Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.44 |
| ▸ | ALPL | P05186 | 1/20 | 0.44 |
| ▸ | TSHR | P16473 | 1/20 | 0.44 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.37 |
| ▸ | CA2 | P00918 | 3/20 | 0.33 |
| ▸ | ELANE | P08246 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | METAP2 | P50579 | 1/20 | 0.33 |
| ▸ | METAP1 | P53582 | 1/20 | 0.33 |
| ▸ | CA1 | P00915 | 2/20 | 0.32 |
| ▸ | CA9 | Q16790 | 2/20 | 0.32 |
| ▸ | PIK3CB | P42338 | 1/20 | 0.32 |
| ▸ | NFE2L2 | Q16236 | 2/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9958029 | 0.92 | SMN1; SMN2 (0.44) | CYP1A2ALPLTSHRHSD17B10KDM4E | |
| SCHEMBL14500654 | 0.87 | TSHR (0.46) | CYP1A2ALPLTSHRHSD17B10KDM4E | |
| SCHEMBL9958678 | 0.86 | CYP1A2 (0.41) | CYP1A2ALPLTSHRHSD17B10CA2 | |
| SCHEMBL2460830 | 0.86 | SMN1; SMN2 (0.47) | HSD17B10KDM4ECA2SMN1; SMN2CA1 | |
| SCHEMBL5702524 | 0.86 | HSD17B10 (0.41) | CYP1A2ALPLTSHRHSD17B10KDM4E | |
| SCHEMBL5541874 | 0.86 | CYP1A2 (0.39) | CYP1A2ALPLTSHRHSD17B10KDM4E | |
| SCHEMBL20943735 | 0.84 | DRD2 (0.38) | CYP1A2ALPLTSHRHSD17B10 | |
| SCHEMBL9958216 | 0.83 | CA12 (0.44) | CYP1A2ALPLTSHRHSD17B10CA2 | |
| SCHEMBL8776805 | 0.82 | FNTA (0.39) | CYP1A2ALPLTSHRHSD17B10KDM4E | |
| SCHEMBL3839152 | 0.82 | NFE2L2 (0.42) | KDM4EKMT2ACA2ELANESMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1934 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118666718-A | 1,2, 3-Trimethylsulfonyloxybenzene, preparation method and application | 先微康新材料科技有限公司 | 2024-09-20 | — | — | CN | claimed |
| US-20240294771-A1 | ANTI-REFLECTIVE COATING COMPOSITION AND CROSSLINKABLE POLYMER | Tan Kah Kee Innovation Laboratory (CN) | 2024-09-05 | — | — | US | claimed |
| CN-118244576-A | Photosensitive resin composition and cured film thereof | 罗门哈斯电子材料韩国有限公司 | 2024-06-25 | — | — | CN | claimed |
| WO-2023070957-A1 | ANTI-REFLECTIVE COATING COMPOSITION AND CROSSLINKABLE POLYMER | 嘉庚创新实验室 | 2023-05-04 | — | — | WO | claimed |
| CN-113913075-B | Anti-reflective coating composition and crosslinkable polymer | 嘉庚创新实验室 | 2022-09-20 | — | — | CN | claimed |
| WO-2012104262-A1 | PHOTORESPONSIVE MICROCAPSULES AND COMPOSITIONS CONTAINING SAME | UNIVERSIDAD DE SEVILLA (ES) | 2012-08-09 | — | — | WO | claimed |
| EP-2467122-A2 | PHOTORESPONSIVE SUNSCREEN COMPOSITION | Blueshift Pharma GmbH (CH) | 2012-06-27 | — | — | EP | claimed |
| US-20120148647-A1 | Photoresponsive Sunscreen Composition | BLUESHIFT PHARMA GMBH (CH) | 2012-06-14 | — | — | US | claimed |
| WO-2011020928-A2 | PHOTORESPONSIVE SUNSCREEN COMPOSITION | BLUESHIFT PHARMA GMBH (CH) | 2011-02-24 | — | — | WO | claimed |
| US-6924079-B2 | Resist resin, chemical amplification type resist, and method of forming of pattern with the same | NEC CORPORATION (JP) | 2005-08-02 | — | — | US | claimed |
| US-6274286-B1 | Resist compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-08-14 | — | — | US | claimed |
| US-5994022-A | BECOMES SOLUBLE IN ALKALI DEVELOPING SOLUTION BY ACTION OF AN ACID | JSR CORPORATION (JP) | 1999-11-30 | — | — | US | claimed |
| US-5916728-A | RESIN WHICH IS CONVERTED TO ALKALI-SOLUBLE FROM ALKALI-INSOLUBLE OR ALKALI-SLIGHTLY SOLUBLE BY THE ACTION OF AN ACID, ACID GENERATOR AND TERTIARY AMINE COMPOUND HAVING AN ALIPHATIC HYDROXYL GROUP. | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-06-29 | — | — | US | claimed |
| US-5738975-A | MIXTURE CONTAINING (METH)ACRYLATE TERPOLYMER HAVING GROUP WHICH REACTS WITH AN ACID TO CONVERT POLARITY OF POLYMER, PHOTO ACID GENERATING COMPOUND, SOLVENT | NEC CORPORATION (JP) | 1998-04-14 | — | — | US | claimed |
| US-5621019-A | PHOTORESIST CONTAINING PHOTO ACID GENERATOR AND ULTRAVIOLET RADIATION TRANSPARENT ACRYLIC POLYMER HAVING BRIDGED CYCLOHYDROCARBON GROUP RESIDUE; RESOLUTION, DRY ETCH RESISTANCE | NEC CORPORATION (JP) | 1997-04-15 | — | — | US | claimed |
| US-5536616-A | Photoresists containing water soluble sugar crosslinking agents | CORNELL RESEARCH FOUNDATION, INC. (US) | 1996-07-16 | — | — | US | claimed |
| US-5532106-A | MICROELECTRONICS WITH POLYMERS, PHOTOACTIVE AGENTS AND DISSOLUTION INHIBITORS | CORNELL RESEARCH FOUNDATION, INC. (US) | 1996-07-02 | — | — | US | claimed |
| US-5470996-A | Pattern forming material and process for forming pattern using the same | HITACHI, LTD. (JP) | 1995-11-28 | — | — | US | claimed |
| US-5118582-A | PATTERN FORMING MATERIAL AND PROCESS FOR FORMING PATTERN USING THE SAME | HITACHI, LTD. (JP) | 1992-06-02 | — | — | US | claimed |
| JP-6348015-A | — | — | None | — | — | JP | disclosed |
| CN-122072438-A | Underlayer composition for manufacturing electronic devices | 杜邦电子材料国际有限责任公司 | 2026-05-22 | — | — | CN | disclosed |
| CN-122072436-A | Negative photosensitive resin composition, cured film, and resist film | DIC株式会社 | 2026-05-22 | — | — | CN | disclosed |
| US-20260140448-A1 | UNDERLAYER COMPOSITION FOR USE IN MANUFACTURING ELECTRONIC DEVICES | DUPONT ELECTRONIC MAT INTERNATIONAL LLC (US) | 2026-05-21 | — | — | US | disclosed |
| CN-122037094-A | Block copolymer having cleavable main chain, photoresist composition comprising the same, and pattern forming method | 杜邦电子材料国际有限责任公司 | 2026-05-15 | — | — | CN | disclosed |
| US-20260132241-A1 | MAIN CHAIN SCISSIONABLE BLOCK COPOLYMERS, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS | DUPONT ELECTRONIC MAT INTERNATIONAL LLC (US) | 2026-05-14 | — | — | US | disclosed |
| US-20260118761-A1 | COMPOUND FOR PHOTOLITHOGRAPHIC MEDIUM COMPOSITION, POLYMER, AND PHOTOLITHOGRAPHIC MEDIUM COMPOSITION | Tan Kah Kee Innovation Laboratory (CN) | 2026-04-30 | — | — | US | disclosed |
| US-20260118762-A1 | POLYMER FOR PHOTOLITHOGRAPHIC MEDIUM COMPOSITION, AND PHOTOLITHOGRAPHIC MEDIUM COMPOSITION | Tan Kah Kee Innovation Laboratory (CN) | 2026-04-30 | — | — | US | disclosed |
| US-20260093178-A1 | POLYMER, METHOD OF PRODUCING THE SAME, RESIST COMPOSITION INCLUDING THE POLYMER, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2026-04-02 | — | — | US | disclosed |
| US-20260093176-A1 | ELECTROACTIVE COMPOUNDS, COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS | DUPONT ELECTRONIC MAT INTERNATIONAL LLC (US) | 2026-04-02 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| US-20260079399-A1 | POLYMERS, PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PATTERNS | DUPONT ELECTRONIC MAT INTERNATIONAL LLC (US) | 2026-03-19 | — | — | US | disclosed |
| US-20260079398-A1 | PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | DUPONT ELECTRONIC MAT INTERNATIONAL LLC (US) | 2026-03-19 | — | — | US | disclosed |
| US-20260008932-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-08 | — | — | US | disclosed |
| EP-4675357-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2026-01-07 | — | — | EP | disclosed |
| EP-4667537-A1 | PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-12-24 | — | — | EP | disclosed |
| US-20250382500-A1 | PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE | TOKYO OHKA KOGYO CO LTD (JP) | 2025-12-18 | — | — | US | disclosed |
| EP-4664197-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-12-17 | — | — | EP | disclosed |
| US-12493241-B2 | Photoacid generators, photoresist compositions, and pattern formation methods | DUPONT ELECTRONIC MAT INTERNATIONAL LLC (US) | 2025-12-09 | — | — | US | disclosed |
| US-20250336673-A1 | METHODS FOR SUBSTRATE PATTERNING PROCESS | TOKYO ELECTRON LTD (JP) | 2025-10-30 | — | — | US | disclosed |
| US-12448485-B2 | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, pattern formation method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-10-21 | — | — | US | disclosed |
| US-20250298315-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-09-25 | — | — | US | disclosed |
| EP-4617775-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT-EMITTING ELEMENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-09-17 | — | — | EP | disclosed |
| EP-3593390-B1 | FILM ELECTRODE, RESIN LAYER FORMING INK AND ELECTRODE PRINTING METHOD | RICOH CO LTD (JP) | 2025-09-17 | — | — | EP | disclosed |
| US-20250271751-A1 | PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE FILM, LOWER LAYER FILM, METHOD FOR PRODUCING STRUCTURE HAVING PHASE-SEPARATED STRUCTURE, AND COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-08-28 | — | — | US | disclosed |
| EP-4600743-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN MEMBRANE, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD, AND LIGHT-EMITTING ELEMENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-08-13 | — | — | EP | disclosed |
| EP-4600741-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT-EMITTING ELEMENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-08-13 | — | — | EP | disclosed |
| US-12386261-B2 | In-resist process for high density contact formation | GEMINATIO, INC. (US) | 2025-08-12 | — | — | US | disclosed |
| US-20250251665-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-08-07 | — | — | US | disclosed |
| US-20250237952-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-07-24 | — | — | US | disclosed |
| US-20250231488-A1 | ANTI-REFLECTIVE COATING COMPOSITION | Tan Kah Kee Innovation Laboratory (CN) | 2025-07-17 | — | — | US | disclosed |
| US-20250216783-A1 | ANTI-SPACER MASKING PROCESS USING SECOND SWITCHABLE POLYMER | TOKYO ELECTRON LTD (JP) | 2025-07-03 | — | — | US | disclosed |
| US-20250216790-A1 | MATERIALS AND METHODS FOR FORMING PATTERNED MASK ON SUBSTRATE | GEMINATIO, INC., | 2025-07-03 | — | — | US | disclosed |
| US-20250216782-A1 | MASKING PROCESS USING SWITCHABLE POLYMER | TOKYO ELECTRON LTD (JP) | 2025-07-03 | — | — | US | disclosed |
| US-20250216763-A1 | ANTI-SPACER MASKING PROCESS USING RESIST LAYER WITH SOLUBILITY SHIFTING AGENT | TOKYO ELECTRON LTD (JP) | 2025-07-03 | — | — | US | disclosed |
| US-20250216784-A1 | IN-RESIST PROCESS FOR HIGH DENSITY CONTACT FORMATION | GEMINATIO, INC. (US) | 2025-07-03 | — | — | US | disclosed |
| US-20250218775-A1 | MATERIALS AND METHODS FOR FORMING PATTERNED MASK ON SUBSTRATE | GEMINATIO, INC. | 2025-07-03 | — | — | US | disclosed |
| CN-120202438-A | Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, pattern forming method and light emitting element | 信越化学工业株式会社 | 2025-06-24 | — | — | CN | disclosed |
| EP-4567936-A2 | FILM ELECTRODE, RESIN LAYER FORMING INK AND ELECTRODE PRINTING METHOD | Ricoh Company, Ltd. (JP) | 2025-06-11 | — | — | EP | disclosed |
| CN-120092212-A | Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, pattern forming method and light emitting element | 信越化学工业株式会社 | 2025-06-03 | — | — | CN | disclosed |
| US-12313971-B2 | Coated underlayer for overcoated photoresist | DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC (US) | 2025-05-27 | — | — | US | disclosed |
| WO-2025106697-A1 | BIO-BASED COMPOSITIONS FOR PHOTORESISTS AND PATTERNING | HUSTAD PHILLIP DENE (US) | 2025-05-22 | — | — | WO | disclosed |
| CN-120019329-A | Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, pattern forming method and light emitting element | 信越化学工业株式会社 | 2025-05-16 | — | — | CN | disclosed |
| US-20250155812-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN-FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-15 | — | — | US | disclosed |
| EP-4553100-A1 | POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-14 | — | — | EP | disclosed |
| CN-119987132-A | Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film and pattern forming method | 信越化学工业株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-119955091-A | Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component | 信越化学工业株式会社 | 2025-05-09 | — | — | CN | disclosed |
| US-20250147420-A1 | Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-08 | — | — | US | disclosed |
| US-20250130501-A1 | ENHANCED FIELD STITCHING WITH CORRECTIVE CHEMISTRY | GEMINATIO, INC. (US) | 2025-04-24 | — | — | US | disclosed |
| US-20250132166-A1 | GENERATION OF MULTILINE ETCH SUBSTRATES | GEMINATIO, INC. (US) | 2025-04-24 | — | — | US | disclosed |
| US-20250132207-A1 | OPTIMIZATION FOR LOCAL CHEMICAL EXPOSURE | GEMINATIO, INC. (US) | 2025-04-24 | — | — | US | disclosed |
| US-20250132156-A1 | NARROW LINE CUT MASKING PROCESS | GEMINATIO, INC. (US) | 2025-04-24 | — | — | US | disclosed |
| US-12282254-B2 | Photoresist compositions and pattern formation methods | DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC (US) | 2025-04-22 | — | — | US | disclosed |
| US-12276910-B2 | Photoresist compositions and pattern formation methods | DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC (US) | 2025-04-15 | — | — | US | disclosed |
| US-20250116927-A1 | PHOTOACID GENERATORS, PHOTORESIST COMPOSITIONS, AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2025-04-10 | — | — | US | disclosed |
| US-20250116933-A1 | MULTIBLOCK COPOLYMERS, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2025-04-10 | — | — | US | disclosed |
| CN-119775514-A | Multiblock copolymer, photoresist composition comprising the same, and pattern forming method | 杜邦电子材料国际有限责任公司 | 2025-04-08 | — | — | CN | disclosed |
| CN-119775113-A | UV absorbing compounds and photoresist compositions containing the same | 湖北鼎龙芯盛科技有限公司 | 2025-04-08 | — | — | CN | disclosed |
| CN-119575759-A | Positive photosensitive resin composition, photosensitive film, resist underlayer film, resist permanent film, and method for producing film | DIC株式会社 | 2025-03-07 | — | — | CN | disclosed |
| US-12242193-B2 | Coating compositions for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2025-03-04 | — | — | US | disclosed |
| US-20250068070-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATIVE FILM, SURFACE-PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-02-27 | — | — | US | disclosed |
| US-20250068064-A1 | ANTI-SPACER BASED SELF-ALIGNED HIGH ORDER PATTERNING | GEMINATIO, INC. (US) | 2025-02-27 | — | — | US | disclosed |
| US-12234369-B2 | Photoresist topcoat compositions and methods of processing photoresist compositions | DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC (US) | 2025-02-25 | — | — | US | disclosed |
| WO-2025038912-A1 | PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC (US) | 2025-02-20 | — | — | WO | disclosed |
| WO-2025038907-A1 | PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC (US) | 2025-02-20 | — | — | WO | disclosed |
| US-12228859-B2 | Pattern formation methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2025-02-18 | — | — | US | disclosed |
| CN-119439625-A | Negative photosensitive resin composition, pattern forming method, cured coating film forming method, interlayer insulating film, surface protective film, and electronic component | 信越化学工业株式会社 | 2025-02-14 | — | — | CN | disclosed |
| CN-111198480-B | Photosensitive resin composition, pattern forming method and antireflection film | 信越化学工业株式会社 | 2025-02-11 | — | — | CN | disclosed |
| EP-4502729-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATIVE FILM, SURFACE-PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-02-05 | — | — | EP | disclosed |
| US-12216405-B2 | Photosensitive resin composition, photosensitive resin film, photosensitive dry film, patterning process, and light emitting device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-02-04 | — | — | US | disclosed |
| CN-119225117-A | Photoresist composition and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2024-12-31 | — | — | CN | disclosed |
| CN-110727175-B | Photosensitive resin composition and pattern forming method | 信越化学工业株式会社 | 2024-12-24 | — | — | CN | disclosed |
| WO-2024254923-A1 | POLYMER FOR PHOTOETCHING MEDIUM COMPOSITION, AND PHOTOETCHING MEDIUM COMPOSITION | 嘉庚创新实验室 | 2024-12-19 | — | — | WO | disclosed |
| US-20240419079-A1 | CHEMICALLY SELECTIVE ADHESION AND STRENGTH PROMOTERS IN SEMICONDUCTOR PATTERNING | GEMINATIO, INC. (US) | 2024-12-19 | — | — | US | disclosed |
| US-20240393689-A1 | COMPOUNDS, MONOMERS, POLYMERS, PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2024-11-28 | — | — | US | disclosed |
| CN-119019256-A | Compound, monomer, polymer, photoresist composition and pattern forming method | 杜邦电子材料国际有限责任公司 | 2024-11-26 | — | — | CN | disclosed |
| US-20240377744-A1 | LOCAL SHADOW MASKING FOR MULTI-COLOR EXPOSURES | GEMINATIO, INC. (US) | 2024-11-14 | — | — | US | disclosed |
| US-20240377749-A1 | ASSISTED FEATURE PLACEMENT IN SEMICONDUCTOR PATTERNING | GEMINATIO, INC. (US) | 2024-11-14 | — | — | US | disclosed |
| US-12140866-B2 | Photoacid generators, photoresist compositions, and pattern formation methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2024-11-12 | — | — | US | disclosed |
| CN-118900866-A | Curable resin composition | 太阳控股株式会社 | 2024-11-05 | — | — | CN | disclosed |
| CN-111142332-B | Photosensitive resin composition and photosensitive dry film | 信越化学工业株式会社 | 2024-10-29 | — | — | CN | disclosed |
| US-20240345481-A1 | SILPHENYLENE-SKELETON-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-10-17 | — | — | US | disclosed |
| CN-113311661-B | Photoresist underlayer composition and method for manufacturing semiconductor device | 台湾积体电路制造股份有限公司 | 2024-10-15 | — | — | CN | disclosed |
| CN-111033381-B | With overcoated photoresist coating composition for use together | 罗门哈斯电子材料韩国有限公司 | 2024-10-11 | — | — | CN | disclosed |
| CN-110297398-B | Photosensitive resin composition, photosensitive resin laminate, and pattern forming method | 信越化学工业株式会社 | 2024-10-08 | — | — | CN | disclosed |
| CN-109976091-B | Photosensitive resin composition, pattern forming method, and manufacture of optoelectronic semiconductor device | 信越化学工业株式会社 | 2024-09-27 | — | — | CN | disclosed |
| CN-118666718-A | 1,2, 3-Trimethylsulfonyloxybenzene, preparation method and application | 先微康新材料科技有限公司 | 2024-09-20 | — | — | CN | disclosed |
| CN-118666718-A | 1,2, 3-Trimethylsulfonyloxybenzene, preparation method and application | 先微康新材料科技有限公司 | 2024-09-20 | — | — | CN | disclosed |
| CN-118666718-A | 1,2, 3-Trimethylsulfonyloxybenzene, preparation method and application | 先微康新材料科技有限公司 | 2024-09-20 | — | — | CN | disclosed |
| WO-2024187508-A1 | COMPOUND FOR PHOTOLITHOGRAPHIC DIELECTRIC COMPOSITION, POLYMER, AND PHOTOLITHOGRAPHIC DIELECTRIC COMPOSITION | 嘉庚创新实验室 | 2024-09-19 | — | — | WO | disclosed |
| US-12085854-B2 | Photoresist compositions and pattern formation methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2024-09-10 | — | — | US | disclosed |
| US-20240294771-A1 | ANTI-REFLECTIVE COATING COMPOSITION AND CROSSLINKABLE POLYMER | Tan Kah Kee Innovation Laboratory (CN) | 2024-09-05 | — | — | US | disclosed |
| EP-4421563-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | Shin-Etsu Chemical Co., Ltd. (JP) | 2024-08-28 | — | — | EP | disclosed |
| WO-2024166559-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | 信越化学工業株式会社 | 2024-08-15 | — | — | WO | disclosed |
| US-12055853-B2 | Photosensitive resin composition, laminate, and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-08-06 | — | — | US | disclosed |
| CN-113121734-B | Polymer and photoresist composition | 罗门哈斯电子材料有限责任公司 | 2024-07-30 | — | — | CN | disclosed |
| US-20240241440-A1 | POLYMER, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2024-07-18 | — | — | US | disclosed |
| US-20240241441-A1 | POLYMER, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2024-07-18 | — | — | US | disclosed |
| CN-110515270-B | Photosensitive resin composition, pattern forming method, and method for manufacturing optical semiconductor device | 信越化学工业株式会社 | 2024-07-12 | — | — | CN | disclosed |
| US-20240218103-A1 | CURABLE COMPOSITION AND FILM PREPARED THEREFROM | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2024-07-04 | — | — | US | disclosed |
| CN-115044040-B | Polyimide-containing polymer, positive photosensitive resin composition, negative photosensitive resin composition, and pattern forming method | 信越化学工业株式会社 | 2024-07-02 | — | — | CN | disclosed |
| CN-118271508-A | Polymer, photoresist composition comprising the same, and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2024-07-02 | — | — | CN | disclosed |
| CN-118255930-A | Polymer, photoresist composition comprising the same, and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2024-06-28 | — | — | CN | disclosed |
| US-20240210832-A1 | PHOTORESIST TOPCOAT COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2024-06-27 | — | — | US | disclosed |
| US-20240210831-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-06-27 | — | — | US | disclosed |
| CN-118244576-A | Photosensitive resin composition and cured film thereof | 罗门哈斯电子材料韩国有限公司 | 2024-06-25 | — | — | CN | disclosed |
| CN-118240154-A | Curable composition and film made therefrom | 罗门哈斯电子材料韩国有限公司 | 2024-06-25 | — | — | CN | disclosed |
| US-20240199854-A1 | COMPOSITION, CURED FILM, STRUCTURAL BODY, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND MANUFACTURING METHOD OF CURED FILM | FUJIFLIM CORPORATION (JP) | 2024-06-20 | — | — | US | disclosed |
| EP-4386037-A1 | SILPHENYLENE-SKELETON-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-06-19 | — | — | EP | disclosed |
| CN-118215986-A | Chemoselective adhesion and strength promoters in semiconductor patterning | 杰米纳蒂奥公司 | 2024-06-18 | — | — | CN | disclosed |
| US-20240184206-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR PATTERNING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-06-06 | — | — | US | disclosed |
| US-20240184201-A1 | POLYMER, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2024-06-06 | — | — | US | disclosed |
| CN-118140295-A | Partial shadow mask for multicolor exposure | 杰米纳蒂奥公司 | 2024-06-04 | — | — | CN | disclosed |
| CN-118103774-A | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, and pattern forming method | 信越化学工业株式会社 | 2024-05-28 | — | — | CN | disclosed |
| CN-110658678-B | Photoresist top coat composition and method for processing photoresist composition | 罗门哈斯电子材料有限责任公司 | 2024-05-17 | — | — | CN | disclosed |
| WO-2024101182-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT-EMITTING ELEMENT | 信越化学工業株式会社 | 2024-05-16 | — | — | WO | disclosed |
| CN-118027269-A | Polymer, photoresist composition comprising the same, and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2024-05-14 | — | — | CN | disclosed |
| CN-113348188-B | Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product | DIC株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-118011733-A | Positive photosensitive resin composition, resist film, resist underlayer film, and resist permanent film | DIC株式会社 | 2024-05-10 | — | — | CN | disclosed |
| US-20240152047-A1 | HIGH REFRACTIVE INDEX MATERIALS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2024-05-09 | — | — | US | disclosed |
| EP-4365679-A1 | LAYERED BODY, METHOD FOR MANUFACTURING LAYERED BODY, AND METHOD FOR FORMING PATTERN | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-05-08 | — | — | EP | disclosed |
| CN-117941029-A | Self-aligned high-order patterning based on anti-spacer | 杰米纳蒂奥公司 | 2024-04-26 | — | — | CN | disclosed |
| CN-113527101-B | Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component | 信越化学工业株式会社 | 2024-04-23 | — | — | CN | disclosed |
| CN-117916851-A | Enhanced field stitching with corrective chemistry | 杰米纳蒂奥公司 | 2024-04-19 | — | — | CN | disclosed |
| CN-117916854-A | Narrow line cutting mask method | 杰米纳蒂奥公司 | 2024-04-19 | — | — | CN | disclosed |
| CN-117916852-A | Assist feature placement in semiconductor patterning | 杰米纳蒂奥公司 | 2024-04-19 | — | — | CN | disclosed |
| CN-117916853-A | Formation of a multi-line etched substrate | 杰米纳蒂奥公司 | 2024-04-19 | — | — | CN | disclosed |
| CN-117916855-A | In-resist process for forming high density contacts | 杰米纳蒂奥公司 | 2024-04-19 | — | — | CN | disclosed |
| CN-117916668-A | Optimization for localized chemical exposure | 杰米纳蒂奥公司 | 2024-04-19 | — | — | CN | disclosed |
| CN-116813852-B | Compounds, polymers and lithographic medium compositions for use in lithographic medium compositions | 嘉庚创新实验室 | 2024-04-19 | — | — | CN | disclosed |
| CN-117866195-A | High refractive index material | 罗门哈斯电子材料有限责任公司 | 2024-04-12 | — | — | CN | disclosed |
| WO-2024075581-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT-EMITTING ELEMENT | 信越化学工業株式会社 | 2024-04-11 | — | — | WO | disclosed |
| WO-2024075585-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN MEMBRANE, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD, AND LIGHT-EMITTING ELEMENT | 信越化学工業株式会社 | 2024-04-11 | — | — | WO | disclosed |
| EP-3656803-B1 | POLYSILOXANE SKELETON POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHINETSU CHEMICAL CO (JP) | 2024-04-10 | — | — | EP | disclosed |
| WO-2024070845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, CURED PRODUCT, CURED PRODUCT PRODUCTION METHOD, SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND RESIN PRODUCTION METHOD | 東レ株式会社 | 2024-04-04 | — | — | WO | disclosed |
| US-11947258-B2 | Photoacid-generating monomer, polymer derived therefrom, photoresist composition including the polymer, and method of forming a photoresist relief image using the photoresist composition | Rohm and Hass Electronic Materials LLC (US) | 2024-04-02 | — | — | US | disclosed |
| CN-116554444-B | Polymer for lithographic medium composition and lithographic medium composition | 嘉庚创新实验室 | 2024-03-29 | — | — | CN | disclosed |
| CN-117794985-A | Polymer containing silicon phenylene skeleton, photosensitive resin composition, pattern forming method, and method for producing optical semiconductor element | 信越化学工业株式会社 | 2024-03-29 | — | — | CN | disclosed |
| US-11940731-B2 | Photoresist topcoat compositions and methods of processing photoresist compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2024-03-26 | — | — | US | disclosed |
| EP-3263626-B1 | SILICONE SKELETON-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM, LAMINATE, AND PATTERNING PROCESS | SHINETSU CHEMICAL CO (JP) | 2024-03-13 | — | — | EP | disclosed |
| CN-111381447-B | Photosensitive resin composition, laminate, and pattern forming method | 信越化学工业株式会社 | 2024-03-08 | — | — | CN | disclosed |
| WO-2024036679-A1 | ANTI-REFLECTIVE COATING COMPOSITION | 嘉庚创新实验室 | 2024-02-22 | — | — | WO | disclosed |
| US-11909031-B2 | Film electrode, resin layer forming ink, inorganic layer forming ink, and electrode printing apparatus | RICOH COMPANY, LTD. (JP) | 2024-02-20 | — | — | US | disclosed |
| EP-4321553-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-02-14 | — | — | EP | disclosed |
| US-11892773-B2 | Photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-02-06 | — | — | US | disclosed |
| US-20240027905-A1 | PHOTOACID GENERATORS, PHOTORESIST COMPOSITIONS, AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2024-01-25 | — | — | US | disclosed |
| US-20240027904-A1 | PHOTOACTIVE COMPOUNDS, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2024-01-25 | — | — | US | disclosed |
| CN-117417367-A | Photoacid generator, photoresist composition, and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2024-01-19 | — | — | CN | disclosed |
| US-20240019779-A1 | COMPOUNDS AND PHOTORESIST COMPOSITIONS INCLUDING THE SAME | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2024-01-18 | — | — | US | disclosed |
| CN-117402126-A | Photoactive compound, photoresist composition comprising the same, and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2024-01-16 | — | — | CN | disclosed |
| US-11874603-B2 | Photoresist composition comprising amide compound and pattern formation methods using the same | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2024-01-16 | — | — | US | disclosed |
| US-20230418161-A1 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2023-12-28 | — | — | US | disclosed |
| WO-2023248887-A1 | POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE TYPE PHOTOSENSITIVE RESIN SHEET, CURED PRODUCT, CURED PRODUCT MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE | 東レ株式会社 | 2023-12-28 | — | — | WO | disclosed |
| US-11852972-B2 | Photoresist compositions and pattern formation methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2023-12-26 | — | — | US | disclosed |
| CN-109388023-B | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming method | 信越化学工业株式会社 | 2023-12-22 | — | — | CN | disclosed |
| CN-112661877-B | Polymer and photoresist composition | 罗门哈斯电子材料有限责任公司 | 2023-12-22 | — | — | CN | disclosed |
| US-11846885-B2 | Topcoat compositions and photolithographic methods | ROHM AND HAAS ELECTRONIC MATERIALS, LLC (US) | 2023-12-19 | — | — | US | disclosed |
| EP-3640289-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2023-12-06 | — | — | EP | disclosed |
| EP-3441818-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, LAMINATE, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2023-12-06 | — | — | EP | disclosed |
| US-11829069-B2 | Photoresist compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2023-11-28 | — | — | US | disclosed |
| CN-117120927-A | Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, and pattern forming method | 信越化学工业株式会社 | 2023-11-24 | — | — | CN | disclosed |
| US-11822248-B2 | Coating compositions for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2023-11-21 | — | — | US | disclosed |
| CN-117088795-A | Compound and photoresist composition comprising the same | 罗门哈斯电子材料有限责任公司 | 2023-11-21 | — | — | CN | disclosed |
| CN-117075428-A | Negative photosensitive resin composition | DIC株式会社 | 2023-11-17 | — | — | CN | disclosed |
| EP-4273624-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, INTERLAYER INSULATING FILM, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-08 | — | — | EP | disclosed |
| US-11809077-B2 | Photoresist compositions and pattern formation methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2023-11-07 | — | — | US | disclosed |
| CN-116991034-A | Negative photosensitive resin composition, pattern forming method, interlayer insulating film, surface protective film, and electronic component | 信越化学工业株式会社 | 2023-11-03 | — | — | CN | disclosed |
| US-20230350294-A1 | Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-02 | — | — | US | disclosed |
| EP-3597704-B1 | PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2023-10-25 | — | — | EP | disclosed |
| EP-3896114-B1 | POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-10-18 | — | — | EP | disclosed |
| CN-116891409-A | Photoactive compound, photoresist composition comprising the same, and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2023-10-17 | — | — | CN | disclosed |
| WO-2023028249-A9 | ASSISTED FEATURE PLACEMENT IN SEMICONDUCTOR PATTERNING | GEMINATIO, INC. (US) | 2023-10-12 | — | — | WO | disclosed |
| EP-3597694-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, AND BLACK MATRIX | SHINETSU CHEMICAL CO (JP) | 2023-10-11 | — | — | EP | disclosed |
| CN-116859669-A | Photoresist topcoat composition and method of treating photoresist composition | 罗门哈斯电子材料有限责任公司 | 2023-10-10 | — | — | CN | disclosed |
| US-20230314934-A1 | PHOTOACTIVE COMPOUNDS, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2023-10-05 | — | — | US | disclosed |
| CN-116813852-A | Compounds, polymers and lithographic medium compositions for use in lithographic medium compositions | 嘉庚创新实验室 | 2023-09-29 | — | — | CN | disclosed |
| WO-2023182495-A1 | CURABLE RESIN COMPOSITION | 太陽ホールディングス株式会社 | 2023-09-28 | — | — | WO | disclosed |
| EP-3398983-B1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHINETSU CHEMICAL CO (JP) | 2023-09-27 | — | — | EP | disclosed |
| EP-3382453-B1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | SHINETSU CHEMICAL CO (JP) | 2023-09-20 | — | — | EP | disclosed |
| US-11762292-B2 | Coating compositions for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2023-09-19 | — | — | US | disclosed |
| US-20230287179-A1 | HIGHLY SOLUBLE TRIS-(2,3-EPOXYPROPYL)-ISOCYANURATE AND METHOD FOR PRODUCING SAME | NISSAN CHEMICAL CORPORATION (JP) | 2023-09-14 | — | — | US | disclosed |
| EP-3266759-B1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING COMPOUND OR RESIN | MITSUBISHI GAS CHEMICAL CO (JP) | 2023-09-13 | — | — | EP | disclosed |
| CN-116723721-A | Light emitting device, method of manufacturing the same, and electronic apparatus | 三星显示有限公司 | 2023-09-08 | — | — | CN | disclosed |
| CN-116723717-A | Light emitting device, method of manufacturing the same, and electronic apparatus | 三星显示有限公司 | 2023-09-08 | — | — | CN | disclosed |
| US-20230284471-A1 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | SAMSUNG DISPLAY CO., LTD. (KR) | 2023-09-07 | — | — | US | disclosed |
| US-20230284522-A1 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING LIGHT-EMITTING DEVICE | SAMSUNG DISPLAY CO., LTD. (KR) | 2023-09-07 | — | — | US | disclosed |
| EP-4056627-B1 | POLYIMIDE-BASED POLYMER, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSTION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-08-23 | — | — | EP | disclosed |
| CN-116554444-A | Polymer for lithographic medium composition and lithographic medium composition | 嘉庚创新实验室 | 2023-08-08 | — | — | CN | disclosed |
| CN-109388022-B | Silicone-structure-containing polymer, photosensitive resin composition, photosensitive resin coating layer, photosensitive dry film, laminate, and pattern forming method | 信越化学工业株式会社 | 2023-07-28 | — | — | CN | disclosed |
| US-20230213862-A1 | PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2023-07-06 | — | — | US | disclosed |
| US-20230212112-A1 | PHOTOACID-GENERATING MONOMER, POLYMER DERIVED THEREFROM, PHOTORESIST COMPOSITION INCLUDING THE POLYMER, AND METHOD OF FORMING A PHOTORESIST RELIEF IMAGE USING THE PHOTORESIST COMPOSITION | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2023-07-06 | — | — | US | disclosed |
| US-11693317-B2 | Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-07-04 | — | — | US | disclosed |
| US-11693318-B2 | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, and black matrix | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-07-04 | — | — | US | disclosed |
| CN-116382031-A | Photoresist composition and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2023-07-04 | — | — | CN | disclosed |
| CN-110959138-B | Resist material | DIC株式会社 | 2023-06-30 | — | — | CN | disclosed |
| CN-116360212-A | Photoresist underlayer composition | 罗门哈斯电子材料韩国有限公司 | 2023-06-30 | — | — | CN | disclosed |
| US-20230202221-A1 | THERMAL TRANSFER SHEET, DISCOLORED OR DECOLORIZED PRINTED MATERIAL, AND METHOD FOR PRODUCING DISCOLORED OR DECOLORIZED PRINTED MATERIAL | DAI NIPPON PRINTING CO., LTD. (JP) | 2023-06-29 | — | — | US | disclosed |
| US-20230205087-A1 | PHOTORESIST UNDERLAYER COMPOSITION | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2023-06-29 | — | — | US | disclosed |
| CN-116300309-A | Photoresist underlayer composition | 罗门哈斯电子材料有限责任公司 | 2023-06-23 | — | — | CN | disclosed |
| US-20230194990-A1 | PHOTORESIST UNDERLAYER COMPOSITION | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2023-06-22 | — | — | US | disclosed |
| WO-2023076224-A9 | CHEMICALLY SELECTIVE ADHESION AND STRENGTH PROMOTORS IN SEMICONDUCTOR PATTERNING | GEMINATIO, INC. (US) | 2023-06-15 | — | — | WO | disclosed |
| US-20230161257-A1 | PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2023-05-25 | — | — | US | disclosed |
| US-11644745-B2 | Photolithography method | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2023-05-09 | — | — | US | disclosed |
