTD (SG) 2016-12-15 WO disclosed
EP-3103819-A1 PRODUCTION METHOD OF (METH)ACRYLIC RESIN COMPOSITION Kuraray Co., Ltd. (JP) 2016-12-14 EP disclosed
EP-3103551-A1 CATALYST, AND METHOD FOR MANUFACTURING OXIDATION PRODUCT Sumitomo Chemical Company Limited (JP) 2016-12-14 EP disclosed
US-20160355709-A1 RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING RESIN COMPOSITION, AND SOLID-STATE IMAGING ELEMENT RESONAC CORPORATION (JP) 2016-12-08 US disclosed
US-20160347879-A1 PRODUCTION METHOD OF (METH)ACRYLIC RESIN COMPOSITION KURARAY CO., LTD. (JP) 2016-12-01 US disclosed
US-20160347707-A1 CATALYST, AND METHOD FOR PRODUCING OXIDATION PRODUCT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2016-12-01 US disclosed
US-20160340561-A1 ADHESIVE COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING ADHESIVE COMPOSITION, AND SOLID-STATE IMAGING ELEMENT HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-11-24 US disclosed
US-20160340554-A1 ADHESIVE COMPOSITION, RESIN CURED PRODUCT OBTAINED FROM ADHESIVE COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING ADHESIVE COMPOSITION, AND SOLID-STATE IMAGING ELEMENT RESONAC CORPORATION (JP) 2016-11-24 US disclosed
EP-2832786-B1 FLUORINE-CONTAINING ELASTOMER COMPOSITION, METHOD FOR PRODUCING SAME, MOLDED BODY, CROSSLINKED PRODUCT, AND COVERED WIRE ASAHI GLASS CO LTD (JP) 2016-11-23 EP disclosed
US-20160326287-A1 METHOD FOR MANUFACTURING (METH)ACRYLIC RESIN COMPOSITION KURARAY CO., LTD. (JP) 2016-11-10 US disclosed
US-9487682-B2 Curable resin composition, cured product thereof, laminate, and method for producing laminate MITSUBISHI RAYON CO., LTD. (JP) 2016-11-08 US disclosed
EP-3088424-A1 METHOD FOR MANUFACTURING (METH)ACRYLIC RESIN COMPOSITION Kuraray Co., Ltd. (JP) 2016-11-02 EP disclosed
EP-2755233-B1 UNDERFILL COMPOSITION HENKEL AG & CO KGAA (DE) 2016-11-02 EP disclosed
EP-2033942-B1 COMPOSITION FOR FORMING INTERLAYER FOR LAMINATED GLASS, INTERLAYER FOR LAMINATED GLASS, AND LAMINATED GLASS BRIDGESTONE CORP (JP) 2016-10-12 EP disclosed
WO-2016160801-A1 A CURABLE TRANSPARENT RUBBER COMPOSITION, A CURED TRANSPARENT RUBBER COMPOSITION MADE THEREOF, AND MANUFACTURING PROCESS KRATON POLYMERS U.S. LLC (US) 2016-10-06 WO disclosed
US-20160289432-A1 CURABLE TRANSPARENT RUBBER COMPOSITION, A CURED TRANSPARENT RUBBER COMPOSITION MADE THEREOF, AND MANUFACTURING PROCESS FOR THE SAME KRATON POLYMERS U.S. LLC (US) 2016-10-06 US disclosed
US-20160289420-A1 CURABLE TRANSPARENT RUBBER COMPOSITION, A CURED TRANSPARENT RUBBER COMPOSITION MADE THEREOF, AND MANUFACTURING PROCESS FOR THE SAME KRATON POLYMERS U.S. LLC (US) 2016-10-06 US disclosed
US-20160289429-A1 CURABLE TRANSPARENT RUBBER COMPOSITION, A CURED TRANSPARENT RUBBER COMPOSITION MADE THEREOF, AND MANUFACTURING PROCESS FOR THE SAME KRATON POLYMERS U.S. LLC (US) 2016-10-06 US disclosed
US-20160289430-A1 CURED TRANSPARENT RUBBER ARTICLE, AND MANUFACTURING PROCESS FOR THE SAME KRATON POLYMERS U.S. LLC (US) 2016-10-06 US disclosed
US-20160280829-A1 RESIN COMPOSITION FOR FORMING OPTICAL WAVEGUIDE, RESIN FILM FOR FORMING OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE USING THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-09-29 US disclosed
EP-2492320-B1 CURABLE COATING AGENT COMPOSITION TOYOTA JIDOSHOKKI KK (JP) 2016-09-14 EP disclosed
US-9441064-B2 Curable composition, transparent heat-resistant material, and use thereof SHOWA DENKO K.K. (JP) 2016-09-13 US disclosed
EP-2770541-B1 SOLAR CELL SEALING FILM AND SOLAR CELL USING SAME BRIDGESTONE CORP (JP) 2016-09-07 EP disclosed
US-9428667-B2 Member for vehicle and manufacturing process for the same KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) 2016-08-30 US disclosed
EP-2439783-B1 SEALING FILM FOR SOLAR CELL, AND SOLAR CELL UTILIZING SAME BRIDGESTONE CORP (JP) 2016-08-24 EP disclosed
US-9422422-B2 Transparent and tough rubber composition and manufacturing process for the same KRATON POLYMERS U.S. LLC (US) 2016-08-23 US disclosed
US-20160229801-A1 ONIUM SALT AND COMPOSITION COMPRISING THE SAME ASAHI KASEI E-MATERIALS CORPORATION (JP) 2016-08-11 US disclosed
EP-3050923-A1 FLUORINATED ELASTOMER COMPOSITION, METHOD FOR PRODUCING SAME, MOLDED ARTICLE, CROSSLINKED PRODUCT, AND COATED ELECTRIC WIRE Asahi Glass Company, Limited (JP) 2016-08-03 EP disclosed
EP-3050924-A1 FLUORINATED ELASTOMER COMPOSITION AND METHOD FOR PRODUCING SAME, MOLDED ARTICLE, CROSSLINKED MATERIAL, AND COATED ELECTRIC WIRE Asahi Glass Company, Limited (JP) 2016-08-03 EP disclosed
US-9403925-B2 Curable composition and cured article ADEKA CORPORATION (JP) 2016-08-02 US disclosed
US-9403990-B2 Curing-type coating-agent composition KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) 2016-08-02 US disclosed
US-20160209743-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING MEMBER HAVING CURVED SHAPE, PHOTOSENSITIVE RESIN FILM FOR FORMING MEMBER HAVING CURVED SHAPE USING SAID COMPOSITION, AND LENS MEMBER MANUFACTRED USING SAID COMPOSITION OR SAID FILM HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-07-21 US disclosed
EP-2537893-B1 SEALING FILM FOR PHOTOVOLTAIC MODULES AND PHOTOVOLTAIC MODULES USING SAME BRIDGESTONE CORP (JP) 2016-07-13 EP disclosed
US-20160196895-A1 FLUORINATED ELASTOMER COMPOSITION AND METHOD FOR ITS PRODUCTION, MOLDED PRODUCT, CROSS-LINKED PRODUCT, AND COVERED ELECTRIC WIRE ASAHI GLASS COMPANY, LIMITED (JP) 2016-07-07 US disclosed
US-20160194491-A1 FLUORINATED ELASTOMER COMPOSITION AND METHOD FOR ITS PRODUCTION, MOLDED PRODUCT, CROSS-LINKED PRODUCT, AND COVERED ELECTRIC WIRE ASAHI GLASS COMPANY, LIMITED (JP) 2016-07-07 US disclosed
US-20160190094-A1 ADHESIVE FOR ELECTRONIC COMPONENT HENKEL AG & CO. KGAA (DE) 2016-06-30 US disclosed
US-20160177148-A1 SEALANT COMPOSITION FOR ELECTRONIC DEVICE HENKEL AG & CO. KGAA (DE) 2016-06-23 US disclosed
EP-2685508-B1 SEALING FILM FOR SOLAR CELLS AND SOLAR CELL USING SAME BRIDGESTONE CORP (JP) 2016-06-22 EP disclosed
EP-3031856-A1 FLUORINE-CONTAINING CROSSLINKABLE ELASTOMER COMPOSITION AND CROSSLINKED PRODUCT THEREOF Asahi Glass Company, Limited (JP) 2016-06-15 EP disclosed
US-20160160006-A1 CURABLE RESIN COMPOSITION, OPTICAL COMPONENT, LENS, AND METHOD FOR MANUFACTURING OPTICAL COMPONENT FUJIFILM CORPORATION (JP) 2016-06-09 US disclosed
US-9359521-B2 Member for vehicle and manufacturing process for the same KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) 2016-06-07 US disclosed
US-20160152873-A1 SHEET FOR FORMING LAMINATE, AND METHOD FOR PRODUCING LAMINATE BRIDGESTONE CORPORATION (JP) 2016-06-02 US disclosed
US-20160155717-A1 ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREFOR DEXERIALS CORPORATION (JP) 2016-06-02 US disclosed
US-20160137809-A1 CROSSLINKABLE FLUORINATED ELASTOMER COMPOSITION AND CROSSLINKED PRODUCT THEREOF ASAHI GLASS COMPANY, LIMITED (JP) 2016-05-19 US disclosed
US-9334352-B2 Semi-cured product, cured product and method for producing these, optical component, curable resin composition, and compound FUJIFILM CORPORATION (JP) 2016-05-10 US disclosed
US-9334429-B2 Underfill sealant composition HENKEL AG & CO. KGAA (DE) 2016-05-10 US disclosed
EP-3015522-A1 SHEET FOR FORMING LAMINATE, AND METHOD FOR PRODUCING LAMINATE Bridgestone Corporation (JP) 2016-05-04 EP disclosed
US-9328178-B2 Method for producing ethylene-tetrafluoroethylene copolymer powder ASAHI GLASS COMPANY, LIMITED (JP) 2016-05-03 US disclosed
US-9321860-B2 Thermoplastic resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-04-26 US disclosed
EP-2735582-B1 METHOD FOR PRODUCING ETHYLENE-TETRAFLUOROETHYLENE COPOLYMER POWDER ASAHI GLASS CO LTD (JP) 2016-04-06 EP disclosed
US-9305892-B2 Adhesive for electronic component HENKEL AG & CO. KGAA (DE) 2016-04-05 US disclosed
US-20160090479-A1 METHACRYLIC RESIN COMPOSITION AND MOLDED BODY THEREOF KURARAY CO., LTD. (JP) 2016-03-31 US disclosed
EP-2998355-A1 METHACRYLIC RESIN COMPOSITION AND MOLDED BODY THEREOF Kuraray Co., Ltd. (JP) 2016-03-23 EP disclosed
US-9293616-B2 Solar cell sealing film and solar cell using the same BRIDGESTONE CORPORATION (JP) 2016-03-22 US disclosed
EP-2634199-B1 (METH)ACRYLATE COMPOSITION IDEMITSU KOSAN CO (JP) 2016-03-16 EP disclosed