| WO-2023076224-A1 | CHEMICALLY SELECTIVE ADHESION AND STRENGTH PROMOTORS IN SEMICONDUCTOR PATTERNING | GEMINATIO, INC. (US) | 2023-05-04 | — | — | WO | disclosed |
| WO-2023070957-A1 | ANTI-REFLECTIVE COATING COMPOSITION AND CROSSLINKABLE POLYMER | 嘉庚创新实验室 | 2023-05-04 | — | — | WO | disclosed |
| WO-2023076222-A1 | LOCAL SHADOW MASKING FOR MULTI-COLOR EXPOSURES | GEMINATIO INC. (US) | 2023-05-04 | — | — | WO | disclosed |
| CN-113527680-B | Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component | 信越化学工业株式会社 | 2023-04-28 | — | — | CN | disclosed |
| US-20230127914-A1 | RESIST PATTERN FORMATION METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-04-27 | — | — | US | disclosed |
| WO-2023068177-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | 信越化学工業株式会社 | 2023-04-27 | — | — | WO | disclosed |
| EP-3572879-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHINETSU CHEMICAL CO (JP) | 2023-04-19 | — | — | EP | disclosed |
| CN-115403976-B | Anti-reflection coating composition | 嘉庚创新实验室 | 2023-04-18 | — | — | CN | disclosed |
| US-20230103685-A1 | IODINE-CONTAINING ACID CLEAVABLE COMPOUNDS, POLYMERS DERIVED THEREFROM, AND PHOTORESIST COMPOSITIONS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2023-04-06 | — | — | US | disclosed |
| US-20230104130-A1 | PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2023-04-06 | — | — | US | disclosed |
| US-20230103371-A1 | PHOTORESIST UNDERLAYER COMPOSITION | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2023-04-06 | — | — | US | disclosed |
| US-20230104679-A1 | PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2023-04-06 | — | — | US | disclosed |
| CN-115903379-A | Photoresist composition and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2023-04-04 | — | — | CN | disclosed |
| CN-115894243-A | Iodine-containing acid-cleavable compounds, polymers derived therefrom and photoresist compositions | 罗门哈斯电子材料有限责任公司 | 2023-04-04 | — | — | CN | disclosed |
| CN-115903382-A | Photoresist composition and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2023-04-04 | — | — | CN | disclosed |
| CN-115894781-A | Photoresist composition and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2023-04-04 | — | — | CN | disclosed |
| CN-115877656-A | Photoresist underlayer composition | 罗门哈斯电子材料有限责任公司 | 2023-03-31 | — | — | CN | disclosed |
| US-20230099348-A1 | PHOTORESIST COMPOSITION COMPRISING AMIDE COMPOUND AND PATTERN FORMATION METHODS USING THE SAME | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2023-03-30 | — | — | US | disclosed |
| US-11613519-B2 | Photoacid-generating monomer, polymer derived therefrom, photoresist composition including the polymer, and method of forming a photoresist relief image using the photoresist composition | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2023-03-28 | — | — | US | disclosed |
| CN-111234236-B | Siloxane polymer containing isocyanuric acid and polyether skeleton, photosensitive resin composition, and pattern formation method | 信越化学工业株式会社 | 2023-03-24 | — | — | CN | disclosed |
| US-20230091130-A1 | FILM ELECTRODE, RESIN LAYER FORMING INK, INORGANIC LAYER FORMING INK, AND ELECTRODE PRINTING APPARATUS | RICOH COMPANY, LTD. (JP) | 2023-03-23 | — | — | US | disclosed |
| CN-115808844-A | Photoresist composition comprising amide compound and pattern forming method using the same | 罗门哈斯电子材料韩国有限公司 | 2023-03-17 | — | — | CN | disclosed |
| US-20230076103-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-03-09 | — | — | US | disclosed |
| WO-2023032746-A1 | COMPOSITION, CURED FILM, STRUCTURE, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND METHOD FOR PRODUCING CURED FILM | 富士フイルム株式会社 | 2023-03-09 | — | — | WO | disclosed |
| WO-2023028244-A1 | GENERATION OF MULTILINE ETCH SUBSTRATES | GEMINATIO, INC. (US) | 2023-03-02 | — | — | WO | disclosed |
| WO-2023028249-A1 | ASSISTED FEATURE PLACEMENT IN SEMICONDUCTOR PATTERNING | GEMINATIO, INC. (US) | 2023-03-02 | — | — | WO | disclosed |
| WO-2023028259-A1 | ENHANCED FIELD STITCHING WITH CORRECTIVE CHEMISTRY | GEMINATIO, INC. (US) | 2023-03-02 | — | — | WO | disclosed |
| WO-2023028236-A1 | IN-RESIST PROCESS FOR HIGH DENSITY CONTACT FORMATION | GEMINATIO, INC. (US) | 2023-03-02 | — | — | WO | disclosed |
| WO-2023028246-A1 | ANTI-SPACER BASED SELF-ALIGNED HIGH ORDER PATTERNING | GEMINATIO, INC. (US) | 2023-03-02 | — | — | WO | disclosed |
| WO-2023028243-A1 | NARROW LINE CUT MASKING PROCESS | GEMINATIO, INC. (US) | 2023-03-02 | — | — | WO | disclosed |
| WO-2023028223-A1 | OPTIMIZATION FOR LOCAL CHEMICAL EXPOSURE | GEMINATIO, INC. (US) | 2023-03-02 | — | — | WO | disclosed |
| CN-110520475-B | Curable resin composition, dry film, cured product, electronic component, and printed wiring board | 太阳控股株式会社 | 2023-02-28 | — | — | CN | disclosed |
| US-20230057401-A1 | COATED UNDERLAYER FOR OVERCOATED PHOTORESIST | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2023-02-23 | — | — | US | disclosed |
| US-11588147-B2 | Film electrode, resin layer forming ink, inorganic layer forming ink, and electrode printing apparatus | RICOH COMPANY, LTD. (JP) | 2023-02-21 | — | — | US | disclosed |
| WO-2023017666-A1 | SILPHENYLENE-SKELETON-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE | 信越化学工業株式会社 | 2023-02-16 | — | — | WO | disclosed |
| CN-111205463-B | Polysiloxane skeleton polymer, photosensitive resin composition, pattern forming method and manufacturing of optical semiconductor device | 信越化学工业株式会社 | 2023-02-14 | — | — | CN | disclosed |
| EP-3505551-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHINETSU CHEMICAL CO (JP) | 2023-02-08 | — | — | EP | disclosed |
| US-11572430-B2 | Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-02-07 | — | — | US | disclosed |
| US-11572442-B2 | Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2023-02-07 | — | — | US | disclosed |
| US-20230030194-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, AND LIGHT EMITTING DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-02-02 | — | — | US | disclosed |
| CN-108388082-B | Photosensitive resin composition, photosensitive dry film, photosensitive resin coating and pattern forming method | 信越化学工业株式会社（JP） | 2023-01-13 | — | — | CN | disclosed |
| US-11548985-B2 | Siloxane polymer containing isocyanuric acid and polyether skeletons, photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-01-10 | — | — | US | disclosed |
| CN-115584177-A | Coated underlayer of overcoated photoresist | 罗门哈斯电子材料有限责任公司 | 2023-01-10 | — | — | CN | disclosed |
| WO-2023276578-A1 | LAYERED BODY, METHOD FOR MANUFACTURING LAYERED BODY, AND METHOD FOR FORMING PATTERN | 信越化学工業株式会社 | 2023-01-05 | — | — | WO | disclosed |
| US-20230002313-A1 | LIGHT EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF | SAMSUNG DISPLAY CO., LTD. (KR) | 2023-01-05 | — | — | US | disclosed |
| CN-115480447-A | Negative photosensitive resin composition | DIC株式会社 | 2022-12-16 | — | — | CN | disclosed |
| EP-3896521-B1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2022-12-14 | — | — | EP | disclosed |
| US-11526078-B2 | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-12-13 | — | — | US | disclosed |
| US-11518876-B2 | Photosensitive resin composition and photosensitive dry film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-12-06 | — | — | US | disclosed |
| EP-4095178-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-11-30 | — | — | EP | disclosed |
| CN-115403976-A | Anti-reflection coating composition | 嘉庚创新实验室 | 2022-11-29 | — | — | CN | disclosed |
| US-11500291-B2 | Underlying coating compositions for use with photoresists | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2022-11-15 | — | — | US | disclosed |
| US-11493845-B2 | Organic bottom antireflective coating composition for nanolithography | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2022-11-08 | — | — | US | disclosed |
| CN-109725493-B | Primer composition for use with photoresists | 罗门哈斯电子材料韩国有限公司 | 2022-11-08 | — | — | CN | disclosed |
| US-11487203-B2 | Monomers, polymers and photoresist compositions | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2022-11-01 | — | — | US | disclosed |
| US-11487204-B2 | Resist material | DIC CORPORATION (JP) | 2022-11-01 | — | — | US | disclosed |
| US-11480878-B2 | Monomers, polymers and photoresist compositions | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2022-10-25 | — | — | US | disclosed |
| WO-2022215403-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | 信越化学工業株式会社 | 2022-10-13 | — | — | WO | disclosed |
| EP-4071200-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT EMITTING ELEMENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-10-12 | — | — | EP | disclosed |
| CN-109991809-B | Photoresist composition and method | 罗门哈斯电子材料有限责任公司 | 2022-10-11 | — | — | CN | disclosed |
| US-11448964-B2 | Coating compositions for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2022-09-20 | — | — | US | disclosed |
| CN-113913075-B | Anti-reflective coating composition and crosslinkable polymer | 嘉庚创新实验室 | 2022-09-20 | — | — | CN | disclosed |
| CN-115058175-A | Coating compositions for use with overcoated photoresists | 罗门哈斯电子材料有限责任公司 | 2022-09-16 | — | — | CN | disclosed |
| US-20220289911-A1 | POLYIMIDE-BASED POLYMER, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-09-15 | — | — | US | disclosed |
| EP-4056627-A1 | POLYIMIDE-BASED POLYMER, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSTION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-09-14 | — | — | EP | disclosed |
| CN-115044040-A | Polyimide-containing polymer, positive photosensitive resin composition, negative photosensitive resin composition, and pattern formation method | 信越化学工业株式会社 | 2022-09-13 | — | — | CN | disclosed |
| CN-115023653-A | Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, and pattern formation method | 信越化学工业株式会社 | 2022-09-06 | — | — | CN | disclosed |
| CN-109725492-B | Underlayer coating composition for use with photoresists | 罗门哈斯电子材料韩国有限公司 | 2022-09-02 | — | — | CN | disclosed |
| US-11402756-B2 | Silicone structure-containing polymer, photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-08-02 | — | — | US | disclosed |
| US-20220236644-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, LAYERED PRODUCT, AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-07-28 | — | — | US | disclosed |
| CN-105739236-B | Coating compositions for use with overcoated photoresists | 罗门哈斯电子材料韩国有限公司 | 2022-07-19 | — | — | CN | disclosed |
| CN-114746809-A | Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, pattern forming method, and light-emitting element | 信越化学工业株式会社 | 2022-07-12 | — | — | CN | disclosed |
| US-20220214619-A1 | PHOTORESIST TOPCOAT COMPOSITIONS AND PATTERN FORMATION METHODS | DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC | 2022-07-07 | — | — | US | disclosed |
| US-20220214614-A1 | PHOTOACID GENERATORS, PHOTORESIST COMPOSITIONS, AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2022-07-07 | — | — | US | disclosed |
| EP-2384457-B1 | COATING COMPOSITIONS | MERCK PATENT GMBH (DE) | 2022-07-06 | — | — | EP | disclosed |
| CN-114690553-A | Photoacid generator, photoresist composition, and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2022-07-01 | — | — | CN | disclosed |
| CN-114690556-A | Photoresist topcoat composition and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2022-07-01 | — | — | CN | disclosed |
| CN-108693713-B | Resist underlayer film material, pattern formation method, and resist underlayer film formation method | 信越化学工业株式会社 | 2022-06-03 | — | — | CN | disclosed |
| EP-4001344-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, LAYERED PRODUCT, AND PATTERN FORMATION METHOD | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-05-25 | — | — | EP | disclosed |
| US-11333975-B2 | Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2022-05-17 | — | — | US | disclosed |
| CN-114442426-A | Photoresist composition and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2022-05-06 | — | — | CN | disclosed |
| CN-114442427-A | Photoresist composition and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2022-05-06 | — | — | CN | disclosed |
| US-20220137509-A1 | PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC | 2022-05-05 | — | — | US | disclosed |
| US-20220137506-A1 | PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2022-05-05 | — | — | US | disclosed |
| CN-109143783-B | Coating compositions for use with overcoated photoresists | 罗门哈斯电子材料韩国有限公司 | 2022-04-29 | — | — | CN | disclosed |
| CN-107129448-B | Photoacid generating monomer, polymer derived therefrom, and photoresist composition including the same | 罗门哈斯电子材料有限责任公司 | 2022-04-26 | — | — | CN | disclosed |
| CN-109541886-B | Antireflective compositions, methods of use thereof, and coated substrates | 罗门哈斯电子材料韩国有限公司 | 2022-04-26 | — | — | CN | disclosed |
| CN-109422881-B | Epoxy group-containing isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern formation method | 信越化学工业株式会社 | 2022-04-19 | — | — | CN | disclosed |
| US-20220112321-A1 | HIGH REFRACTIVE INDEX MATERIALS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2022-04-14 | — | — | US | disclosed |
| EP-3981806-A1 | HIGH REFRACTIVE INDEX MATERIALS | Rohm and Haas Electronic Materials LLC (US) | 2022-04-13 | — | — | EP | disclosed |
| CN-114341282-A | Curable composition for inkjet | 太阳油墨制造株式会社 | 2022-04-12 | — | — | CN | disclosed |
| CN-114316137-A | High refractive index materials | 罗门哈斯电子材料有限责任公司 | 2022-04-12 | — | — | CN | disclosed |
| US-11294283-B2 | Photosensitive resin composition, photosensitive resin laminate, and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-04-05 | — | — | US | disclosed |
| US-11294284-B2 | Photosensitive resin composition and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-04-05 | — | — | US | disclosed |
| US-11294282-B2 | Epoxy-containing, isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-04-05 | — | — | US | disclosed |
| EP-3974904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-03-30 | — | — | EP | disclosed |
| CN-114253071-A | Photoresist composition and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2022-03-29 | — | — | CN | disclosed |
| CN-114253069-A | Photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, and surface protective film | 信越化学工业株式会社 | 2022-03-29 | — | — | CN | disclosed |
| US-20220091509-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-03-24 | — | — | US | disclosed |
| US-20220091506-A1 | PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2022-03-24 | — | — | US | disclosed |
| US-11262656-B2 | Coating compositions for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2022-03-01 | — | — | US | disclosed |
| CN-114063385-A | Photoresist composition and pattern forming method | 罗门哈斯电子材料有限责任公司 | 2022-02-18 | — | — | CN | disclosed |
| US-20220043342-A1 | PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2022-02-10 | — | — | US | disclosed |
| US-11243467-B2 | Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-02-08 | — | — | US | disclosed |
| US-20220019143-A1 | PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2022-01-20 | — | — | US | disclosed |
| US-20220011670-A1 | RESIST UNDERLAYER SURFACE MODIFICATION | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2022-01-13 | — | — | US | disclosed |
| US-11187982-B2 | Photosensitive resin composition, photosensitive dry film, and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-11-30 | — | — | US | disclosed |
| EP-3674350-B1 | PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2021-11-24 | — | — | EP | disclosed |
| US-11156919-B2 | Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-26 | — | — | US | disclosed |
| EP-3896521-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2021-10-20 | — | — | EP | disclosed |
| EP-3896114-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2021-10-20 | — | — | EP | disclosed |
| US-11150556-B2 | Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-19 | — | — | US | disclosed |
| US-20210317270-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |
| US-20210317268-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |
| US-11143962-B2 | Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and production method thereof, pattern forming method, resin, and purification method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-10-12 | — | — | US | disclosed |
| US-11137686-B2 | Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and production method thereof, and resist pattern forming method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-10-05 | — | — | US | disclosed |
| US-11119409-B2 | Polysiloxane skeleton polymer, photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-09-14 | — | — | US | disclosed |
| US-11092894-B2 | Method for forming pattern using anti-reflective coating composition comprising photoacid generator | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2021-08-17 | — | — | US | disclosed |
| EP-3660077-B1 | SILOXANE POLYMER CONTAINING ISOCYANURIC ACID AND POLYETHER SKELETONS, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHINETSU CHEMICAL CO (JP) | 2021-08-11 | — | — | EP | disclosed |
| US-11086220-B2 | Underlayer coating compositions for use with photoresists | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2021-08-10 | — | — | US | disclosed |
| EP-3118183-B1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING THE COMPOUND OR RESIN | MITSUBISHI GAS CHEMICAL CO (JP) | 2021-07-21 | — | — | EP | disclosed |
| US-20210200081-A1 | PATTERN FORMATION METHODS | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2021-07-01 | — | — | US | disclosed |
| US-20210200084-A1 | POLYMERS AND PHOTORESIST COMPOSITIONS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2021-07-01 | — | — | US | disclosed |
| EP-3657253-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND ANTIREFLECTION FILM | SHINETSU CHEMICAL CO (JP) | 2021-06-30 | — | — | EP | disclosed |
| US-20210165316-A1 | PHOTOLITHOGRAPHY METHOD | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2021-06-03 | — | — | US | disclosed |
| EP-3179308-B1 | UNDERLAYER FILM-FORMING COMPOSITION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL CO (JP) | 2021-04-21 | — | — | EP | disclosed |
| US-10983436-B2 | Negative-type photosensitive resin composition, cured film, display device provided with cured film, and production method therefor | TORAY INDUSTRIES, INC. (JP) | 2021-04-20 | — | — | US | disclosed |
| US-20210108065-A1 | POLYMERS AND PHOTORESIST COMPOSITIONS | DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC | 2021-04-15 | — | — | US | disclosed |
| US-10919918-B2 | Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-02-16 | — | — | US | disclosed |
| US-20200409261-A1 | COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING AMORPHOUS FILM, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-12-31 | — | — | US | disclosed |
| EP-3495434-B1 | NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHINETSU CHEMICAL CO (JP) | 2020-12-30 | — | — | EP | disclosed |
| US-20200377713-A1 | POLYMERS, PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2020-12-03 | — | — | US | disclosed |
| EP-3450478-B1 | EPOXY-CONTAINING, ISOCYANURATE-MODIFIED SILICONE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, LAMINATE, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2020-11-11 | — | — | EP | disclosed |
| US-10816900-B2 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-10-27 | — | — | US | disclosed |
| US-10816898-B2 | — | — | 2020-10-27 | — | — | US | disclosed |
| EP-3441419-B1 | SILICONE STRUCTURE-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, LAMINATE, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2020-10-07 | — | — | EP | disclosed |
| US-10788751-B2 | Coating composition for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2020-09-29 | — | — | US | disclosed |
| US-20200303086-A1 | ELECTROCONDUCTIVE FILM AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE PATTERN | TOKYO UNIVERSITY OF SCIENCE FOUNDATION (JP) | 2020-09-24 | — | — | US | disclosed |
| EP-3553601-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2020-09-23 | — | — | EP | disclosed |
| US-10745372-B2 | Compound, resin, material for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and purification method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-08-18 | — | — | US | disclosed |
| US-10747112-B2 | Compound, resin, and purification method thereof, material for forming underlayer film for lithography, composition for forming underlayer film, and underlayer film, as well as resist pattern forming method and circuit pattern forming method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-08-18 | — | — | US | disclosed |
| EP-3346334-B1 | USE OF A COMPOSITION FOR FORMING A PHOTORESIST UNDERLAYER FILM FOR LITHOGRAPHY, PHOTORESIST UNDERLAYER FILM FOR LITHOGRAPHY AND METHOD FOR PRODUCING SAME, AND RESIST PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL CO (JP) | 2020-08-12 | — | — | EP | disclosed |
| US-10720259-B2 | Electroconductive film and method for manufacturing electroconductive pattern | TOKYO UNIVERSITY OF SCIENCE FOUNDATION (JP) | 2020-07-21 | — | — | US | disclosed |
| US-10719014-B2 | Photoresists comprising amide component | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2020-07-21 | — | — | US | disclosed |
| US-10703917-B2 | Coating compositions suitable for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2020-07-07 | — | — | US | disclosed |
| US-20200209751-A1 | PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-07-02 | — | — | US | disclosed |
| EP-3674350-A1 | PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, AND PATTERN FORMING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2020-07-01 | — | — | EP | disclosed |
| EP-3235803-B1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHINETSU CHEMICAL CO (JP) | 2020-06-03 | — | — | EP | disclosed |
| EP-3660077-A1 | SILOXANE POLYMER CONTAINING ISOCYANURIC ACID AND POLYETHER SKELETONS, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | Shin-Etsu Chemical Co., Ltd. (JP) | 2020-06-03 | — | — | EP | disclosed |
| US-20200166838-A1 | RESIST MATERIAL | DIC CORPORATION (JP) | 2020-05-28 | — | — | US | disclosed |
| US-20200165394-A1 | SILOXANE POLYMER CONTAINING ISOCYANURIC ACID AND POLYETHER SKELETONS, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-05-28 | — | — | US | disclosed |
| US-20200165456-A1 | POLYSILOXANE SKELETON POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-05-28 | — | — | US | disclosed |
| EP-3656803-A1 | POLYSILOXANE SKELETON POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | Shin-Etsu Chemical Co., Ltd. (JP) | 2020-05-27 | — | — | EP | disclosed |
| EP-3657253-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND ANTIREFLECTION FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2020-05-27 | — | — | EP | disclosed |
| US-20200157348-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND ANTIREFLECTION FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-05-21 | — | — | US | disclosed |
| CN-107075155-B | Resin-containing sheet, and structure and circuit board using same | 太阳控股株式会社 | 2020-05-19 | — | — | CN | disclosed |
| US-20200140678-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-05-07 | — | — | US | disclosed |
| EP-3647870-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2020-05-06 | — | — | EP | disclosed |
| EP-3203320-B9 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2020-05-06 | — | — | EP | disclosed |
| EP-3640289-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2020-04-22 | — | — | EP | disclosed |
| US-20200117089-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-04-16 | — | — | US | disclosed |
| US-10578969-B2 | Photoresist topcoat compositions and methods of processing photoresist compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2020-03-03 | — | — | US | disclosed |
| US-10577323-B2 | Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and method for purifying compound or resin | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-03-03 | — | — | US | disclosed |
| US-10564542-B2 | Photoresist compositions and methods | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2020-02-18 | — | — | US | disclosed |
| EP-3279179-B1 | COMPOUND, RESIN, AND PURIFICATION METHOD THEREOF, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM , AND UNDERLAYER FILM, AS WELL AS RESIST PATTERN FORMING METHOD AND CIRCUIT PATTERN FORMING METHOD. | MITSUBISHI GAS CHEMICAL CO (JP) | 2019-12-18 | — | — | EP | disclosed |
| EP-3572879-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | Shin-Etsu Chemical Co., Ltd. (JP) | 2019-11-27 | — | — | EP | disclosed |
| US-20190354015-A1 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2019-11-21 | — | — | US | disclosed |
| US-20190354013-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-11-21 | — | — | US | disclosed |
| US-10481494-B1 | Coating compositions for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2019-11-19 | — | — | US | disclosed |
| US-10457779-B2 | Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-10-29 | — | — | US | disclosed |
| EP-3203320-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2019-10-23 | — | — | EP | disclosed |
| US-10451970-B2 | Silicone skeleton-containing polymer, photo-curable resin composition, photo-curable dry film, laminate, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-10-22 | — | — | US | disclosed |
| EP-3553601-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AND PATTERN FORMING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2019-10-16 | — | — | EP | disclosed |
| US-10429737-B2 | Antireflective compositions with thermal acid generators | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2019-10-01 | — | — | US | disclosed |
| CN-110297398-A | Photosensitve resin composition, photosensitive resin lamilate and pattern forming method | 信越化学工业株式会社 | 2019-10-01 | — | — | CN | disclosed |
| US-20190294045-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-09-26 | — | — | US | disclosed |
| US-10416563-B2 | Resist underlayer film composition, patterning process, and method for forming resist underlayer film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-09-17 | — | — | US | disclosed |
| US-10409163-B2 | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2019-09-10 | — | — | US | disclosed |
| EP-3103831-B1 | PHOTO-CURABLE RESIN COMPOSITION AND PHOTO-CURABLE DRY FILM USING THE SAME | SHINETSU CHEMICAL CO (JP) | 2019-09-04 | — | — | EP | disclosed |
| EP-2602661-B1 | Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film | SHINETSU CHEMICAL CO (JP) | 2019-08-28 | — | — | EP | disclosed |
| EP-3216823-B1 | RESIN-CONTAINING SHEET, AND STRUCTURE AND WIRING BOARD USING SAME | ASAHI CHEMICAL IND (JP) | 2019-08-14 | — | — | EP | disclosed |
| US-20190235385-A1 | PHOTORESIST TOPCOAT COMPOSITIONS AND METHODS OF PROCESSING PHOTORESIST COMPOSITIONS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2019-08-01 | — | — | US | disclosed |
| US-10364314-B2 | Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, resist pattern forming method, circuit pattern forming method, and purification method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-07-30 | — | — | US | disclosed |
| US-10365562-B2 | Coating compositions for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2019-07-30 | — | — | US | disclosed |
| EP-3382454-B1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | SHINETSU CHEMICAL CO (JP) | 2019-07-24 | — | — | EP | disclosed |
| US-10359701-B2 | Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and pattern forming method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-07-23 | — | — | US | disclosed |
| CN-109976091-A | The manufacture of photosensitive resin composition, pattern forming method and optoelectronic semiconductor component | 信越化学工业株式会社 | 2019-07-05 | — | — | CN | disclosed |
| US-20190204742-A1 | PATTERN FORMATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2019-07-04 | — | — | US | disclosed |
| US-20190203065-A1 | PHOTORESIST TOPCOAT COMPOSITIONS AND METHODS OF PROCESSING PHOTORESIST COMPOSITIONS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2019-07-04 | — | — | US | disclosed |
| US-20190204743-A1 | PHOTORESIST COMPOSITIONS AND METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2019-07-04 | — | — | US | disclosed |
| US-20190204741-A1 | PHOTORESIST TOPCOAT COMPOSITIONS AND METHODS OF PROCESSING PHOTORESIST COMPOSITIONS | ROHM & HAAS ELECT MAT (US) | 2019-07-04 | — | — | US | disclosed |
| EP-3358412-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, PHOTOSENSITIVE RESIN COATING, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2019-07-03 | — | — | EP | disclosed |
| EP-3505551-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | Shin-Etsu Chemical Co., Ltd. (JP) | 2019-07-03 | — | — | EP | disclosed |
| US-10338471-B2 | Composition for forming underlayer film for lithography, underlayer film for lithography and pattern forming method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-07-02 | — | — | US | disclosed |
| US-20190196331-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-06-27 | — | — | US | disclosed |
| EP-3495434-A1 | NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | Shin-Etsu Chemical Co., Ltd. (JP) | 2019-06-12 | — | — | EP | disclosed |
| US-20190169211-A1 | NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-06-06 | — | — | US | disclosed |
| EP-3275857-B1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHINETSU CHEMICAL CO (JP) | 2019-06-05 | — | — | EP | disclosed |
| US-10310377-B2 | Material for forming film for lithography, composition for forming film for lithography, film for lithography, pattern forming method and purification method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-06-04 | — | — | US | disclosed |
| EP-2799928-B1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT | TORAY INDUSTRIES (JP) | 2019-05-22 | — | — | EP | disclosed |
| US-10295910-B2 | Photoresists and methods of use thereof | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2019-05-21 | — | — | US | disclosed |
| US-10294183-B2 | Compound, resin, material for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and method for purifying the compound or resin | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-05-21 | — | — | US | disclosed |
| US-20190129306-A1 | UNDERLAYER COATING COMPOSITIONS FOR USE WITH PHOTORESISTS | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2019-05-02 | — | — | US | disclosed |
| US-10274824-B2 | Photobase generators and photoresist compositions comprising same | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2019-04-30 | — | — | US | disclosed |
| US-10241412-B2 | Resist underlayer film composition, patterning process, and method for forming resist underlayer film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-03-26 | — | — | US | disclosed |
| US-20190085173-A1 | ANTIREFLECTIVE COMPOSITIONS WITH THERMAL ACID GENERATORS | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2019-03-21 | — | — | US | disclosed |
| EP-2602660-B1 | Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film | SHINETSU CHEMICAL CO (JP) | 2019-03-20 | — | — | EP | disclosed |
| EP-2387735-B1 | NONPOLYMERIC BINDERS FOR SEMICONDUCTOR SUBSTRATE COATINGS | FUJIFILM ELECTRONIC MAT USA INC (US) | 2019-03-13 | — | — | EP | disclosed |
| US-10227505-B2 | Active energy ray-curable composition | KANEKA CORPORATION (JP) | 2019-03-12 | — | — | US | disclosed |
| US-20190072851-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, DISPLAY DEVICE PROVIDED WITH CURED FILM, AND PRODUCTION METHOD THEREFOR | TORAY INDUSTRIES, INC. (JP) | 2019-03-07 | — | — | US | disclosed |
| CN-109422881-A | Containing the isocyanurate-modified organic siliconresin of epoxy group, photosensitive resin composition, photo-conductive film, laminated body and pattern forming method | 信越化学工业株式会社 | 2019-03-05 | — | — | CN | disclosed |
| CN-109411336-A | Photolithography method | 德淮半导体有限公司 | 2019-03-01 | — | — | CN | disclosed |
| US-20190056657-A1 | COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING AMORPHOUS FILM, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-02-21 | — | — | US | disclosed |
| EP-3056552-B1 | ACTIVE ENERGY-RAY-CURABLE RESIN COMPOSITION FOR COATING ORGANIC OR INORGANIC SUBSTRATE | KANEKA CORP (JP) | 2019-02-20 | — | — | EP | disclosed |
| US-20190049844-A1 | SILICONE STRUCTURE-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, LAMINATE, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-02-14 | — | — | US | disclosed |
| US-20190049843-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, LAMINATE, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-02-14 | — | — | US | disclosed |
| EP-3441419-A1 | SILICONE STRUCTURE-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, LAMINATE, AND PATTERN FORMING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2019-02-13 | — | — | EP | disclosed |
| EP-3441818-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, LAMINATE, AND PATTERN FORMING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2019-02-13 | — | — | EP | disclosed |
| US-10203601-B2 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-02-12 | — | — | US | disclosed |
| US-10203602-B2 | Coating compositions for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2019-02-12 | — | — | US | disclosed |
| US-20190041750-A1 | MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PRODUCTION METHOD THEREOF, PATTERN FORMING METHOD, RESIN, AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-02-07 | — | — | US | disclosed |
| US-10197918-B2 | Photoresist topcoat compositions and methods of processing photoresist compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2019-02-05 | — | — | US | disclosed |
| EP-3141959-B1 | LITHOGRAPHIC FILM FORMATION MATERIAL, COMPOSITION FOR LITHOGRAPHIC FILM FORMATION, LITHOGRAPHIC FILM, PATTERN FORMATION METHOD, AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL CO (JP) | 2019-01-30 | — | — | EP | disclosed |
| EP-2336829-B1 | Photoresists and methods for use thereof | ROHM & HAAS ELECT MAT (US) | 2019-01-23 | — | — | EP | disclosed |
| US-20190018320-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-01-17 | — | — | US | disclosed |
| US-10180627-B2 | Processes for photolithography | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2019-01-15 | — | — | US | disclosed |
| US-10162265-B2 | Pattern treatment methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2018-12-25 | — | — | US | disclosed |
| US-20180364575-A1 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2018-12-20 | — | — | US | disclosed |
| WO-2018229554-A2 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2018-12-20 | — | — | WO | disclosed |
| US-20180364576-A1 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2018-12-20 | — | — | US | disclosed |
| US-10133179-B2 | Pattern treatment methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2018-11-20 | — | — | US | disclosed |
| US-10131810-B2 | Active energy-ray-curable resin composition for coating organic or inorganic substrate | KANCKA CORPORATION (JP) | 2018-11-20 | — | — | US | disclosed |
| EP-3398983-A1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-11-07 | — | — | EP | disclosed |
| US-10114287-B2 | Silicone skeleton-containing polymer compound and method for producing same, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, and substrate | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-10-30 | — | — | US | disclosed |
| EP-2716671-B1 | PHENOLIC RESIN AND MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY | MITSUBISHI GAS CHEMICAL CO (JP) | 2018-10-10 | — | — | EP | disclosed |
| US-20180284615-A1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-10-04 | — | — | US | disclosed |
| US-20180284614-A1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-10-04 | — | — | US | disclosed |
| EP-3382454-A1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-10-03 | — | — | EP | disclosed |
| EP-3382453-A1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-10-03 | — | — | EP | disclosed |
| US-10087288-B2 | Silicone skeleton-containing polymer compound, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, substrate, and semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-10-02 | — | — | US | disclosed |
| US-20180275513-A1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-09-27 | — | — | US | disclosed |
| EP-2660257-B1 | AROMATIC HYDROCARBON RESIN, COMPOSITION FOR FORMING LITHOGRAPHIC UNDERLAYER FILM, AND METHOD FOR FORMING MULTILAYER RESIST PATTERN | MITSUBISHI GAS CHEMICAL CO (JP) | 2018-09-19 | — | — | EP | disclosed |
| EP-1877864-B1 | NANOCOMPOSITE PHOTOSENSITIVE COMPOSITION AND USE THEREOF | MERCK PATENT GMBH (DE) | 2018-09-19 | — | — | EP | disclosed |
| WO-2018160726-A1 | LOW DIELECTRIC CONSTANT POROUS EPOXY-BASED DIELECTRIC | GEORGIA TECH RESEARCH CORPORATION (US) | 2018-09-07 | — | — | WO | disclosed |
| US-20180246409-A1 | MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PRODUCTION METHOD THEREOF, AND RESIST PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-08-30 | — | — | US | disclosed |
| CN-108388082-A | Photosensitive polymer combination, photosensitive dry film, photosensitive resin coating and pattern forming method | 信越化学工业株式会社 | 2018-08-10 | — | — | CN | disclosed |
| US-20180224743-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, PHOTOSENSITIVE RESIN COATING, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-08-09 | — | — | US | disclosed |
| EP-3358412-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, PHOTOSENSITIVE RESIN COATING, AND PATTERN FORMING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-08-08 | — | — | EP | disclosed |
| US-10042259-B2 | Topcoat compositions and pattern-forming methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2018-08-07 | — | — | US | disclosed |
| US-10042255-B2 | Block copolymers and pattern treatment compositions and methods | DOW GLOBAL TECHNOLOGIES LLC (US) | 2018-08-07 | — | — | US | disclosed |
| CN-103941547-B | Hard mask is surface-treated | 罗门哈斯电子材料有限公司 | 2018-07-27 | — | — | CN | disclosed |
| US-20180212026-A1 | SURFACE MODIFIED DIAMOND MATERIALS AND METHODS OF MANUFACTURING | MASSACHUSETTS INSTITUTE OF TECHNOLOGY | 2018-07-26 | — | — | US | disclosed |
| US-20180208703-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN FORMING METHOD, CIRCUIT PATTERN FORMING METHOD, AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-07-26 | — | — | US | disclosed |
| US-20180203352-A1 | MONOMERS, POLYMERS AND PHOTORESIST COMPOSITIONS | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2018-07-19 | — | — | US | disclosed |
| EP-3348542-A1 | COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR PRODUCING AMORPHOUS FILM, MATERIAL FOR FORMING LITHOGRAPHIC UNDERLAYER FILM, COMPOSTION FOR FORMING LITHOGRAPHIC UNDERLAYER FILM, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-07-18 | — | — | EP | disclosed |
| EP-3346335-A1 | MATERIAL FOR FORMING UNDERLAYER FILMS FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILMS FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND METHOD FOR PRODUCING SAME, PATTERN FORMING METHOD, RESIN, AND PURIFICATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-07-11 | — | — | EP | disclosed |
| EP-3346334-A1 | MATERIAL FOR FORMING UNDERLAYER FILMS FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILMS FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND METHOD FOR PRODUCING SAME, AND RESIST PATTERN FORMING METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-07-11 | — | — | EP | disclosed |
| EP-2336828-B1 | Photoresists and methods for use thereof | ROHM & HAAS ELECT MAT (US) | 2018-07-11 | — | — | EP | disclosed |
| EP-3327005-A1 | COMPOUND, RESIN, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN FORMING METHOD, CIRCUIT PATTERN FORMING METHOD, AND PURIFICATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-05-30 | — | — | EP | disclosed |
| US-9975830-B2 | Compound containing modified phenolic hydroxy group, method for producing compound containing modified phenolic hydroxy group, photosensitive composition, resist material, and resist coating film | DIC CORPORATION (JP) | 2018-05-22 | — | — | US | disclosed |
| US-9971242-B2 | Photo-curable resin composition and photo-curable dry film using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-05-15 | — | — | US | disclosed |
| US-20180120703-A1 | PHOTORESIST TOPCOAT COMPOSITIONS AND METHODS OF PROCESSING PHOTORESIST COMPOSITIONS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2018-05-03 | — | — | US | disclosed |
| US-20180118970-A1 | TOPCOAT COMPOSITIONS AND PATTERN-FORMING METHODS | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2018-05-03 | — | — | US | disclosed |
| US-20180120702-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-05-03 | — | — | US | disclosed |
| EP-3315504-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-05-02 | — | — | EP | disclosed |
| US-20180101096-A1 | MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-04-12 | — | — | US | disclosed |
| US-20180101097-A1 | MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-04-12 | — | — | US | disclosed |
| US-20180095367-A1 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) | 2018-04-05 | — | — | US | disclosed |
| US-20180095368-A1 | COMPOUND, RESIN, AND PURIFICATION METHOD THEREOF, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM, AND UNDERLAYER FILM, AS WELL AS RESIST PATTERN FORMING METHOD AND CIRCUIT PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-04-05 | — | — | US | disclosed |
| EP-2955175-B1 | USE OF 9-[1,1'-BIPHENYL]-4-YL-9H-XANTHENE-2,7-DIOL AND SIMILAR COMPOUNDS FOR FORMING RESINS FOR USE IN UNDERLAYER FILMS FOR LITHOGRAPHY AND IN PATTERN FORMING METHODS | MITSUBISHI GAS CHEMICAL CO (JP) | 2018-04-04 | — | — | EP | disclosed |
| US-9926422-B2 | Bump-forming material, method for producing electronic component, method for producing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2018-03-27 | — | — | US | disclosed |
| US-9918921-B2 | Methods for shaping fibrous material and treatment compositions therefor | THE PROCTER & GAMBLE COMPANY (US) | 2018-03-20 | — | — | US | disclosed |
| US-9916973-B2 | Photolithographic methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2018-03-13 | — | — | US | disclosed |
| US-20180065930-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING COMPOUND OR RESIN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-03-08 | — | — | US | disclosed |
| US-9910355-B2 | Method of negative tone development using a copolymer multilayer electrolyte and articles made therefrom | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2018-03-06 | — | — | US | disclosed |
| US-9910353-B2 | Method of negative tone development using a copolymer multilayer electrolyte and articles made therefrom | DOW GLOBAL TECHNOLOGIES LLC (US) | 2018-03-06 | — | — | US | disclosed |
| US-20180059545-A1 | MONOMERS, POLYMERS AND PHOTORESIST COMPOSITIONS | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2018-03-01 | — | — | US | disclosed |
| EP-2657766-B1 | Patterning process | SHINETSU CHEMICAL CO (JP) | 2018-02-28 | — | — | EP | disclosed |
| US-20180052392-A1 | MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN FORMING METHOD, AND CIRCUIT PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-02-22 | — | — | US | disclosed |
| US-20180044270-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING COMPOUND OR RESIN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-02-15 | — | — | US | disclosed |
| EP-3282318-A1 | MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-02-14 | — | — | EP | disclosed |
| EP-3282319-A1 | MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-02-14 | — | — | EP | disclosed |
| EP-3279179-A1 | COMPOUND, RESIN, AND METHOD FOR PURIFYING SAME, UNDERLAYER FILM FORMATION MATERIAL FOR LITHOGRAPHY, UNDERLAYER FILM FORMING COMPOSITION, AND UNDERLAYER FILM, AND METHOD FOR FORMING RESIST PATTERN AND METHOD FOR FORMING CIRCUIT PATTERN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-02-07 | — | — | EP | disclosed |
| US-20180031975-A1 | PATTERN TREATMENT METHODS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2018-02-01 | — | — | US | disclosed |
| US-20180029968-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN FORMING METHOD, CIRCUIT PATTERN FORMING METHOD, AND PURIFICATION METHOD OF COMPOUND OR RESIN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-02-01 | — | — | US | disclosed |
| US-20180031971-A1 | METHOD OF NEGATIVE TONE DEVELOPMENT USING A COPOLYMER MULTILAYER ELECTROLYTE AND ARTICLES MADE THEREFROM | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2018-02-01 | — | — | US | disclosed |
| US-20180031972-A1 | METHOD OF NEGATIVE TONE DEVELOPMENT USING A COPOLYMER MULTILAYER ELECTROLYTE AND ARTICLES MADE THEREFROM | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2018-02-01 | — | — | US | disclosed |
| EP-3275857-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-01-31 | — | — | EP | disclosed |
| EP-2955577-B1 | COMPOUND, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL CO (JP) | 2018-01-31 | — | — | EP | disclosed |
| US-9877559-B2 | Methods for shaping fibrous material and treatment compositions therefor | THE PROCTER & GAMBLE COMANY (US) | 2018-01-30 | — | — | US | disclosed |
| US-20180024434-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-01-25 | — | — | US | disclosed |
| EP-3269712-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING COMPOUND OR RESIN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-01-17 | — | — | EP | disclosed |
| EP-3266759-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING COMPOUND OR RESIN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-01-10 | — | — | EP | disclosed |
| EP-3267256-A1 | UNDERLAYER FILM-FORMING MATERIAL FOR LITHOGRAPHY, UNDERLAYER FILM-FORMING COMPOSITION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN-FORMING METHOD, AND CIRCUIT PATTERN-FORMING METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-01-10 | — | — | EP | disclosed |
| US-20180004088-A1 | SILICONE SKELETON-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM, LAMINATE, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-01-04 | — | — | US | disclosed |
| EP-3263626-A1 | SILICONE SKELETON-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM, LAMINATE, AND PATTERNING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-01-03 | — | — | EP | disclosed |
| US-9851823-B2 | Electronic devices and precursor articles | EASTMAN KODAK COMPANY (US) | 2017-12-26 | — | — | US | disclosed |
| EP-3257835-A1 | COMPOUND, RESIN, LITHOGRAPHY UNDERLAYER FILM FORMING MATERIAL, LITHOGRAPHY UNDERLAYER FILM FORMING COMPOSITION, LITHOGRAPHY UNDERLAYER FILM, METHOD FOR FORMING RESIST PATTERN, METHOD FOR FORMING CIRCUIT PATTERN, AND METHOD FOR PURIFYING COMPOUND OR RESIN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2017-12-20 | — | — | EP | disclosed |
| US-20170349564-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2017-12-07 | — | — | US | disclosed |
| US-9828355-B2 | Compound, material for forming underlayer film for lithography, underlayer film for lithography and pattern forming method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2017-11-28 | — | — | US | disclosed |
| US-20170336709-A1 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2017-11-23 | — | — | US | disclosed |
| US-20170329221-A1 | PHOTOSENSITIVE COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, AND RESIST UNDERLAYER FILM | DIC CORPORATION (JP) | 2017-11-16 | — | — | US | disclosed |
| US-9815930-B2 | Block copolymer and associated photoresist composition and method of forming an electronic device | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2017-11-14 | — | — | US | disclosed |
| US-9809601-B2 | Compound, material for forming underlayer film for lithography, underlayer film for lithography and pattern forming method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2017-11-07 | — | — | US | disclosed |
| US-20170313889-A1 | COATING COMPOSITIONS SUITABLE FOR USE WITH AN OVERCOATED PHOTORESIST | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2017-11-02 | — | — | US | disclosed |
| US-20170313831-A1 | RESIN-CONTAINING SHEET, AND STRUCTURE AND WIRING BOARD USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-11-02 | — | — | US | disclosed |
| EP-3239141-A1 | COMPOUND, RESIN, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD AND PURIFICATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2017-11-01 | — | — | EP | disclosed |
| US-20170309363-A1 | ELECTROCONDUCTIVE FILM AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE PATTERN | TOKYO UNIVERSITY OF SCIENCE FOUNDATION (JP) | 2017-10-26 | — | — | US | disclosed |
| EP-3235803-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2017-10-25 | — | — | EP | disclosed |
| US-20170298186-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-10-19 | — | — | US | disclosed |
| US-20170285477-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2017-10-05 | — | — | US | disclosed |
| US-20170283651-A1 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2017-10-05 | — | — | US | disclosed |
| EP-2348360-B1 | Photoresist comprising nitrogen-containing compound | ROHM & HAAS ELECT MAT (US) | 2017-09-27 | — | — | EP | disclosed |
| US-9765175-B2 | Modified hydroxy naphthalene novolak resin, production method for modified hydroxy naphthalene novolak resin, photosensitive composition, resist material and coating | DIC CORPORATION (JP) | 2017-09-19 | — | — | US | disclosed |
| US-20170260315-A1 | NOVOLAC TYPE PHENOL RESIN, MANUFACTURING METHOD THEREFOR, PHOTOSENSITIVE COMPOSITION, RESIST MATERIAL AND COATING FILM | DIC CORPORATION (JP) | 2017-09-14 | — | — | US | disclosed |
| US-20170260348-A1 | BUMP-FORMING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COMPONENT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2017-09-14 | — | — | US | disclosed |
| US-20170260348-A1 | BUMP-FORMING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COMPONENT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2017-09-14 | — | — | US | disclosed |
| EP-3216823-A1 | RESIN-CONTAINING SHEET, AND STRUCTURE AND WIRING BOARD USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-09-13 | — | — | EP | disclosed |
| US-9758610-B2 | Acid-labile hyperbranched copolymer and associated photoresist composition and method of forming an electronic device | DOW GLOBAL TECHNOLOGIES LLC (US) | 2017-09-12 | — | — | US | disclosed |
| US-9753370-B2 | Multiple-pattern forming methods | DOW GLOBAL TECHNOLOGIES LLC (US) | 2017-09-05 | — | — | US | disclosed |
| US-9751070-B2 | Structure modifying apparatus | THE PROCTER & GAMBLE COMPANY (US) | 2017-09-05 | — | — | US | disclosed |
| US-20170248844-A1 | PHOTOACID-GENERATING MONOMER, POLYMER DERIVED THEREFROM, PHOTORESIST COMPOSITION INCLUDING THE POLYMER, AND METHOD OF FORMING A PHOTORESIST RELIEF IMAGE USING THE PHOTORESIST COMPOSITION | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2017-08-31 | — | — | US | disclosed |
| US-20170227849-A1 | COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2017-08-10 | — | — | US | disclosed |
| EP-3202811-A1 | ACTINIC RADIATION CURABLE COMPOSITION | Kaneka Corporation (JP) | 2017-08-09 | — | — | EP | disclosed |
| EP-3203320-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2017-08-09 | — | — | EP | disclosed |
| US-20170204231-A1 | ACTINIC RADIATION CURABLE COMPOSITION | KANEKA CORPORATION (JP) | 2017-07-20 | — | — | US | disclosed |
| EP-3191183-A1 | STRUCTURE MODIFYING APPARATUS | The Procter and Gamble Company (US) | 2017-07-19 | — | — | EP | disclosed |
| EP-3191184-A1 | STRUCTURE MODIFYING APPARATUS | The Procter and Gamble Company (US) | 2017-07-19 | — | — | EP | disclosed |
| US-9708493-B2 | Coating compositions suitable for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2017-07-18 | — | — | US | disclosed |
| US-9703200-B2 | Photolithographic methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2017-07-11 | — | — | US | disclosed |
| US-9703203-B2 | Compositions and methods for pattern treatment | DOW GLOBAL TECHNOLOGIES LLC (US) | 2017-07-11 | — | — | US | disclosed |
| US-9704724-B2 | Photosensitive resin composition and method for producing semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2017-07-11 | — | — | US | disclosed |
| US-9696627-B2 | Compositions comprising base-reactive component and processes for photolithography | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2017-07-04 | — | — | US | disclosed |
| US-20170174808-A1 | ACID-LABILE HYPERBRANCHED COPOLYMER AND ASSOCIATED PHOTORESIST COMPOSITION AND METHOD OF FORMING AN ELECTRONIC DEVICE | DOW GLOBAL TECHNOLOGIES LLC | 2017-06-22 | — | — | US | disclosed |
| US-9684241-B2 | Compositions and methods for pattern treatment | DOW GLOBAL TECHNOLOGIES LLC (US) | 2017-06-20 | — | — | US | disclosed |
| US-20170170008-A1 | PATTERN TREATMENT METHODS | DOW GLOBAL TECHNOLOGIES LLC | 2017-06-15 | — | — | US | disclosed |
| EP-3179308-A1 | UNDERLAYER FILM-FORMING COMPOSITION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMING METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2017-06-14 | — | — | EP | disclosed |
| US-9675989-B2 | Structure modifying apparatus | THE PROCTER & GAMBLE COMPANY (US) | 2017-06-13 | — | — | US | disclosed |
| US-9671697-B2 | Pattern treatment methods | DOW GLOBAL TECHNOLOGIES LLC (US) | 2017-06-06 | — | — | US | disclosed |
| US-20170153547-A1 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2017-06-01 | — | — | US | disclosed |
| US-9665001-B2 | Photoresists and methods for use thereof | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2017-05-30 | — | — | US | disclosed |
| US-9665005-B2 | Pattern treatment methods | DOW GLOBAL TECHNOLOGIES LLC (US) | 2017-05-30 | — | — | US | disclosed |
| US-20170144954-A1 | MATERIAL FOR FORMING FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING FILM FOR LITHOGRAPHY, FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2017-05-25 | — | — | US | disclosed |
| US-20170147101-A1 | ELECTRONIC DEVICES AND PRECURSOR ARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2017-05-25 | — | — | US | disclosed |
| US-9650533-B2 | Articles containing carbon-coated metal particles | EASTMAN KODAK COMPANY (US) | 2017-05-16 | — | — | US | disclosed |
| US-20170123319-A1 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2017-05-04 | — | — | US | disclosed |
| US-20170123316-A1 | BLOCK COPOLYMERS AND PATTERN TREATMENT COMPOSITIONS AND METHODS | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2017-05-04 | — | — | US | disclosed |
| US-9637659-B2 | Latex primer composition and latex primed substrates | EASTMAN KODAK COMPANY (US) | 2017-05-02 | — | — | US | disclosed |
| US-20170090283-A1 | PHOTORESIST COMPOSITIONS AND METHODS | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2017-03-30 | — | — | US | disclosed |
| US-9606652-B2 | Electronic devices and precursor articles | EASTMAN KODAK COMPANY (US) | 2017-03-28 | — | — | US | disclosed |
| EP-3002633-B1 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | SHINETSU CHEMICAL CO (JP) | 2017-03-22 | — | — | EP | disclosed |
| US-20170073288-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING THE COMPOUND OR RESIN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2017-03-16 | — | — | US | disclosed |
| EP-3141959-A1 | LITHOGRAPHIC FILM FORMATION MATERIAL, COMPOSITION FOR LITHOGRAPHIC FILM FORMATION, LITHOGRAPHIC FILM, PATTERN FORMATION METHOD, AND PURIFICATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2017-03-15 | — | — | EP | disclosed |
| US-20170066703-A1 | COMPOUND CONTAINING MODIFIED PHENOLIC HYDROXY GROUP, METHOD FOR PRODUCING COMPOUND CONTAINING MODIFIED PHENOLIC HYDROXY GROUP, PHOTOSENSITIVE COMPOSITION, RESIST MATERIAL, AND RESIST COATING FILM | DIC CORPORATION (JP) | 2017-03-09 | — | — | US | disclosed |
| US-20170059991-A1 | COATING COMPOSITION FOR USE WITH AN OVERCOATED PHOTORESIST | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2017-03-02 | — | — | US | disclosed |
| EP-1415974-B1 | PROCESS FOR PRODUCTION OF FLUORINE-CONTAINING NORBORNENE DERIVATIVES | DAIKIN IND LTD (JP) | 2017-03-01 | — | — | EP | disclosed |
| US-9581904-B2 | Photoresist overcoat compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2017-02-28 | — | — | US | disclosed |
| US-9581901-B2 | Photoacid-generating copolymer and associated photoresist composition, coated substrate, and method of forming an electronic device | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2017-02-28 | — | — | US | disclosed |
| US-20170037178-A1 | BLOCK COPOLYMER AND ASSOCIATED PHOTORESIST COMPOSITION AND METHOD OF FORMING AN ELECTRONIC DEVICE | THE UNIVERSITY OF QUEENSLAND (AU) | 2017-02-09 | — | — | US | disclosed |
| EP-3002308-B1 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND AND METHOD FOR PRODUCING SAME, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, AND SUBSTRATE | SHINETSU CHEMICAL CO (JP) | 2017-02-08 | — | — | EP | disclosed |
| EP-2258691-B1 | Coating compositions for use with an overcoated photoresist | ROHM & HAAS ELECT MAT (US) | 2017-01-25 | — | — | EP | disclosed |
| EP-3118183-A1 | COMPOUND, RESIN, BASE LAYER FILM-FORMING MATERIAL FOR LITHOGRAPHY, BASE LAYER FILM FOR LITHOGRAPHY, PATTERN-FORMING METHOD, AND METHOD FOR REFINING COMPOUND OR RESIN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2017-01-18 | — | — | EP | disclosed |
| EP-3043206-B1 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, SUBSTRATE, AND SEMICONDUCTOR APPARATUS | SHINETSU CHEMICAL CO (JP) | 2017-01-11 | — | — | EP | disclosed |
| US-9541834-B2 | Ionic thermal acid generators for low temperature applications | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2017-01-10 | — | — | US | disclosed |
| EP-3103831-A1 | PHOTO-CURABLE RESIN COMPOSITION AND PHOTO-CURABLE DRY FILM USING THE SAME | Shin-Etsu Chemical Co., Ltd. (JP) | 2016-12-14 | — | — | EP | disclosed |
| US-20160357111-A1 | COMPOSITIONS AND METHODS FOR PATTERN TREATMENT | DOW GLOBAL TECHNOLOGIES LLC | 2016-12-08 | — | — | US | disclosed |
| US-20160357112-A1 | COMPOSITIONS AND METHODS FOR PATTERN TREATMENT | DOW GLOBAL TECHNOLOGIES LLC | 2016-12-08 | — | — | US | disclosed |
| US-20160357105-A1 | PHOTO-CURABLE RESIN COMPOSITION AND PHOTO-CURABLE DRY FILM USING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-12-08 | — | — | US | disclosed |
| US-20160357110-A1 | PATTERN TREATMENT METHODS | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2016-12-08 | — | — | US | disclosed |
| US-20160357109-A1 | PATTERN TREATMENT METHODS | DOW GLOBAL TECHNOLOGIES LLC | 2016-12-08 | — | — | US | disclosed |
| US-9505942-B2 | Preparation of patterned or electrically-conductive articles | EASTMAN KODAK COMPANY (US) | 2016-11-29 | — | — | US | disclosed |
| US-9508553-B2 | Photoresists and methods for use thereof | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2016-11-29 | — | — | US | disclosed |
| US-9502254-B2 | Photoresists and methods for use thereof | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2016-11-22 | — | — | US | disclosed |
| US-20160334703-A1 | PHOTOBASE GENERATORS AND PHOTORESIST COMPOSITIONS COMPRISING SAME | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2016-11-17 | — | — | US | disclosed |
| US-20160333212-A1 | PHOTORESIST TOPCOAT COMPOSITIONS AND METHODS OF PROCESSING PHOTORESIST COMPOSITIONS | ROHM & HAAS ELECT MAT (US) | 2016-11-17 | — | — | US | disclosed |
| US-9494863-B2 | Chemically amplified negative resist composition, photo-curable dry film, making method, patterning process, and electric/electronic part-protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-11-15 | — | — | US | disclosed |
| US-20160320702-A1 | PHOTORESIST COMPOSITIONS AND METHODS | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2016-11-03 | — | — | US | disclosed |
| EP-2980172-B1 | SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | SHINETSU CHEMICAL CO (JP) | 2016-11-02 | — | — | EP | disclosed |
| US-9482945-B2 | Photoresist compositions and methods of forming photolithographic patterns | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2016-11-01 | — | — | US | disclosed |
| US-9482948-B2 | Photoresist compositions and methods of forming photolithographic patterns | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2016-11-01 | — | — | US | disclosed |
| EP-3082755-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | The Procter & Gamble Company (US) | 2016-10-26 | — | — | EP | disclosed |
| EP-3082961-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | The Procter & Gamble Company (US) | 2016-10-26 | — | — | EP | disclosed |
| EP-3082732-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | The Procter & Gamble Company (US) | 2016-10-26 | — | — | EP | disclosed |
| EP-3082748-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | The Procter & Gamble Company (US) | 2016-10-26 | — | — | EP | disclosed |
| EP-3082738-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | The Procter & Gamble Company (US) | 2016-10-26 | — | — | EP | disclosed |
| US-9475763-B2 | Photoresist comprising nitrogen-containing compound | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2016-10-25 | — | — | US | disclosed |
| US-9472438-B2 | Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-10-18 | — | — | US | disclosed |
| US-9458348-B2 | Photoresist overcoat compositions and methods of forming electronic devices | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2016-10-04 | — | — | US | disclosed |
| US-9459534-B2 | Photolithographic methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2016-10-04 | — | — | US | disclosed |
| US-20160284559-A1 | POLYMER FOR RESIST UNDER LAYER FILM COMPOSITION, RESIST UNDER LAYER FILM COMPOSITION, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-09-29 | — | — | US | disclosed |
| US-9447501-B2 | Forming articles and devices with carbon-coated metal particles | EASTMAN KODAK COMPANY (US) | 2016-09-20 | — | — | US | disclosed |
| US-9448483-B2 | Pattern shrink methods | DOW GLOBAL TECHNOLOGIES LLC (US) | 2016-09-20 | — | — | US | disclosed |
| US-9436082-B2 | Compositions comprising base-reactive component and processes for photolithography | ROHM AND HAAS ELECTRONICS MATERIALS LLC (US) | 2016-09-06 | — | — | US | disclosed |
| US-9434852-B2 | Photocurable compositions with dispersed carbon-coated metal particles | EASTMAN KODAK COMPANY (US) | 2016-09-06 | — | — | US | disclosed |
| US-9428606-B2 | Polyfunctional epoxy compound | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2016-08-30 | — | — | US | disclosed |
| US-9428606-B2 | Polyfunctional epoxy compound | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2016-08-30 | — | — | US | disclosed |
| EP-3059774-A1 | ENHANCED TRANSISTORS EMPLOYING PHOTOACTIVE ORGANIC MATERIALS AND METHODS OF MANUFACTURING SAME | Corning Incorporated (US) | 2016-08-24 | — | — | EP | disclosed |
| EP-3056552-A1 | ACTIVE ENERGY-RAY-CURABLE RESIN COMPOSITION FOR COATING ORGANIC OR INORGANIC SUBSTRATE | Kaneka Corporation (JP) | 2016-08-17 | — | — | EP | disclosed |
| US-9416289-B2 | Active-energy-ray-curable inkjet ink composition, active-energy-ray-curable inkjet ink, and inkjet recording method | Konica Minolta, Inc. (JP) | 2016-08-16 | — | — | US | disclosed |
| US-9416289-B2 | Active-energy-ray-curable inkjet ink composition, active-energy-ray-curable inkjet ink, and inkjet recording method | Konica Minolta, Inc. (JP) | 2016-08-16 | — | — | US | disclosed |
| EP-2138897-B1 | CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF RESIST PATTERN | FUJITSU LTD (JP) | 2016-08-03 | — | — | EP | disclosed |
| US-9400428-B2 | Polymer compound, chemically amplified negative resist composition, photo-curable dry film and production method thereof, layered product, patterning process, and substrate | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-07-26 | — | — | US | disclosed |
| US-20160200877-A1 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, SUBSTRATE, AND SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-07-14 | — | — | US | disclosed |
| EP-3043206-A1 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, SUBSTRATE, AND SEMICONDUCTOR APPARATUS | Shin-Etsu Chemical Co., Ltd. (JP) | 2016-07-13 | — | — | EP | disclosed |
| US-20160187782-A1 | PHOTOLITHOGRAPHIC METHODS | DOW GLOBAL TECHNOLOGIES LLC | 2016-06-30 | — | — | US | disclosed |
| US-20160187781-A1 | METHOD FOR FORMING PATTERN USING ANTI-REFLECTIVE COATING COMPOSITION COMPRISING PHOTOACID GENERATOR | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2016-06-30 | — | — | US | disclosed |
| US-20160187778-A1 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2016-06-30 | — | — | US | disclosed |
| US-9377689-B2 | Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, patterning process, and electric/electronic part-protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-06-28 | — | — | US | disclosed |
| US-20160177020-A1 | MODIFIED HYDROXY NAPHTHALENE NOVOLAK RESIN, PRODUCTION METHOD FOR MODIFIED HYDROXY NAPHTHALENE NOVOLAK RESIN, PHOTOSENSITIVE COMPOSITION, RESIST MATERIAL AND COATING | DIC CORPORATION (JP) | 2016-06-23 | — | — | US | disclosed |
| US-9366961-B2 | Silicone structure-bearing polymer, resin composition, and photo-curable dry film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-06-14 | — | — | US | disclosed |
| US-9359517-B2 | Non-aqueous compositions of dispersed carbon-coated metal particles | EASTMAN KODAK COMPANY (US) | 2016-06-07 | — | — | US | disclosed |
| US-20160152861-A1 | ACTIVE ENERGY-RAY-CURABLE RESIN COMPOSITION FOR COATING ORGANIC OR INORGANIC SUBSTRATE | KANEKA CORPORATION (JP) | 2016-06-02 | — | — | US | disclosed |
| US-20160145467-A1 | ACTIVE ENERGY RAY-CURABLE COMPOSITION | KANEKA CORPORATION (JP) | 2016-05-26 | — | — | US | disclosed |
| US-20160137874-A1 | PHOTORESIST OVERCOAT COMPOSITIONS AND METHODS OF FORMING ELECTRONIC DEVICES | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2016-05-19 | — | — | US | disclosed |
| US-20160130462-A1 | TOPCOAT COMPOSITIONS AND PHOTOLITHOGRAPHIC METHODS | ROHM & HAAS ELECT MAT (US) | 2016-05-12 | — | — | US | disclosed |
| US-20160122574-A1 | PHOTORESIST OVERCOAT COMPOSITIONS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2016-05-05 | — | — | US | disclosed |
| US-20160124309-A1 | PATTERN FORMATION METHODS | ROHM & HAAS ELECT MAT (US) | 2016-05-05 | — | — | US | disclosed |
| EP-2228400-B1 | NOVEL POLYIMIDE SILICONE, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE NOVEL POLYIMIDE SILICONE, AND METHOD FOR PATTERN FORMATION | SHINETSU CHEMICAL CO (JP) | 2016-04-27 | — | — | EP | disclosed |
| US-20160108269-A1 | PHOTOCURABLE COMPOSITIONS WITH DISPERSED CARBON-COATED METAL PARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2016-04-21 | — | — | US | disclosed |
| US-20160108270-A1 | ARTICLES CONTAINING CARBON-COATED METAL PARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2016-04-21 | — | — | US | disclosed |
| WO-2016060856-A1 | DISPERSED CARBON-COATED METAL PARTICLES, ARTICLES AND USES | EASTMAN KODAK COMPANY (US) | 2016-04-21 | — | — | WO | disclosed |
| US-20160108526-A1 | FORMING ARTICLES AND DEVICES WITH CARBON-COATED METAL PARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2016-04-21 | — | — | US | disclosed |
| US-20160108266-A1 | NON-AQUEOUS COMPOSITIONS OF DISPERSED CARBON-COATED METAL PARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2016-04-21 | — | — | US | disclosed |
| US-20160109800-A1 | PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2016-04-21 | — | — | US | disclosed |
| US-9316913-B2 | Underlayer film-forming material for lithography, underlayer film for lithography, and pattern formation method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2016-04-19 | — | — | US | disclosed |
| US-20160103393-A1 | PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2016-04-14 | — | — | US | disclosed |
| US-20160097974-A1 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-04-07 | — | — | US | disclosed |
| US-20160097973-A1 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND AND METHOD FOR PRODUCING SAME, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, AND SUBSTRATE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-04-07 | — | — | US | disclosed |
| EP-3002633-A1 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2016-04-06 | — | — | EP | disclosed |
| EP-3002308-A1 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND AND METHOD FOR PRODUCING SAME, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, AND SUBSTRATE | Shin-Etsu Chemical Co., Ltd. (JP) | 2016-04-06 | — | — | EP | disclosed |
| US-9298093-B2 | Polymers, photoresist compositions and methods of forming photolithographic patterns | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2016-03-29 | — | — | US | disclosed |
| EP-2275490-B1 | Coating compositions for use with an overcoated photoresist | ROHM & HAAS ELECT MAT (US) | 2016-03-23 | — | — | EP | disclosed |
| EP-1276012-B1 | Resist patterning process | SHINETSU CHEMICAL CO (JP) | 2016-03-23 | — | — | EP | disclosed |
| WO-2016040216-A1 | STRUCTURE MODIFYING APPARATUS | THE PROCTER & GAMBLE COMPANY (US) | 2016-03-17 | — | — | WO | disclosed |
| WO-2016040215-A1 | STRUCTURE MODIFYING APPARATUS | THE PROCTER & GAMBLE COMPANY (US) | 2016-03-17 | — | — | WO | disclosed |
| EP-2842984-B1 | POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND PRODUCTION METHOD THEREOF, LAYERED PRODUCT, PATTERNING PROCESS, AND SUBSTRATE | SHINETSU CHEMICAL CO (JP) | 2016-03-16 | — | — | EP | disclosed |
| US-20160067669-A1 | Structure Modifying Apparatus | THE PROCTER & GAMBLE COMPANY | 2016-03-10 | — | — | US | disclosed |
| US-20160067734-A1 | Structure Modifying Apparatus | THE PROCTER & GAMBLE COMPANY | 2016-03-10 | — | — | US | disclosed |
| US-20160062232-A1 | MULTIPLE-PATTERN FORMING METHODS | DOW GLOBAL TECHNOLOGIES LLC | 2016-03-03 | — | — | US | disclosed |
| EP-2479198-B1 | AROMATIC HYDROCARBON RESIN AND COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY | MITSUBISHI GAS CHEMICAL CO (JP) | 2016-02-17 | — | — | EP | disclosed |
| US-20160041467-A1 | PHOTOLITHOGRAPHIC METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2016-02-11 | — | — | US | disclosed |
| EP-2390722-B1 | Methods of forming photolithographic patterns | ROHM & HAAS ELECT MAT (US) | 2016-02-10 | — | — | EP | disclosed |