US-9287429-B2 Solar cell sealing film and solar cell using the same BRIDGESTONE CORPORATION (JP) 2016-03-15 US disclosed
US-20160060437-A1 Transparent, Tough and Heatproof Rubber Composition Comprising Neodymium-Catalyzed Isoprene Component, And Manufacturing Process For The Same KRATON POLYMERS U.S. LLC (US) 2016-03-03 US disclosed
US-20160053062-A1 ACRYLIC RESIN FILM KURARAY CO., LTD. (JP) 2016-02-25 US disclosed
EP-2985313-A1 ACRYLIC RESIN FILM Kuraray Co., Ltd. (JP) 2016-02-17 EP disclosed
US-20160024297-A1 RESIN COMPOSITION AND RESIN MOLDED ARTICLE FUJI XEROX CO., LTD. (JP) 2016-01-28 US disclosed
US-20160017076-A1 CURABLE COMPOSITION, TRANSPARENT HEAT-RESISTANT MATERIAL, AND USE THEREOF SHOWA DENKO K.K. (JP) 2016-01-21 US disclosed
US-20160009907-A1 Transparent And Tough Rubber Composition And Manufacturing Process For The Same KRATON POLYMERS U.S. LLC (US) 2016-01-14 US disclosed
US-20160002380-A1 COPOLYMER AND MOLDED BODY KURAKAY CO., LTD. (JP) 2016-01-07 US disclosed
US-20160005901-A1 METHOD FOR MANUFACTURING SOLAR CELL MODULE AND SOLAR CELL MODULE BRIDGESTONE CORPORATION (JP) 2016-01-07 US disclosed
EP-2963085-A1 TRANSPARENT AND TOUGH RUBBER COMPOSITION, AND PROCESS FOR PRODUCING SAME Kraton Polymers U.S. LLC (US) 2016-01-06 EP disclosed
EP-2963690-A1 SOLAR CELL MODULE MANUFACTURING METHOD AND SOLAR CELL MODULE Bridgestone Corporation (JP) 2016-01-06 EP disclosed
EP-2957579-A1 COPOLYMER AND MOLDED BODY Kuraray Co., Ltd. (JP) 2015-12-23 EP disclosed
US-9193817-B2 Semi-cured product, cured product and method of manufacturing same, optical component, curable resin composition FUJIFILM CORPORATION (JP) 2015-11-24 US disclosed
US-20150322233-A1 (METH)ACRYLATE COMPOSITION IDEMITSU KOSAN CO. LTD. (JP) 2015-11-12 US disclosed
US-20150284558-A1 METHOD FOR PRODUCING (METH)ACRYLIC RESIN COMPOSITION, METHOD FOR PRODUCING (METH)ACRYLIC RESIN SHAPED ARTICLE, (METH)ACRYLIC RESIN SHAPED ARTICLE, FRONT-SURFACE PLATE FOR LIQUID CRYSTAL DISPLAY DEVICE, AND TOUCH PANEL MITSUBISHI RAYON CO., LTD. (JP) 2015-10-08 US disclosed
US-9150670-B2 Near-infrared absorptive dye-containing curable composition, ink composition and method of producing near-infrared absorptive filter FUJIFILM CORPORATION (JP) 2015-10-06 US disclosed
US-20150280037-A1 SOLAR CELL SEALING FILM AND SOLAR CELL MODULE USING THE SAME BRIDGESTONE CORPORATION (JP) 2015-10-01 US disclosed
US-20150267012-A1 CURED SHEET, LAMINATE HAVING THE SAME AND PROCESS FOR MANUFACTURING THE LAMINATE BRIDGESTONE CORPORATION (JP) 2015-09-24 US disclosed
US-20150271918-A1 ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME DEXERIALS CORPORATION (JP) 2015-09-24 US disclosed
EP-2918617-A1 METHOD FOR PRODUCING (METH)ACRYLIC RESIN COMPOSITION, METHOD FOR PRODUCING (METH)ACRYLIC RESIN MOLDED BODY, (METH)ACRYLIC RESIN MOLDED BODY, FRONT SURFACE PLATE FOR LIQUID CRYSTAL DISPLAY DEVICE, AND TOUCH PANEL Mitsubishi Rayon Co., Ltd. (JP) 2015-09-16 EP disclosed
US-20150252160-A1 PREPREG AND METHOD FOR PRODUCING SAME MITSUBISHI RAYON CO., LTD. (JP) 2015-09-10 US disclosed
US-20150252226-A1 FUNCTIONALIZED ALPHA-OLEFIN POLYMER, AS WELL AS CURED COMPOSITION AND CURED ARTICLE USING SAME IDEMITSU KOSAN CO., LTD. (JP) 2015-09-10 US disclosed
US-9123836-B2 Solar cell sealing film and solar cell using the same BRIDGESTONE CORPORATION (JP) 2015-09-01 US disclosed
EP-2910615-A1 CURED SHEET, LAMINATE BODY USING SAME, AND METHOD FOR PRODUCING SAID LAMINATE BODY Bridgestone Corporation (JP) 2015-08-26 EP disclosed
EP-2056356-B1 COMPOSITION FOR SOLAR CELL SEALING FILM, SOLAR CELL SEALING FILM, AND SOLAR CELL USING THE SEALING FILM BRIDGESTONE CORP (JP) 2015-08-19 EP disclosed
EP-2905815-A1 SEALING FILM FOR SOLAR CELLS AND SOLAR CELL USING SAME Bridgestone Corporation (JP) 2015-08-12 EP disclosed
US-20150214176-A1 ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME DEXERIALS CORPORATION (JP) 2015-07-30 US disclosed
EP-2899216-A1 FUNCTIONALIZED ALPHA-OLEFIN POLYMER, AS WELL AS CURED COMPOSITION AND CURED ARTICLE USING SAME Idemitsu Kosan Co., Ltd (JP) 2015-07-29 EP disclosed
US-20150197592-A1 SEMI-CURED PRODUCT, CURED PRODUCT AND METHOD FOR PRODUCING THESE, OPTICAL COMPONENT, CURABLE RESIN COMPOSITION, AND COMPOUND FUJIFILM CORPORATION (JP) 2015-07-16 US disclosed
EP-2894190-A1 PREPREG AND METHOD FOR PRODUCING SAME Mitsubishi Rayon Co., Ltd. (JP) 2015-07-15 EP disclosed
EP-2889315-A1 CURABLE FLUORINE-CONTAINING POLYMER, METHOD FOR PRODUCING SAME, AND FLUORINE-CONTAINING POLYMER CURED PRODUCT Asahi Glass Company, Limited (JP) 2015-07-01 EP disclosed
US-9065150-B2 Electrolyte material, and battery material and secondary battery using said electrolyte material NIPPON SHOKUBAI CO., LTD. (JP) 2015-06-23 US disclosed
US-9062148-B2 Method for producing fine-particle-dispersed polyol, and method for producing polyurethane resin SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2015-06-23 US disclosed
US-20150144194-A1 Solar Cell Protective Sheet and Solar Cell Module MITSUBISHI RAYON CO., LTD. (JP) 2015-05-28 US disclosed
US-20150148508-A1 (METH) ACRYLIC RESIN COMPOSITION KURARAY CO., LTD. (JP) 2015-05-28 US disclosed
US-20150141604-A1 CURABLE FLUORINATED POLYMER, PROCESS FOR ITS PRODUCTION, AND FLUORINATED POLYMER CURED PRODUCT ASAHI GLASS COMPANY, LIMITED (JP) 2015-05-21 US disclosed
US-9034973-B2 Composition for forming intermediate film for laminated glass, intermediate film for laminated glass and laminated glass BRIDGESTONE CORPORATION (JP) 2015-05-19 US disclosed
US-20150126697-A1 (METH) ACRYLIC RESIN COMPOSITION KURARAY CO., LTD. (JP) 2015-05-07 US disclosed
US-20150079368-A1 LAMINATE MATERIAL MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-03-19 US disclosed
US-20150080543-A1 THERMOPLASTIC RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-03-19 US disclosed
US-8981019-B2 Method for producing methacrylic-based polymer MITSUBISHI RAYON CO., LTD. (JP) 2015-03-17 US disclosed
EP-2840096-A1 THERMOPLASTIC RESIN Mitsubishi Gas Chemical Company, Inc. (JP) 2015-02-25 EP disclosed
EP-2839956-A1 LAMINATE BODY Mitsubishi Gas Chemical Company, Inc. (JP) 2015-02-25 EP disclosed
US-20150044477-A1 MEMBER FOR VEHICLE AND MANUFACTURING PROCESS FOR THE SAME KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) 2015-02-12 US disclosed
US-8952079-B2 Semi-cured product, cured product and method of manufacturing these, optical component, curable resin composition FUJIFILM CORPORATION (JP) 2015-02-10 US disclosed
US-20150038646-A1 COMPOSITION FOR PRODUCING SHEET FOR FORMING LAMINATE, PROCESS FOR PRODUCING THE SAME, AND SHEET FOR FORMING LAMINATE BRIDGESTONE CORPORATION (JP) 2015-02-05 US disclosed
EP-2832786-A1 FLUORINE-CONTAINING ELASTOMER COMPOSITION, METHOD FOR PRODUCING SAME, MOLDED BODY, CROSSLINKED PRODUCT, AND COVERED WIRE Asahi Glass Company, Limited (JP) 2015-02-04 EP disclosed
US-8940808-B2 Curable coating agent composition KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) 2015-01-27 US disclosed
US-20150007888-A1 SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SAME BRIDGESTONE CORPORATION (JP) 2015-01-08 US disclosed
EP-2218724-B1 EPOXY GROUP-CONTAINING ORGANOSILOXANE COMPOUND, CURABLE COMPOSITION FOR TRANSFER MATERIAL, AND FINE PATTERN FORMING METHOD USING THE COMPOSITION SHOWA DENKO KK (JP) 2015-01-07 EP disclosed
US-20140377558-A1 FLUORINATED ELASTOMER COMPOSITION AND METHOD FOR ITS PRODUCTION, MOLDED PRODUCT, CROSS-LINKED PRODUCT, AND COVERED ELECTRIC WIRE ASAHI GLASS COMPANY, LIMITED (JP) 2014-12-25 US disclosed
US-20140366945-A1 SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SAME BRIDGESTONE CORPORATION (JP) 2014-12-18 US disclosed
EP-2808360-A1 COMPOSITION FOR PRODUCING SHEET FOR FORMING LAMINATE, PROCESS FOR PRODUCING SAME, AND SHEET FOR FORMING LAMINATE Bridgestone Corporation (JP) 2014-12-03 EP disclosed
EP-2808906-A1 SEALING FILM FOR SOLAR CELLS, AND SOLAR CELL USING SAME Bridgestone Corporation (JP) 2014-12-03 EP disclosed
EP-2808907-A1 SEALING FILM FOR SOLAR CELLS, AND SOLAR CELL USING SAME Bridgestone Corporation (JP) 2014-12-03 EP disclosed