| US-20160033869-A1 | PATTERN SHRINK METHODS | DOW GLOBAL TECHNOLOGIES LLC | 2016-02-04 | — | — | US | disclosed |
| US-20160033865-A1 | SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-02-04 | — | — | US | disclosed |
| EP-2980172-A1 | SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2016-02-03 | — | — | EP | disclosed |
| US-9248693-B2 | Patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-02-02 | — | — | US | disclosed |
| US-9244352-B2 | Coating compositions for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS, LLC (US) | 2016-01-26 | — | — | US | disclosed |
| US-20160017083-A1 | MODIFIED NOVOLAC PHENOL RESIN, RESIST MATERIAL, COATING FILM, AND RESIST PERMANENT FILM | DAINIPPON INK & CHEMICALS (JP) | 2016-01-21 | — | — | US | disclosed |
| US-20160009924-A1 | COATING COMPOSITIONS SUITABLE FOR USE WITH AN OVERCOATED PHOTORESIST | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2016-01-14 | — | — | US | disclosed |
| US-9229319-B2 | Photoacid-generating copolymer and associated photoresist composition, coated substrate, and method of forming an electronic device | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2016-01-05 | — | — | US | disclosed |
| US-20150376158-A1 | COMPOUND, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-12-31 | — | — | US | disclosed |
| US-20150376202-A1 | COMPOUND, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-12-31 | — | — | US | disclosed |
| EP-2743770-B1 | UNDERLAYER FILM-FORMING MATERIAL FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMATION METHOD | MITSUBISHI GAS CHEMICAL CO (JP) | 2015-12-30 | — | — | EP | disclosed |
| WO-2015199988-A1 | LATEX PRIMER COMPOSITION AND LATEX PRIMED SUBSTRATES | EASTMAN KODAK COMPANY (US) | 2015-12-30 | — | — | WO | disclosed |
| US-20150368805-A1 | PREPARATION OF PATTERNED OR ELECTRICALLY-CONDUCTIVE ARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2015-12-24 | — | — | US | disclosed |
| US-20150370284-A1 | ELECTRONIC DEVICES AND PRECURSOR ARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2015-12-24 | — | — | US | disclosed |
| US-20150368501-A1 | LATEX PRIMER COMPOSITION AND LATEX PRIMED SUBSTRATES | BANK OF AMERICA, N.A., AS AGENT | 2015-12-24 | — | — | US | disclosed |
| US-20150367594-A1 | PATTERNED AND PRIMED TRANSPARENT ARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2015-12-24 | — | — | US | disclosed |
| EP-2955175-A1 | COMPOUND, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2015-12-16 | — | — | EP | disclosed |
| EP-2955577-A1 | COMPOUND, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2015-12-16 | — | — | EP | disclosed |
| US-9212293-B2 | Photoresist overcoat compositions and methods of forming electronic devices | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2015-12-15 | — | — | US | disclosed |
| US-20150353684-A1 | HIGHLY SOLUBLE TRIS- (2, 3-EPOXYPROPYL)- ISOCYANURATE AND METHOD FOR PRODUCING SAME | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2015-12-10 | — | — | US | disclosed |
| US-20150353684-A1 | HIGHLY SOLUBLE TRIS- (2, 3-EPOXYPROPYL)- ISOCYANURATE AND METHOD FOR PRODUCING SAME | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2015-12-10 | — | — | US | disclosed |
| US-20150353482-A1 | PHOTORESIST COMPRISING NITROGEN-CONTAINING COMPOUND | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2015-12-10 | — | — | US | disclosed |
| US-9205628-B1 | Patterned and primed transparent articles | EASTMAN KODAK COMPANY (US) | 2015-12-08 | — | — | US | disclosed |
| US-9207533-B2 | Photopolymerizable compositions for electroless plating methods | EASTMAN KODAK COMPANY (US) | 2015-12-08 | — | — | US | disclosed |
| US-9209028-B2 | Ion implantation methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2015-12-08 | — | — | US | disclosed |
| US-9188862-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, and, actinic ray-sensitive or radiation-sensitive film and pattern forming method, each using the same | FUJIFILM CORPORATION (JP) | 2015-11-17 | — | — | US | disclosed |
| US-9188865-B2 | Actinic ray-sensitive or radiation-sensitive composition, resist film using the same, pattern forming method, method for manufacturing electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2015-11-17 | — | — | US | disclosed |
| US-9188861-B2 | Photopolymerizable compositions for electroless plating methods | EASTMAN KODAK COMPANY (US) | 2015-11-17 | — | — | US | disclosed |
| US-9188864-B2 | Photoresist compositions and methods of forming photolithographic patterns | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2015-11-17 | — | — | US | disclosed |
| US-20150323869-A1 | TOPCOAT COMPOSITIONS AND PHOTOLITHOGRAPHIC METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2015-11-12 | — | — | US | disclosed |
| US-9182669-B2 | Copolymer with acid-labile group, photoresist composition, coated substrate, and method of forming an electronic device | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2015-11-10 | — | — | US | disclosed |
| US-9171720-B2 | Hardmask surface treatment | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2015-10-27 | — | — | US | disclosed |
| US-20150293447-A1 | SILICONE STRUCTURE-BEARING POLYMER, RESIN COMPOSITION, AND PHOTO-CURABLE DRY FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-10-15 | — | — | US | disclosed |
| US-9158191-B2 | Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-10-13 | — | — | US | disclosed |
| US-9158198-B2 | Photoresist compositions and methods of forming photolithographic patterns | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2015-10-13 | — | — | US | disclosed |
| US-9146467-B2 | Coating compositions | MERCK PATENT GMBH (DE) | 2015-09-29 | — | — | US | disclosed |
| US-9140989-B2 | Photosensitive organic particles | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2015-09-22 | — | — | US | disclosed |
| US-9140989-B2 | Photosensitive organic particles | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2015-09-22 | — | — | US | disclosed |
| EP-2336827-B1 | METHOD FOR PROVIDING AN ION-IMPLANTED SEMICONDUCTOR SUBSTRATE | ROHM & HAAS ELECT MAT (US) | 2015-09-16 | — | — | EP | disclosed |
| US-9136123-B2 | Hardmask surface treatment | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2015-09-15 | — | — | US | disclosed |
| US-20150253661-A1 | PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS | BANK OF AMERICA, N.A., AS AGENT | 2015-09-10 | — | — | US | disclosed |
| US-9128379-B2 | Photolithographic methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2015-09-08 | — | — | US | disclosed |
| EP-2293143-B1 | Novel photoresist compositions | ROHM & HAAS ELECT MAT (US) | 2015-09-02 | — | — | EP | disclosed |
| US-9110373-B2 | Phenolic resin and material for forming underlayer film for lithography | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-08-18 | — | — | US | disclosed |
| US-20150227041-A1 | PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS | BANK OF AMERICA, N.A., AS AGENT | 2015-08-13 | — | — | US | disclosed |
| CN-102194673-B | Photoresist and using method thereof | ROHM AND HAAS ELECTRONIC MATERIALS CO., LTD. (US) | 2015-08-05 | — | — | CN | disclosed |
| US-20150212414-A1 | IONIC THERMAL ACID GENERATORS FOR LOW TEMPERATURE APPLICATIONS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2015-07-30 | — | — | US | disclosed |
| US-20150214056-A1 | ION IMPLANTATION METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2015-07-30 | — | — | US | disclosed |
| US-9091919-B2 | Silicone structure-bearing polymer, resin composition, and photo-curable dry film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-07-28 | — | — | US | disclosed |
| EP-2364847-B1 | PHOTOCURABLE DRY FILM, METHOD FOR PREPARING SAME, PATTERNING METHOD AND FILM FOR PROTECTING ELECTRIC AND ELECTRONIC PARTS | SHINETSU CHEMICAL CO (JP) | 2015-07-22 | — | — | EP | disclosed |
| US-20150183912-A1 | (METH)ACRYLATE DERIVATIVE, POLYMER AND PHOTORESIST COMPOSITION HAVING LACTONE STRUCTURE, AND METHOD FOR FORMING PATTERN BY USING IT | NEC CORPORATION (JP) | 2015-07-02 | — | — | US | disclosed |
| US-20150185615-A1 | PHOTOLITHOGRAPHIC METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2015-07-02 | — | — | US | disclosed |
| US-20150185607-A1 | PHOTORESIST OVERCOAT COMPOSITIONS | ROHM AND HAAS ELECRONIC MATERIALS LLC | 2015-07-02 | — | — | US | disclosed |
| US-20150185614-A1 | ORGANIC BOTTOM ANTIREFLECTIVE COATING COMPOSITION FOR NANOLITHOGRAPHY | DUPONT SPECIALTY MATERIALS KOREA LTD (KR) | 2015-07-02 | — | — | US | disclosed |
| US-20150185616-A1 | RESISTS FOR LITHOGRAPHY | PIXELLIGENT TECHNOLOGIES, LLC | 2015-07-02 | — | — | US | disclosed |
| WO-2015094789-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | THE PROCTER & GAMBLE COMPANY (US) | 2015-06-25 | — | — | WO | disclosed |
| US-20150173478-A1 | Methods for Shaping Fibrous Material and Treatment Compositions Therefor | THE PROCTER & GAMBLE COMPANY | 2015-06-25 | — | — | US | disclosed |
| WO-2015094787-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | THE PROCTER & GAMBLE COMPANY (US) | 2015-06-25 | — | — | WO | disclosed |
| WO-2015094788-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | THE PROCTER & GAMBLE COMPANY (US) | 2015-06-25 | — | — | WO | disclosed |
| WO-2015094784-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | THE PROCTER & GAMBLE COMPANY (US) | 2015-06-25 | — | — | WO | disclosed |
| WO-2015094790-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | THE PROCTER & GAMBLE COMPANY (US) | 2015-06-25 | — | — | WO | disclosed |
| US-20150174432-A1 | Methods for Shaping Fibrous Material and Treatment Compositions Therefor | THE PROCTER & GAMBLE COMPANY | 2015-06-25 | — | — | US | disclosed |
| US-20150177614-A1 | COPOLYMER WITH ACID-LABILE GROUP, PHOTORESIST COMPOSITION, COATED SUBSTRATE, AND METHOD OF FORMING AN ELECTRONIC DEVICE | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2015-06-25 | — | — | US | disclosed |
| US-20150177615-A1 | PHOTOACID-GENERATING COPOLYMER AND ASSOCIATED PHOTORESIST COMPOSITION, COATED SUBSTRATE, AND METHOD OF FORMING AN ELECTRONIC DEVICE | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2015-06-25 | — | — | US | disclosed |
| US-20150174793-A1 | Methods for Shaping Fibrous Material and Treatment Compositions Therefor | THE PROCTER & GAMBLE COMPANY | 2015-06-25 | — | — | US | disclosed |
| US-20150177613-A1 | PHOTOACID-GENERATING COPOLYMER AND ASSOCIATED PHOTORESIST COMPOSITION, COATED SUBSTRATE, AND METHOD OF FORMING AN ELECTRONIC DEVICE | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2015-06-25 | — | — | US | disclosed |
| US-20150174035-A1 | Methods for Shaping Fibrous Material and Treatment Compositions Therefor | THE PROCTER & GAMBLE COMPANY | 2015-06-25 | — | — | US | disclosed |
| US-20150173479-A1 | Methods for Shaping Fibrous Material and Treatment Compositions Therefor | THE PROCTER & GAMBLE COMPANY | 2015-06-25 | — | — | US | disclosed |
| US-9063425-B2 | Topcoat compositions and photolithographic methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC. (US) | 2015-06-23 | — | — | US | disclosed |
| US-9063420-B2 | Photoresist composition, coated substrate, and method of forming electronic device | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2015-06-23 | — | — | US | disclosed |
| US-20150159038-A1 | PHOTORESIST OVERCOAT COMPOSITIONS AND METHODS OF FORMING ELECTRONIC DEVICES | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2015-06-11 | — | — | US | disclosed |
| US-20150090691-A1 | MATERIAL FOR FORMING UNDERLAYER FILM LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-04-02 | — | — | US | disclosed |
| CN-103282396-B | Aromatic hydrocarbon resin, composition for forming lithographic underlayer film, and method for forming multilayer resist pattern | MITSUBISHI GAS CHEMICAL CO | 2015-03-18 | — | — | CN | disclosed |
| US-8975001-B2 | Photoresist compositions and methods of forming photolithographic patterns | ROHM AND HAAS ELECTRONICS MATERIALS LLC (US) | 2015-03-10 | — | — | US | disclosed |
| EP-2842984-A1 | Polymer compound, chemically amplified negative resist composition, photo-curable dry film and production method thereof, layered product, patterning process, and substrate | Shin-Etsu Chemical Co., Ltd. (JP) | 2015-03-04 | — | — | EP | disclosed |
| EP-2631259-B1 | Silicone Structure-Bearing Polymer, Resin Composition, and Photo-Curable Dry Film | SHINETSU CHEMICAL CO (JP) | 2015-03-04 | — | — | EP | disclosed |
| US-8969483-B2 | (Meth)acrylate derivative, polymer and photoresist composition having lactone structure, and method for forming pattern by using it | NEC CORPORATION (JP) | 2015-03-03 | — | — | US | disclosed |
| US-8968981-B2 | Coating compositions for use with an overcoated photoresist | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2015-03-03 | — | — | US | disclosed |
| US-20150056545-A1 | POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND PRODUCTION METHOD THEREOF, LAYERED PRODUCT, PATTERNING PROCESS, AND SUBSTRATE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-02-26 | — | — | US | disclosed |
| CN-104330956-A | PHOTORESIST COMPOSITION, COATED SUBSTRATE, AND METHOD OF FORMING ELECTRONIC DEVICE | ROHM & HAAS ELECT MAT | 2015-02-04 | — | — | CN | disclosed |
| CN-103091978-B | Methods of forming photolithographic patterns by negative tone development | ROHM & HAAS ELECT MAT | 2015-01-28 | — | — | CN | disclosed |
| CN-102681341-B | Photoresist compositions and methods of forming photolithographic patterns | ROHM & HAAS ELECT MAT | 2015-01-28 | — | — | CN | disclosed |
| US-20150021289-A1 | PHOTORESIST COMPOSITION, COATED SUBSTRATE, AND METHOD OF FORMING ELECTRONIC DEVICE | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2015-01-22 | — | — | US | disclosed |
| US-20150010857-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE COMPOSITION, RESIST FILM USING THE SAME, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2015-01-08 | — | — | US | disclosed |
| US-8927190-B2 | Photoresist comprising nitrogen-containing compound | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2015-01-06 | — | — | US | disclosed |
| US-8921031-B2 | Photoresist overcoat compositions and methods of forming electronic devices | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-12-30 | — | — | US | disclosed |
| US-20140361415-A1 | PHOTORESISTS AND METHODS FOR USE THEREOF | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2014-12-11 | — | — | US | disclosed |
| US-20140356785-A1 | PHOTORESISTS COMPRISING CARBAMATE COMPONENT | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2014-12-04 | — | — | US | disclosed |
| CN-102681348-B | Methods of forming photolithographic patterns | ROHM & HAAS ELECT MAT | 2014-11-12 | — | — | CN | disclosed |
| US-8883407-B2 | Coating compositions suitable for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-11-11 | — | — | US | disclosed |
| US-8883710-B2 | Compositions and methods incorporating photocatalysts | THE PROCTER & GAMBLE COMPANY (US) | 2014-11-11 | — | — | US | disclosed |
| EP-2799928-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT | Toray Industries, Inc. (JP) | 2014-11-05 | — | — | EP | disclosed |
| EP-1403295-B1 | Ester compounds, polymers, resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2014-10-22 | — | — | EP | disclosed |
| US-8865391-B2 | Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-10-21 | — | — | US | disclosed |
| US-8852844-B2 | Composition for forming silicon-containing film, silicon-containing film-formed substrate and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-10-07 | — | — | US | disclosed |
| US-20140295332-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM AND PATTERN FORMING METHOD, EACH USING THE SAME | FUJIFILM CORPORATION (JP) | 2014-10-02 | — | — | US | disclosed |
| CN-102540703-B | Compositions comprising base-reactive component and processes for photolithography | ROHM AND HAAS ELECTRONIC MATERIALS CO., LTD. (US) | 2014-10-01 | — | — | CN | disclosed |
| US-8846292-B2 | Radiation-sensitive composition | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2014-09-30 | — | — | US | disclosed |
| US-8828651-B2 | Positive-type photosensitive resin composition and cured film manufactured therefrom | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2014-09-09 | — | — | US | disclosed |
| US-8828651-B2 | Positive-type photosensitive resin composition and cured film manufactured therefrom | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2014-09-09 | — | — | US | disclosed |
| US-20140246400-A1 | RESIN HAVING FLUORENE STRUCTURE AND MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2014-09-04 | — | — | US | disclosed |
| US-20140242787-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2014-08-28 | — | — | US | disclosed |
| US-8815754-B2 | Photoresists and methods for use thereof | ROHM AND HAAS ELECTRONICS MATERIALS LLC (US) | 2014-08-26 | — | — | US | disclosed |
| US-8815989-B2 | Resin composition for coating material | KANEKA CORPORATION (JP) | 2014-08-26 | — | — | US | disclosed |
| US-8802783-B2 | — | — | 2014-08-12 | — | — | US | disclosed |
| US-8802798-B2 | (Meth)acrylate derivative, polymer and photoresist composition having lactone structure, and method for forming pattern by using it | NEC CORPORATION (JP) | 2014-08-12 | — | — | US | disclosed |
| EP-2762513-A1 | RESIN HAVING FLUORENE STRUCTURE AND UNDERLAYER FILM-FORMING MATERIAL FOR LITHOGRAPHY | Mitsubishi Gas Chemical Company, Inc. (JP) | 2014-08-06 | — | — | EP | disclosed |
| EP-1099983-B1 | Chemically amplified positive resist composition and patterning method | SHINETSU CHEMICAL CO (JP) | 2014-08-06 | — | — | EP | disclosed |
| US-20140212816-A1 | PHOTOLITHOGRAPHIC METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2014-07-31 | — | — | US | disclosed |
| US-8790867-B2 | Methods of forming photolithographic patterns by negative tone development | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-07-29 | — | — | US | disclosed |
| US-20140202632-A1 | HARDMASK SURFACE TREATMENT | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-07-24 | — | — | US | disclosed |
| US-20140206201-A1 | HARDMASK SURFACE TREATMENT | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-07-24 | — | — | US | disclosed |
| CN-103941547-A | Hardmask Surface Treatment | ROHM & HAAS ELECT MAT | 2014-07-23 | — | — | CN | disclosed |
| CN-103941538-A | Hardmask surface treatment | ROHM & HAAS ELECT MAT | 2014-07-23 | — | — | CN | disclosed |
| US-8778597-B2 | Long-chain alkylene-containing curable epoxy resin composition | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2014-07-15 | — | — | US | disclosed |
| US-8778597-B2 | Long-chain alkylene-containing curable epoxy resin composition | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2014-07-15 | — | — | US | disclosed |
| EP-1788433-B1 | Silicon-containing film forming composition and substrate processing method | SHINETSU CHEMICAL CO (JP) | 2014-07-09 | — | — | EP | disclosed |
| CN-103915331-A | Ion injection method | ROHM & HAAS ELECT MAT | 2014-07-09 | — | — | CN | disclosed |
| US-8771917-B2 | Monomers, polymers, photoresist compositions and methods of forming photolithographic patterns | ROHM AND HAAS ELECTRONICS MATERIALS LLC (US) | 2014-07-08 | — | — | US | disclosed |
| US-20140186776-A1 | PHENOLIC RESIN AND MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2014-07-03 | — | — | US | disclosed |
| EP-2743770-A1 | UNDERLAYER FILM-FORMING MATERIAL FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2014-06-18 | — | — | EP | disclosed |
| EP-2172807-B1 | Composition for forming silicon-containing film, silicon-containing film-formed substrate and patterning process | SHINETSU CHEMICAL CO (JP) | 2014-06-18 | — | — | EP | disclosed |
| CN-103852973-A | Ionic thermal acid generators for low temperature applications | ROHM & HAAS ELECT MAT | 2014-06-11 | — | — | CN | disclosed |
| EP-2172808-B1 | Metal oxide-containing film-forming composition metal oxide-containing film-formed substrate, and patterning process | SHINETSU CHEMICAL CO (JP) | 2014-06-04 | — | — | EP | disclosed |
| US-8741553-B2 | Aromatic hydrocarbon resin, underlayer film forming composition for lithography, and method for forming multilayer resist pattern | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2014-06-03 | — | — | US | disclosed |
| US-8729148-B2 | Photocurable dry film, method for preparing same, patterning method and film for protecting electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-05-20 | — | — | US | disclosed |
| EP-2727578-A2 | Compositions and methods incorporating photocatalysts | The Procter and Gamble Company (US) | 2014-05-07 | — | — | EP | disclosed |
| US-8715905-B2 | Silphenylene-containing photocurable composition, pattern formation method using same, and optical semiconductor element obtained using the method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20140120470-A1 | PHOTORESISTS COMPRISING IONIC COMPOUND | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-05-01 | — | — | US | disclosed |
| US-20140120469-A1 | THERMAL ACID GENERATORS FOR USE IN PHOTORESIST | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-05-01 | — | — | US | disclosed |
| US-8697338-B2 | Photolithographic methods | ROHM AND HAAS ELECTRONICS MATERIALS LLC (US) | 2014-04-15 | — | — | US | disclosed |
| US-8673537-B2 | Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-03-18 | — | — | US | disclosed |
| US-8652750-B2 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-02-18 | — | — | US | disclosed |
| US-8652267-B2 | Coated-type silicon-containing film stripping process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-02-18 | — | — | US | disclosed |
| US-8652755-B2 | Positive photosensitive resin composition and lyophobic film | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2014-02-18 | — | — | US | disclosed |
| US-8652755-B2 | Positive photosensitive resin composition and lyophobic film | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2014-02-18 | — | — | US | disclosed |
| US-20140045119-A1 | PHOTOSENSITIVE ORGANIC PARTICLES | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2014-02-13 | — | — | US | disclosed |
| US-20140045119-A1 | PHOTOSENSITIVE ORGANIC PARTICLES | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2014-02-13 | — | — | US | disclosed |
| US-20140038102-A1 | PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2014-02-06 | — | — | US | disclosed |
| US-20130344439-A1 | PHOTORESISTS COMPRISING AMIDE COMPONENT | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2013-12-26 | — | — | US | disclosed |
| US-8614050-B2 | Polymers, photoresist compositions and methods of forming photolithographic patterns | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2013-12-24 | — | — | US | disclosed |
| US-8609013-B2 | Method of fabricating a microfabricated structure | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2013-12-17 | — | — | US | disclosed |
| EP-2196858-B1 | Coated-type silicon-containing film stripping process | SHINETSU CHEMICAL CO (JP) | 2013-12-04 | — | — | EP | disclosed |
| US-8592134-B2 | Composition for forming base film for lithography and method for forming multilayer resist pattern | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2013-11-26 | — | — | US | disclosed |
| US-20130307913-A1 | ACTIVE-ENERGY-RAY-CURABLE INKJET INK COMPOSITION, ACTIVE-ENERGY-RAY-CURABLE INKJET INK, AND INKJET RECORDING METHOD | Konica Minolta, Inc. (JP) | 2013-11-21 | — | — | US | disclosed |
| EP-2219076-B1 | COMPOSITION FOR FORMING BASE FILM FOR LITHOGRAPHY AND METHOD FOR FORMING MULTILAYER RESIST PATTERN | MITSUBISHI GAS CHEMICAL CO (JP) | 2013-11-20 | — | — | EP | disclosed |
| CN-102346371-B | Photoresist compositions and methods of forming photolithographic patterns | ROHM & HAAS ELECT MAT | 2013-11-20 | — | — | CN | disclosed |
| US-8586289-B2 | Aromatic hydrocarbon resin and composition for forming underlayer film for lithography | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2013-11-19 | — | — | US | disclosed |
| US-20130302735-A1 | MONOMERS, POLYMERS AND PHOTORESIST COMPOSITIONS | ROHM & HAAS ELECT MAT (US) | 2013-11-14 | — | — | US | disclosed |
| EP-2660257-A1 | AROMATIC HYDROCARBON RESIN, COMPOSITION FOR FORMING LITHOGRAPHIC UNDERLAYER FILM, AND METHOD FOR FORMING MULTILAYER RESIST PATTERN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2013-11-06 | — | — | EP | disclosed |
| US-20130284698-A1 | PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-10-31 | — | — | US | disclosed |
| EP-2657766-A1 | Patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-10-30 | — | — | EP | disclosed |
| US-20130280655-A1 | AROMATIC HYDROCARBON RESIN, UNDERLAYER FILM FORMING COMPOSITION FOR LITHOGRAPHY, AND METHOD FOR FORMING MULTILAYER RESIST PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2013-10-24 | — | — | US | disclosed |
| US-20130274433-A1 | POLYFUNCTIONAL EPOXY COMPOUND | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2013-10-17 | — | — | US | disclosed |
| US-20130274433-A1 | POLYFUNCTIONAL EPOXY COMPOUND | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2013-10-17 | — | — | US | disclosed |
| US-8557144-B2 | Material for forming conductive antireflection film, method for forming conductive antireflection film, method for forming resist pattern, semiconductor device, and magnetic head | FUJITSU LIMITED (JP) | 2013-10-15 | — | — | US | disclosed |
| US-8546587-B2 | Method for producing acrylate derivative, acrylate derivative, and intermediate thereof | KURARAY CO., LTD. (JP) | 2013-10-01 | — | — | US | disclosed |
| US-20130244180-A1 | PHOTORESIST OVERCOAT COMPOSITIONS AND METHODS OF FORMING ELECTRONIC DEVICES | ROHM AND HAAS ELECTRONIC MATERIAL LLC (US) | 2013-09-19 | — | — | US | disclosed |
| US-20130244178-A1 | PHOTORESISTS COMPRISING MULTI-AMIDE COMPONENT | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2013-09-19 | — | — | US | disclosed |
| US-20130244438-A1 | PHOTOLITHOGRAPHIC METHODS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2013-09-19 | — | — | US | disclosed |
| US-8535872-B2 | Thermally cured underlayer for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2013-09-17 | — | — | US | disclosed |
| US-20130236833-A1 | COATING COMPOSITIONS | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2013-09-12 | — | — | US | disclosed |
| EP-1953183-B1 | Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film | SHINETSU CHEMICAL CO (JP) | 2013-09-04 | — | — | EP | disclosed |
| US-8524440-B2 | Photoresist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2013-09-03 | — | — | US | disclosed |
| EP-2631259-A1 | Silicone Structure-Bearing Polymer, Resin Composition, and Photo-Curable Dry Film | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-08-28 | — | — | EP | disclosed |
| US-8501383-B2 | Coating compositions for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2013-08-06 | — | — | US | disclosed |
| US-20130196114-A1 | SILICONE STRUCTURE-BEARING POLYMER, RESIN COMPOSITION, AND PHOTO-CURABLE DRY FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-08-01 | — | — | US | disclosed |
| US-8492562-B2 | (Meth)acrylate derivative, intermediate thereof, and polymer compound | KURARAY CO., LTD. (JP) | 2013-07-23 | — | — | US | disclosed |
| US-8486606-B2 | Acrylate derivative, haloester derivative, polymer compound and photoresist composition | KURARAY CO., LTD. (JP) | 2013-07-16 | — | — | US | disclosed |
| EP-2333015-B1 | Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition | SHINETSU CHEMICAL CO (JP) | 2013-07-10 | — | — | EP | disclosed |
| US-8481244-B2 | Epoxy-containing polymer, photo-curable resin composition, patterning process, and electric/electronic part protective film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-07-09 | — | — | US | disclosed |
| US-8475982-B2 | Charge-transporting compound, electrophotographic photoreceptor, image-forming apparatus, and process cartridge | FUJI XEROX CO., LTD. (JP) | 2013-07-02 | — | — | US | disclosed |
| EP-2472328-B1 | Coating compositions for use with an overcoated photoresist | ROHM & HAAS ELECT MAT (US) | 2013-06-19 | — | — | EP | disclosed |
| US-20130149493-A1 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERN FORMING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTING FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-06-13 | — | — | US | disclosed |
| US-20130149645-A1 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERN FORMING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTING FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-06-13 | — | — | US | disclosed |
| EP-2602661-A1 | Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-06-12 | — | — | EP | disclosed |
| EP-2602660-A1 | Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-06-12 | — | — | EP | disclosed |
| EP-2472329-B1 | Coating compositions for use with an overcoated photoresist | ROHM & HAAS ELECT MAT (US) | 2013-06-05 | — | — | EP | disclosed |
| US-8454152-B2 | Ink jet recording device and ink jet recording method | KONICA MINOLTA HOLDINGS, INC. (JP) | 2013-06-04 | — | — | US | disclosed |
| US-8454152-B2 | Ink jet recording device and ink jet recording method | KONICA MINOLTA HOLDINGS, INC. (JP) | 2013-06-04 | — | — | US | disclosed |
| US-8455176-B2 | Coating composition | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2013-06-04 | — | — | US | disclosed |
| US-20130136897-A1 | RESISTS FOR LITHOGRAPHY | PIXELLIGENT TECHNOLOGIES, LLC (US) | 2013-05-30 | — | — | US | disclosed |
| US-20130122419-A1 | (METH)ACRYLATE DERIVATIVE, POLYMER AND PHOTORESIST COMPOSITION HAVING LACTONE STRUCTURE, AND METHOD FOR FORMING PATTERN BY USING IT | NEC CORPORATION (JP) | 2013-05-16 | — | — | US | disclosed |
| US-8439480-B2 | Ink jet recording apparatus, and ink jet recording method | KONICA MINOLTA HOLDINGS, INC. (JP) | 2013-05-14 | — | — | US | disclosed |
| US-8439480-B2 | Ink jet recording apparatus, and ink jet recording method | KONICA MINOLTA HOLDINGS, INC. (JP) | 2013-05-14 | — | — | US | disclosed |
| US-20130115553-A1 | TOPCOAT COMPOSITIONS AND PHOTOLITHOGRAPHIC METHODS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2013-05-09 | — | — | US | disclosed |
| US-20130115559-A1 | METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS BY NEGATIVE TONE DEVELOPMENT | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2013-05-09 | — | — | US | disclosed |
| US-8435718-B2 | Upper layer-forming composition and photoresist patterning method | JSR CORPORATION (JP) | 2013-05-07 | — | — | US | disclosed |
| US-20130105440-A1 | NANOCOMPOSITE NEGATIVE PHOTOSENSITIVE COMPOSITION AND USE THEREOF | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2013-05-02 | — | — | US | disclosed |
| US-8431722-B2 | Acrylate ester derivatives and polymer compounds | KURARAY CO., LTD. (JP) | 2013-04-30 | — | — | US | disclosed |
| US-8426107-B2 | Positive-type photosensitive composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2013-04-23 | — | — | US | disclosed |
| US-8426093-B2 | photosensitive layer has a charge transferring compound having hole transportation ability; hardening by heating, stable electrical properties | FUJI XEROX CO., LTD. (JP) | 2013-04-23 | — | — | US | disclosed |
| US-8403453-B2 | Method for forming inkjet image while flowing the ink in an ink chamber | KONICA MINOLTA HOLDINGS, INC. (JP) | 2013-03-26 | — | — | US | disclosed |
| EP-1942375-B1 | Inkjet printer head comprising photosensitive polymer complex containing silver nanoparticles and method of preparing the photosensitive polymer complex | SAMSUNG ELECTRONICS CO LTD (KR) | 2013-02-27 | — | — | EP | disclosed |
| US-8383316-B2 | Multi-step; reversible; provide exposure quadratically dependant on intensity of light; semiconductors | PIXELLIGENT TECHNOLOGIES, LLC (US) | 2013-02-26 | — | — | US | disclosed |
| US-8383317-B2 | Surface treatment of interpenetrating polymer networkcarbon tubes; photolithography; modifying surfaces of carbon nanotubes with polymerizable functional groups such as oxirane and anhydride groups; heat curing; negative patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2013-02-26 | — | — | US | disclosed |
| US-8378016-B2 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2013-02-19 | — | — | US | disclosed |
| US-8362169-B2 | Acrylate ester derivatives and polymer compounds | KURARAY CO., LTD. (JP) | 2013-01-29 | — | — | US | disclosed |
| US-20130011783-A1 | MONOMERS, POLYMERS, PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2013-01-10 | — | — | US | disclosed |
| EP-1788436-B1 | Rework process for photoresist film | SHINETSU CHEMICAL CO (JP) | 2013-01-09 | — | — | EP | disclosed |
| US-8349916-B2 | Actinic energy radiation curable ink-jet ink, ink-jet recording method, and printed matter | KONICA MINOLTA IJ TECHNOLOGIES, INC. (JP) | 2013-01-08 | — | — | US | disclosed |
| US-8349780-B2 | Compositions and methods incorporating photocatalysts | THE PROCTER & GAMBLE COMPANY (US) | 2013-01-08 | — | — | US | disclosed |
| US-20130004894-A1 | UNDER COAT FILM MATERIAL AND METHOD OF FORMING MULTILAYER RESIST PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2013-01-03 | — | — | US | disclosed |
| US-20130004901-A1 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2013-01-03 | — | — | US | disclosed |
| US-20130004893-A1 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2013-01-03 | — | — | US | disclosed |
| US-20130005990-A1 | METHOD FOR PRODUCING ACRYLATE DERIVATIVE, ACRYLATE DERIVATIVE, AND INTERMEDIATE THEREOF | KURARAY CO., LTD. (JP) | 2013-01-03 | — | — | US | disclosed |
| US-8338072-B2 | Resist composition, resist pattern forming process, and method for manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2012-12-25 | — | — | US | disclosed |
| EP-2535768-A1 | UNDERLAYER FILM MATERIAL, AND METHOD FOR FORMATION OF MULTILAYER RESIST PATTERN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2012-12-19 | — | — | EP | disclosed |
| US-20120316349-A1 | ACRYLATE ESTER DERIVATIVES AND POLYMER COMPOUNDS | KURARAY CO., LTD. (JP) | 2012-12-13 | — | — | US | disclosed |
| US-8329376-B2 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-12-11 | — | — | US | disclosed |
| US-8329377-B2 | Imide compound and chemically amplified resist composition containing the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2012-12-11 | — | — | US | disclosed |
| US-20120308927-A1 | POLYMERS, PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAHIC PATTERNS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2012-12-06 | — | — | US | disclosed |
| EP-1225479-B1 | A chemical amplifying type positive resist composition | SUMITOMO CHEMICAL CO (JP) | 2012-12-05 | — | — | EP | disclosed |
| US-20120295199-A1 | LONG-CHAIN ALKYLENE-CONTAINING CURABLE EPOXY RESIN COMPOSITION | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2012-11-22 | — | — | US | disclosed |
| US-8314258-B2 | Method for producing acrylate derivative, acrylate derivative, and intermediate thereof | KURARAY CO., LTD. (JP) | 2012-11-20 | — | — | US | disclosed |
| US-8313890-B2 | Antireflective coating composition, antireflective coating, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-11-20 | — | — | US | disclosed |
| US-20120288794-A1 | POLYMERS, PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2012-11-15 | — | — | US | disclosed |