US-8900712-B2 Member for vehicle and manufacturing process for the same KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) 2014-12-02 US disclosed
EP-2805988-A1 METHOD FOR PRODUCING ACRYLIC RUBBER/FLUORO-RUBBER COMPOSITION, CROSSLINKED COMPOSITION, LAMINATE BODY, AND HEAT-RESISTANT AIR RUBBER HOSE Asahi Glass Company, Limited (JP) 2014-11-26 EP disclosed
EP-2805999-A1 Photosensitive Alkali-Soluble Silicone Resin Composition Asahi Kasei E-materials Corporation (JP) 2014-11-26 EP disclosed
US-8883947-B2 Method of forming thin film DAIKIN INDUSTRIES, LTD. (JP) 2014-11-11 US disclosed
US-20140329096-A1 PROCESS FOR PRODUCING ACRYLIC RUBBER/FLUORINATED RUBBER COMPOSITION, CROSSLINKABLE COMPOSITION, LAMINATE AND HEAT RESISTANT AIR RUBBER HOSE ASAHI GLASS COMPANY, LIMITED (JP) 2014-11-06 US disclosed
EP-2433916-B1 ETHYLENE-UNSATURATED ESTER COPOLYMER FILM FOR FORMING LAMINATE BRIDGESTONE CORP (JP) 2014-11-05 EP disclosed
US-8871825-B2 Polypropylene resin composition, method for producing the same, and foam molded article SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2014-10-28 US disclosed
US-20140311571-A1 SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SAME BRIDGESTONE CORPORATION (JP) 2014-10-23 US disclosed
US-20140309383-A1 METHOD FOR PRODUCING METHACRYLIC-BASED POLYMER MITSUBISHI RAYON CO., LTD. (JP) 2014-10-16 US disclosed
US-8860165-B2 Wavelength conversion-type photovoltaic cell sealing material and photovoltaic cell module using the same HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-10-14 US disclosed
EP-2398066-B1 ENCAPSULATION FILM FOR SOLAR CELL MODULE AND SOLAR CELL MODULE USING ENCAPSULATION FILM BRIDGESTONE CORP (JP) 2014-09-24 EP disclosed
US-20140242757-A1 ADHESIVE FOR ELECTRONIC COMPONENT Henkel IP & Holding GmbH (DE) 2014-08-28 US disclosed
US-20140242395-A1 MEMBER FOR VEHICLE AND MANUFACTURING PROCESS FOR THE SAME KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) 2014-08-28 US disclosed
EP-2770541-A1 SEALING FILM FOR SOLAR CELLS, AND SOLAR CELL USING SAME Bridgestone Corporation (JP) 2014-08-27 EP disclosed
US-20140228468-A1 CURING-TYPE COATING-AGENT COMPOSITION TOAGOSEI CO., LTD. (JP) 2014-08-14 US disclosed
US-8796397-B2 Silicone resin, process for producing the same, and curable resin composition comprising the same NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) 2014-08-05 US disclosed
US-20140193632-A1 PHOTOSENSITIVE ALKALI-SOLUBLE SILICONE RESIN COMPOSITION ASAHI KASEI E-MATERIALS CORPORATION (JP) 2014-07-10 US disclosed
EP-2752712-A1 PHOTOSENSITIVE ALKALI-SOLUBLE SILICONE RESIN COMPOSITION Asahi Kasei E-Materials Corporation (JP) 2014-07-09 EP disclosed
US-20140187714-A1 SEALANT COMPOSITION FOR ELECTRONIC DEVICE HENKEL AG & CO. KGAA (DE) 2014-07-03 US disclosed
US-20140187729-A1 UNDERFILL SEALANT COMPOSITION HENKEL AG & CO. KGAA (DE) 2014-07-03 US disclosed
US-20140187659-A1 COMPOSITION FOR ELECTRONIC DEVICE HENKEL AG & CO KGAA (DE) 2014-07-03 US disclosed
US-20140187715-A1 CURABLE COMPOSITION AND CURED ARTICLE ADEKA CORPORATION (JP) 2014-07-03 US disclosed
EP-2749581-A1 CURABLE COMPOSITION AND CURED ARTICLE Adeka Corporation (JP) 2014-07-02 EP disclosed
US-8765837-B2 Dental curable composition TOKUYAMA DENTAL CORPORATION (JP) 2014-07-01 US disclosed
US-8754181-B2 Silicone resin, process for producing the same, and curable resin composition comprising the same NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) 2014-06-17 US disclosed
EP-2735582-A1 METHOD FOR PRODUCING ETHYLENE-TETRAFLUOROETHYLENE COPOLYMER POWDER Asahi Glass Company, Limited (JP) 2014-05-28 EP disclosed
US-20140135465-A1 METHOD FOR PRODUCING ETHYLENE-TETRAFLUOROETHYLENE COPOLYMER POWDER ASAHI GLASS COMPANY, LIMITED (JP) 2014-05-15 US disclosed
US-8716360-B2 Curing-type coating-agent composition KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) 2014-05-06 US disclosed
US-20140120358-A1 Curable Resin Composition, Cured Product Thereof, Laminate, and Method For Producing Laminate MITSUBISHI RAYON CO., LTD. (JP) 2014-05-01 US disclosed
US-20140116499-A1 PROCESS FOR MANUFACTURING SOLAR CELL MODULES BRIDGESTONE CORPORATION (JP) 2014-05-01 US disclosed
EP-2720278-A1 SOLAR CELL MODULE MANUFACTURING METHOD Bridgestone Corporation (JP) 2014-04-16 EP disclosed
US-8696942-B2 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-04-15 US disclosed
US-8679625-B2 Solar cell sealing film and solar cell using the sealing film BRIDGESTONE CORPORATION (JP) 2014-03-25 US disclosed
EP-2492023-B1 VEHICLE MEMBER AND PROCESS FOR PRODUCING THE SAME TOYOTA JIDOSHOKKI KK (JP) 2014-03-05 EP disclosed
US-8642178-B2 Vehicle member and process for producing the same KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) 2014-02-04 US disclosed
US-8632952-B2 Photosensitive resin composition, photosensitive resin cured matter, photosensitive resin film, photosensitive resin film cured matter and optical waveguide obtained by using the same HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-01-21 US disclosed
US-8632916-B2 Lithium ion polymer battery SANYO ELECTRIC CO., LTD. (JP) 2014-01-21 US disclosed
EP-2685508-A1 SEALING FILM FOR SOLAR CELLS AND SOLAR CELL USING SAME Bridgestone Corporation (JP) 2014-01-15 EP disclosed
US-20130340828-A1 SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SAME BRIDGESTONE CORPORATION (JP) 2013-12-26 US disclosed
US-8609225-B2 Ethylene-unsaturated ester copolymer film for forming laminate BRIDGESTONE CORPORATION (JP) 2013-12-17 US disclosed
US-20130328149-A1 WAVELENGTH CONVERSION-TYPE PHOTOVOLTAIC CELL SEALING MATERIAL AND PHOTOVOLTAIC CELL MODULE USING THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-12-12 US disclosed
EP-2484722-B1 CROSSLINKABLE FLUORORUBBER COMPOSITION AND CROSSLINKED RUBBER ARTICLE ASAHI GLASS CO LTD (JP) 2013-12-11 EP disclosed
US-8604150-B2 Epoxy group-containing organosiloxane compound, curable composition for transfer materials and method for forming micropattern using the composition SHOWA DENKO K.K. (JP) 2013-12-10 US disclosed
EP-2669301-A1 a-OLEFIN POLYMER AND METHOD FOR PRODUCING SAME Idemitsu Kosan Co., Ltd. (JP) 2013-12-04 EP disclosed
WO-2013176279-A1 CURABLE COMPOSITION AND CURED MATERIAL OF THE SAME SHOWA DENKO K.K. (JP) 2013-11-28 WO disclosed
US-20130317166-A1 ALPHA-OLEFIN POLYMER AND METHOD FOR PRODUCING THE SAME IDEMITSU KOSAN CO., LTD. (JP) 2013-11-28 US disclosed
US-20130307195-A1 CURABLE COMPOSITION FOR TRANSFER MATERIALS AND METHOD FOR FORMING MICROPATTERN USING THE CURABLE COMPOSITION SHOWA DENKO K.K. (JP) 2013-11-21 US disclosed
US-20130237660-A1 (METH)ACRYLATE COMPOSITION IDEMITSU KOSAN CO. LTD (JP) 2013-09-12 US disclosed
US-20130237630-A1 SEMI-CURED PRODUCT, CURED PRODUCT AND METHOD OF MANUFACTURING THESE, OPTICAL COMPONENT, CURABLE RESIN COMPOSITION FUJIFILM CORPORATION (JP) 2013-09-12 US disclosed
US-20130237677-A1 METHOD OF FORMING THIN FILM DAIKIN INDUSTRIES, LTD. (JP) 2013-09-12 US disclosed
US-8530583-B2 Thermo- and/or photo-sensitive material and insulator film made thereof FUJIFILM CORPORATION (JP) 2013-09-10 US disclosed
EP-2634199-A1 (METH)ACRYLATE COMPOSITION Idemitsu Kosan Co., Ltd. (JP) 2013-09-04 EP disclosed
EP-2045629-B1 RESIN COMPOSITION FOR OPTICAL WAVEGUIDE, RESIN FILM FOR OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE HITACHI CHEMICAL CO LTD (JP) 2013-09-04 EP disclosed
US-8518524-B2 Transparent composite material SHOWA DENKO K.K. (JP) 2013-08-27 US disclosed
US-8518303-B2 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-08-27 US disclosed
US-20130160841-A1 ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE AND CIRCUIT CONNECTING MATERIAL USING THE SAME, CONNECTING STRUCTURE OF CIRCUIT MEMBER AND MANUFACTURING METHOD THEREOF HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-06-27 US disclosed
US-8460787-B2 Sealing film for solar cell BRIDGESTONE CORPORATION (JP) 2013-06-11 US disclosed
US-8463099-B2 Resin composition for optical material, resin film for optical material, and optical waveguide using them HITACHI CHEMICAL COMPANY (JP) 2013-06-11 US disclosed
US-8460501-B2 Cured film and method for production thereof SHOWA DENKO K.K. (JP) 2013-06-11 US disclosed