| US-20120283350-A1 | RESIN COMPOSITION FOR COATING MATERIAL | KANEKA CORPORATION (JP) | 2012-11-08 | — | — | US | disclosed |
| EP-1813985-B1 | Antireflection film composition, substrate, and pattering process | SHINETSU CHEMICAL CO (JP) | 2012-10-31 | — | — | EP | disclosed |
| EP-2510398-A2 | COMPOSITIONS COMPRISING BASE-REACTIVE COMPONENT AND PROCESSES FOR PHOTOLITHOGRAPHY | Rohm and Haas Electronic Materials LLC (US) | 2012-10-17 | — | — | EP | disclosed |
| US-8288072-B2 | Antireflection film; fast etching speed whcih reduces deformation; accuracy; 2,3-epoxypropyl methacrylate ester-styrene copolymer | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-10-16 | — | — | US | disclosed |
| EP-2499208-A1 | COMPOSITIONS AND METHODS INCORPORATING PHOTOCATALYSTS | The Procter & Gamble Company (US) | 2012-09-19 | — | — | EP | disclosed |
| US-8268540-B2 | Method of manufacturing light receiving device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2012-09-18 | — | — | US | disclosed |
| US-8263308-B2 | Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-09-11 | — | — | US | disclosed |
| US-20120219901-A1 | PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-08-30 | — | — | US | disclosed |
| US-20120219902-A1 | PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-08-30 | — | — | US | disclosed |
| EP-2492749-A1 | Photoresist compositions and methods of forming photolithographic patterns | Rohm and Haas Electronic Materials LLC (US) | 2012-08-29 | — | — | EP | disclosed |
| EP-2492750-A1 | Photoresist compositions and methods of forming photolithographic patterns | Rohm and Haas Electronic Materials LLC (US) | 2012-08-29 | — | — | EP | disclosed |
| US-8247166-B2 | Double patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-08-21 | — | — | US | disclosed |
| US-8241830-B2 | Positive resist composition and a pattern forming method using the same | FUJIFILM CORPORATION (JP) | 2012-08-14 | — | — | US | disclosed |
| WO-2012104262-A1 | PHOTORESPONSIVE MICROCAPSULES AND COMPOSITIONS CONTAINING SAME | UNIVERSIDAD DE SEVILLA (ES) | 2012-08-09 | — | — | WO | disclosed |
| US-20120199957-A1 | PHOTORESISTS AND METHODS FOR USE THEREOF | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-08-09 | — | — | US | disclosed |
| EP-2479198-A1 | AROMATIC HYDROCARBON RESIN AND COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY | Mitsubishi Gas Chemical Company, Inc. (JP) | 2012-07-25 | — | — | EP | disclosed |
| EP-2477215-A2 | Resin composition, embedding material, insulating layer and semiconductor device | Sumitomo Bakelite Company Limited (JP) | 2012-07-18 | — | — | EP | disclosed |
| US-20120178871-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | DE BINOD B (US) | 2012-07-12 | — | — | US | disclosed |
| US-20120178023-A1 | (METH)ACRYLATE DERIVATIVE, POLYMER AND PHOTORESIST COMPOSITION HAVING LACTONE STRUCTURE, AND METHOD FOR FORMING PATTERN BY USING IT | NEC CORPORATION | 2012-07-12 | — | — | US | disclosed |
| US-20120171626-A1 | COMPOSITIONS COMPRISING BASE-REACTIVE COMPONENT AND PROCESSES FOR PHOTOLITHOGRAPHY | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-07-05 | — | — | US | disclosed |
| US-20120171611-A1 | AROMATIC HYDROCARBON RESIN AND COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2012-07-05 | — | — | US | disclosed |
| US-20120171617-A1 | POLYMERS, PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2012-07-05 | — | — | US | disclosed |
| EP-2472324-A1 | Monomers, polymers, photoresist compositions and methods of forming photolithographic patterns | Rohm and Haas Electronic Materials LLC (US) | 2012-07-04 | — | — | EP | disclosed |
| EP-2472329-A1 | Coating compositions for use with an overcoated photoresist | Rohm and Haas Electronic Materials LLC (US) | 2012-07-04 | — | — | EP | disclosed |
| EP-2472325-A1 | Polymers, photoresist compositions and methods of forming photolithographic patterns | Rohm and Haas Electronic Materials LLC (US) | 2012-07-04 | — | — | EP | disclosed |
| EP-2472326-A1 | Polymers, photoresist compositions and methods of forming photolithographic patterns | Rohm and Haas Electronic Materials LLC (US) | 2012-07-04 | — | — | EP | disclosed |
| EP-2472328-A1 | Coating compositions for use with an overcoated photoresist | Rohm and Haas Electronic Materials LLC (US) | 2012-07-04 | — | — | EP | disclosed |
| EP-2472320-A2 | Compositions comprising base-reactive component and processes for photolithography | Rohm and Haas Electronic Materials LLC (US) | 2012-07-04 | — | — | EP | disclosed |
| EP-2472327-A1 | Photoresists and methods for use thereof | Rohm and Haas Electronic Materials LLC (US) | 2012-07-04 | — | — | EP | disclosed |
| US-8211957-B2 | Negative pattern of carbon nanotubes and carbon nanotube composite comprising surface-modified carbon nanotubes | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-07-03 | — | — | US | disclosed |
| EP-2467122-A2 | PHOTORESPONSIVE SUNSCREEN COMPOSITION | Blueshift Pharma GmbH (CH) | 2012-06-27 | — | — | EP | disclosed |
| US-8206888-B2 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2012-06-26 | — | — | US | disclosed |
| US-20120148647-A1 | Photoresponsive Sunscreen Composition | BLUESHIFT PHARMA GMBH (CH) | 2012-06-14 | — | — | US | disclosed |
| US-8198016-B2 | Patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-06-12 | — | — | US | disclosed |
| EP-2461213-A1 | Polymers, photoresist compositions and methods of forming photolithographic patterns | Rohm and Haas Electronic Materials LLC (US) | 2012-06-06 | — | — | EP | disclosed |
| US-20120122030-A1 | COMPOSITIONS COMPRISING BASE-REACTIVE COMPONENT AND PROCESSES FOR PHOTOLITHOGRAPHY | DOW GLOBAL TECHNOLOGIES LLC (US) | 2012-05-17 | — | — | US | disclosed |
| EP-2453308-A1 | Compositions comprising base-reactive component and processes for photolithography | Rohm and Haas Electronic Materials LLC (US) | 2012-05-16 | — | — | EP | disclosed |
| US-8178284-B2 | Method of forming pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2012-05-15 | — | — | US | disclosed |
| US-8173350-B2 | Oxime compound and resist composition containing the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2012-05-08 | — | — | US | disclosed |
| EP-1950610-B1 | IMMERSION LITHOGRAPHIC COMPOSITION FOR FORMING UPPER FILM AND METHOD FOR FORMING PHOTORESIST PATTERN | JSR CORP (JP) | 2012-05-02 | — | — | EP | disclosed |
| US-8168371-B2 | Positive photosensitive resin composition | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2012-05-01 | — | — | US | disclosed |
| US-8158338-B2 | Resist sensitizer | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2012-04-17 | — | — | US | disclosed |
| US-8153346-B2 | Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2012-04-10 | — | — | US | disclosed |
| US-20120077120-A1 | PHOTORESISTS COMPRISING MULTI-AMIDE COMPONENT | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-03-29 | — | — | US | disclosed |
| US-20120064456-A1 | PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2012-03-15 | — | — | US | disclosed |
| EP-2428843-A1 | Photoresist compositions and methods of forming photolithographic patterns | Rohm and Haas Electronic Materials LLC (US) | 2012-03-14 | — | — | EP | disclosed |
| EP-2428842-A1 | Photoresists comprising multi-amide component | Rohm and Haas Electronic Materials LLC (US) | 2012-03-14 | — | — | EP | disclosed |
| EP-2424947-A1 | COMPOSITIONS AND METHODS INCORPORATING PHOTOCATALYSTS | The Procter & Gamble Company (US) | 2012-03-07 | — | — | EP | disclosed |
| US-8129100-B2 | Double patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-03-06 | — | — | US | disclosed |
| US-8129086-B2 | Polymerizable compound, polymer, positive resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-03-06 | — | — | US | disclosed |
| US-8129099-B2 | Double patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-03-06 | — | — | US | disclosed |
| US-8119751-B2 | — | — | 2012-02-21 | — | — | US | disclosed |
| US-8110339-B2 | Multi-tone resist compositions | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2012-02-07 | — | — | US | disclosed |
| US-8110336-B2 | Resin and chemically amplified resist composition comprising the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2012-02-07 | — | — | US | disclosed |
| US-8110334-B2 | Radiation-sensitive composition | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2012-02-07 | — | — | US | disclosed |
| US-20120028198-A1 | UPPER LAYER-FORMING COMPOSITION AND PHOTORESIST PATTERNING METHOD | JSR CORPORATION (JP) | 2012-02-02 | — | — | US | disclosed |
| US-8105760-B2 | Patterning process and pattern surface coating composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-01-31 | — | — | US | disclosed |
| US-8105764-B2 | Patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-01-31 | — | — | US | disclosed |
| EP-2305754-B1 | Epoxy-containing polymer photo-curable resin composition, patterning process and electric/electronic part protective film | SHINETSU CHEMICAL CO (JP) | 2012-01-25 | — | — | EP | disclosed |
| US-8090287-B2 | Charging member cleaning unit, method of producing charging member cleaning unit, charging device, process cartridge and image forming apparatus | FUJI XEROX CO., LTD. (JP) | 2012-01-03 | — | — | US | disclosed |
| US-8088554-B2 | Bottom resist layer composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD (JP) | 2012-01-03 | — | — | US | disclosed |
| US-8090298-B2 | Electrostatic charging member, electrostatic charging device, process cartridge and image forming apparatus | FUJI XEROX CO., LTD. (JP) | 2012-01-03 | — | — | US | disclosed |
| US-8071270-B2 | Polyhydric compound and chemically amplified resist composition containing the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2011-12-06 | — | — | US | disclosed |
| EP-2390722-A1 | Photoresist compositions and methods of forming photolithographic patterns | Rohm and Haas Electronic Materials LLC (US) | 2011-11-30 | — | — | EP | disclosed |
| EP-2387735-A1 | NONPOLYMERIC BINDERS FOR SEMICONDUCTOR SUBSTRATE COATINGS | FujiFilm Electronic Materials USA, Inc. (US) | 2011-11-23 | — | — | EP | disclosed |
| US-8057982-B2 | Monomer, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-11-15 | — | — | US | disclosed |
| EP-2063319-B1 | Metal oxide-containing film-forming composition, multilayer resist and method of formation of pattern in a substrate | SHINETSU CHEMICAL CO (JP) | 2011-11-02 | — | — | EP | disclosed |
| US-8048611-B2 | Polyorganosiloxane, resin composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-11-01 | — | — | US | disclosed |
| US-20110254133-A1 | PHOTORESISTS AND METHODS FOR USE THEREOF | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-10-20 | — | — | US | disclosed |
| US-20110255061-A1 | COMPOSITIONS COMPRISING BASE-REACTIVE COMPONENT AND PROCESSES FOR PHOTOLITHOGRAPHY | ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. (US) | 2011-10-20 | — | — | US | disclosed |
| US-20110257693-A1 | HARD TISSUE ANCHORS AND DELIVERY DEVICES | TC1 LLC | 2011-10-20 | — | — | US | disclosed |
| US-20110254140-A1 | PHOTORESISTS AND METHODS FOR USE THEREOF | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-10-20 | — | — | US | disclosed |
| US-20110256481-A1 | PHOTORESISTS AND METHODS OF USE THEREOF | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-10-20 | — | — | US | disclosed |
| US-8037621-B2 | Article of footwear including a woven strap system | NIKE, INC. (US) | 2011-10-18 | — | — | US | disclosed |
| US-8029974-B2 | Metal oxide-containing film-forming composition, metal oxide-containing film-formed substrate, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-10-04 | — | — | US | disclosed |
| US-8026038-B2 | Metal oxide-containing film-forming composition, metal oxide-containing film, metal oxide-containing film-bearing substrate, and patterning method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-09-27 | — | — | US | disclosed |
| US-20110223535-A1 | PHOTORESIST COMPRISING NITROGEN-CONTAINING COMPOUND | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-09-15 | — | — | US | disclosed |
| EP-2364847-A1 | Photocurable dry film, method for preparing same, patterning method and film for protecting electric and electronic parts | Shin-Etsu Chemical Co., Ltd. (JP) | 2011-09-14 | — | — | EP | disclosed |
| EP-1645909-B1 | Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film | SHINETSU CHEMICAL CO (JP) | 2011-08-24 | — | — | EP | disclosed |
| EP-1741705-B1 | Fluorinated cyclic structure-bearing silicon compounds and silicone resins, resist compositions using the same, and patterning process | SHINETSU CHEMICAL CO (JP) | 2011-08-24 | — | — | EP | disclosed |
| US-7999354-B2 | Resin composition, filling material, insulating layer and semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-08-16 | — | — | US | disclosed |
| US-20110196122-A1 | (METH)ACRYLATE DERIVATIVE, POLYMER AND PHOTORESIST COMPOSITION HAVING LACTONE STRUCTURE, AND METHOD FOR FORMING PATTERN BY USING IT | NEC CORPORATION | 2011-08-11 | — | — | US | disclosed |
| EP-2348360-A1 | Photoresist comprising nitrogen-containing compound | Rohm and Haas Electronic Materials LLC (US) | 2011-07-27 | — | — | EP | disclosed |
| US-20110165519-A1 | RESIN SUITABLE FOR AN ACID GENERATOR AND A CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION CONTAINING THE SAME | ANDO NOBUO | 2011-07-07 | — | — | US | disclosed |
| US-20110165387-A1 | ACTINIC ENERGY RADIATION CURABLE INK-JET INK, IMAGE FORMING METHOD USING THE SAME, AND PRINTED MATTER OBTAINED THEREBY | KONICA MINOLTA IJ TECHNOLOGIES, INC. (JP) | 2011-07-07 | — | — | US | disclosed |
| US-20110165513-A1 | PHOTORESIST COMPOSITION | SUMITOMO CHEMICAL COMPANY LTD (JP) | 2011-07-07 | — | — | US | disclosed |
| US-7972763-B2 | Patterns having high resolution; used for semiconductor microfabrication employing a lithography | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2011-07-05 | — | — | US | disclosed |
| EP-2336829-A1 | Photoresists and methods for use thereof | Rohm and Haas Electronic Materials LLC (US) | 2011-06-22 | — | — | EP | disclosed |
| EP-2336828-A2 | Photoresists and methods for use thereof | Rohm and Haas Electronic Materials LLC (US) | 2011-06-22 | — | — | EP | disclosed |
| EP-2336827-A1 | Photoresists and methods for use thereof | Rohm and Haas Electronic Materials LLC (US) | 2011-06-22 | — | — | EP | disclosed |
| US-20110143103-A1 | PHOTO-CURABLE RESIN COMPOSITION, PATTERN FORMING METHOD AND SUBSTRATE PROTECTING FILM, AND FILM-SHAPED ADHESIVE AND ADHESIVE SHEET USING SAID COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-06-16 | — | — | US | disclosed |
| US-20110141187-A1 | METHOD FOR FORMING INKJET IMAGE | KONICA MINOLTA HOLDINGS, INC. (JP) | 2011-06-16 | — | — | US | disclosed |
| US-20110143092-A1 | PHOTOCURABLE DRY FILM, METHOD FOR PREPARING SAME, PATTERNING METHOD AND FILM FOR PROTECTING ELECTRIC AND ELECTRONIC PARTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-06-16 | — | — | US | disclosed |
| WO-2011072307-A2 | COMPOSITIONS COMPRISING BASE-REACTIVE COMPONENT AND PROCESSES FOR PHOTOLITHOGRAPHY | ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. (US) | 2011-06-16 | — | — | WO | disclosed |
| EP-2333015-A2 | Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition | Shin-Etsu Chemical Co., Ltd. (JP) | 2011-06-15 | — | — | EP | disclosed |
| US-20110117497-A1 | ACRYLATE DERIVATIVE, HALOESTER DERIVATIVE, POLYMER COMPOUND AND PHOTORESIST COMPOSITION | KURARAY CO., LTD. (JP) | 2011-05-19 | — | — | US | disclosed |
| US-20110114108-A1 | Compositions and Methods Incorporating Photocatalysts | THE PROCTER & GAMBLE COMPANY | 2011-05-19 | — | — | US | disclosed |
| WO-2011060110-A1 | COMPOSITIONS AND METHODS INCORPORATING PHOTOCATALYSTS | THE PROCTER & GAMBLE COMPANY (US) | 2011-05-19 | — | — | WO | disclosed |
| US-20110101503-A1 | HYPERBRANCHED POLYMER SYNTHESIZING METHOD, HYPERBRANCHED POLYMER, RESIST COMPOSITION, SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION METHOD | LION CORPORATION (JP) | 2011-05-05 | — | — | US | disclosed |
| US-20110096132-A1 | INK JET RECORDING DEVICE AND INK JET RECORDING METHOD | KONICA MINOLTA HOLDINGS, INC. (JP) | 2011-04-28 | — | — | US | disclosed |
| EP-2112188-B1 | Polyorganosiloxane, resin composition, and patterning process | SHINETSU CHEMICAL CO (JP) | 2011-04-27 | — | — | EP | disclosed |
| US-7932334-B2 | Resin suitable for an acid generator | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2011-04-26 | — | — | US | disclosed |
| US-7923195-B2 | Positive resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-04-12 | — | — | US | disclosed |
| US-7923110-B2 | Metal nanoparticle having a self-assembled monolayer on its surface, and formation of conductive pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-04-12 | — | — | US | disclosed |
| EP-2305754-A1 | Epoxy-containing polymer photo-curable resin composition, patterning process and electric/electronic part protective film | Shin-Etsu Chemical Co., Ltd. (JP) | 2011-04-06 | — | — | EP | disclosed |
| US-20110076465-A1 | EPOXY-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTIVE FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-03-31 | — | — | US | disclosed |
| US-7915467-B2 | layer contains a cyclic olefin resin having an epoxy group and a photoacid generator; low stress properties and adhesion; prevent breakage of the semiconductor wafer in a process for grinding the backside to make them thinner | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-03-29 | — | — | US | disclosed |
| US-7910283-B2 | Silicon-containing antireflective coating forming composition, silicon-containing antireflective coating, substrate processing intermediate, and substrate processing method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-03-22 | — | — | US | disclosed |
| US-20110064913-A1 | POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION | TOKYO OHKA KOGYO CO., LTD (JP) | 2011-03-17 | — | — | US | disclosed |
| US-20110060112-A1 | ACRYLATE ESTER DERIVATIVES AND POLYMER COMPOUNDS | KURARAY CO., LTD. (JP) | 2011-03-10 | — | — | US | disclosed |
| EP-2293143-A2 | Novel resins and photoresist compositions comprising the same | Rohm and Haas Electronic Materials, L.L.C. (US) | 2011-03-09 | — | — | EP | disclosed |
| US-7896485-B2 | Light cure of cationic ink on acidic substrates | GERBER SCIENTIFIC INTERNATIONAL, INC. (US) | 2011-03-01 | — | — | US | disclosed |
| WO-2011020928-A2 | PHOTORESPONSIVE SUNSCREEN COMPOSITION | BLUESHIFT PHARMA GMBH (CH) | 2011-02-24 | — | — | WO | disclosed |
| US-7893293-B2 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2011-02-22 | — | — | US | disclosed |
| US-20110039206-A1 | NOVEL RESINS AND PHOTORESIST COMPOSITIONS COMPRISING SAME | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-02-17 | — | — | US | disclosed |
| US-20110039210-A1 | NOVEL RESINS AND PHOTORESIST COMPOSITIONS COMPRISING SAME | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-02-17 | — | — | US | disclosed |
| US-20110040056-A1 | PROCESS FOR PRODUCTION OF POLYMER | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2011-02-17 | — | — | US | disclosed |
| US-7887991-B2 | Positive resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-02-15 | — | — | US | disclosed |
| US-20110033800-A1 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-02-10 | — | — | US | disclosed |
| US-20110033804-A1 | PHOTORESIST COMPOSITION | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2011-02-10 | — | — | US | disclosed |
| US-20110033801-A1 | COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-02-10 | — | — | US | disclosed |
| EP-2280308-A1 | Processes for photolithography | Rohm and Haas Electronic Materials, L.L.C. (US) | 2011-02-02 | — | — | EP | disclosed |
| US-7878642-B2 | Image forming method, actinic radiation curable ink-jet ink, and inkjet recording apparatus | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2011-02-01 | — | — | US | disclosed |
| US-7879530-B2 | Antireflective coating composition, antireflective coating, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-02-01 | — | — | US | disclosed |
| US-7878644-B2 | Light cure of cationic ink on acidic substrates | GERBER SCIENTIFIC INTERNATIONAL, INC. (US) | 2011-02-01 | — | — | US | disclosed |
| US-7875417-B2 | Heat curable; mixture of hydrolytic condensation of a silicon compound using acid catalyst; second compound is hydrolytic condensation of a silicon compound in presence of basic catalyst; hydroxide or organic acid salt of Group 1a metal; organic acid; alcohol containing ether groups and solvent | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-01-25 | — | — | US | disclosed |
| US-7875416-B2 | Composition for forming photosensitive polymer complex and method of preparing photosensitive polymer complex containing silver nanoparticles using the composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-01-25 | — | — | US | disclosed |
| EP-2275490-A1 | Coating compositions for use with an overcoated photoresist | Rohm and Haas Electronic Materials, L.L.C. (US) | 2011-01-19 | — | — | EP | disclosed |
| EP-1122606-B1 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL CO (JP) | 2011-01-19 | — | — | EP | disclosed |
| EP-2273968-A1 | COMPOSITIONS AND METHODS INCORPORATING PHOTOCATALYSTS | THE PROCTER & GAMBLE COMPANY (US) | 2011-01-19 | — | — | EP | disclosed |
| US-7871761-B2 | Resist lower layer material, resist lower layer substrate comprising the material and method for forming pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-01-18 | — | — | US | disclosed |
| US-20110009643-A1 | METHOD FOR PRODUCING ACRYLATE DERIVATIVE, ACRYLATE DERIVATIVE, AND INTERMEDIATE THEREOF | KURARAY CO., LTD. (JP) | 2011-01-13 | — | — | US | disclosed |
| US-7867690-B2 | Tertiary alcohol derivative, polymer compound and photoresist composition | KURARAY CO., LTD. (JP) | 2011-01-11 | — | — | US | disclosed |
| US-7868407-B2 | Substrate comprising a lower silicone resin film and an upper silicone resin film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-01-11 | — | — | US | disclosed |
| US-20110003257-A1 | PROCESSES FOR PHOTOLITHOGRAPHY | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-01-06 | — | — | US | disclosed |
| US-20110001779-A1 | INKJET RECORDING APPARATUS AND INKJET RECORDING METHOD | KONICA MINOLTA HOLDINGS, INC. (JP) | 2011-01-06 | — | — | US | disclosed |
| US-20110003250-A1 | COATING COMPOSITIONS SUITABLE FOR USE WITH AN OVERCOATED PHOTORESIST | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-01-06 | — | — | US | disclosed |
| US-20100331508-A1 | (METH)ACRYLATE DERIVATIVE, INTERMEDIATE THEREOF, AND POLYMER COMPOUND | KURARAY CO., LTD. (JP) | 2010-12-30 | — | — | US | disclosed |
| US-20100323298-A1 | Photosensitive composition, microfabrication method using the same, and microfabricated structure thereof | PARK JONG JIN | 2010-12-23 | — | — | US | disclosed |
| US-7855043-B2 | Hydrolytic condensation of organosilicon compound using acid and basic catalyst with Group 1a hydroxide, organic acid and solvent; efficiency patterning photoresist film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-12-21 | — | — | US | disclosed |
| US-20100316950-A1 | COMPOSITION FOR FORMING BASE FILM FOR LITHOGRAPHY AND METHOD FOR FORMING MULTILAYER RESIST PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2010-12-16 | — | — | US | disclosed |
| EP-2261738-A2 | Coating compositions suitable for use with an overcoated photoresist | Rohm and Haas Electronic Materials, L.L.C. (US) | 2010-12-15 | — | — | EP | disclosed |
| EP-2258691-A1 | Coating compositions for use with an overcoated photoresist | Rohm and Haas Electronic Materials, L.L.C. (US) | 2010-12-08 | — | — | EP | disclosed |
| US-20100297851-A1 | COMPOSITIONS AND METHODS FOR MULTIPLE EXPOSURE PHOTOLITHOGRAPHY | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2010-11-25 | — | — | US | disclosed |
| EP-2253647-A1 | Novel resins and photoresist compositions comprising same | Rohm and Haas Electronic Materials, L.L.C. (US) | 2010-11-24 | — | — | EP | disclosed |
| WO-2010126919-A1 | COMPOSITIONS AND METHODS INCORPORATING PHOTOCATALYSTS | THE PROCTER & GAMBLE COMPANY (US) | 2010-11-04 | — | — | WO | disclosed |
| EP-1324134-B1 | Resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2010-10-20 | — | — | EP | disclosed |
| US-7808083-B2 | Semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2010-10-05 | — | — | US | disclosed |
| US-7807331-B2 | Hydrogenated ring-opening metathesis polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-10-05 | — | — | US | disclosed |
| US-20100247800-A1 | Compositions and Methods Incorporating Photocatalysts | THE PROCTER & GAMBLE COMPANY | 2010-09-30 | — | — | US | disclosed |
| US-7803514-B2 | Photosensitive composition, microfabrication method using the same, and microfabricated structure thereof | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-09-28 | — | — | US | disclosed |
| US-7799506-B2 | Positive resist composition and pattern forming method using the same | FUJIFILM CORPORATION (JP) | 2010-09-21 | — | — | US | disclosed |
| US-20100233619-A1 | NOVEL POLYIMIDE SILICONE, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE NOVEL POLYIMIDE SILICONE, AND METHOD FOR PATTERN FORMATION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-09-16 | — | — | US | disclosed |
| EP-2228400-A1 | Novel polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation | Shin-Etsu Chemical Co., Ltd. (JP) | 2010-09-15 | — | — | EP | disclosed |
| US-7794915-B2 | Hydrogenated ring-opening metathesis polymer, resist composition comprising the same and patterning method | MITSUI CHEMICALS, INC. (JP) | 2010-09-14 | — | — | US | disclosed |
| US-7794913-B2 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2010-09-14 | — | — | US | disclosed |
| EP-1096317-B1 | Resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2010-09-08 | — | — | EP | disclosed |
| US-7785766-B2 | Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-08-31 | — | — | US | disclosed |
| EP-2219076-A1 | COMPOSITION FOR FORMING BASE FILM FOR LITHOGRAPHY AND METHOD FOR FORMING MULTILAYER RESIST PATTERN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2010-08-18 | — | — | EP | disclosed |
| US-7776504-B2 | Dye-containing resist composition and color filter using same | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2010-08-17 | — | — | US | disclosed |
| US-20100193122-A1 | PROCESS FOR MANUFACTURING ELECTRONIC DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-08-05 | — | — | US | disclosed |
| US-20100190107-A1 | CYCLIC COMPOUND, PHOTORESIST BASE MATERIAL AND PHOTORESIST COMPOSITION | IDEMITSU KOSAN CO. LTD (JP) | 2010-07-29 | — | — | US | disclosed |
| US-20100181684-A1 | RESIN COMPOSITION, FILLING MATERIAL, INSULATING LAYER AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2010-07-22 | — | — | US | disclosed |
| WO-2010083350-A1 | NONPOLYMERIC BINDERS FOR SEMICONDUCTOR SUBSTRATE COATINGS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2010-07-22 | — | — | WO | disclosed |
| US-7759045-B2 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2010-07-20 | — | — | US | disclosed |
| US-7749664-B2 | Dye-containing resist composition and color filter using same | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2010-07-06 | — | — | US | disclosed |
| US-7745104-B2 | Polymer having a hydrocarbon chain backbone and containing units derived from norbornadiene, indene, benzofuran, benzothiophene, acenaphthene, or vinyl pyrene, fluorene, phenanthrene, chrysene, naphthacene, pentacene, or acenaphthene; excellent etching resistance; shorter wavelengths | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-29 | — | — | US | disclosed |
| US-20100159219-A1 | Negative pattern of carbon nanotubes and carbon nanotube composite comprising surface-modified carbon nanotubes | PARK JONG JIN | 2010-06-24 | — | — | US | disclosed |
| US-7741015-B2 | Patterning process and resist composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-22 | — | — | US | disclosed |
| US-20100151381-A1 | ANTIREFLECTIVE COATING COMPOSITION, ANTIREFLECTIVE COATING , AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-17 | — | — | US | disclosed |
| US-20100147334-A1 | Coated-type silicon-containing film stripping process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-17 | — | — | US | disclosed |
| US-20100151382-A1 | Bottom resist layer composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-17 | — | — | US | disclosed |
| EP-2196858-A1 | Coated-type silicon-containing film stripping process | Shin-Etsu Chemical Co., Ltd. (JP) | 2010-06-16 | — | — | EP | disclosed |
| US-7736834-B2 | Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, process for manufacturing printed circuit board and method for removing photocured product | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-06-15 | — | — | US | disclosed |
| US-7727705-B2 | High etch resistant underlayer compositions for multilayer lithographic processes | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2010-06-01 | — | — | US | disclosed |
| EP-0989460-B1 | PATTERN FORMING METHOD | AZ ELECTRONIC MATERIALS USA (US) | 2010-05-26 | — | — | EP | disclosed |
| US-20100119972-A1 | COATING COMPOSITION | MERCK PATENT GMBH (DE) | 2010-05-13 | — | — | US | disclosed |
| US-20100120937-A1 | SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-05-13 | — | — | US | disclosed |
| US-20100104316-A1 | ELECTROSTATIC CHARGING MEMBER, ELECTROSTATIC CHARGING DEVICE, PROCESS CARTRIDGE AND IMAGE FORMING APPARATUS | FUJI XEROX CO., LTD. (JP) | 2010-04-29 | — | — | US | disclosed |
| EP-2180376-A2 | Electrostatic charging member, electrostatic charging device, process cartridge and image forming apparatus | Fuji Xerox Co., Ltd. (JP) | 2010-04-28 | — | — | EP | disclosed |
| US-20100086872-A1 | Metal oxide-containing film-forming composition, metal oxide-containing film-formed substrate, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-04-08 | — | — | US | disclosed |
| US-20100086870-A1 | Composition for forming silicon-containing film, silicon-containing film-formed substrate and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-04-08 | — | — | US | disclosed |
| EP-2172807-A1 | Composition for forming silicon-containing film, silicon-containing film-formed substrate and patterning process | Shinetsu Chemical Co., Ltd. (JP) | 2010-04-07 | — | — | EP | disclosed |
| EP-2172808-A1 | Metal oxide-containing film-forming composition metal oxide-containing film-formed substrate, and patterning process | Shinetsu Chemical Co., Ltd. (JP) | 2010-04-07 | — | — | EP | disclosed |
| EP-1720063-B1 | Resin containing ketene-aldehyde copolymer | NIPPON SODA CO (JP) | 2010-04-07 | — | — | EP | disclosed |
| US-7687228-B2 | Antireflection film composition and patterning process using the same | SHIN ETSU CHEMICAL CO., LTD. (JP) | 2010-03-30 | — | — | US | disclosed |
| US-20100075257-A1 | Resin and Chemically Amplified Resist Composition Comprising the Same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2010-03-25 | — | — | US | disclosed |
| EP-2166036-A1 | RESIN COMPOSITION, EMBEDDING MATERIAL, INSULATING LAYER, AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company Limited (JP) | 2010-03-24 | — | — | EP | disclosed |
| US-7678529-B2 | Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-03-16 | — | — | US | disclosed |
| US-20100062380-A1 | DOUBLE PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-03-11 | — | — | US | disclosed |
| EP-2161744-A1 | ELECTRONIC DEVICE MANUFACTURING METHOD | Sumitomo Bakelite Co., Ltd. (JP) | 2010-03-10 | — | — | EP | disclosed |
| US-7666573-B2 | Positive photosensitive resin composition and method for forming pattern | MITSUI CHEMICALS, INC. (JP) | 2010-02-23 | — | — | US | disclosed |
| US-7666967-B2 | Ester compound, polymer, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-02-23 | — | — | US | disclosed |
| US-20100028805-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2010-02-04 | — | — | US | disclosed |
| US-20100028807-A1 | Imide Compound and Chemically Amplified Resist Composition Containing The Same | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 2010-02-04 | — | — | US | disclosed |
| US-20100028800-A1 | RADIATION-SENSITIVE RESIN COMPOSITION | JSR CORPORATION (JP) | 2010-02-04 | — | — | US | disclosed |
| US-7655378-B2 | Negative resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-02-02 | — | — | US | disclosed |
| US-20100021847-A1 | Oxime Compound and Resist Composition Containing the Same | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 2010-01-28 | — | — | US | disclosed |
| US-7651829-B2 | Positive resist material and pattern formation method using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-01-26 | — | — | US | disclosed |
| US-7649118-B2 | Process for preparing fluorine-containing norbornene derivative | DAIKIN INDUSTRIES, LTD. (JP) | 2010-01-19 | — | — | US | disclosed |
| WO-2010005428-A1 | RESIST SENSITIZER | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (MIT) (US) | 2010-01-14 | — | — | WO | disclosed |
| US-20100009296-A1 | MATERIAL FOR FORMING CONDUCTIVE ANTIREFLECTION FILM, METHOD FOR FORMING CONDUCTIVE ANTIREFLECTION FILM, METHOD FOR FORMING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND MAGNETIC HEAD | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| US-20100009289-A1 | RESIST SENSITIZER | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2010-01-14 | — | — | US | disclosed |
| US-20100003615-A1 | UPPER LAYER-FORMING COMPOSITION AND PHOTORESIST PATTERNING METHOD | JSR CORPORATION (JP) | 2010-01-07 | — | — | US | disclosed |
| US-7642043-B2 | Rework process for photoresist film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-01-05 | — | — | US | disclosed |
| EP-2138897-A1 | MATERIAL FOR FORMATION OF CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND MAGNETIC HEAD | Fujitsu Limited (JP) | 2009-12-30 | — | — | EP | disclosed |
| US-7638268-B2 | Rework process for photoresist film | SHIN-ESTU CHEMICAL CO., LTD. (JP) | 2009-12-29 | — | — | US | disclosed |
| US-7638256-B2 | Fluorinated cyclic structure-bearing silicon compounds and silicone resins, resist compositions using the same, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-29 | — | — | US | disclosed |
| EP-1788437-B1 | Rework process for photoresist film | SHINETSU CHEMICAL CO (JP) | 2009-12-23 | — | — | EP | disclosed |
| EP-1238972-B1 | Novel carbazole derivative and chemically amplified radiation-sensitive resin composition | JSR CORP (JP) | 2009-12-16 | — | — | EP | disclosed |
| US-7632624-B2 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-15 | — | — | US | disclosed |
| US-7629106-B2 | Resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-08 | — | — | US | disclosed |
| US-20090297979-A1 | Polymerizable compound, polymer, positive resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-03 | — | — | US | disclosed |
| US-7625689-B2 | better line edge roughness in excimer laser lithography; supramolecule ester useful in photoresists e.g. pentaerythritol, tetrakis(3-(methoxymethyloxycarbonyl)cyclohexanecarboxylate) aka PECHOM and other adamantanyl and norbornyl derivatives | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2009-12-01 | — | — | US | disclosed |
| US-20090286188-A1 | Patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-11-19 | — | — | US | disclosed |
| WO-2009140076-A1 | COMPOSITIONS AND METHODS INCORPORATING PHOTOCATALYSTS | THE PROCTER & GAMBLE COMPANY (US) | 2009-11-19 | — | — | WO | disclosed |
| US-20090285768-A1 | Compositions and Methods Incorporating Photocatalysts | THE PROCTER & GAMBLE COMPANY | 2009-11-19 | — | — | US | disclosed |
| US-20090280438-A1 | METHOD OF FORMING PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-11-12 | — | — | US | disclosed |
| US-RE40964-E1 | Negative type resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2009-11-10 | — | — | US | disclosed |
| US-20090269697-A1 | POLYORGANOSILOXANE, RESIN COMPOSITION, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-10-29 | — | — | US | disclosed |
| EP-2112188-A1 | Polyorganosiloxane, resin composition, and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2009-10-28 | — | — | EP | disclosed |
| US-20090263631-A1 | FILM FORMING COMPOSITION FOR NANOIMPRINTING AND METHOD FOR PATTERN FORMATION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-10-22 | — | — | US | disclosed |
| US-7604343-B2 | Actinic ray curable composition, actinic ray curable ink, image formation method employing it, and ink-jet recording apparatus | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2009-10-20 | — | — | US | disclosed |
| US-20090253881-A1 | POLYMERIZABLE COMPOUND FOR PHOTORESIST, POLYMER THEREOF, AND PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER | IDEMITSU KOSAN CO., LTD. (JP) | 2009-10-08 | — | — | US | disclosed |
| US-20090253084-A1 | DOUBLE PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-10-08 | — | — | US | disclosed |
| US-7592407-B2 | a perfluorinated ester compound containing a pyran ring, a hydroxy or protected hydroxy group; able to polymerized into a fluorinated polymer which is used as a base polymer to formulate a resist composition having transparency to laser light; alkali development amenability, and dry etch resistance | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-09-22 | — | — | US | disclosed |
| US-20090226848-A1 | Method of manufacturing light receiving device | SUMITOMO BAKELITE CO., LTD. (JP) | 2009-09-10 | — | — | US | disclosed |
| US-20090226843-A1 | MONOMER, RESIST COMPOSITION, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-09-10 | — | — | US | disclosed |
| US-7585613-B2 | comprising light absorbing silicone resin, acid generator generates acid upon exposure to radiation; photoresist pattern cover the antireflection film with a vertical wall profile, without intermixing, less damage to an underlying layer | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-09-08 | — | — | US | disclosed |
| US-20090220886-A1 | POLYHYDRIC COMPOUND AND CHEMICALLY AMPLIFIED RESIST COMPOSITION CONTAINING THE SAME | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2009-09-03 | — | — | US | disclosed |
| US-20090206520-A1 | Photosensitive composition, microfabrication method using the same, and microfabricated structure thereof | SAMSUNG ELECTRONICS CO., LTD. | 2009-08-20 | — | — | US | disclosed |
| US-20090208868-A1 | Polyimides; polynorbornenes; photomasks; heat treatment; heat resistance; flame resistance | MITSUI CHEMICALS , INC. (JP) | 2009-08-20 | — | — | US | disclosed |
| US-20090208886-A1 | DOUBLE PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-08-20 | — | — | US | disclosed |
| US-20090202940-A1 | Positive resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-08-13 | — | — | US | disclosed |
| US-20090202947-A1 | Positive resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO.,LTD (JP) | 2009-08-13 | — | — | US | disclosed |
| US-20090186307-A1 | HYDROGENATED RING-OPENING METATHESIS POLYMER, RESIST COMPOSITION AND PATTERNING PROCESS | MITSUI CHEMICALS, INC. (JP) | 2009-07-23 | — | — | US | disclosed |
| US-7556908-B2 | Chemically amplified positive resist composition, (meth)acrylate derivative and a process for producing the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2009-07-07 | — | — | US | disclosed |
| EP-1652844-B1 | Fluorinated monomer having cyclic structure, manufacturing method, polymer, photoresist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2009-07-01 | — | — | EP | disclosed |
| EP-2075247-A1 | Fluorinated monomer having cyclic structure, manufaturing method, polymer, photoresist composition and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2009-07-01 | — | — | EP | disclosed |
| US-20090162092-A1 | CHARGING MEMBER CLEANING UNIT, METHOD OF PRODUCING CHARGING MEMBER CLEANING UNIT, CHARGING DEVICE, PROCESS CARTRIDGE AND IMAGE FORMING APPARATUS | FUJI XEROX CO., LTD. (JP) | 2009-06-25 | — | — | US | disclosed |
| US-20090155546-A1 | FILM-FORMING COMPOSITION, METHOD FOR PATTERN FORMATION, AND THREE-DIMENSIONAL MOLD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-06-18 | — | — | US | disclosed |
| US-7541134-B2 | Antireflective film-forming composition, method for manufacturing the same, and antireflective film and pattern formation method using the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-06-02 | — | — | US | disclosed |
| US-20090136869-A1 | METAL OXIDE-CONTAINING FILM-FORMING COMPOSITION, METAL OXIDE-CONTAINING FILM, METAL OXIDE-CONTAINING FILM-BEARING SUBSTRATE, AND PATTERNING METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-05-28 | — | — | US | disclosed |
| EP-2063319-A1 | Metal oxide-containing film-forming composition, metal oxide-containing film, metal oxide-containing film-bearing substrate, and patterning method | Shin-Etsu Chemical Co., Ltd. (JP) | 2009-05-27 | — | — | EP | disclosed |
| US-20090130419-A1 | FOAM SHEET AND PRODUCTION PROCESS THEREOF | OJI PAPER CO., LTD (JP) | 2009-05-21 | — | — | US | disclosed |
| US-7534547-B2 | Optically active compound and photosensitive resin composition | OSAKA GAS COMPANY LIMITED (JP) | 2009-05-19 | — | — | US | disclosed |
| US-7531289-B2 | Fluorinated monomer having cyclic structure, manufacturing method, polymer, photoresist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-05-12 | — | — | US | disclosed |
| US-7517619-B2 | Dye-containing resist composition and color filter using same | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2009-04-14 | — | — | US | disclosed |
| EP-1788012-B1 | Silicon-containing antireflective coating forming composition, silicon-containing antireflective coating, substrate processing intermediate, and substrate processing method | SHINETSU CHEMICAL CO (JP) | 2009-04-08 | — | — | EP | disclosed |
| US-20090087776-A1 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2009-04-02 | — | — | US | disclosed |
| US-20090087799-A1 | ANTIREFLECTIVE COATING COMPOSITION, ANTIREFLECTIVE COATING, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-04-02 | — | — | US | disclosed |
| US-7511179-B2 | Fluorine-containing polymer, resist composition prepared from same and novel fluorine-containing monomer | DAIKIN INDUSTRIES, LTD. (JP) | 2009-03-31 | — | — | US | disclosed |
| US-7510820-B2 | Resist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-03-31 | — | — | US | disclosed |
| US-20090081595-A1 | PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-03-26 | — | — | US | disclosed |
| WO-2009032890-A1 | MULTI-TONE RESIST COMPOSITIONS | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (MIT) (US) | 2009-03-12 | — | — | WO | disclosed |
| US-20090067874-A1 | Charging device, process cartridge, image forming apparatus, and cleaning member | FUJI XEROX CO., LTD. (JP) | 2009-03-12 | — | — | US | disclosed |
| US-20090068589-A1 | MULTI-TONE RESIST COMPOSITIONS | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2009-03-12 | — | — | US | disclosed |
| US-20090053657-A1 | PATTERNING PROCESS AND PATTERN SURFACE COATING COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-02-26 | — | — | US | disclosed |
| US-7494763-B2 | Polyhydric phenol compound and chemically amplified resist composition containing the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2009-02-24 | — | — | US | disclosed |
| US-7494212-B2 | Activated light curable inkjet ink and image formation method | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2009-02-24 | — | — | US | disclosed |
| US-7495040-B2 | Actinic ray curable composition, image forming method using the same and ink-jet recording apparatus using the same | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2009-02-24 | — | — | US | disclosed |
| EP-2026385-A1 | METHOD FOR MANUFACTURING LIGHT RECEIVING APPARATUS | Sumitomo Bakelite Company, Ltd. (JP) | 2009-02-18 | — | — | EP | disclosed |
| US-7491483-B2 | Polymers, positive resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-02-17 | — | — | US | disclosed |
| US-20090042123-A1 | CALIXRESORCINARENE COMPOUND, PHOTORESIST BASE COMPRISING THE SAME, AND COMPOSITION THEREOF | Kinoshita, Hiroo (JP) | 2009-02-12 | — | — | US | disclosed |
| US-20090041945-A1 | ACTIVE RAY CURABLE COMPOSITION, POLYMERIZATION METHOD, ACTIVE RAY CURABLE INK, IMAGE FORMING METHOD, AND INK-JET RECORDING APPARATUS | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2009-02-12 | — | — | US | disclosed |
| US-7488567-B2 | Polymer, resist composition and patterning process | PANASONIC CORPORATION (JP) | 2009-02-10 | — | — | US | disclosed |
| US-20090035700-A1 | TERTIARY ALCOHOL DERIVATIVE, POLYMER COMPOUND AND PHOTORESIST COMPOSITION | KURARAY CO., LTD. (JP) | 2009-02-05 | — | — | US | disclosed |
| US-7485405-B2 | Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-02-03 | — | — | US | disclosed |
| US-7485408-B2 | Fluorine-containing silicon compounds, silicone resins, resist compositions, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-02-03 | — | — | US | disclosed |
| US-20090023878-A1 | (Meth)acrylate derivative, polymer and photoresist composition having lactone structure, and method for forming pattern by using it | NEC CORPORATION | 2009-01-22 | — | — | US | disclosed |
| EP-1845132-B1 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | SHINETSU CHEMICAL CO (JP) | 2009-01-21 | — | — | EP | disclosed |
| EP-1031879-B1 | Novel ester compounds, polymers, resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2009-01-21 | — | — | EP | disclosed |
| US-7476486-B2 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-01-13 | — | — | US | disclosed |
| US-7476485-B2 | Resist lower layer film material and method for forming a pattern | SHIN-ESTU CHEMICAL CO., LTD. (JP) | 2009-01-13 | — | — | US | disclosed |
| US-20090011372-A1 | SILICON-CONTAINING FILM-FORMING COMPOSITION, SILICON-CONTAINING FILM, SILICON-CONTAINING FILM-BEARING SUBSTRATE, AND PATTERNING METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-01-08 | — | — | US | disclosed |
| US-20090008682-A1 | Light-Receiving Device | SUMITOMO BAKELITE CO., LTD. (JP) | 2009-01-08 | — | — | US | disclosed |
| EP-2011829-A1 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | Shin-Etsu Chemical Co., Ltd. (JP) | 2009-01-07 | — | — | EP | disclosed |
| EP-2011830-A1 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | Shin-Etsu Chemical Co., Ltd. (JP) | 2009-01-07 | — | — | EP | disclosed |
| EP-1132774-B1 | Polymer, resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2009-01-07 | — | — | EP | disclosed |
| US-20090004601-A1 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2009-01-01 | — | — | US | disclosed |
| US-20090004600-A1 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2009-01-01 | — | — | US | disclosed |
| EP-1867681-B1 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | SHINETSU CHEMICAL CO (JP) | 2008-12-31 | — | — | EP | disclosed |
| US-20080312400-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, AND RESIST UNDERLAYER FILM | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-12-18 | — | — | US | disclosed |
| US-7459261-B2 | Resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-12-02 | — | — | US | disclosed |
| WO-2008140846-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-11-20 | — | — | WO | disclosed |
| US-20080286691-A1 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2008-11-20 | — | — | US | disclosed |
| EP-1992650-A1 | TERTIARY ALCOHOL DERIVATIVE, POLYMER COMPOUND AND PHOTORESIST COMPOSITION | Kuraray Co., Ltd. (JP) | 2008-11-19 | — | — | EP | disclosed |
| EP-1640804-B1 | Positive-tone radiation-sensitive resin composition | JSR CORP (JP) | 2008-11-19 | — | — | EP | disclosed |
| US-7452657-B2 | comprising one of a tannin and a derivative thereof, a crosslinking agent and a polymer; formation of a fine, highly-detailed resist pattern; nanoedge roughness can be suppressed | FUJITSU LIMITED (JP) | 2008-11-18 | — | — | US | disclosed |
| US-20080277805-A1 | Semiconductor Device | SUMITOMO BAKELITE CO., LTD. (JP) | 2008-11-13 | — | — | US | disclosed |
| US-7449277-B2 | Positive resist compositions and patterning process | SHIN-ETSU CHEMICAL C., LTD (JP) | 2008-11-11 | — | — | US | disclosed |
| US-20080274432-A1 | SILICONE-CONTAINING FILM-FORMING COMPOSITION, SILICON-CONTAINING FILM, SILICON-CONTAINING FILM-BEARING SUBSTRATE, AND PATTERNING METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-11-06 | — | — | US | disclosed |
| US-7439010-B2 | Alkali-soluble siloxane polymer, positive type resist composition, resist pattern, process for forming the same, electronic device and process for manufacturing the same | FUJITSU LIMITED (JP) | 2008-10-21 | — | — | US | disclosed |
| US-20080248417-A1 | Polyhydric phenol compound and chemically amplified resist composition containing the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2008-10-09 | — | — | US | disclosed |
| US-7432035-B2 | (Meth)acrylate derivative, polymer and photoresist composition having lactone structure, and method for forming pattern by using it | NEC CORPORATION (JP) | 2008-10-07 | — | — | US | disclosed |
| US-7427464-B2 | Patterning process and undercoat-forming material | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-09-23 | — | — | US | disclosed |
| US-20080227037-A1 | Resist lower layer film composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-09-18 | — | — | US | disclosed |
| US-20080220356-A1 | Electrophotographic photoreceptor, process cartridge and image-forming apparatus | FUJI XEROX CO., LTD. (JP) | 2008-09-11 | — | — | US | disclosed |
| US-20080220381-A1 | Antireflection film composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-09-11 | — | — | US | disclosed |
| US-7423102-B2 | Star polymer | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2008-09-09 | — | — | US | disclosed |
| US-20080206676-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC | 2008-08-28 | — | — | US | disclosed |
| US-20080206667-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2008-08-28 | — | — | US | disclosed |
| WO-2008103776-A2 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-28 | — | — | WO | disclosed |
| US-7416833-B2 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-08-26 | — | — | US | disclosed |
| US-7417104-B2 | Porous film-forming composition, patterning process, and porous sacrificial film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-08-26 | — | — | US | disclosed |
| US-20080199814-A1 | Device manufacturing process utilizing a double patterning process | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2008-08-21 | — | — | US | disclosed |
| US-20080199806-A1 | PATTERNING PROCESS AND RESIST COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-08-21 | — | — | US | disclosed |
| EP-1953593-A1 | RADIATION-SENSITIVE RESIN COMPOSITION | JSR Corporation (JP) | 2008-08-06 | — | — | EP | disclosed |
| EP-1801619-B1 | Substrate comprising two antireflective silicone resin layers between an organic layer and a photoresist layer, method for producing the same and patterning process using the same | SHINETSU CHEMICAL CO (JP) | 2008-08-06 | — | — | EP | disclosed |
| EP-1798599-B1 | Antireflection film composition, patterning process and substrate using the same | SHINETSU CHEMICAL CO (JP) | 2008-08-06 | — | — | EP | disclosed |
| EP-1953183-A2 | Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film | Shin-Etsu Chemical Co., Ltd. (JP) | 2008-08-06 | — | — | EP | disclosed |
| US-20080182087-A1 | SILPHENYLENE-BEARING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PATTERNING PROCESS, AND SUBSTRATE CIRCUIT PROTECTIVE FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-07-31 | — | — | US | disclosed |
| EP-1948724-A1 | LIGHT CURE OF CATIONIC INK ON ACIDIC SUBSTRATES | Gerber Scientific International, Inc. (US) | 2008-07-30 | — | — | EP | disclosed |
| EP-1950610-A1 | COMPOSITION FOR FORMING UPPER FILM AND METHOD FOR FORMING PHOTORESIST PATTERN | JSR Corporation (JP) | 2008-07-30 | — | — | EP | disclosed |
| EP-1948444-A2 | LIGHT CURE OF CATIONIC INK ON ACIDIC SUBSTRATES | Gerber Scientific International, Inc. (US) | 2008-07-30 | — | — | EP | disclosed |
| US-20080176166-A1 | RESISTS FOR LITHOGRAPHY | PIXELLIGENT TECHNOLOGIES, LLC | 2008-07-24 | — | — | US | disclosed |
| EP-1236745-B1 | Silicon-containing polymer, resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2008-07-23 | — | — | EP | disclosed |
| US-20080166670-A1 | Complex includes a multifunctional epoxy resin, a photoacid generator, an organic solvent and a silver compound, or additionally includes a multifunctional acrylate resin and a photoinitiator, or an additive; photoreduction is improved; heat and wear resistance; dispersibility | SAMSUNG ELECTRONICS CO., LTD. | 2008-07-10 | — | — | US | disclosed |
| EP-1942375-A2 | Composition for forming photosensitive polymer complex and method of preparing photosensitive polymer complex containing silver nanoparticles using the composition | Samsung Electronics Co., Ltd. (KR) | 2008-07-09 | — | — | EP | disclosed |
| US-20080153036-A1 | Chemically amplified positive resist compostion | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2008-06-26 | — | — | US | disclosed |
| US-20080153991-A1 | Method of making carbon nanotube patterned film or carbon nanotube composite using carbon nanotubes surface-modified with polymerizable moieties | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2008-06-26 | — | — | US | disclosed |
| US-7390840-B2 | Active ray curable composition, active ray curable ink, image forming method and inkjet recording apparatus utilizing the same | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2008-06-24 | — | — | US | disclosed |
| US-7378218-B2 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-05-27 | — | — | US | disclosed |
| US-7368218-B2 | Positive resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-05-06 | — | — | US | disclosed |
| US-20080090176-A1 | Semiconductor Wafer And Semiconductor Device | SUMITOMO BAKELITE CO., LTD. (JP) | 2008-04-17 | — | — | US | disclosed |
| US-7358025-B2 | Etching resistance; novolak resin having a fluorene or tetrahydrospirobiindene structure, an organic solvent, an acid generator, and a crosslinker, optionally combined with an intermediate layer having an antireflective effect | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-04-15 | — | — | US | disclosed |
| US-20080085470-A1 | Hydrogenated ring-opening metathesis polymer, resist composition comprising the same and patterning method | MITSUI CHEMICALS, INC. (JP) | 2008-04-10 | — | — | US | disclosed |
| US-20080076252-A1 | RESIST COMPOSITION, RESIST PATTERN FORMING PROCESS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2008-03-27 | — | — | US | disclosed |
| US-20080070998-A1 | Foam Production Method | OJI PAPER CO., LTD. (JP) | 2008-03-20 | — | — | US | disclosed |
| US-7344827-B2 | Fine contact hole forming method employing thermal flow process | SHIN-ETSU CHEMICAL CO., INC. (JP) | 2008-03-18 | — | — | US | disclosed |
| US-7341775-B2 | Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO. LTD. (JP) | 2008-03-11 | — | — | US | disclosed |
| US-7335457-B2 | Positive-tone radiation-sensitive resin composition | JSR CORPORATION (JP) | 2008-02-26 | — | — | US | disclosed |
| US-20080043081-A1 | Active Ray Curable Ink-Jet Ink; And Image Forming Method And Ink-Jet Recording Apparatus Using The Same | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2008-02-21 | — | — | US | disclosed |
| US-7332616-B2 | Polymerizable compound, polymer, positive-resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-02-19 | — | — | US | disclosed |
| US-20080038662-A1 | Bottom resist layer composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-02-14 | — | — | US | disclosed |
| US-20080032231-A1 | Resist lower layer material, resist lower layer substrate comprising the material and method for forming pattern | SHIN-ETSU CHEMICAL CO., LTD. | 2008-02-07 | — | — | US | disclosed |
| US-7326513-B2 | Positive working resist composition | FUJIFILM CORPORATION (JP) | 2008-02-05 | — | — | US | disclosed |
| US-20080026322-A1 | Hydrolytic condensation of organosilicon compound using acid and basic catalyst with Group 1a hydroxide, organic acid and solvent; efficiency patterning photoresist film | SHIN-ETSU CHEMICAL CO., LTD. | 2008-01-31 | — | — | US | disclosed |
| EP-1882705-A1 | POLYMERIZABLE COMPOUND FOR PHOTORESIST, POLYMER THEREOF, AND PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER | IDEMITSU KOSAN CO., LTD. (JP) | 2008-01-30 | — | — | EP | disclosed |
| US-20080020290-A1 | Negative resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-01-24 | — | — | US | disclosed |
| US-20080020289-A1 | Novel polymer, positive resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-01-24 | — | — | US | disclosed |
| US-20080019729-A1 | Charging member cleaning roller, charging device, process cartridge, and image forming apparatus | FUJI XEROX CO., LTD. (JP) | 2008-01-24 | — | — | US | disclosed |
| US-20080020317-A1 | Novel metal nanoparticle and formation of conductive pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2008-01-24 | — | — | US | disclosed |
| US-7314701-B2 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2008-01-01 | — | — | US | disclosed |
| US-20070296787-A1 | Ink-jet printer and image forming method | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2007-12-27 | — | — | US | disclosed |
| EP-1867681-A1 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | Shin-Etsu Chemical Co., Ltd. (JP) | 2007-12-19 | — | — | EP | disclosed |
| US-7309122-B2 | Method for storing cationic polymerizable composition and container for using thereof | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2007-12-18 | — | — | US | disclosed |
| US-20070287086-A1 | Colored photosensitive resin composition, color filter, image sensor, and camera system | SONY CORPORATION (JP) | 2007-12-13 | — | — | US | disclosed |
| US-20070287087-A1 | Colored photosensitive resin composition, color filter, image sensor, and camera system | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2007-12-13 | — | — | US | disclosed |
| US-7303785-B2 | Antireflective film material, and antireflective film and pattern formation method using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-04 | — | — | US | disclosed |
| US-7303855-B2 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-04 | — | — | US | disclosed |
| US-7303852-B2 | Photoacid generating compounds, chemically amplified positive resist materials, and pattern forming method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-04 | — | — | US | disclosed |
| US-7303787-B2 | Active ray curable ink-jet composition, image forming method using the same, and ink-jet recording apparatus | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2007-12-04 | — | — | US | disclosed |
| US-7303787-B2 | Active ray curable ink-jet composition, image forming method using the same, and ink-jet recording apparatus | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2007-12-04 | — | — | US | disclosed |
| US-20070275325-A1 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-11-29 | — | — | US | disclosed |
| EP-1860502-A1 | Colored photosensitive resin composition, color filter, image sensor, and camera system | Sumitomo Chemical Company, Limited (JP) | 2007-11-28 | — | — | EP | disclosed |
| EP-1860503-A2 | Colored photosensitive resin composition, color filter, image sensor, and camera system | Sumitomo Chemical Company, Limited (JP) | 2007-11-28 | — | — | EP | disclosed |
| US-20070257976-A1 | Image Forming Method, Actinic Radiation Curable Ink-Jet Ink, and Ink, Jet Recording Apparatus | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2007-11-08 | — | — | US | disclosed |
| US-20070257976-A1 | Image Forming Method, Actinic Radiation Curable Ink-Jet Ink, and Ink, Jet Recording Apparatus | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2007-11-08 | — | — | US | disclosed |
| US-7285368-B2 | Polymerizable ester having sulfonamide structure, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-10-23 | — | — | US | disclosed |
| EP-1845132-A2 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | Shinetsu Chemical Co., Ltd. (JP) | 2007-10-17 | — | — | EP | disclosed |
| US-20070238300-A1 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | SHIN-ETSU CHEMICAL CO., LTD. | 2007-10-11 | — | — | US | disclosed |
| EP-1482361-B1 | ACID-DEGRADABLE RESIN COMPOSITIONS CONTAINING KETENE-ALDEHYDE COPOLYMER | NIPPON SODA CO (JP) | 2007-10-03 | — | — | EP | disclosed |
| EP-1837357-A1 | ACTINIC RAY CURABLE COMPOSITION, ACTINIC RAY CURABLE INK, METHOD OF IMAGE FORMING THEREWITH, INKJET RECORDING APPARATUS AND EPOXY COMPOUND | Konica Minolta Medical & Graphic, Inc. (JP) | 2007-09-26 | — | — | EP | disclosed |
| US-20070219292-A1 | INK SET FOR INK-JET RECORDING, POLYMERIZATION METHOD AND IMAGE FORMING METHOD | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2007-09-20 | — | — | US | disclosed |
| US-20070218403-A1 | (Meth)acrylate derivative, polymer and photoresist composition having lactone structure, and method for forming pattern by using it | NEC CORPORATION | 2007-09-20 | — | — | US | disclosed |
| US-20070218402-A1 | Fluorine-containing silicon compounds, silicone resins, resist compositions, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-09-20 | — | — | US | disclosed |
| US-20070207408-A1 | Polymers, positive resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2007-09-06 | — | — | US | disclosed |
| EP-1829937-A1 | IMAGE FORMING METHOD, ACTIVE RAY CURING INKJET INK AND INKJET RECORDING DEVICE | Konica Minolta Medical & Graphic, Inc. (JP) | 2007-09-05 | — | — | EP | disclosed |
| EP-1829938-A1 | ACTINIC RADIATION CURABLE MAGENTA INK COMPOSITION, ACTINIC RADIATION CURABLE INK JET RECORDING MAGENTA INK AND METHOD FOR IMAGE FORMATION AND INK JET RECORDING APPARATUS USING SAID INK, AND ACTINIC RADIATION CURABLE PRINTING MAGENTA INK | Konica Minolta Medical & Graphic, Inc. (JP) | 2007-09-05 | — | — | EP | disclosed |
| EP-1616854-B1 | Polymerizable fluorinated ester, manufacturing method, polymer, photoresist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2007-09-05 | — | — | EP | disclosed |
| EP-1829936-A1 | ACTIVE RAY-CURABLE COMPOSITION, ACTIVE RAY-CURABLE INK AND IMAGE-FORMING METHOD | Konica Minolta Medical & Graphic, Inc. (JP) | 2007-09-05 | — | — | EP | disclosed |
| EP-1829939-A1 | ACTIVE RAY-CURABLE INKJET INK AND IMAGE-FORMING METHOD USING SAME | Konica Minolta Medical & Graphic, Inc. (JP) | 2007-09-05 | — | — | EP | disclosed |
| EP-1652846-B1 | Polymerizable fluorinated compound, making method, polymer, resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2007-08-22 | — | — | EP | disclosed |
| US-7258962-B2 | Positive-tone radiation-sensitive resin composition | JSR CORPORATION (JP) | 2007-08-21 | — | — | US | disclosed |
| WO-2007058796-A9 | LIGHT CURE OF CATIONIC INK ON ACIDIC SUBSTRATES | GERBER SCIENT INTERNATIONAL IN (US) | 2007-08-16 | — | — | WO | disclosed |
| US-20070190451-A1 | Calixresorcinarene compounds, photoresist base materials, and compositions thereof | IDEMITSU KOSAN CO., LTD. (JP) | 2007-08-16 | — | — | US | disclosed |
| US-20070190451-A1 | Calixresorcinarene compounds, photoresist base materials, and compositions thereof | IDEMITSU KOSAN CO., LTD. (JP) | 2007-08-16 | — | — | US | disclosed |
| US-7256419-B2 | Composition for forming organic insulating film and organic insulating film formed from the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-08-14 | — | — | US | disclosed |
| US-7255973-B2 | Positive resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-08-14 | — | — | US | disclosed |
| US-20070185226-A1 | NOVEL POLYMERIZABLE COMPOUND, POLYMER, POSITIVE-RESIST COMPOSITION, AND PATTERNING PROCESS USING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-08-09 | — | — | US | disclosed |
| EP-1813985-A1 | Antireflection film composition, substrate, and pattering process | Shin-Etsu Chemical Co., Ltd. (JP) | 2007-08-01 | — | — | EP | disclosed |
| US-20070172759-A1 | Antireflection film composition, substrate, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-07-26 | — | — | US | disclosed |
| US-7247419-B2 | Nanocomposite photosensitive composition and use thereof | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2007-07-24 | — | — | US | disclosed |
| US-7244472-B2 | Actinic radiation curable composition and actinic radiation curable ink, and image forming method as well as ink jet recording apparatus using the same | KONICA CORPORATION (JP) | 2007-07-17 | — | — | US | disclosed |
| US-20070161721-A1 | Ink and image forming method utilizing the same | KONICA MINOLTA MEDICAL & GRAPHIC, INC. | 2007-07-12 | — | — | US | disclosed |
| US-7241553-B2 | Polymer, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-07-10 | — | — | US | disclosed |
| EP-1803781-A1 | ACTINIC LIGHT CURABLE INK JET INK SET, IMAGE FORMING METHOD USING THE SAME, AND INK JET RECORDING APPARATUS | Konica Minolta Medical & Graphic, Inc. (JP) | 2007-07-04 | — | — | EP | disclosed |
| EP-1804291-A1 | SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Limited (JP) | 2007-07-04 | — | — | EP | disclosed |
| US-20070148585-A1 | Hyperbranched polymer, production method therefor and resist composition containing hyperbranched polymer | LION CORPORATION. | 2007-06-28 | — | — | US | disclosed |
| US-20070148570-A1 | Electrophotographic photoreceptor, process cartridge and image-forming apparatus | FUJI XEROX CO., LTD. (JP) | 2007-06-28 | — | — | US | disclosed |
| US-20070149702-A1 | Resin suitable for an acid generator and a chemically amplified positive resist composition containing the same | SUMITOMO CHEMICAL COMPANY, LIMITED | 2007-06-28 | — | — | US | disclosed |
| EP-1801619-A2 | Substrate, method for producing the same, and patterning process using the same | Shin-Etsu Chemical Co., Ltd. (JP) | 2007-06-27 | — | — | EP | disclosed |
| EP-1801872-A1 | SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Limited (JP) | 2007-06-27 | — | — | EP | disclosed |
| US-20070141510-A1 | NANOCOMPOSITE PHOTOSENSITIVE COMPOSITION AND USE THEREOF | CHEN CHUNWEI | 2007-06-21 | — | — | US | disclosed |
| EP-1798599-A1 | Antireflection film composition, patterning process and substrate using the same | Shinetsu Chemical Co., Ltd. (JP) | 2007-06-20 | — | — | EP | disclosed |
| US-7232205-B2 | Capping member, cleaning member, piping member, ink tank member, and UV curable ink jet recording apparatus fitted with the above members | KONICA MINOLTA HOLDINGS, INC. (JP) | 2007-06-19 | — | — | US | disclosed |
| US-7232638-B2 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-06-19 | — | — | US | disclosed |
| US-7232642-B2 | Chemically amplified positive resist composition, a haloester derivative and a process for producing the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2007-06-19 | — | — | US | disclosed |
| US-7232641-B2 | Polymerizable compound, polymer, positive-resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-06-19 | — | — | US | disclosed |
| US-20070134916-A1 | Antireflection film composition, patterning process and substrate using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-06-14 | — | — | US | disclosed |
| EP-1795553-A1 | PROCESS FOR PRODUCING FOAM | Oji Paper Co., Ltd. (JP) | 2007-06-13 | — | — | EP | disclosed |
| US-7229747-B2 | Surface treatment of interpenetrating polymer networkcarbon tubes; photolithography; heat curing; negative patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-06-12 | — | — | US | disclosed |
| US-20070128886-A1 | Substrate, method for producing the same, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-06-07 | — | — | US | disclosed |
| US-20070129576-A1 | Process for preparing fluorine-containing norbornene derivative | DAIKIN INDUSTRIES, LTD. | 2007-06-07 | — | — | US | disclosed |
| US-20070128555-A1 | Novel ester compound, polymer, resist composition, and patterning process | CENTRAL GLASS CO., LTD. | 2007-06-07 | — | — | US | disclosed |
| US-20070122740-A1 | Resist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| US-7223516-B2 | Positive type photoresist composition | FUJIFILM CORPORATION (JP) | 2007-05-29 | — | — | US | disclosed |
| WO-2007058651-A1 | LIGHT CURE OF CATIONIC INK ON ACIDIC SUBSTRATES | GERBER SCIENTIFIC INTERNATIONAL, INC. (US) | 2007-05-24 | — | — | WO | disclosed |
| US-20070117044-A1 | Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method | SHIN-ETSU CHEMICAL CO., LTD. | 2007-05-24 | — | — | US | disclosed |
| US-20070117411-A1 | Rework process for photoresist film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-05-24 | — | — | US | disclosed |
| WO-2007058796-A2 | LIGHT CURE OF CATIONIC INK ON ACIDIC SUBSTRATES | GERBER SCIENTIFIC INTERNATIONAL, INC. (US) | 2007-05-24 | — | — | WO | disclosed |
| US-20070117252-A1 | Silicon-containing antireflective coating forming composition, silicon-containing antireflective coating, substrate processing intermediate, and substrate processing method | SHIN-ETSU CHEMICAL CO., LTD. | 2007-05-24 | — | — | US | disclosed |
| EP-1788436-A1 | Rework process for photoresist film | Shin-Etsu Chemical Company, Ltd. (JP) | 2007-05-23 | — | — | EP | disclosed |
| EP-1788012-A1 | Silicon-containing antireflective coating forming composition, silicon-containing antireflective coating, substrate processing intermediate, and substrate processing method | Shin-Etsu Chemical Co., Ltd. (JP) | 2007-05-23 | — | — | EP | disclosed |
| EP-1788433-A2 | Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method | Shin-Etsu Chemical Co., Ltd. (JP) | 2007-05-23 | — | — | EP | disclosed |
| EP-1788437-A2 | Rework process for photoresist film | Shinetsu Chemical Co., Ltd. (JP) | 2007-05-23 | — | — | EP | disclosed |
| US-7220530-B2 | Light sensitive planographic printing plate material | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2007-05-22 | — | — | US | disclosed |
| US-20070111140-A1 | Resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-05-17 | — | — | US | disclosed |
| US-20070111136-A1 | Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, process for manufacturing printed circuit board and method for removing photocured product | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-05-17 | — | — | US | disclosed |