US-20130140083-A1 ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, CIRCUIT CONNECTION STRUCTURE, METHOD FOR CONNECTING CIRCUIT MEMBERS, USE OF ADHESIVE COMPOSITION, USE OF FILM-LIKE ADHESIVE AND USE OF ADHESIVE SHEET HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-06-06 US disclosed
US-8450439-B2 Method of forming thin film DAIKIN INDUSTRIES, LTD. (JP) 2013-05-28 US disclosed
CN-101821311-B Granular polyurethane resin composition and molded article of the same MITSU CHEMICALS INC 2013-05-15 CN disclosed
US-8426527-B2 Crosslinkable fluororubber composition and crosslinked rubber article ASAHI GLASS COMPANY, LIMITED (JP) 2013-04-23 US disclosed
US-8419978-B2 Anisotropic conductive film composition CHEIL INDUSTRIES, INC. (KR) 2013-04-16 US disclosed
US-20130079470-A1 RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, AND MOLDED ARTICLE USING THE SAME SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2013-03-28 US disclosed
US-20130074928-A1 WAVELENGTH CONVERSION TYPE PHOTOVOLTAIC CELL SEALING SHEET AND PHOTOVOLTAIC CELL MODULE MITSUBISHI ELECTRIC CORPORATION 2013-03-28 US disclosed
US-20130075142-A1 ADHESIVE COMPOSITION, USE THEREOF, CONNECTION STRUCTURE FOR CIRCUIT MEMBERS, AND METHOD FOR PRODUCING SAME HITACHI CHEMICAL CO., LTD. (JP) 2013-03-28 US disclosed
US-20130065982-A1 CURING-TYPE COATING-AGENT COMPOSITION TOAGOSEI CO., LTD. (JP) 2013-03-14 US disclosed
US-20130065062-A1 MEMBER FOR VEHICLE AND MANUFACTURING PROCESS FOR THE SAME KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) 2013-03-14 US disclosed
EP-2568010-A1 THERMOPLASTIC TRANSPARENT RESIN COMPOSITION Mitsubishi Gas Chemical Company, Inc. (JP) 2013-03-13 EP disclosed
US-20130059980-A1 THERMOPLASTIC TRANSPARENT RESIN COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2013-03-07 US disclosed
US-8383695-B2 Phenoxy resin for optical material, resin composition for optical material, resin film for optical material and optical waveguide using those HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-02-26 US disclosed
US-8383313-B2 Toner CANON KABUSHIKI KAISHA (JP) 2013-02-26 US disclosed
EP-2555253-A1 WAVELENGTH-CONVERTING SOLAR CELL SEALING SHEET, AND SOLAR CELL MODULE Hitachi Chemical Company, Ltd. (JP) 2013-02-06 EP disclosed
EP-2537893-A1 SEALING FILM FOR PHOTOVOLTAIC MODULES AND PHOTOVOLTAIC MODULES USING SAME Bridgestone Corporation (JP) 2012-12-26 EP disclosed
US-20120309878-A1 SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SEALING FILM BRIDGESTONE CORPORATION (JP) 2012-12-06 US disclosed
US-8319222-B2 Adhesive composition SONY CHEMICAL & INFORMATION DEVICE CORPORATION (JP) 2012-11-27 US disclosed
US-8309658-B2 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-11-13 US disclosed
US-20120273974-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL CO., LTD. (JP) 2012-11-01 US disclosed
US-20120244361-A1 VEHICLE MEMBER AND PROCESS FOR PRODUCING THE SAME KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) 2012-09-27 US disclosed
US-20120244427-A1 ELECTROLYTE MATERIAL, AND BATTERY MATERIAL AND SECONDARY BATTERY USING SAID ELECTROLYTE MATERIAL NIPPON SHOKUBAI CO., LTD. (JP) 2012-09-27 US disclosed
US-20120225994-A1 PROPYLENE RESIN COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2012-09-06 US disclosed
CN-102653616-A Propylene resin composition SUMITOMO CHEMICAL CO 2012-09-05 CN disclosed
EP-2492320-A1 CURABLE COATING MATERIAL COMPOSITION Kabushiki Kaisha Toyota Jidoshokki (JP) 2012-08-29 EP disclosed
EP-2492023-A1 VEHICLE MEMBER AND PROCESS FOR PRODUCTION THEREOF Kabushiki Kaisha Toyota Jidoshokki (JP) 2012-08-29 EP disclosed
US-20120202950-A1 CROSSLINKABLE FLUORORUBBER COMPOSITION AND CROSSLINKED RUBBER ARTICLE ASAHI GLASS COMPANY, LIMITED (JP) 2012-08-09 US disclosed
US-20120202911-A1 CURABLE COATING AGENT COMPOSITION TOAGOSEI CO., LTD. (JP) 2012-08-09 US disclosed
EP-2484722-A1 CROSSLINKABLE FLUORORUBBER COMPOSITION AND CROSSLINKED RUBBER ARTICLE Asahi Glass Company, Limited (JP) 2012-08-08 EP disclosed
US-8221880-B2 Adhesive composition SONY CHEMICAL & INFORMATION DEVICE CORPORATION (JP) 2012-07-17 US disclosed
US-20120157656-A1 POLYALKYLENE GLYCOL-BASED POLYMER AND PROCESS FOR PRODUCING THE SAME NIPPON SHOKUBAI CO, LTD (JP) 2012-06-21 US disclosed
US-8202613-B2 Multilayer pellet and method for producing the same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2012-06-19 US disclosed
US-20120138868-A1 CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE CIRCUIT CONNECTING MATERIAL, STRUCTURE FOR CONNECTING CIRCUIT MEMBER, AND METHOD FOR CONNECTING CIRCUIT MEMBER HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-06-07 US disclosed
US-8187706-B2 2012-05-29 US disclosed
US-20120107564-A1 ETHYLENE-UNSATURATED ESTER COPOLYMER FILM FOR FORMING LAMINATE BRIDGESTONE CORPORATION (JP) 2012-05-03 US disclosed
US-8163842-B2 Transparent composite material and process for producing the same SHOWA DENKO K.K. (JP) 2012-04-24 US disclosed
US-20120085579-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-04-12 US disclosed
US-8148625-B2 Composition for solar cell sealing film, solar cell sealing film and solar cell using the sealing film BRIDGESTONE CORPORATION (JP) 2012-04-03 US disclosed
US-20120073656-A1 SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SEALING FILM BRIDGESTONE CORPORATION (JP) 2012-03-29 US disclosed
EP-2433916-A1 ETHYLENE-UNSATURATED ESTER COPOLYMER FILM FOR FORMING LAMINATE Bridgestone Corporation (JP) 2012-03-28 EP disclosed
US-8138268-B2 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-03-20 US disclosed
US-20120063109-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2012-03-15 US disclosed
EP-2426787-A1 CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE CIRCUIT CONNECTING MATERIAL, STRUCTURE FOR CONNECTING CIRCUIT MEMBER, AND METHOD FOR CONNECTING CIRCUIT MEMBER Hitachi Chemical Company, Ltd. (JP) 2012-03-07 EP disclosed
US-20120048606-A1 ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-03-01 US disclosed
US-20120034397-A1 TRANSPARENT COMPOSITE MATERIAL SHOWA DENKO K.K. (JP) 2012-02-09 US disclosed
EP-2412738-A1 TRANSPARENT COMPOSITE MATERIAL SHOWA DENKO K.K. (JP) 2012-02-01 EP disclosed
EP-2412749-A1 TRANSPARENT COMPOSITE MATERIAL SHOWA DENKO K.K. (JP) 2012-02-01 EP disclosed
US-20120022191-A1 TRANSPARENT COMPOSITE MATERIAL SHOWA DENKO K.K. (JP) 2012-01-26 US disclosed
US-20120021265-A1 NONAQUEOUS SECONDARY BATTERY AND NONAQUEOUS SECONDARY BATTERY PACK SANYO ELECTRIC CO., LTD. (JP) 2012-01-26 US disclosed
US-20120016161-A1 METHOD FOR PRODUCING OXIME SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2012-01-19 US disclosed
EP-2407239-A1 Method for producing oxime Sumitomo Chemical Company, Limited (JP) 2012-01-18 EP disclosed
US-20110319517-A1 SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SEALING FILM BRIDGESTONE CORPORATION (JP) 2011-12-29 US disclosed
EP-2087526-B1 SEALING FILMS FOR SOLAR CELL BRIDGESTONE CORP (JP) 2011-12-21 EP disclosed
EP-2395031-A1 Vinylidene fluoride homopolymer Daikin Industries, Ltd. (JP) 2011-12-14 EP disclosed
EP-2395030-A1 Vinylidene fluoride homopolymer DAIKIN INDUSTRIES, LIMITED (JP) 2011-12-14 EP disclosed
EP-2393106-A1 CURABLE COMPOSITION FOR TRANSFER MATERIAL AND UREA COMPOUND CONTAINING (METH)ACRYLOYL GROUP Showa Denko K.K. (JP) 2011-12-07 EP disclosed
EP-1607417-B1 METHOD OF FORMING THIN FILM DAIKIN IND LTD (JP) 2011-11-23 EP disclosed
US-20110281025-A1 CURABLE COMPOSITION FOR TRANSFER MATERIALS, AND (METH) ACRYLOYL GROUP-CONTAINING UREA COMPOUND SHOWA DENKO K.K. (JP) 2011-11-17 US disclosed
US-20110281119-A1 Adhesive composition SONY CHEMICAL & INFORMATION DEVICE CORPORATION (JP) 2011-11-17 US disclosed
US-8036511-B2 Resin composition for optical material, resin film for optical material, and optical waveguide HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-10-11 US disclosed
US-20110245130-A1 POLYMER COMPOSITION AND PROCESS FOR THE PRODUCTION THEREOF PROCTER & GAMBLE COMPANY, THE 2011-10-06 US disclosed
US-20110245416-A1 COMPOSITION FUJIFILM CORPORATION (JP) 2011-10-06 US disclosed
US-8029911-B2 Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-10-04 US disclosed
US-8022148-B2 Polypropylene resin composition and film made thereof SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2011-09-20 US disclosed
US-20110206834-A1 CURABLE COMPOSITION FOR TRANSFER MATERIALS, AND PATTERN FORMING PROCESS SHOWA DENKO K.K. (JP) 2011-08-25 US disclosed
EP-2357204-A1 COMPOSITION FUJIFILM Corporation (JP) 2011-08-17 EP disclosed
EP-2357215-A1 Use of an adhesive composition, a circuit connecting material, a process for the production of a circuit member connection structure and a semiconductor device Hitachi Chemical Company, Ltd. (JP) 2011-08-17 EP disclosed
EP-2247656-B1 TRANSPARENT COMPOSITE MATERIAL SHOWA DENKO KK (JP) 2011-08-10 EP disclosed
US-7994255-B2 Polyorganiosiloxane-containing graft copolymer, resin compositions containing the same and process for produciton of polyorganosiloxane emulsions KANEKA CORPORATION (JP) 2011-08-09 US disclosed
US-20110183212-A1 LITHIUM ION POLYMER BATTERY SANYO ELECTRIC CO., LTD. (JP) 2011-07-28 US disclosed
EP-1607986-B1 METHOD FOR FORMING FERROELECTRIC THIN FILM DAIKIN IND LTD (JP) 2011-07-27 EP disclosed
EP-2348087-A1 Adhesive composition, circuit connecting material and connecting structure of circuit member Hitachi Chemical Company, Ltd. (JP) 2011-07-27 EP disclosed
US-20110176288-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL COMPANY LTD. (JP) 2011-07-21 US disclosed
EP-2070985-B1 THERMOPLASTIC RESIN COMPOSITION AND RESIN MOLDED ARTICLE TECHNO POLYMER CO LTD (JP) 2011-07-20 EP disclosed
EP-2345676-A1 CURABLE COMPOSITION FOR TRANSFER MATERIAL AND PATTERN FORMATION METHOD SHOWA DENKO K.K. (JP) 2011-07-20 EP disclosed
EP-2345935-A1 TONER Canon Kabushiki Kaisha (JP) 2011-07-20 EP disclosed
US-7964684-B2 Polysiesquioxanes preferably comprising vinyl or ethynyl silanetriol; improved inhibition of film shrinkage and degassing during curing; uniform thickness, low refractive index FUJIFILM CORPORATION (JP) 2011-06-21 US disclosed
EP-1652876-B1 Polylactic acid resin foamed molding and process for manufacturing the same JSP CORP (JP) 2011-06-15 EP disclosed
US-20110133130-A1 ANISOTROPIC CONDUCTIVE FILM COMPOSITION CHEIL INDUSTRIES, INC. (KR) 2011-06-09 US disclosed
US-20110129689-A2 CURABLE COMPOSITION FOR TRANSFER MATERIALS AND METHOD FOR FORMING MICROPATTERN USING THE CURABLE COMPOSITION SHOWA DENKO K.K. (JP) 2011-06-02 US disclosed
EP-2322585-A1 Adhesive composition, circuit connecting material and connecting structure of circuit member Hitachi Chemical Co., Ltd. (JP) 2011-05-18 EP disclosed
EP-2318501-A1 POLYMER COMPOSITION AND PROCESS FOR THE PRODUCTION THEREOF The Procter & Gamble Company (US) 2011-05-11 EP disclosed
US-7931956-B2 Anisotropic conductive film, method for producing the same, and bonded structure SONY CHEMICAL & INFORMATION DEVICE CORPORATION (JP) 2011-04-26 US disclosed
US-20110081609-A1 TONER CANON KABUSHIKI KAISHA (JP) 2011-04-07 US disclosed
US-20110075981-A1 RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE MAKINO TATSUYA 2011-03-31 US disclosed
US-20110070407-A1 NEAR-INFRARED ABSORPTIVE DYE-CONTAINING CURABLE COMPOSITION, INK COMPOSITION AND METHOD OF PRODUCING NEAR-INFRARED ABSORPTIVE FILTER FUJIFILM CORPORATION (JP) 2011-03-24 US disclosed
US-7893167-B2 Sealing film for solar cell and solar cell using the sealing film BRIDGESTONE CORPORATION (JP) 2011-02-22 US disclosed
US-20110040015-A1 TRANSPARENT COMPOSITE MATERIAL AND PROCESS FOR PRODUCING THE SAME SHOWA DENKO K.K. (JP) 2011-02-17 US disclosed
US-20110039117-A1 CURED FILM AND METHOD FOR PRODUCTION THEREOF SHOWA DENKO K.K. (JP) 2011-02-17 US disclosed
EP-2284236-A1 ADHESIVE MATERIAL TAPE AND ADHESIVE MATERIAL TAPE WOUND BODY Hitachi Chemical Company, Ltd. (JP) 2011-02-16 EP disclosed
US-7879259-B2 thermoplastic resin and a styrene-acrylonitrile (SAN) copolymer resin, a curing composition, and conductive particles; exhibiting improved adhesion and low contact resistance characteristics CHEIL INDUSTRIES, INC. (KR) 2011-02-01 US disclosed
EP-2270059-A1 TRANSPARENT COMPOSITE MATERIAL AND PROCESS FOR PRODUCING THE SAME Showa Denko K.K. (JP) 2011-01-05 EP disclosed
EP-2269818-A1 CURED FILM AND METHOD FOR PRODUCTION THEREOF Showa Denko K.K. (JP) 2011-01-05 EP disclosed
US-7858282-B2 binder resin, colorant, and wax, and inorganic fine particles; temperature-storage elastic modulus; offset resistance, gloss performance, and penetration resistance, high-quality image CANON KABUSHIKI KAISHA (JP) 2010-12-28 US disclosed
US-20100316889-A1 CURABLE COMPOSITION FOR TRANSFER MATERIALS AND METHOD FOR FORMING MICROPATTERN USING THE CURABLE COMPOSITION SHOWA DENKO K.K. (JP) 2010-12-16 US disclosed
US-7853113-B2 Resin composition for optical material, resin film for optical material, and optical waveguide HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-12-14 US disclosed
US-20100307805-A1 CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-12-09 US disclosed
US-20100311919-A1 SILICONE RESIN, PROCESS FOR PRODUCING THE SAME, AND CURABLE RESIN COMPOSITION COMPRISING THE SAME NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) 2010-12-09 US disclosed
US-20100304961-A1 DENTAL CHEMICAL POLYMERIZATION CATALYST AND DENTAL CURABLE COMPOSITION CONTAINING THE SAME CATALYST TOKUYAMA DENTAL CORPORATION (JP) 2010-12-02 US disclosed
US-20100294551-A1 ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING THE SAME, AND CIRCUIT CONNECTED STRUCTURE NOMURA SATOYUKI 2010-11-25 US disclosed
US-20100298456-A1 POLYPROPYLENE RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, AND FOAM MOLDED ARTICLE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2010-11-25 US disclosed
EP-2009070-B1 Ink-jet ink and method of producing the same, color filter and method of producing the same, display device, and method of forming functional film FUJIFILM CORP (JP) 2010-11-24 EP disclosed
US-20100292378-A1 TRANSPARENT COMPOSITE MATERIAL SHOWA DENKO K.K. (JP) 2010-11-18 US disclosed
US-20100288347-A1 SEALING FILM FOR SOLAR CELL BRIDGESTONE CORPORATION (JP) 2010-11-18 US disclosed
EP-2247656-A1 TRANSPARENT COMPOSITE MATERIAL Showa Denko K.K. (JP) 2010-11-10 EP disclosed
US-20100277884-A1 CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-11-04 US disclosed
US-20100277885-A1 CIRCUIT CONNECTING MATERIAL AND STRUCTURE FOR CONNECTING CIRCUIT MEMBER HITACHI CHEMICAL COMOANY, LTD. (JP) 2010-11-04 US disclosed
EP-2246400-A1 Circuit connecting material Hitachi Chemical Co., Ltd. (JP) 2010-11-03 EP disclosed
US-20100261144-A1 Dental Curable Composition TOKUYAMA DENTAL CORPORATION (JP) 2010-10-14 US disclosed
US-20100258983-A1 EPOXY GROUP-CONTAINING ORGANOSILOXANE COMPOUND, CURABLE COMPOSITION FOR TRANSFER MATERIALS AND METHOD FOR FORMING MICROPATTERN USING THE COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-14 US disclosed
EP-2237650-A1 CIRCUIT CONNECTING ADHESIVE FILM AND CIRCUIT CONNECTING STRUCTURE Hitachi Chemical Company, Ltd. (JP) 2010-10-06 EP disclosed
US-7799844-B2 Active energy beam-curable composition for optical material TOAGOSEI CO., LTD. (JP) 2010-09-21 US disclosed
US-20100229946-A1 COMPOSITION FOR SOLAR CELL SEALING FILM, SOLAR CELL SEALING FILM AND SOLAR CELL USING THE SEALING FILM BRIDGESTONE CORPORATION (JP) 2010-09-16 US disclosed
US-7795353-B2 Method for producing a modified propylene polymer SUMITOMO CHEMICAL COMPANY LIMITED (JP) 2010-09-14 US disclosed
US-20100221668-A1 RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE MAKINO TATSUYA 2010-09-02 US disclosed
US-20100221533-A1 CIRCUIT CONNECTING ADHESIVE FILM AND CIRCUIT CONNECTING STRUCTURE HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-09-02 US disclosed
US-20100222507-A1 METHOD FOR PRODUCING FINE-PARTICLE-DISPERSED POLYOL, AND METHOD FOR PRODUCING POLYURETHANE RESIN SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2010-09-02 US disclosed
CN-101821311-A Granular polyurethane resin composition and molded article of the same MITSUI CHEMICALS POLYURETHANES 2010-09-01 CN disclosed
EP-2222146-A1 CIRCUIT CONNECTING MATERIAL AND STRUCTURE FOR CONNECTING CIRCUIT MEMBER Hitachi Chemical Company, Ltd. (JP) 2010-08-25 EP disclosed