| US-20070111134-A1 | solvent remove the first photoresist film, forming a second photoresist film over the second antireflection silicone resin film which is over the first antireflection silicone resin film; lower cost and provide an excellent resist pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-05-17 | — | — | US | disclosed |
| US-20070109382-A1 | Light Cure of Cationic Ink on Acidic | GERBER SCIENTIFIC, INC. | 2007-05-17 | — | — | US | disclosed |
| US-20070110958-A1 | Light cure of cationic ink on acidic substrates | GERBER SCIENTIFIC, INC. | 2007-05-17 | — | — | US | disclosed |
| US-7217743-B2 | Curable white ink | KONICA CORPORATION (JP) | 2007-05-15 | — | — | US | disclosed |
| EP-1136885-B1 | Chemically amplified positive resist composition and patterning method | SHINETSU CHEMICAL CO (JP) | 2007-05-09 | — | — | EP | disclosed |
| EP-1096318-B1 | Resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2007-05-09 | — | — | EP | disclosed |
| US-7214743-B2 | Resist lower layer film material and method for forming a pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-05-08 | — | — | US | disclosed |
| US-7211367-B2 | Photo acid generator, chemical amplification resist material | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-05-01 | — | — | US | disclosed |
| US-7204588-B2 | Ink jet printed matter | KONICA CORPORATION (JP) | 2007-04-17 | — | — | US | disclosed |
| US-7202013-B2 | Antireflective film material, and antireflective film and pattern formation method using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-04-10 | — | — | US | disclosed |
| US-7202318-B2 | Polymerizable fluorinated ester, manufacturing method, polymer, photoresist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-04-10 | — | — | US | disclosed |
| US-20070072115-A1 | Positive resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-03-29 | — | — | US | disclosed |
| US-7192684-B2 | Polymerizable silicon-containing compound, manufacturing method, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-03-20 | — | — | US | disclosed |
| US-7189493-B2 | Polymer, positive resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-03-13 | — | — | US | disclosed |
| US-7186773-B2 | Process for preparing fluorine-containing norbornene derivative | DAIKIN INDUSTRIES, LTD. (JP) | 2007-03-06 | — | — | US | disclosed |
| US-7186495-B2 | (Meth) acrylate derivative, polymer and photoresist composition having lactone structure, and method for forming pattern by using it | NEC CORPORATION (JP) | 2007-03-06 | — | — | US | disclosed |
| US-7182453-B2 | Ink jet recording apparatus and ink jet recording method | KONICA MINOLTA HOLDINGS, INC. (JP) | 2007-02-27 | — | — | US | disclosed |
| US-20070042291-A1 | Positive resist composition and a pattern forming method using the same | FUJI PHOTO FILM CO., LTD. | 2007-02-22 | — | — | US | disclosed |
| US-7179581-B2 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-02-20 | — | — | US | disclosed |
| EP-1150167-B1 | Polymers, resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2007-02-07 | — | — | EP | disclosed |
| US-7169697-B2 | Semiconductor device and manufacturing method of the same | KABUSHIKI KAISHA TOSHIBA (JP) | 2007-01-30 | — | — | US | disclosed |
| US-7169697-B2 | Semiconductor device and manufacturing method of the same | KABUSHIKI KAISHA TOSHIBA (JP) | 2007-01-30 | — | — | US | disclosed |
| US-7169869-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-01-30 | — | — | US | disclosed |
| US-7169541-B2 | Compound, polymer, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-01-30 | — | — | US | disclosed |
| US-7169446-B2 | Oxetane compound, actinic ray curable composition, ink composition for ink jet recording, and image formation method | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2007-01-30 | — | — | US | disclosed |
| US-7168802-B2 | Ink composition and a method for ink jet recording | KONICA CORPORATION (JP) | 2007-01-30 | — | — | US | disclosed |
| US-20070020559-A1 | Positive-type photosensitive resin composition and cured film manufactured therefrom | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2007-01-25 | — | — | US | disclosed |
| US-20070020559-A1 | Positive-type photosensitive resin composition and cured film manufactured therefrom | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2007-01-25 | — | — | US | disclosed |
| US-7163970-B2 | Actinic ray curable ink and printed matter utilizing the same | KONICA MINOLTA HOLDINGS, INC. (JP) | 2007-01-16 | — | — | US | disclosed |
| US-7163778-B2 | Anti-reflection film material and a substrate having an anti-reflection film and a method for forming a pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-01-16 | — | — | US | disclosed |
| US-20070009831-A1 | PLANOGRAPHIC PRINTING PLATE MATERIAL AND IMAGE FORMATION METHOD | KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) | 2007-01-11 | — | — | US | disclosed |
| US-20070009832-A1 | Fluorinated cyclic structure-bearing silicon compounds and silicone resins, resist compositions using the same, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-01-11 | — | — | US | disclosed |
| EP-1741705-A1 | Fluorinated cyclic structure-bearing silicon compounds and silicone resins, resist compositions using the same, and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2007-01-10 | — | — | EP | disclosed |
| US-20070003862-A1 | Resist composition, method of forming resist pattern, semiconductor device and method of manufacturing thereof | FUJITSU LIMITED (JP) | 2007-01-04 | — | — | US | disclosed |
| US-20070003862-A1 | Resist composition, method of forming resist pattern, semiconductor device and method of manufacturing thereof | FUJITSU LIMITED (JP) | 2007-01-04 | — | — | US | disclosed |
| US-20060292488-A1 | Composition for formation of antireflection film, and antireflection film in which the same is used | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-12-28 | — | — | US | disclosed |
| US-7153630-B2 | Resist with reduced line edge roughness | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2006-12-26 | — | — | US | disclosed |
| US-7144674-B2 | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2006-12-05 | — | — | US | disclosed |
| US-20060269871-A1 | Polymer, resist composition and patterning process | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. | 2006-11-30 | — | — | US | disclosed |
| US-7141351-B2 | Basic compound, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-11-28 | — | — | US | disclosed |
| US-7141352-B2 | Basic compound, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-11-28 | — | — | US | disclosed |
| US-20060263702-A1 | Composition for forming intermediate layer containing sylylphenylene-based polymer and pattern-forming method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-11-23 | — | — | US | disclosed |
| US-7135269-B2 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-11-14 | — | — | US | disclosed |
| US-20060251991-A1 | Novel fluorine-containing polymer, resist composition prepared from same and novel fluorine-containing monomer | DAIKIN INDUSTRIES, LTD. | 2006-11-09 | — | — | US | disclosed |
| EP-1720063-A1 | Resin containing ketene-aldehyde copolymer | NIPPON SODA CO., LTD. (JP) | 2006-11-08 | — | — | EP | disclosed |
| US-7132220-B2 | Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective film | SHIH-ETSU CHEMICAL CO., LTD. (JP) | 2006-11-07 | — | — | US | disclosed |
| US-7132215-B2 | Ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-11-07 | — | — | US | disclosed |
| EP-0982628-B1 | A chemical amplifying type positive resist composition | SUMITOMO CHEMICAL CO (JP) | 2006-11-02 | — | — | EP | disclosed |
| US-7129014-B2 | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2006-10-31 | — | — | US | disclosed |
| US-7125641-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-10-24 | — | — | US | disclosed |
| US-7125642-B2 | Sulfonates, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-10-24 | — | — | US | disclosed |
| US-7125643-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-10-24 | — | — | US | disclosed |
| US-20060234158-A1 | Bottom resist layer composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-10-19 | — | — | US | disclosed |
| US-20060234160-A1 | Novel ester compounds, polymers, resist compositions and patterning process | HASEGAWA KOJI | 2006-10-19 | — | — | US | disclosed |
| US-20060228562-A1 | Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2006-10-12 | — | — | US | disclosed |
| US-20060228645-A1 | Nanocomposite photosensitive composition and use thereof | MERCK PATENT GMBH (DE) | 2006-10-12 | — | — | US | disclosed |
| US-7115690-B2 | Fluorine-containing polymer, resist composition prepared from same and novel fluorine-containing monomer | DAIKIN INDUSTRIES, LTD. (JP) | 2006-10-03 | — | — | US | disclosed |
| US-20060216619-A1 | Charge-transporting compound, electrophotographic photoreceptor, image-forming apparatus, and process cartridge | FUJI XEROX CO., LTD. (JP) | 2006-09-28 | — | — | US | disclosed |
| EP-1542241-B1 | Composition for forming organic insulating film and organic insulating film formed from the same | SAMSUNG ELECTRONICS CO LTD (KR) | 2006-09-27 | — | — | EP | disclosed |
| US-20060210785-A1 | Foamed product in a sheet form and method for production thereof | OJI PAPER CO., LTD. (JP) | 2006-09-21 | — | — | US | disclosed |
| US-20060204891-A1 | Etching resistance; novolak resin having a fluorene or tetrahydrospirobiindene structure, an organic solvent, an acid generator, and a crosslinker, optionally combined with an intermediate layer having an antireflective effect | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-09-14 | — | — | US | disclosed |
| US-20060204893-A1 | Novel fluorine-containing polymer, resist composition prepared from same and novel fluorine-containing monomer | DAIKIN INDUSTRIES, LTD. | 2006-09-14 | — | — | US | disclosed |
| US-7105267-B2 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-09-12 | — | — | US | disclosed |
| US-7105269-B2 | Copolymer, polymer mixture, and radiation-sensitive resin composition | JSR CORPORATION (JP) | 2006-09-12 | — | — | US | disclosed |
| US-7105272-B2 | Acid-degradable resin compositions containing ketene-aldehyde copolymer | NIPPON SODA CO., LTD. (JP) | 2006-09-12 | — | — | US | disclosed |
| EP-1698645-A1 | HYPERBRANCHED POLYMER, PROCESS FOR PRODUCING THE SAME AND RESIST COMPOSITION CONTAINING THE HYPERBRANCHED POLYMER | Lion Corporation (JP) | 2006-09-06 | — | — | EP | disclosed |
| US-20060194143-A1 | Fluorine-containing polymerizable monomers, fluorine-containing polymer compounds, resist compositions using the same, and patterning process | CENTRAL GLASS COMPANY, LIMITED (JP) | 2006-08-31 | — | — | US | disclosed |
| US-20060188812-A1 | Phenolic hydroxyl group-containing copolymer and radiation-sensitive resin composition | JSR CORPORATION (JP) | 2006-08-24 | — | — | US | disclosed |
| US-20060188809-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-08-24 | — | — | US | disclosed |
| US-7090961-B2 | Photo acid generator, chemical amplification resist material and pattern formation method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-08-15 | — | — | US | disclosed |
| US-20060177765-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2006-08-10 | — | — | US | disclosed |
| EP-1059563-B1 | Agent for reducing substrate dependence of resist | WAKO PURE CHEM IND LTD (JP) | 2006-08-09 | — | — | EP | disclosed |
| EP-1686424-A2 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2006-08-02 | — | — | EP | disclosed |
| US-20060166138-A1 | Radiation-sensitive resin composition | JSR CORPORATION | 2006-07-27 | — | — | US | disclosed |
| US-20060160017-A1 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2006-07-20 | — | — | US | disclosed |
| US-20060160023-A1 | Photo acid generator, chemical amplification resist material and pattern formation method | SHIN-ETSU CHEMICAL CO., LTD. | 2006-07-20 | — | — | US | disclosed |
| US-7078147-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-07-18 | — | — | US | disclosed |
| US-20060147836-A1 | Resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-07-06 | — | — | US | disclosed |
| US-7067231-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-06-27 | — | — | US | disclosed |
| US-20060093960-A1 | Fluorinated monomer having cyclic structure, manufacturing method, polymer, photoresist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2006-05-04 | — | — | US | disclosed |
| US-20060094817-A1 | Polymerizable fluorinated compound, making method, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2006-05-04 | — | — | US | disclosed |
| EP-1652846-A1 | Polymerizable fluorinated compound, making method, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-05-03 | — | — | EP | disclosed |
| EP-1652844-A2 | Fluorinated monomer having cyclic structure, manufacturing method, polymer, photoresist composition and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2006-05-03 | — | — | EP | disclosed |
| US-7037995-B2 | Tertiary (meth)acrylates having lactone structure, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-05-02 | — | — | US | disclosed |
| EP-1647570-A1 | FOAMED PRODUCT IN A SHEET FORM AND METHOD FOR PRODUCTION THEREOF | Oji Paper Co., Ltd. (JP) | 2006-04-19 | — | — | EP | disclosed |
| US-20060078821-A1 | A caroboxyalkylanthracene based compound, a hydroxy or alkoxystyrene polymer, and a sulfonimide compound as photoacid generator; low sublimation properties and excellent compatibility with other components; exhibits optimum controllability of radiation transmittance; microfabrication | JSR CORPORATION (JP) | 2006-04-13 | — | — | US | disclosed |
| US-20060079658-A1 | Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film | SHIN-ETSU CHEMICAL CO., LTD. | 2006-04-13 | — | — | US | disclosed |
| US-20060078820-A1 | Resist with reduced line edge roughness | MASS INSTITUTE OF TECHNOLOGY (MIT) (US) | 2006-04-13 | — | — | US | disclosed |
| EP-1645909-A2 | Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film | Shin-Etsu Chemical Co., Ltd. (JP) | 2006-04-12 | — | — | EP | disclosed |
| US-20060073411-A1 | Chemically amplified resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2006-04-06 | — | — | US | disclosed |
| EP-1640804-A2 | Positive-tone radiation-sensitive resin composition | JSR Corporation (JP) | 2006-03-29 | — | — | EP | disclosed |
| US-7005228-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-02-28 | — | — | US | disclosed |
| US-7005216-B2 | Photo mask | RENESAS TECHNOLOGY CORP. (JP) | 2006-02-28 | — | — | US | disclosed |
| US-7001707-B2 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-02-21 | — | — | US | disclosed |
| US-20060029870-A1 | Electrophotographic photoreceptor, image forming apparatus, and process cartridge | FUJI XEROX CO., LTD. (JP) | 2006-02-09 | — | — | US | disclosed |
| US-6994946-B2 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-02-07 | — | — | US | disclosed |
| US-6994945-B2 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-02-07 | — | — | US | disclosed |
| EP-0908473-B1 | Styrene polymers, chemically-amplified positive resist compositions, their preparation and use in a patterning process | SHINETSU CHEMICAL CO (JP) | 2006-02-01 | — | — | EP | disclosed |
| US-20060019195-A1 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-01-26 | — | — | US | disclosed |
| EP-1004568-B1 | Novel ester compounds, polymers, resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2006-01-25 | — | — | EP | disclosed |
| US-20060014913-A1 | Star polymer | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2006-01-19 | — | — | US | disclosed |
| US-20060014106-A1 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2006-01-19 | — | — | US | disclosed |
| EP-1616854-A1 | Polymerizable fluorinated ester, manufacturing method, polymer, photoresist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-01-18 | — | — | EP | disclosed |
| US-20060009602-A1 | Polymerizable fluorinated ester, manufacturing method, polymer, photoresist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2006-01-12 | — | — | US | disclosed |
| US-20060008730-A1 | Monomers for photoresists bearing acid-labile groups of reduced optical density | HONEYWELL INTERNATIONAL INC | 2006-01-12 | — | — | US | disclosed |
| US-20060008731-A1 | Novel photoresist monomers and polymers | HONEYWELL INTERNATIONAL INC | 2006-01-12 | — | — | US | disclosed |
| US-20050287471-A1 | Novel fluorine-containing polymer having acid-reactive group and chemically amplifying type photoresist composition prepared from same | DAIKIN INDUSTRIES, LTD. | 2005-12-29 | — | — | US | disclosed |
| US-20050282091-A1 | Patterning process and undercoat-forming material | SHIN-ETSU CHEMICAL CO.,LTD. (JP) | 2005-12-22 | — | — | US | disclosed |
| US-20050277756-A1 | Porous film-forming composition, patterning process, and porous sacrificial film | SHIN-ETSU CHEMICAL CO., LTD. | 2005-12-15 | — | — | US | disclosed |
| US-20050277058-A1 | Antireflective film-forming composition, method for manufacturing the same, and antireflective film and pattern formation method using the same | SHIN-ETSU CHEMICAL CO., LTD. | 2005-12-15 | — | — | US | disclosed |
| EP-0875787-B1 | Method for reducing the substrate dependence of resist | WAKO PURE CHEM IND LTD (JP) | 2005-12-14 | — | — | EP | disclosed |
| US-20050266351-A1 | Chemically amplified positive resist composition, (meth)acrylate derivative and a process for producing the same | SUMITOMO CHEMICAL COMPANY, LIMITED | 2005-12-01 | — | — | US | disclosed |
| US-20050267275-A1 | Polymers, resist compositions and patterning process | HARADA YUJI | 2005-12-01 | — | — | US | disclosed |
| US-20050260525-A1 | Chemically amplified positive resist composition, a haloester derivative and a process for producing the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2005-11-24 | — | — | US | disclosed |
| US-20050260521-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-11-24 | — | — | US | disclosed |
| US-20050250924-A1 | Novel tertiary (meth)acrylates having lactone structure, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-11-10 | — | — | US | disclosed |
| US-6962767-B2 | Acetal compound, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-11-08 | — | — | US | disclosed |
| US-20050244747-A1 | Positive-tone radiation-sensitive resin composition | JSR CORPORATION (JP) | 2005-11-03 | — | — | US | disclosed |
| US-20050227173-A1 | Positive resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2005-10-13 | — | — | US | disclosed |
| US-20050227174-A1 | Positive resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2005-10-13 | — | — | US | disclosed |
| US-6953651-B2 | Chemical amplifying type positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2005-10-11 | — | — | US | disclosed |
| US-20050221221-A1 | Polymer, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-10-06 | — | — | US | disclosed |
| US-20050221227-A1 | Alkali-soluble siloxane polymer, positive type resist composition, resist pattern, process for forming the same, electronic device and process for manufacturing the same | FUJITSU LIMITED (JP) | 2005-10-06 | — | — | US | disclosed |
| US-6949324-B2 | Alkali-soluble siloxane polymer, positive type resist composition, resist pattern, process for forming the same, electronic device and process for manufacturing the same | FUJITSU LIMITED (JP) | 2005-09-27 | — | — | US | disclosed |
| US-6946235-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-09-20 | — | — | US | disclosed |
| US-6946233-B2 | High resolution; etching chemical resistance | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-09-20 | — | — | US | disclosed |
| US-6936398-B2 | Resist with reduced line edge roughness | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2005-08-30 | — | — | US | disclosed |
| US-6933095-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-08-23 | — | — | US | disclosed |
| US-20050175935-A1 | Polymer, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2005-08-11 | — | — | US | disclosed |
| US-6924079-B2 | Resist resin, chemical amplification type resist, and method of forming of pattern with the same | NEC CORPORATION (JP) | 2005-08-02 | — | — | US | disclosed |
| US-6921623-B2 | Active components and photosensitive resin composition containing the same | KRI, INC. (JP) | 2005-07-26 | — | — | US | disclosed |
| US-6919161-B2 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-07-19 | — | — | US | disclosed |
| US-6916592-B2 | Esters, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-07-12 | — | — | US | disclosed |
| US-6916593-B2 | Amines having a carbonyl group, ester group, or a carbonate group prevent a decrease in the thickness of a resist film, enlarge focus margin, and increase dimensional stability | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-07-12 | — | — | US | disclosed |
| US-6913865-B2 | Surface modified encapsulated inorganic resist | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2005-07-05 | — | — | US | disclosed |
| US-20050142491-A1 | Novel epoxy compounds having an alicyclic structure, polymer compounds, resist materials, and patterning methods | HASEGAWA KOJI (JP) | 2005-06-30 | — | — | US | disclosed |
| US-6908724-B2 | Fluorine-containing polymer having acid-reactive group and chemically amplifying type photoresist composition prepared from same | DAIKIN INDUSTRIES, LTD. (JP) | 2005-06-21 | — | — | US | disclosed |
| US-20050130057-A1 | Acid-degradable resin compositions containing ketene-aldehyde copolymer | NIPPON SODA CO., LTD. (JP) | 2005-06-16 | — | — | US | disclosed |
| US-20050127355-A1 | Composition for forming organic insulating film and organic insulating film formed from the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2005-06-16 | — | — | US | disclosed |
| EP-1542241-A1 | Composition for forming organic insulating film and organic insulating film formed from the same | Samsung Electronics Co., Ltd (KR) | 2005-06-15 | — | — | EP | disclosed |
| US-6902772-B2 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-06-07 | — | — | US | disclosed |
| US-6899991-B2 | Photo-curable resin composition, patterning process, and substrate protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-05-31 | — | — | US | disclosed |
| US-6899990-B2 | Epoxy compound having alicyclic structure, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-05-31 | — | — | US | disclosed |
| US-20050106499-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2005-05-19 | — | — | US | disclosed |
| US-6893792-B2 | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2005-05-17 | — | — | US | disclosed |
| US-20050095527-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2005-05-05 | — | — | US | disclosed |
| US-20050089797-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2005-04-28 | — | — | US | disclosed |
| US-20050084796-A1 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-21 | — | — | US | disclosed |
| US-20050079446-A1 | Novel polymerizable compound, polymer, positive-resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-14 | — | — | US | disclosed |
| US-20050079440-A1 | Novel polymer, positive resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-14 | — | — | US | disclosed |
| US-6878501-B2 | Fluorinated cyclolefin polymers; radiation transparent, alkali solubility | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-12 | — | — | US | disclosed |
| US-6878508-B2 | Resist patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-12 | — | — | US | disclosed |
| US-6875556-B2 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-05 | — | — | US | disclosed |
| US-6872514-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-03-29 | — | — | US | disclosed |
| US-6872504-B2 | High sensitivity X-ray photoresist | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2005-03-29 | — | — | US | disclosed |
| US-6869744-B2 | Chemically amplified positive resist composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-03-22 | — | — | US | disclosed |
| US-6866982-B2 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-03-15 | — | — | US | disclosed |
| US-6866983-B2 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-03-15 | — | — | US | disclosed |
| US-6864037-B2 | Acrylic polymer; exposure to high energy radiation; photoresist patterns | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-03-08 | — | — | US | disclosed |
| US-6861197-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-03-01 | — | — | US | disclosed |
| US-6855477-B2 | Chemically amplified resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-02-15 | — | — | US | disclosed |
| US-20050019692-A1 | Resist material and method for pattern formation | KUBOTA HIROSHI (JP) | 2005-01-27 | — | — | US | disclosed |
| US-6846607-B2 | Carbazole derivative and chemically amplified radiation-sensitive resin composition | JSR CORPORATION (JP) | 2005-01-25 | — | — | US | disclosed |
| US-20050014092-A1 | Novel compound, polymer, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-01-20 | — | — | US | disclosed |
| US-6844133-B2 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-01-18 | — | — | US | disclosed |
| US-20050008968-A1 | Basic compound, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-01-13 | — | — | US | disclosed |
| US-20050003303-A1 | Polymerizable ester having sulfonamide structure, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-01-06 | — | — | US | disclosed |
| US-20040265755-A1 | Surface treatment of interpenetrating polymer networkcarbon tubes; photolithography; heat curing; negative patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2004-12-30 | — | — | US | disclosed |
| US-6835527-B2 | Lithography; forming semiconductors | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2004-12-28 | — | — | US | disclosed |
| US-6835524-B2 | Polymers, chemical amplification resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-28 | — | — | US | disclosed |
| US-6835525-B2 | Copolymer of a (meth)acrylic acid derivative with a vinyl ether monomer, an allyl ether monomer and an oxygen-containing alicyclic olefin monomer, as a base resin; sensitive to high energy radiation, and etching resistance | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-28 | — | — | US | disclosed |
| US-20040259037-A1 | Resist lower layer film material and method for forming a pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-23 | — | — | US | disclosed |
| EP-1059314-B1 | A resist composition | WAKO PURE CHEM IND LTD (JP) | 2004-12-22 | — | — | EP | disclosed |
| US-20040253461-A1 | Antireflective film material, and antireflective film and pattern formation method using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-16 | — | — | US | disclosed |
| US-6830866-B2 | Hydrogenated product of ring- opening metathesis polymer and a poly(meth)acrylic acid derivative as a base resin is sensitive to high-energy radiation, has excellent sensitivity, resolution, and etch resistance | SHI-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-14 | — | — | US | disclosed |
| US-6830868-B2 | Useful as a chemically amplified resist responding to active radiation, for example ultraviolet rays such as a KrF excimer laser, ArF excimer laser, and F2 excimer laser | JSR CORPORATION (JP) | 2004-12-14 | — | — | US | disclosed |
| US-20040247900-A1 | Antireflective film material, and antireflective film and pattern formation method using the same | SHIN-ETSU CHEMICAL CO. LTD. (JP) | 2004-12-09 | — | — | US | disclosed |
| EP-0789279-B2 | Polymer and resist material | WAKO PURE CHEM IND LTD (JP) | 2004-12-08 | — | — | EP | disclosed |
| EP-1195390-B1 | Polymer, resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2004-12-08 | — | — | EP | disclosed |
| US-20040241579-A1 | Positive resist material and pattern formation method using the same | SHIN-ETSU CHEMICAL CO., LTD. | 2004-12-02 | — | — | US | disclosed |
| US-20040241577-A1 | Resist lower layer film material and method for forming a pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-02 | — | — | US | disclosed |
| US-20040242821-A1 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-02 | — | — | US | disclosed |
| EP-1482361-A1 | ACID-DEGRADABLE RESIN COMPOSITIONS CONTAINING KETENE-ALDEHYDE COPOLYMER | NIPPON SODA CO., LTD. (JP) | 2004-12-01 | — | — | EP | disclosed |
| US-6824955-B2 | RADIATION TRANSPARENT PHOTORESISTS COMPRISING MIXTURES OF COPOLYMERS, SOLVENTS AND ACID GENERATORS, HAVING HIGH SENSITIVITY AND ETCHING RESISTANCE, USED IN LITHOGRAPHY | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-11-30 | — | — | US | disclosed |
| US-20040234884-A1 | Basic compound, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-11-25 | — | — | US | disclosed |
| US-20040234885-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-11-25 | — | — | US | disclosed |
| US-20040224513-A1 | Fine contact hole forming method employing thermal flow process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-11-11 | — | — | US | disclosed |
| US-6815145-B2 | PHOTORESISTS USEFUL IN MICRO-LITHOGRAPHY; FOR PATTERN FORMATION ON SEMICONDUCTOR WAFERS | MASSACHUSETTS INSTITUTE OF TECHNOLOGY | 2004-11-09 | — | — | US | disclosed |
| US-6815143-B2 | POST EXPOSURE DELAY (PED)-STABILIZER-CONTAINING RESIST MATERIAL HAVING HIGH SENSITIVITY AND HIGH RESOLUTION; THIOL DERIVATIVES, DISULFIDE DERIVATIVES AND/OR THIOLSULFONATE DERIVATIVES | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-11-09 | — | — | US | disclosed |
| US-20040214103-A1 | Process for preparing fluorine-containing norbornene derivative | DAIKIN INDUSTRIES, LTD. | 2004-10-28 | — | — | US | disclosed |
| US-20040191479-A1 | Anti-reflection film material and a substrate having an anti-reflection film and a method for forming a pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-09-30 | — | — | US | disclosed |
| US-20040191670-A1 | Chemical amplification type positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED | 2004-09-30 | — | — | US | disclosed |
| US-20040191680-A1 | Novel fluorine-containing polymer, resist composition prepared from same and novel fluorine-containing monomer | DAIKIN INDUSTRIES, LTD. | 2004-09-30 | — | — | US | disclosed |
| US-20040191674-A1 | Chemical amplification resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2004-09-30 | — | — | US | disclosed |
| US-6794109-B2 | POLYMER CONTAINING A FLUORINATED STYRENE COPOLYMER | MASSACHUSETTS INSTITUTE OF TECHNOLOGY | 2004-09-21 | — | — | US | disclosed |
| US-6794111-B2 | UNSATURATED TETRAHYDROFURAN DERIVATIVE MONOMERS AND THEIR PREPARATION E.G, 3,6-EPOXY-2,2-DIMETHYL-2,2A,3,6,6A,7-HEXAHYDROBENZO(C)FURAN | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-09-21 | — | — | US | disclosed |
| EP-1457821-A1 | Method of making carbon nanotube patterned film or carbon nanotube composite material using a composition comprising carbon nanotubes surface-modified with polymerizable moieties | Samsung Electronics Co., Ltd. (KR) | 2004-09-15 | — | — | EP | disclosed |
| US-6790564-B2 | FOR USE IN PRODUCING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES; EFFICIENCY | RENESAS TECHNOLOGY CORPORATION (JP) | 2004-09-14 | — | — | US | disclosed |
| US-6790586-B2 | BASE RESIN WITH ALICYCLIC HYDROCARBON BACKBONE HAVING A CARBOXYLATE MOIETY WHICH GENERATES A CARBOXYLIC ACID UNDER ACIDIC CONDITIONS, A PHOTOACID GENERATOR, AND AN ORGANIC SOLVENT; EXCIMER LASER, MICROPATTERNING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-09-14 | — | — | US | disclosed |
| US-6790591-B2 | POLYMER FORMED BY RADICAL RING CLOSING POLYMERIZATION OF 4-(TRIFLUOROMETHYL)-4-HYDROXY-OR SUBSTITUTED HYDROXY-1,1,2,3,3-PENTAFLUORO-1,6-HEPTADIENE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-09-14 | — | — | US | disclosed |
| US-6784268-B2 | POLAR ALKYLOXYALKYL-SUBSTITUTED NORBORN-2-ENES, PENTALENES, 4,7-METHANOINDENES HAVING A ACID LABILE GROUP AS MONOMERS FOR HIGH-MOLECULAR WEIGHT POLYMERS; SUBSTRATE ADHESION; RIGIDITY; RESOLUTION AND ETCH RESISTANE; MICROPATTERNS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-08-31 | — | — | US | disclosed |
| US-6783914-B1 | POSITIVE PHOTOSENSITIVE RESIST COMPRISING RESIN BINDER AND ENCAPSULATED INORGANIC CORE PARTICLES; BASE SOLUBLE; ACTIVATION BY RADIATION | MASSACHUSETTS INSTITUTE OF TECHNOLOGY | 2004-08-31 | — | — | US | disclosed |
| EP-1449860-A1 | NOVEL FLUOROPOLYMER, RESIST COMPOSITIONS CONTAINING THE SAME, AND NOVEL FLUOROMONOMERS | Daikin Industries, Ltd. (JP) | 2004-08-25 | — | — | EP | disclosed |
| US-6780563-B2 | SENSITIVITY AND RESOLUTION, RESISTANCE TO OXYGEN PLASMA ETCHING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-08-24 | — | — | US | disclosed |
| US-20040157156-A1 | Sulfonates, polymers, resist compositions and patterning process | CENTRAL GLASS CO., LTD. (JP) | 2004-08-12 | — | — | US | disclosed |
| US-20040157155-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-08-12 | — | — | US | disclosed |
| US-6770780-B1 | QUATERNIZATION OF T-BUTYL BROMOACETATE WITH TRI(N-BUTYL)PHOSPHINE TO FORM PHOSPHONIUM SALT; REACTING WITH BASE TO FORM PHOSPHORUS YLIDE; FORMING 2,4,6-TRIS(3', 5'-DI-T-BUTYL-4'-HYDROXYBENZYL)METHYL-STYRENE; HYDROLYSIS | JSR CORPORATION (JP) | 2004-08-03 | — | — | US | disclosed |
| US-20040144752-A1 | Resist compositions and patterning process | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2004-07-29 | — | — | US | disclosed |
| US-6767686-B2 | FOR USE IN LITHOGRAPHY | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2004-07-27 | — | — | US | disclosed |
| US-20040142276-A1 | Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-07-22 | — | — | US | disclosed |
| US-6762007-B2 | A BLENDS COMPRISING A PARTIALLY ETHERIFIED POLYHYDROXYSTYRENE-P AND A PARTIALLY ESTERIFIED POLYHYDROXYSTYRENE-P WITH PIVALIC ACID, AN ACID GENERATORS; PHOTOLITHOGRAPHY ACTIVATED BY HIGH-ENERGY ULTRAVIOLET RAY | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2004-07-13 | — | — | US | disclosed |
| US-6749988-B2 | PREVENTING A RESIST FILM FROM THINNING AND ALSO FOR ENHANCING THE RESOLUTION AND FOCUS MARGIN OF RESIST; HETEROCYCLIC AMINE COMPOUNDS HAVING A HYDRATING GROUP SUCH AS A HYDROXY, ETHER, ESTER, CARBONYL, CARBONATE GROUP OR LACTONE RING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-06-15 | — | — | US | disclosed |
| US-20040110091-A1 | High sensitivity X-ray photoresist | MASS INSTITUTE OF TECHNOLOGY (MIT) | 2004-06-10 | — | — | US | disclosed |
| US-6746722-B2 | EXPOSING POLYMER AND PHOTOACID GENERATOR WITH A LIGHT OF 180 NM OR LESS WAVELENGTH, AND CONDUCTING BAKING AND DEVELOPMENT. | NEC CORPORATION (JP) | 2004-06-08 | — | — | US | disclosed |
| US-20040106063-A1 | Resist composition | HATAKEYAMA JUN (JP) | 2004-06-03 | — | — | US | disclosed |
| US-6743564-B2 | A POSITIVE RESIST FORMULATION CONSISTS OF NITRILE CONTAINING TERT-AMINE COMPOUND, AN ORGANIC SOLVENT AND A BASE RESIN HAVING AN ACIDIC FUNCTIONAL GROUP WHICH IS PROTECTED WITH AN ACID LABILE GROUP, A PHOTOACID GENERATOR | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-06-01 | — | — | US | disclosed |
| US-6743566-B2 | (1,3-DIOXOLAN-4-YL)ALKYL 5-NORBORNENE-2-CARBOXYLATE USEFUL-AS A MONOMER TO FORM A POLYMER | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-06-01 | — | — | US | disclosed |
| EP-1039346-B1 | Resist compositions and pattering process | SHINETSU CHEMICAL CO (JP) | 2004-05-26 | — | — | EP | disclosed |