EP-2218724-A1 EPOXY GROUP-CONTAINING ORGANOSILOXANE COMPOUND, CURABLE COMPOSITION FOR TRANSFER MATERIAL, AND FINE PATTERN FORMING METHOD USING THE COMPOSITION Showa Denko K.K. (JP) 2010-08-18 EP disclosed
US-20100204369-A1 POLYPROPYLENE RESIN COMPOSITION AND FILM THEREOF SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2010-08-12 US disclosed
EP-2216349-A1 CHEMICAL POLYMERIZATION CATALYST FOR DENTAL USE AND CURABLE DENTAL COMPOSITIONS CONTAINING THE CATALYST Tokuyama Dental Corporation (JP) 2010-08-11 EP disclosed
US-7772690-B2 Insulating film FUJIFILM CORPORATION (JP) 2010-08-10 US disclosed
EP-2213275-A1 CURABLE COMPOSITION FOR DENTAL APPLICATIONS Tokuyama Dental Corporation (JP) 2010-08-04 EP disclosed
EP-2211596-A1 CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE Hitachi Chemical Company, Ltd. (JP) 2010-07-28 EP disclosed
EP-2206756-A1 CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME Hitachi Chemical Company, Ltd. (JP) 2010-07-14 EP disclosed
US-7754781-B2 Active energy beam-curable composition TOAGOSEI CO., LTD. (JP) 2010-07-13 US disclosed
US-20100167030-A1 ADHESIVE TAPE AND ADHESIVE TAPE ROLL HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-07-01 US disclosed
US-7747129-B2 Resin composition for optical materials, resin film for optical material, and optical waveguide HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-06-29 US disclosed
EP-2199309-A1 METHOD FOR PRODUCING FINE PARTICLE-DISPERSED POLYOL AND METHOD FOR PRODUCING POLYURETHANE RESIN Sanyo Chemical Industries, Ltd. (JP) 2010-06-23 EP disclosed
US-20100139947-A1 CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-06-10 US disclosed
US-20100143834-A1 binder resin, colorant, and wax, and inorganic fine particles; temperature-storage elastic modulus; offset resistance, gloss performance, and penetration resistance, high-quality image CANON KABUSHIKI KAISHA (JP) 2010-06-10 US disclosed
US-7727423-B2 Anisotropic conductive film composition and film including the same CHEIL INDUSTRIES, INC. (KR) 2010-06-01 US disclosed
US-7727606-B2 Polylactic acid resin foamed molding and process for manufacturing the same JSP CORPORATION (JP) 2010-06-01 US disclosed
EP-2182410-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PHOTOSENSITIVE RESIN PRODUCT, PHOTOSENSITIVE RESIN FILM, CURED PHOTOSENSITIVE RESIN FILM PRODUCT, AND OPTICAL WAVEGUIDE PRODUCED BY USING THOSE PRODUCTS Hitachi Chemical Company, Ltd. (JP) 2010-05-05 EP disclosed
US-20100105836-A1 THERMOPLASTIC RESIN COMPOSITION AND RESIN MOLDED PRODUCT TECHNO POLYMER CO., LTD. (JP) 2010-04-29 US disclosed
EP-2180026-A1 ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER Hitachi Chemical Company, Ltd. (JP) 2010-04-28 EP disclosed
US-7704437-B2 Applicator for cosmetics NISHIKAWA RUBBER CO., LTD. (JP) 2010-04-27 US disclosed
US-20100093962-A1 METHOD OF FORMING THIN FILM DAIKIN INDUSTRIES, LTD. (JO) 2010-04-15 US disclosed
EP-1569013-B1 Curable composition for optical parts NIPPON CATALYTIC CHEM IND (JP) 2010-04-14 EP disclosed
US-20100065311-A1 CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-03-18 US disclosed
WO-2010024467-A1 POLYMER COMPOSITION AND PROCESS FOR THE PRODUCTION THEREOF THE PROCTER & GAMBLE COMPANY (US) 2010-03-04 WO disclosed
EP-1772471-B1 Radiation-curable composition and cured product thereof NIPPON CATALYTIC CHEM IND (JP) 2010-03-03 EP disclosed
US-20100040339-A1 RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE USING THEM HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-02-18 US disclosed
US-20100035073-A1 AQUEOUS EMULSION OF OLEFIN COPOLYMER SUMIKA CHEMTEX COMPANY, LIMITED (JP) 2010-02-11 US disclosed
US-20100027950-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN CURED MATTER, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE RESIN FILM CURED MATTER AND OPTICAL WAVEGUIDE OBTAINED BY USING THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-02-04 US disclosed
US-20100025097-A1 CIRCUIT CONNECTION STRUCTURE HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-02-04 US disclosed
US-7655742-B2 Method of forming thin film DAIKIN INDUSTRIES, LTD. (JP) 2010-02-02 US disclosed
EP-2148393-A1 CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER Hitachi Chemical Company, Ltd. (JP) 2010-01-27 EP disclosed
US-20100009205-A1 COMPOSITION FOR FORMING INTERMEDIATE FILM FOR LAMINATED GLASS, INTERMEDIATE FILM FOR LAMINATED GLASS AND LAMINATED GLASS BRIDGESTONE CORPORATION (JP) 2010-01-14 US disclosed
US-20090324922-A1 TRANSPARENT COMPOSITE MATERIAL SHOWA DENKO K.K. (JP) 2009-12-31 US disclosed
US-20090326123-A1 POLYPROPYLENE RESIN COMPOSITION AND MOLDED ARTICLE MADE THEREOF SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2009-12-31 US disclosed
US-20090309220-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL CO., LTD. (JP) 2009-12-17 US disclosed
US-20090278284-A1 PROCESS FOR MAKING A DIP-FORMING COMPOSITION AND A DIP-FORMED ARTICLE KODAMA KAZUMI 2009-11-12 US disclosed
US-20090280332-A1 Adhesive composition SONY CHEMICAL & INFORMATION DEVICE CORPORATION (JP) 2009-11-12 US disclosed
US-7612155-B2 Film forming composition, insulating film formed by use of the composition, and electronic device FUJIFILM CORPORATION (JP) 2009-11-03 US disclosed
EP-2112181-A1 RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE USING THEM Hitachi Chemical Company, Ltd. (JP) 2009-10-28 EP disclosed
US-20090253879-A1 POLYMER COMPOUND AND OIL ABSORBENT FUJIFILM CORPORATION (JP) 2009-10-08 US disclosed
US-20090244693-A1 POLYMER GEL-CONTAINING COMPOSITION, LIGHT MODULATING DEVICE AND LIGHT MODULATING METHOD FUJIFILM CORPORATION (JP) 2009-10-01 US disclosed
US-20090239082-A1 ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING THE SAME, AND BONDED STRUCTURE SONY CHEMICAL & INFORMATION DEVICE CORPORATION (JP) 2009-09-24 US disclosed
EP-2096138-A1 AQUEOUS EMULSION OF OLEFIN COPOLYMER Sumika Chemtex Company, Limited (JP) 2009-09-02 EP disclosed
EP-2094654-A1 RADICALLY POLYMERIZABLE COMPOUND HAVING A DITHIOCARBONATE STRUCTURE AND A SULFUR-CONTAINING ALLYLCARBONATE Showa Denko K.K. (JP) 2009-09-02 EP disclosed
US-20090196559-A1 Resin Composition for Optical Materials, Resin Film for Optical Material, and Optical Waveguide HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-08-06 US disclosed
WO-2009096607-A1 TRANSPARENT COMPOSITE MATERIAL SHOWA DENKO K.K. (JP) 2009-08-06 WO disclosed
US-7569649-B2 Film forming composition, insulating film, and electronic device FUJIFILM CORPORATION (JP) 2009-08-04 US disclosed
EP-2081222-A1 CIRCUIT CONNECTION STRUCTURE Hitachi Chemical Company, Ltd. (JP) 2009-07-22 EP disclosed
US-20090159129-A1 SEALING FILM FOR SOLAR CELL AND SOLAR CELL USING THE SEALING FILM BRIDGESTONE CORPORATION (JP) 2009-06-25 US disclosed
EP-2070985-A1 THERMOPLASTIC RESIN COMPOSITION AND RESIN MOLDED ARTICLE Techno Polymer Co., Ltd. (JP) 2009-06-17 EP disclosed
US-7538161-B2 Production and bonding method of elastomer composition THE YOKOHAMA RUBBER CO., LTD. (JP) 2009-05-26 US disclosed
EP-2056356-A1 COMPOSITION FOR SOLAR CELL SEALING FILM, SOLAR CELL SEALING FILM, AND SOLAR CELL USING THE SEALING FILM BRIDGESTONE CORPORATION (JP) 2009-05-06 EP disclosed
EP-2048209-A1 ADHESIVE COMPOSITION, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER Hitachi Chemical Company, Ltd. (JP) 2009-04-15 EP disclosed
EP-2046685-A1 TRANSPARENT COMPOSITE MATERIAL Showa Denko K.K. (JP) 2009-04-15 EP disclosed
US-7517548-B2 Polymerizing vinylidene fluoride in the presence of a free radical catalyst to form a green powder having a specific crystal structure; forming a film of the polyvinylidene fluoride; and subjectng the film to polarization DAIKIN INDUSTRIES, LTD. (JP) 2009-04-14 US disclosed
EP-2045629-A1 RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE Hitachi Chemical Company, Ltd. (JP) 2009-04-08 EP disclosed
EP-2040268-A1 CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER Hitachi Chemical Company, Ltd. (JP) 2009-03-25 EP disclosed
EP-2033942-A1 COMPOSITION FOR FORMING INTERLAYER FOR LAMINATED GLASS, INTERLAYER FOR LAMINATED GLASS, AND LAMINATED GLASS BRIDGESTONE CORPORATION (JP) 2009-03-11 EP disclosed
US-20090062421-A1 Phenoxy Resin for Optical Material, Resin Composition for Optical Material, Resin Film For Optical Material and Optical Waveguide Using Those HITACHI CHEIMICAL COMPANY LTD. (JP) 2009-03-05 US disclosed
US-20090035535-A1 INK-JET INK AND METHOD OF PRODUCING THE SAME, COLOR FILTER AND METHOD OF PRODUCING THE SAME, DISPLAY DEVICE, AND METHOD OF FORMING FUNCTIONAL FILM FUJIFILM CORPORATION (JP) 2009-02-05 US disclosed
US-20090008829-A1 Applicator for cosmetics NISHIKAWA RUBBER CO., LTD. 2009-01-08 US disclosed
EP-2009070-A1 Ink-jet ink and method of producing the same, color filter and method of producing the same, display device, and method of forming functional film FUJIFILM Corporation (JP) 2008-12-31 EP disclosed
EP-2003701-A1 SEALING FILM FOR SOLAR CELL AND SOLAR CELL USING SUCH SEALING FILM BRIDGESTONE CORPORATION (JP) 2008-12-17 EP disclosed
EP-1995266-A1 PHENOXY RESIN FOR OPTICAL MATERIAL, RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE USING THOSE Hitachi Chemical Co., Ltd. (JP) 2008-11-26 EP disclosed
US-20080227885-A1 Active Energy Beam-Curable Composition for Optical Material TOAGOSEI CO., LTD. (JP) 2008-09-18 US disclosed
US-20080217746-A1 INSULATING FILM FUJIFILM CORPORATION (JP) 2008-09-11 US disclosed
EP-1967564-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER HITACHI CHEMICAL COMPANY, LTD. (JP) 2008-09-10 EP disclosed
US-20080213602-A1 ANTIREFLECTION FILM FORMING COMPOSITION, ANITREFLECTION FILM AND OPTICAL DEVICE FUJIFILM CORPORATION (JP) 2008-09-04 US disclosed
US-20080194727-A1 Active Energy Beam-Curable Composition TOAGOSEI CO., LTD. (JP) 2008-08-14 US disclosed
EP-1548039-B1 PHOTOPOLYMERIZABLE COMPOSITION AND USE THEREOF MITSUI CHEMICALS INC (JP) 2008-08-13 EP disclosed
US-20080185559-A1 Anisotropic conductive film composition and film including the same CHEIL INDUSTRIES, INC. 2008-08-07 US disclosed
US-7399498-B2 Material composition for producing optical waveguide and method for producing optical waveguide TOYODA GOSEI CO., LTD. (JP) 2008-07-15 US disclosed
US-20080161521-A1 PRODUCTION METHOD OF INSULATING FILM FORMING COMPOSITION, INSULATING FILM FORMING COMPOSITION PRODUCED BY THE PRODUCTION METHOD, INSULATING FILM AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2008-07-03 US disclosed
WO-2008062903-A1 RADICALLY POLYMERIZABLE COMPOUND HAVING A DITHIOCARBONATE STRUCTURE AND A SULFUR-CONTAINING ALLYLCARBONATE SHOWA DENKO K.K. (JP) 2008-05-29 WO disclosed
US-20080099733-A1 Anisotropic conductive film composition CHEIL INDUSTRIES, INC. 2008-05-01 US disclosed
US-20080076888-A1 FILM FORMING COMPOSITION, INSULATING FILM, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20080076850-A1 PRODUCTION METHOD OF INSULATING FILM, INSULATING FILM, STACKED PRODUCT AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20080051498-A1 Dip-Forming Composition and Dip-Formed Article ZEON CORPORATION (JP) 2008-02-28 US disclosed
US-20080033076-A1 Olefin Polymer Composition Powder and Modified Olefin Polymer SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2008-02-07 US disclosed
WO-2008010610-A1 TRANSPARENT COMPOSITE MATERIAL SHOWA DENKO K.K. (JP) 2008-01-24 WO disclosed
US-7312280-B2 Process for producing modified ethylene-vinylcyclohexane copolymer resin SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-12-25 US disclosed
US-7307107-B2 Photopolymerizable composition and use thereof MITSUI CHEMICALS, INC. (JP) 2007-12-11 US disclosed
EP-1860170-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL COMPANY, LTD. (JP) 2007-11-28 EP disclosed
EP-1857469-A1 ACTIVE ENERGY RAY-CURABLE COMPOSITION TOAGOSEI CO., LTD. (JP) 2007-11-21 EP disclosed
US-20070255003-A1 Film forming composition, insulating film formed by use of the composition, and electronic device FUJIFILM CORPORATION (JP) 2007-11-01 US disclosed
US-20070246684-A1 Film forming composition FUJIFILM CORPORATION (JP) 2007-10-25 US disclosed
US-20070231462-A1 Method of forming ferroelectric thin film DAIKIN INDUSTRIES, LTD. 2007-10-04 US disclosed
US-20070224436-A1 Film forming composition FUJIFILM CORPORATION (JP) 2007-09-27 US disclosed
EP-1826236-A1 COMPOSITION FOR DIP FORMING AND DIP-FORMED MOLDING ZEON CORPORATION (JP) 2007-08-29 EP disclosed
US-20070197731-A1 Process for producing thermoplastic resin composition SUMITOMO CHEMICAL COMPANY, LIMITED 2007-08-23 US disclosed
US-20070197718-A1 Photofunctional optical material comprising fluorine-containing acrylate polymer DAIKIN INDUSTRIES LTD. 2007-08-23 US disclosed
US-20070190334-A1 Method of forming thin film of vinylidene fluoride homopolymer DAIKIN INDUSTRIES, LTD. (JP) 2007-08-16 US disclosed
US-20070166549-A1 Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure NOMURA SATOYUKI 2007-07-19 US disclosed
US-20070135585-A1 Film forming composition, insulating film using the composition, and electronic device having the insulating film FUJIFILM CORPORATION (JP) 2007-06-14 US disclosed
US-20070135603-A1 Film, film forming composition and electronic device having the film FUJIFILM CORPORATION (JP) 2007-06-14 US disclosed
US-20070112157-A1 Polyorganiosiloxane-containing graft copolymer, resin compositions containing the same and process for produciton of polyorganosiloxane emulsions KANEKA CORPORATION (JP) 2007-05-17 US disclosed
US-20070093606-A1 Method for producing modified polyolefin resin SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-04-26 US disclosed
US-7208105-B2 Mixture of electroconductive particles and polymer HITACHI CHEMICAL CO., LTD. (JP) 2007-04-24 US disclosed
EP-1772471-A1 Radiation-curable composition and cured product thereof Nippon Shokubai Co.,Ltd. (JP) 2007-04-11 EP disclosed
EP-1772469-A2 Polymer and film forming composition FUJIFILM Corporation (JP) 2007-04-11 EP disclosed
US-20070073020-A1 Polymer and film forming composition FUJI PHOTO FILM CO., LTD. 2007-03-29 US disclosed
US-20070049655-A1 Radiation-curable composition and cured product thereof NIPPON SHOKUBAI CO., LTD. (JP) 2007-03-01 US disclosed
US-20070043143-A1 Active energy beam-curable composition for optical material THOMSON LICENSING (FR) 2007-02-22 US disclosed
EP-1754762-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE Hitachi Chemical Co., Ltd. (JP) 2007-02-21 EP disclosed
EP-1239332-B1 PHOTOSENSITIVE POLYSILAZANE COMPOSITION, METHOD OF FORMING PATTERN THEREFROM, AND METHOD OF BURNING COATING FILM THEREOF AZ ELECTRONIC MATERIALS USA (US) 2007-02-21 EP disclosed
EP-1743710-A1 PROCESS FOR FORMING VINYLIDENE FLUORIDE HOMOPOLYMER THIN FILMS DAIKIN INDUSTRIES, LTD. (JP) 2007-01-17 EP disclosed
EP-1302507-B1 Thermoplastic elastomer composition, moldings using the same JSR CORP (JP) 2006-12-27 EP disclosed
EP-1734074-A1 PHOTOFUNCTIONAL OPTICAL MATERIAL COMPRISING FLUORINATED ACRYLATE POLYMER Daikin Industries, Ltd. (JP) 2006-12-20 EP disclosed
US-20060263603-A1 Multilayer pellet and method for producing the same SUMITOMO CHEMICAL COMPANY, LIMITED 2006-11-23 US disclosed
US-20060199900-A1 Resin composition containing ultrafine particles KANEKA CORPORATION (JP) 2006-09-07 US disclosed
US-20060189788-A1 Cyclic ether copolymer, coating resin composition, optical devices, and process for production of the devices DAIKIN INDUSTRIES, LTD. (JP) 2006-08-24 US disclosed
US-20060148995-A1 Method for producing a modified propylene polymer SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2006-07-06 US disclosed
US-20060091576-A1 Polylactic acid resin foamed molding and process for manufacturing the same JSP CORPORATION (JP) 2006-05-04 US disclosed
EP-1652876-A2 Polylactic acid resin foamed molding and process for manufacturing the same JSP CORPORATION (JP) 2006-05-03 EP disclosed
EP-1650264-A1 RESIN COMPOSITION CONTAINING ULTRAFINE PARTICLES KANEKA CORPORATION (JP) 2006-04-26 EP disclosed
US-7026407-B2 Process for producing modified polyolefin resin SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2006-04-11 US disclosed
US-20060014912-A1 preparing a green powder product of polyvinylidene fluoride comprising crystal form by subjecting vinylidene fluoride to radical polymerization in the presence of a bromine or iodine compound having 1 to 20 carbon atoms which contains perfluoroalyl groups as chain transferring agent; ferroelectricity DAIKIN INDUSTRIES, LTD. 2006-01-19 US disclosed
US-20060003261-A1 Photopolymerizable composition and use thereof MITSUI CHEMICALS, INC. (JP) 2006-01-05 US disclosed
EP-1607986-A1 METHOD FOR FORMING FERROELECTRIC THIN FILM Daikin Industries, Limited (JP) 2005-12-21 EP disclosed
EP-1607417-A1 METHOD OF FORMING THIN FILM Daikin Industries, Ltd. (JP) 2005-12-21 EP disclosed
US-20050214488-A1 Faintly aromatic cushioning body EBISUKASEI CO., LTD. (JP) 2005-09-29 US disclosed
US-20050192373-A1 Curable composition for optical parts NIPPON SHOKUBAI CO., LTD. 2005-09-01 US disclosed
EP-1569013-A2 Curable composition for optical parts NIPPON SHOKUBAI CO., LTD. (JP) 2005-08-31 EP disclosed
US-20050171284-A1 Process for producing modified polyolefin resin SUMITOMO CHEMICAL COMPANY, LIMITED 2005-08-04 US disclosed
EP-1548039-A1 PHOTOPOLYMERIZABLE COMPOSITION AND USE THEREOF Mitsui Chemicals, Inc. (JP) 2005-06-29 EP disclosed
US-6902875-B2 Photosensitive polysilazane composition, method of forming pattern therefrom, and method of burning coating film thereof CLARIANT FINANCE (BVI) LIMITED (VG) 2005-06-07 US disclosed
US-20050080198-A1 Process for producing modified polyolefin resin SUMITOMO CHEMICAL COMPANY, LIMITED 2005-04-14 US disclosed
US-6875823-B2 Process for producing modified polyolefin resin SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2005-04-05 US disclosed
US-20050065289-A1 Production and bonding method of elastomer composition YOKOHAMA RUBBER CO., LTD., THE (JP) 2005-03-24 US disclosed
US-20040265588-A1 Cushion body and foam resin particles for filling cushion body SEKISUI PLASTICS CO., LTD. (JP) 2004-12-30 US disclosed
US-6835889-B2 Passive element component and substrate with built-in passive element KABUSHIKI KAISHA TOSHIBA (JP) 2004-12-28 US disclosed
US-6825267-B2 HAVING SOLVENT RESISTANCE, CHEMICAL RESISTANCE, HEAT RESISTANCE AND LOW-TEMPERATURE PROPERTIES, STRENGTH SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-11-30 US disclosed
US-6815506-B2 DYNAMICALLY CROSSLINKED MIXTURE OF OLEFIN RESIN; UNSATURATED ACRYLIC RUBBER FROM DIUNSATURATED MONOMER, ALKYL OR ALKOXYALKYL ACRYLATE, AND ACRYLONITRILE; AND INORGANIC FILLER JSR CORPORATION (JP) 2004-11-09 US disclosed
US-20040198921-A1 Process for producing modified polyolefin resin SUMITOMO CHEMICAL COMPANY, LIMITED 2004-10-07 US disclosed
US-20040166303-A1 Applicator for cosmetics NISHIKAWA RUBBER CO., LTD. (JP) 2004-08-26 US disclosed
EP-1416301-A9 Material composition for producing optical waveguide and method for producing optical waveguide Toyoda Gosei Co., Ltd. (JP) 2004-07-14 EP disclosed
US-20040132620-A1 Melt knead graft polymerization with polar functionalized monomer; high level of incorporation SUMITOMO CHEMICAL COMPANY, LIMITED 2004-07-08 US disclosed
US-20040131320-A1 Material composition for producing optical waveguide and method for producing optical waveguide TOYODA GOSEI CO., LTD. (JP) 2004-07-08 US disclosed
EP-1435212-A1 CUSHION BODY AND FOAM RESIN PARTICLES FOR FILLING CUSHION BODY Sekisui Plastics Co., Ltd. (JP) 2004-07-07 EP disclosed
US-20040097605-A1 Cellular rubber material and producion process therefor SHOWA DENKO K.K. (JP) 2004-05-20 US disclosed
EP-1416301-A1 Material composition for producing optical-waveguide and method for producing optical waveguide Toyoda Gosei Co., Ltd. (JP) 2004-05-06 EP disclosed
US-6716942-B1 IN A SUPERCRITICAL STATE; FREE RADICAL CATALYST, VINYLIDENE FLUORIDE, ABSENCE OF WATER, CHAIN TRANSFER AGENT; ELIMINATION OF UNSTABLE END GROUPS AND COMPLICATED POST-TREATMENT; INCREASE IN PURITY DAIKIN INDUSTRIES, LTD. (JP) 2004-04-06 US disclosed
US-20030232919-A1 Fluororubber compositions and making method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-12-18 US disclosed
EP-1371678-A1 Fluororubber compositions and method for making them Shin-Etsu Chemical Co., Ltd. (JP) 2003-12-17 EP disclosed
US-20030141014-A1 Mixture of electroconductive particles and polymer HITACHI CHEMICAL CO., LTD. (JP) 2003-07-31 US disclosed
US-20030113657-A1 Photosensitive ploysilazane composition, method of forming pattern therefrom, and method of burning coating film thereof MERCK PATENT GMBH (DE) 2003-06-19 US disclosed
US-20030107465-A1 Passive element component and substrate with built-in passive element KABUSHIKI KAISHA TOSHIBA (JP) 2003-06-12 US disclosed
US-6569950-B2 Peroxy curing agent SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2003-05-27 US disclosed
US-20030096071-A1 Oil-resistant thermoplastic elastomer composition and moldings using the same JSR CORPORATION (JP) 2003-05-22 US disclosed
EP-0908450-B1 Novel polyfunctional peroxides, vinyl monomer polymerization initiators comprising the same and process for polymerizing vinyl monomers employing the same NOF CORP (JP) 2003-05-07 EP disclosed
EP-1302507-A2 Thermoplastic elastomer composition, moldings using the same JSR Corporation (JP) 2003-04-16 EP disclosed
US-20020161131-A1 Process for producing acid modified polypropylene resin SUMITOMO CHEMICAL COMPANY, LIMITED 2002-10-31 US disclosed
US-6465368-B2 DISSOLVING POLYMER IN SOLVENT; FORMING DIELECTRIC FILMS JSR CORPORATION (JP) 2002-10-15 US disclosed
EP-1239332-A1 PHOTOSENSITIVE POLYSILAZANE COMPOSITION, METHOD OF FORMING PATTERN THEREFROM, AND METHOD OF BURNING COATING FILM THEREOF CLARIANT INTERNATIONAL LTD. (CH) 2002-09-11 EP disclosed
EP-1233014-A1 ASYMMETRIC ORGANIC PEROXIDE, CROSSLINKING AGENT COMPRISING THE SAME, AND METHOD OF CROSSLINKING WITH THE SAME NOF CORPORATION (JP) 2002-08-21 EP disclosed
EP-1209175-A1 FLUOROELASTOMER AND VULCANIZED MOLDING Daikin Industries, Ltd. (JP) 2002-05-29 EP disclosed
EP-1193275-A1 PROCESS FOR PRODUCING FLUOROPOLYMER Daikin Industries, Ltd. (JP) 2002-04-03 EP disclosed
US-20010051446-A1 Method of manufacturing insulating film-forming material, the insulating film-forming material, and insulating film JSR CORPORATION (JP) 2001-12-13 US disclosed
US-20010021750-A1 Polymer compound, method of producing the same, photosensitive composition, and pattern formation method TOYO GOSEI KOGYO CO., LTD. (JP) 2001-09-13 US disclosed
EP-1117005-A1 Polymer compound, method of producing the same, photosensitive composition, and pattern formation method Toyo Gosei Kogyo Co., Ltd. (JP) 2001-07-18 EP disclosed
US-6136751-A LOW MOLECULAR WEIGHT ORGANIC MATERIAL DISPERSED IN CARBAMATE-CONTAINING ACRYLIC GRAFT POLYMER MATRIX RESIN RICOH COMPANY, LTD. (JP) 2000-10-24 US disclosed
US-6111042-A HIGH POLYMERIZATION INITIATION EFFICIENCY NOF CORPORATION (JP) 2000-08-29 US disclosed
US-5973181-A BIS(2,2-BIS(TERT-ALKYLPEROXYCARBONYLOXYMETHYL)ALKYL CARBONATE NOF CORPORATION (JP) 1999-10-26 US disclosed
EP-0908450-A2 Novel polyfunctional peroxides, vinyl monomer polymerization initiators comprising the same and process for polymerizing vinyl monomers employing the same NOF CORPORATION (JP) 1999-04-14 EP disclosed
EP-0785964-A1 NON-LINEAR STYRENIC POLYMER-BASED FOAMS THE DOW CHEMICAL COMPANY (US) 1997-07-30 EP disclosed
EP-0785957-A1 NON-LINEAR STYRENIC POLYMER COMPOSITIONS AND ARTICLES PREPARED THEREFROM THE DOW CHEMICAL COMPANY (US) 1997-07-30 EP disclosed
WO-1996011970-A1 NON-LINEAR STYRENIC POLYMER-BASED FOAMS THE DOW CHEMICAL COMPANY (US) 1996-04-25 WO disclosed
WO-1996011970-A1 NON-LINEAR STYRENIC POLYMER-BASED FOAMS THE DOW CHEMICAL COMPANY (US) 1996-04-25 WO disclosed
WO-1996011962-A1 NON-LINEAR STYRENIC POLYMER COMPOSITIONS AND ARTICLES PREPARED THEREFROM THE DOW CHEMICAL COMPANY (US) 1996-04-25 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (43 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
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US-20110245416-A1 COMPOSITION PIEZO1, C5, F10 LMNA 175/4885HSD17B10 3399/4885
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US-10005718-B2 Catalyst, and method for producing oxidation product PPOX, HAO2, SCO2 LMNA 2710/4885HSD17B10 492/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.