| EP-1415974-A1 | PROCESS FOR PRODUCTION OF FLUORINE-CONTAINING NORBORNENE DERIVATIVES | Daikin Industries, Ltd. (JP) | 2004-05-06 | — | — | EP | disclosed |
| US-6730453-B2 | POLYSILSESQUIOXANE POLYMERS CONTAINING CARBOXY OR HYDROXY GROUPS, AND A PHOTOACID GENERATOR | SHIN ETSU CHEMICAL CO., LTD. (JP) | 2004-05-04 | — | — | US | disclosed |
| US-6730451-B2 | FLUOROACRYLATE POLYMERS; TRANSPARENCY; PREVENTING NEGATIVE WORKING; LOW ABSORPTION OF FLUORINE EXCIMER LASER LIGHT; HIGH TRANSMITTANCE TO VACUUM ULTRAVIOLET RADITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-05-04 | — | — | US | disclosed |
| US-20040068124-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-04-08 | — | — | US | disclosed |
| US-20040067436-A1 | Polymerizable silicon-containing compound, manufacturing method, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-04-08 | — | — | US | disclosed |
| US-6716573-B2 | Resist Composition | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2004-04-06 | — | — | US | disclosed |
| EP-0849634-B1 | Radiation sensitive resin composition | JSR CORP (JP) | 2004-03-31 | — | — | EP | disclosed |
| EP-1403295-A2 | Ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-03-31 | — | — | EP | disclosed |
| US-6710148-B2 | COPOLYMER OF FLUORINATED ACRYLATE AND NORBORNENE COMPOUND | SHIN ETSU CHEMICAL CO., LTD. (JP) | 2004-03-23 | — | — | US | disclosed |
| US-6710188-B2 | VINYL COPOLYMER HAVING 3-OXO-4-OXABICYCLO(3.2.1)OCTANE-2-YL GROUP | NEC CORPORATION (JP) | 2004-03-23 | — | — | US | disclosed |
| US-6709799-B2 | Resist compositions | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2004-03-23 | — | — | US | disclosed |
| US-6696218-B2 | RESIN WHICH HAS A POLYMERIZATION UNIT DERIVED FROM P-HYDROXYSTYRENE AND A POLYMERIZATION UNIT HAVING A GROUP UNSTABLE AGAINST ACID, AND A DIALKANESULFONATE OF ISOPROPYLIDENEDICYCLOHEXANOL | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2004-02-24 | — | — | US | disclosed |
| US-20040030079-A1 | Polymers, resist compositions and patterning process | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2004-02-12 | — | — | US | disclosed |
| US-6686121-B2 | WITHOUT PURIFYING RESIST MATERIALS FORMED BY REACTION, BY REACTING AN ALKALI-SOLUBLE POLYMER HAVING PHENOLIC HYDROXYL GROUPS OR CARBOXYL GROUP WITH A VINYL ETHER AND/OR DIALKYL CARBONATE IN CATALYST, APROTIC SOLVENT, ADDING ACID GENERATOR | CLARIANT FINANCE (BVI) LIMITED (VG) | 2004-02-03 | — | — | US | disclosed |
| US-20040013980-A1 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-01-22 | — | — | US | disclosed |
| US-20040013973-A1 | Ether, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO,. LTD. (JP) | 2004-01-22 | — | — | US | disclosed |
| US-20040009424-A1 | Protecting groups for lithographic resist compositions | MASS INSTITUTE OF TECHNOLOGY (MIT) | 2004-01-15 | — | — | US | disclosed |
| US-6677102-B2 | RESOLUTION, SENSITIVITY | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2004-01-13 | — | — | US | disclosed |
| US-6677101-B2 | REACTIVITY, RIGIDITY AND ADHESION TO THE SUBSTRATE, AND UNDERGOES A LOW DEGREE OF SWELLING DURING DEVELOPMENT; RESOLUTION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-01-13 | — | — | US | disclosed |
| US-20040006191-A1 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO. LTD. (JP) | 2004-01-08 | — | — | US | disclosed |
| EP-1148044-B1 | Ester compounds, polymers, resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2004-01-07 | — | — | EP | disclosed |
| US-6673511-B1 | PHOTORESISTS COMPRISING TERTIARY AMINES, SOLVENTS, ACID GENERATORS AND ADDITION POLYMERS HAVING ACID-LABILE GROUPS USED FOR LITHOGRAPHY AND HAVING HIGH SENSITIVITY, RESOLUTION AND CORROSION RESISTANCE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-01-06 | — | — | US | disclosed |
| US-6673518-B2 | PHENOL-FORMALDEHYDE RESIN AND ACID GENERATOR | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-01-06 | — | — | US | disclosed |
| US-6673515-B2 | SENSITIVE TO HIGH-ENERGY RADIATION, RESOLUTION, AND ETCHING RESISTANCE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-01-06 | — | — | US | disclosed |
| EP-1375463-A1 | OPTICALLY ACTIVE COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION | Kansai Research Institute, Inc. (JP) | 2004-01-02 | — | — | EP | disclosed |
| US-6670498-B2 | Norbornene and dimethanonaphthalenes substituted with a branched or cyclic tertiary alkoxycarbonyl hydrocarbyleneoxycarbonyl group | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-12-30 | — | — | US | disclosed |
| US-6670094-B2 | Norbornene based polymers; photoresists; resolution, etching resistance, use in micropatterning with electron beams or deep-ultraviolet radation | SHIN-ETSU CHEMICAL CO., LTD (JP) | 2003-12-30 | — | — | US | disclosed |
| US-20030236351-A1 | Positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITIED (JP) | 2003-12-25 | — | — | US | disclosed |
| US-20030235779-A1 | Photoacid generating compounds, chemically amplified positive resist materials, and pattern forming method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-12-25 | — | — | US | disclosed |
| US-6667145-B1 | Resist composition comprising as a base resin a polymer having highly adherent, highly rigid units and especially suited as micropatterning material for VLSI fabrication, and (2) a patterning process using the resist | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-12-23 | — | — | US | disclosed |
| US-6660448-B2 | Lactone ring-substituted norbornene based polymers; photoresists; resolution, etching resistance, use in micropatterning with electron beams or deep-ultraviolet radation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-12-09 | — | — | US | disclosed |
| US-6660447-B2 | Copolymers of fluorinated vinyl phenol units and acrylonitrile units has high transmittance to VUV radiation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-12-09 | — | — | US | disclosed |
| US-20030224291-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-12-04 | — | — | US | disclosed |
| US-20030224290-A1 | Photo acid generator, chemical amplification resist material and pattern formation method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-12-04 | — | — | US | disclosed |
| US-20030224297-A1 | Chemically amplified resist, polymer for the chemically amplified resist, monomer for the polymer and method for transferring pattern to chemically amplified resist layer | NEC CORPORATION | 2003-12-04 | — | — | US | disclosed |
| US-6656660-B1 | Resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2003-12-02 | — | — | US | disclosed |
| US-20030219678-A1 | Novel esters, polymers, resist compositions and patterning process | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2003-11-27 | — | — | US | disclosed |
| US-20030219677-A1 | Positive resist composition | SUMITOMO CHEMICAL COMPANY (JP) | 2003-11-27 | — | — | US | disclosed |
| US-20030215740-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-11-20 | — | — | US | disclosed |
| US-20030215739-A1 | Polymers, resist compositions and patterning process | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2003-11-20 | — | — | US | disclosed |
| US-20030211734-A1 | Resist resin, chemical amplification type resist, and method of forming of pattern with the same | NEC CORPORATION (JP) | 2003-11-13 | — | — | US | disclosed |
| US-20030211421-A1 | Optically active compound and photosensitive resin composition | KRI, INC. (JP) | 2003-11-13 | — | — | US | disclosed |
| US-20030207201-A1 | Photoacid generating compounds, chemically amplified positive resist materials, and pattern forming method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-11-06 | — | — | US | disclosed |
| US-6639084-B2 | Comprises vinyl polymer having 3-oxo-4-oxabicyclo(3.2.1) octane-2-yl group; sensitive to far-ultraviolet light; imaging; for use with semiconductor wafers; improved resistance against dry etching and adhesion to substrates | NEC CORPORATION (JP) | 2003-10-28 | — | — | US | disclosed |
| US-20030198891-A1 | Novel ester compounds polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-10-23 | — | — | US | disclosed |
| US-6635400-B2 | Alkali-insoluble polymer having acidic groups protected with acid labile groups, photoacid generator, and 1,2-naphthoquinonediazidosulfonyl group-bearing compound; high resolution; plating resistance | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-10-21 | — | — | US | disclosed |
| US-20030194644-A1 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-10-16 | — | — | US | disclosed |
| US-20030194634-A1 | Novel anthracene derivative and radiation-sensitive resin composition | JSR CORPORATION (JP) | 2003-10-16 | — | — | US | disclosed |
| US-20030194639-A1 | Positive resist composition | FORTINET, INC. | 2003-10-16 | — | — | US | disclosed |
| US-20030194645-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-10-16 | — | — | US | disclosed |
| US-6632581-B2 | Improved resist performance-sensitivity and resolution using resin derived from alicyclic unsaturated carboxylic acid ester and acid generator suitable for excimer laser lithography using argon/krypton fluoride; semiconductor processing | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2003-10-14 | — | — | US | disclosed |
| US-20030180659-A1 | Resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2003-09-25 | — | — | US | disclosed |
| US-20030180663-A1 | Chemical amplification type positive resist composition | SUMITOMO CHEMICAL COMPANY (JP) | 2003-09-25 | — | — | US | disclosed |
| US-6624335-B2 | Unsaturated ether compound; photopolymerization | SHIN ETSU CHEMICAL CO., LTD. (JP) | 2003-09-23 | — | — | US | disclosed |
| US-6623909-B2 | Polysiloxane | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-09-23 | — | — | US | disclosed |
| US-6623907-B2 | Chemical amplified photoresist | JSR CORPORATION (JP) | 2003-09-23 | — | — | US | disclosed |
| US-20030175620-A1 | Chemical amplification type positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2003-09-18 | — | — | US | disclosed |
| US-20030175617-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-09-18 | — | — | US | disclosed |
| WO-2003075092-A2 | PROTECTING GROUP-CONTAINING POLYMERS FOR LITHOGRAPHIC RESIST COMPOSITIONS | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2003-09-12 | — | — | WO | disclosed |
| EP-1148045-B1 | Ester compounds, polymers, resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2003-09-10 | — | — | EP | disclosed |
| EP-1343048-A2 | Anthracene derivative and radiation-sensitive resin composition | JSR Corporation (JP) | 2003-09-10 | — | — | EP | disclosed |
| US-20030165773-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-09-04 | — | — | US | disclosed |
| US-6613844-B2 | Polyhydroxystyrene type polymer containing acid labile groups, endcapped and optionally crosslinked; improved alkali dissolution contrast, sensitivity, resolution, plasma etching resistance, heat resistance, and reproducibility | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-09-02 | — | — | US | disclosed |
| US-20030157423-A1 | Copolymer, polymer mixture, and radiation-sensitive resin composition | JSR CORPORATION (JP) | 2003-08-21 | — | — | US | disclosed |
| US-20030157431-A1 | Resist materials for 157-nm lithography | MASS INSTITUTE OF TECHNOLOGY (MIT) | 2003-08-21 | — | — | US | disclosed |
| US-20030153706-A1 | Acetal compound, polymer, resist composition and patterning response | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-08-14 | — | — | US | disclosed |
| US-20030152864-A1 | Novel fluorine-containing polymer having acid-reactive group and chemically amplifying type photoresist composition prepared from same | DAIKIN INDUSTRIES, LTD. | 2003-08-14 | — | — | US | disclosed |
| US-6605408-B2 | Hydrogenated polymer | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-08-12 | — | — | US | disclosed |
| US-6605678-B2 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-08-12 | — | — | US | disclosed |
| US-6596463-B2 | Photosensitivity, resolution, chemical resistance | SHIN-ETSU CHEMICAL, CO., LTD. (JP) | 2003-07-22 | — | — | US | disclosed |
| EP-1143299-B1 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL CO (JP) | 2003-07-16 | — | — | EP | disclosed |
| EP-1053985-B1 | Resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2003-07-16 | — | — | EP | disclosed |
| US-6593056-B2 | Chemically amplified positive resist composition and patterning method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-07-15 | — | — | US | disclosed |
| US-20030129505-A1 | Krypton fluoride laser lithography; photoresist pattern | RENESAS ELECTRONICS CORPORATION (JP) | 2003-07-10 | — | — | US | disclosed |
| EP-0780732-B1 | Polymer composition and resist material | WAKO PURE CHEM IND LTD (JP) | 2003-07-09 | — | — | EP | disclosed |
| US-6590010-B2 | Containing units from 4,4'-(9H-fluoren-9-ylidene) bis((2-propenyl) phenol) | SHIN-ETSU CHEMICALS, CO., LTD. (JP) | 2003-07-08 | — | — | US | disclosed |
| EP-1324134-A2 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-07-02 | — | — | EP | disclosed |
| US-6586157-B2 | Cycloalkyl-substituted cycloalkyl or cycloalkenyl acrylates; polymers that are sensitive to high energy radiation; patterning using electron beams or deep UV | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-07-01 | — | — | US | disclosed |
| US-6586152-B1 | Useful as an ingredient of a resist composition used for preparation of semiconductor devices and the like, which comprises a compound shown by the following general formula useful as an ingredient of a resist composition used for | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2003-07-01 | — | — | US | disclosed |
| US-20030120009-A1 | Polymer, resist composition and patterning process | NISHI TSUNEHIRO (JP) | 2003-06-26 | — | — | US | disclosed |
| US-6582880-B2 | Acrylate resin containing fluorinated alkyl groups in ester side chains; high transmittance to VUV radiation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-06-24 | — | — | US | disclosed |
| US-20030113662-A1 | Photo-curable resin composition, patterning process, and substrate protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-06-19 | — | — | US | disclosed |
| US-20030113659-A1 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-06-19 | — | — | US | disclosed |
| US-6579659-B2 | Interpolymer from alicyclic lactone ester of (meth)acrylic acid; tetrahydrofuranonyl (meth)acrylate; a hydroxyadamantyl (meth)acrylate, or a norbornene and maleic or itaconic anhydride; and another unit (2-ethyl-2-adamantyl acrylate) | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2003-06-17 | — | — | US | disclosed |
| US-6579658-B2 | Fluorinated maleic anhydride or maleimide | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-06-17 | — | — | US | disclosed |
| US-20030108819-A1 | Resist patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-06-12 | — | — | US | disclosed |
| US-20030099901-A1 | Chemically amplified resist compositions and patterning process | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2003-05-29 | — | — | US | disclosed |
| US-20030099897-A1 | Surface modified encapsulated inorganic resist | MASS INSTITUTE OF TECHNOLOGY (MIT) | 2003-05-29 | — | — | US | disclosed |
| US-6569596-B1 | Photoresists comprising N-(ethylsulfonyloxy)succinimide, novolaks, curing agents and an acid generators such as alpha -(hexylsulfonyloxyimino)-4-methoxybenzyl cyanide; integrated circuits; semiconductors | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2003-05-27 | — | — | US | disclosed |
| US-6566038-B2 | Micropatterning using electron beams or ultraviolet rays | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-20 | — | — | US | disclosed |
| US-6566037-B2 | A polymer with monomers of a robust alicyclic structure having both polar and acid labile groups; resist composition of improved reactivity, substrate adhesion and etching resistance | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-20 | — | — | US | disclosed |
| US-20030091929-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-15 | — | — | US | disclosed |
| US-20030087183-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-08 | — | — | US | disclosed |
| US-20030087181-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-08 | — | — | US | disclosed |
| US-20030088115-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-08 | — | — | US | disclosed |
| US-6559337-B2 | Containing C17-23 divalent hydrocarbon group containing a bridged cyclic hydrocarbon group, as well as an acid decompsable group | NEC CORPORATION (JP) | 2003-05-06 | — | — | US | disclosed |
| US-20030082479-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-01 | — | — | US | disclosed |
| US-20030064320-A1 | Active components and photosensitive resin composition containing the same | KRI, INC. (JP) | 2003-04-03 | — | — | US | disclosed |
| US-6541179-B2 | A chemically amplified, positive resist comprising a sulfonium salt compound as photoacid generator, a base resin containing a monomer having alicyclic structure, and a solvent; heat treatment and exposure | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-04-01 | — | — | US | disclosed |
| US-6537726-B2 | Polymeric unit derived from 3-hydroxy-1-adamantyl(meth)acrylate and polymeric unit derived from beta-(meth)acryloyloxy-gamma-butyrolactone; adhesion, sensitivity, resolution | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2003-03-25 | — | — | US | disclosed |
| US-20030054290-A1 | Polymer, resist material and patterning method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-03-20 | — | — | US | disclosed |
| US-20030054289-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-03-20 | — | — | US | disclosed |
| US-6534235-B1 | Photosensitive resin and inorganic particles having a functional group obtained by a reaction between inorganic particles and a coupling agent | KANSAI RESEARCH INSTITUTE, INC. (JP) | 2003-03-18 | — | — | US | disclosed |
| US-20030050398-A1 | Novel epoxy compounds having an alicyclic structure, polymer compounds, resist materials, and patterning methods | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-03-13 | — | — | US | disclosed |
| US-6531627-B2 | Pendant ester groups on norbornene and 1,4:5,8-dimethanonaph-thalene backbone monomers, excellent reactivity; photosensitivity | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-03-11 | — | — | US | disclosed |
| US-20030045731-A1 | Cyclic acetal compound, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-03-06 | — | — | US | disclosed |
| EP-1186624-B1 | Organosiloxane polymers and photo-curable resin compositions | SHINETSU CHEMICAL CO (JP) | 2003-03-05 | — | — | EP | disclosed |
| US-6527966-B1 | Forming a pattern composed of an etchable layer by conducting dry etching of an etchable layer formed on a substrate for semiconductor through a mask of patterned radiation sensitive material coating formed on the etchable layer | CLARIANT FINANCE (BVI) LIMITED (VG) | 2003-03-04 | — | — | US | disclosed |
| US-20030039918-A1 | Chemical amplifying type positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2003-02-27 | — | — | US | disclosed |
| US-20030039920-A1 | Resist composition | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2003-02-27 | — | — | US | disclosed |
| US-6524765-B1 | Micropatterning material for VLSI fabrication; improved sensitivity, resolution and etching resistance; copolymer of di-tert-butyl 1-(bicyclo(2.2.1)hept-2-en-5-yl) propane-2,2-dicarboxylate and maleic anhydride | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-02-25 | — | — | US | disclosed |
| US-20030036618-A1 | Fluorine-containing phenylmaleimide derivative, polymer, chemically amplified resist composition, and method for pattern formation using the composition | NEC CORPORATION (JP) | 2003-02-20 | — | — | US | disclosed |
| US-20030036015-A1 | Resist with reduced line edge roughness | AIR FORCE, UNITED STATES | 2003-02-20 | — | — | US | disclosed |
| US-20030036603-A1 | Novel epoxy compound having alicyclic structure, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-02-20 | — | — | US | disclosed |
| EP-0843220-B1 | Radiation sensitive resin composition | JSR CORP (JP) | 2003-02-19 | — | — | EP | disclosed |
| US-20030031953-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-02-13 | — | — | US | disclosed |
| US-20030031952-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-02-13 | — | — | US | disclosed |
| US-6515150-B2 | Photoresist resin; exposure to high energy radiation; development | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-02-04 | — | — | US | disclosed |
| US-6515149-B2 | Exposure to high energy radiation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-02-04 | — | — | US | disclosed |
| US-6511787-B2 | Acrylic resin containing hexafluoroisopropanol units having high transmittance to ultraviolet radiation having high transparency, substrate adhesion, alkali development, and acid-elimination capability for lithographic microprocessing | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-01-28 | — | — | US | disclosed |
| US-6512067-B2 | An addition polymer containing allyl, copolycarbons and other addition polymers; applying polymeric resist onto a substrate, heat-treating the formed coating and then exposing to high energy radiation of electron beam through a photomask | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-01-28 | — | — | US | disclosed |
| US-6511785-B1 | Polymer with alkenyloxy, acetal, and/or orthoester functional groups; forming contact hole pattern by thermal flow process | SHIN ETSU CHEMICAL CO., LTD. (JP) | 2003-01-28 | — | — | US | disclosed |
| US-6509135-B2 | Polymers having fused rings with polar and acid labile groups tetracyclo(4.4.0.1(2,5).1(7,10))dodec-3-ene-8-carboxylic acid, tert-butyl ester for example; resists with improved etch resistance, resolution and sensitivity | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-01-21 | — | — | US | disclosed |
| US-20030013039-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (US) | 2003-01-16 | — | — | US | disclosed |
| US-20030013038-A1 | Chemical amplification type positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2003-01-16 | — | — | US | disclosed |
| US-20030013832-A1 | Novel styrene polymer, chemically amplified positive resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-01-16 | — | — | US | disclosed |
| EP-1276012-A2 | Resist patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-01-15 | — | — | EP | disclosed |
| EP-1275666-A1 | NOVEL FLUOROPOLYMER HAVING ACID-REACTIVE GROUP AND CHEMICAL AMPLIFICATION TYPE PHOTORESIST COMPOSITION CONTAINING THE SAME | Daikin Industries, Ltd. (JP) | 2003-01-15 | — | — | EP | disclosed |
| US-6506537-B2 | Photopolymerization | JSR CORPORATION (JP) | 2003-01-14 | — | — | US | disclosed |
| US-20030008231-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-01-09 | — | — | US | disclosed |
| EP-0831369-B1 | Positive photosensitive composition | FUJI PHOTO FILM CO LTD (JP) | 2003-01-02 | — | — | EP | disclosed |
| US-20020197559-A1 | Polymers, resist compositions and patterning process, novel tetrahydrofuran compounds and their preparation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-12-26 | — | — | US | disclosed |
| EP-1265103-A1 | ACTIVE COMPONENTS AND PHOTOSENSITIVE RESIN COMPOSITIONS CONTAINING THE SAME | Kansai Research Institute, Inc. (JP) | 2002-12-11 | — | — | EP | disclosed |
| US-6492090-B2 | MICROPATTERNING USING ELECTRON BEAMS OR ULTRAVIOLET RAYS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-12-10 | — | — | US | disclosed |
| US-6492089-B2 | POLYMER BEARING CYCLIC SILICON-CONTAINING GROUPS SUCH AS 1,4,4-TRIMETHYL-4-SILACYCLOHEXYL METHACRYLATE; USE AS CHEMICALLY AMPLIFIED POSITIVE RESIST | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-12-10 | — | — | US | disclosed |
| US-20020172885-A1 | Novel carbazole derivative and chemically amplified radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-11-21 | — | — | US | disclosed |
| EP-1257880-A2 | RESIST MATERIALS FOR 157-NM LITHOGRAPHY | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2002-11-20 | — | — | EP | disclosed |
| WO-2002091084-A2 | RESIST WITH REDUCED LINE EDGE ROUGHNESS | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2002-11-14 | — | — | WO | disclosed |
| US-20020168583-A1 | Chemical amplifying type positive resist composition | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 2002-11-14 | — | — | US | disclosed |
| US-20020168581-A1 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-11-14 | — | — | US | disclosed |
| EP-0942329-B1 | NOVEL PROCESS FOR PREPARING RESISTS | CLARIANT FINANCE BVI LTD (VG) | 2002-11-13 | — | — | EP | disclosed |
| US-6479210-B2 | COMPRISING AN ORGANIC MATERIAL CONTAINING SUBSTITUENT(S) CAPABLE OF BEING RELEASED IN THE PRESENCE OF ACID, AND ACID GENERATORS OF AT LEAST ONE ONIUM SALT AND SULFONE AND/OR SULFONATE COMPOUNDS; RESOLUTION, SENSITIVITY | CLARIANT FINANCE (BVI) LIMITED (VG) | 2002-11-12 | — | — | US | disclosed |
| US-20020164540-A1 | Chemical amplifying type positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2002-11-07 | — | — | US | disclosed |
| US-20020160297-A1 | Low abosorbing resists for 157 nm lithography | AIR FORCE, UNITED STATES | 2002-10-31 | — | — | US | disclosed |
| US-20020161148-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-31 | — | — | US | disclosed |
| US-20020161150-A1 | Ether, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-31 | — | — | US | disclosed |
| US-20020155378-A1 | Chemical amplifying type positive resist compositions | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 2002-10-24 | — | — | US | disclosed |
| US-6469197-B1 | A (METH)ACRYLATE DERIVATIVE WHOSE ESTER PORTION IS A 4,7-METHANOINDENE DIOL OR 1,4:5,8-DIMETHANONAPHTHALENE DIOL FOR MAKING PHOTORESIST POLYMERS | NEC CORPORATION (JP) | 2002-10-22 | — | — | US | disclosed |
| US-6468712-B1 | PHOTOLITHOGRAPHY AT VERY SHORT ULTRAVIOLET WAVELENGTHS EMPLOYING A PHOTO-ACID GENERATOR AND AN ALIPHATIC POLYMER THAT INCLUDES ONE OR MORE PROTECTED HYDROXYL GROUPS; FLUORIDE EXCIMER LASERS; ENHANCED RESOLUTION | MASSACHUSETTS INSTITUTE OF TECHNOLOGY | 2002-10-22 | — | — | US | disclosed |
| US-20020150835-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-17 | — | — | US | disclosed |
| US-20020147259-A1 | Chemical amplifying type positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2002-10-10 | — | — | US | disclosed |
| US-20020146641-A1 | Chemically amplifying type positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2002-10-10 | — | — | US | disclosed |
| US-20020147290-A1 | Cyclic acetal compound, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-10 | — | — | US | disclosed |
| US-6461791-B1 | NOVEL POLYMER HAVING HIGH TRANSMITTANCE TO VACUUM ULTRAVIOLET RADIATION OF UP TO 300 NANOMETERS; RESIST MATERIALS HAVE SUFFICIENT TRANSPARENCY IN REGION OF EXCIMER LASER AND SATISFY RESOLUTION AND SENSITIVITY REQUIREMENTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-08 | — | — | US | disclosed |
| US-6461790-B1 | NOVEL POLYMER HAVING HIGH TRANSMITTANCE TO VACUUM ULTRAVIOLET RADIATION OF UP TO 300 NANOMETERS; RESIST MATERIALS HAVE SUFFICIENT TRANSPARENCY IN REGION OF EXCIMER LASER AND SATISFY RESOLUTION AND SENSITIVITY REQUIREMENTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-08 | — | — | US | disclosed |
| US-6461789-B1 | NOVEL POLYMER HAVING HIGH TRANSMITTANCE TO VACUUM ULTRAVIOLET RADIATION OF UP TO 300 NANOMETERS; RESIST MATERIALS HAVE SUFFICIENT TRANSPARENCY IN REGION OF EXCIMER LASERS, AND SATISFY RESOLUTION AND SENSITIVITY REQUIREMENTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-08 | — | — | US | disclosed |
| US-20020136981-A1 | Resist material and pattern forming method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-09-26 | — | — | US | disclosed |
| US-6455223-B1 | COMPOSITION COMPRISING AS BASE RESIN DENDRITIC OR HYPERBRANCHED POLYMER OF PHENOL DERIVATIVE HAVING SPECIFIED WEIGHT AVERAGE MOLECULAR WEIGHT; HIGH RESOLUTION, HIGH SENSITIVITY, MINIMIZED LINE EDGE ROUGHNESS, ETCH RESISTANCE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-09-24 | — | — | US | disclosed |
| US-20020132970-A1 | Acetal compound, polymer, resist composition and patterning response | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-09-19 | — | — | US | disclosed |
| US-20020132182-A1 | Polymers, resist materials, and pattern formation method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-09-19 | — | — | US | disclosed |
| EP-1238972-A1 | Novel carbazole derivative and chemically amplified radiation-sensitive resin composition | JSR Corporation (JP) | 2002-09-11 | — | — | EP | disclosed |
| WO-2002069043-A2 | LOW ABSORBING RESISTS FOR 157 NM LITHOGRAPHY | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2002-09-06 | — | — | WO | disclosed |
| EP-0887705-B1 | Resist compositions | SHINETSU CHEMICAL CO (JP) | 2002-09-04 | — | — | EP | disclosed |
| EP-1236745-A2 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-09-04 | — | — | EP | disclosed |
| US-6444396-B1 | ESTER COMPOUND HAVING AN ALKYLCYCLOALKYL OR ALKYLCYCLOALKENYL GROUP AS THE PROTECTIVE GROUP IS PROVIDED AS WELL AS A POLYMER COMPRISING UNITS OF THE ESTER COMPOUND. THE POLYMER IS USED AS A BASE RESIN TO FORMULATE A RESIST COMPOSITION HAVING A HIGHER | SHIN-ETSU CHEMICAL CO. (JP) | 2002-09-03 | — | — | US | disclosed |
| US-20020115807-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-08-22 | — | — | US | disclosed |
| US-20020115018-A1 | Amine compounds, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-08-22 | — | — | US | disclosed |
| US-6437052-B1 | Monomer having diol structure, polymer thereof, and negative photoresist composition and pattern forming method using the same | NEC CORPORATION (JP) | 2002-08-20 | — | — | US | disclosed |
| US-6436606-B1 | POLYMERS AND PHOTORESISTS COATING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-08-20 | — | — | US | disclosed |
| US-20020111509-A1 | (Meth) acrylate, polymer, photoresist composition, and pattern forming process making use of the composition | NEC CORPORATION (JP) | 2002-08-15 | — | — | US | disclosed |
| EP-1231205-A1 | VINYLPHENYLPROPIONIC ACID DERIVATIVES, PROCESSES FOR PRODUCTION OF THE DERIVATIVES, POLYMERS THEREOF AND RADIOSENSITIVE RESIN COMPOSITIONS | JSR Corporation (JP) | 2002-08-14 | — | — | EP | disclosed |
| US-6432608-B1 | FINENESS PATTERN | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2002-08-13 | — | — | US | disclosed |
| EP-0803775-B1 | Positive working photosensitive composition | FUJI PHOTO FILM CO LTD (JP) | 2002-08-07 | — | — | EP | disclosed |
| US-20020102493-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-08-01 | — | — | US | disclosed |
| EP-0908783-B1 | Resist compositions, their preparation and use for patterning processes | SHINETSU CHEMICAL CO (JP) | 2002-07-31 | — | — | EP | disclosed |
| US-20020098442-A1 | Resist resins, chemically amplified resist composition, and process for the formation of a pattern | NEC CORPORATION | 2002-07-25 | — | — | US | disclosed |
| US-20020098443-A1 | Amine compounds, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-07-25 | — | — | US | disclosed |
| EP-1225479-A2 | Chemical amplifying type positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2002-07-24 | — | — | EP | disclosed |
| US-6420085-B1 | SULFONIUM SALT PHOTOACID GENERATOR WITH HIGH SENSITIVITY TO ARF EXCIMER LASER; THERMAL AND STORAGE STABILITY; | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-07-16 | — | — | US | disclosed |
| US-20020091215-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-07-11 | — | — | US | disclosed |
| US-20020086222-A1 | Photomask and manufacturing method of an electronic device therewith | RENESAS ELECTRONICS CORPORATION (JP) | 2002-07-04 | — | — | US | disclosed |
| US-6413695-B1 | ENANTIOMORPHS; EXPOSURE, DEVELOPMENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-07-02 | — | — | US | disclosed |
| US-20020081524-A1 | Chemical amplifying type positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2002-06-27 | — | — | US | disclosed |
| EP-0819981-B1 | Radiation sensitive resin composition | JSR CORP (JP) | 2002-06-05 | — | — | EP | disclosed |
| US-6399274-B1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD (JP) | 2002-06-04 | — | — | US | disclosed |
| US-20020061465-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-05-23 | — | — | US | disclosed |
| US-20020061463-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-05-23 | — | — | US | disclosed |
| EP-1207423-A1 | Chemically amplifying type positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2002-05-22 | — | — | EP | disclosed |
| US-6391529-B2 | PHOTOLITHOGRAPHY USING AS PHOTORESIST A PHOTOACID GENERATOR AND (METH)ACRYLIC ACID ESTERS OF ACID- OR ESTER-FUNCTIONAL C17-23 DIVALENT BRIDGED CYCLIC HYDROCARBON ALCOHOLS; ETCH RESISTANCE, TRANSPARENCY TO 220 NANOMETERS AND SHORTER | NEC CORPORATION (JP) | 2002-05-21 | — | — | US | disclosed |
| US-20020058205-A1 | High molecular weight silicone compounds, resist compositions, and patterning method | NAKASHIMA MUTSUO (JP) | 2002-05-16 | — | — | US | disclosed |
| US-20020055550-A1 | Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective coating | SHIN-ETSU CHEMICAL CO. LTD. (JP) | 2002-05-09 | — | — | US | disclosed |
| US-6384169-B1 | POLYHYDROXYSTYRENE WITH ACID LABILE GROUP, MODIFIED AT ENDS WITH ALKYLS, ESTERS OR ALCOHOLS; INCREASED DISSOLUTION RATE, HIGH SENSITIVITY AND RESOLUTION; RESIST PATTERNS HAVE PLASMA ETCHING RESISTANCE, HEAT RESISTANCE, REPRODUCIBILITY | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-05-07 | — | — | US | disclosed |
| US-20020051935-A1 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD (JP) | 2002-05-02 | — | — | US | disclosed |
| US-20020051937-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-05-02 | — | — | US | disclosed |
| EP-0795786-B1 | Positive photosensitive composition | FUJI PHOTO FILM CO LTD (JP) | 2002-05-02 | — | — | EP | disclosed |
| US-20020051936-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-05-02 | — | — | US | disclosed |
| US-20020048724-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-04-25 | — | — | US | disclosed |
| US-20020042017-A1 | Chemically amplified positive resist composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-04-11 | — | — | US | disclosed |
| EP-0837367-B1 | Positive resist composition comprising a dipyridyl compound | SUMITOMO CHEMICAL CO (JP) | 2002-04-10 | — | — | EP | disclosed |
| EP-1195390-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-04-10 | — | — | EP | disclosed |
| EP-1186624-A1 | Organosiloxane polymers and photo-curable resin compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-03-13 | — | — | EP | disclosed |
| EP-0837368-B1 | Positive resist composition | SUMITOMO CHEMICAL CO (JP) | 2002-02-20 | — | — | EP | disclosed |
| US-20020015906-A1 | Polymer for photoresist, method of production thereof and photoresist composition containing polymer | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2002-02-07 | — | — | US | disclosed |
| US-20020016431-A1 | Monomer having diol structure, polymer thereof, and negative photoresist composition and pattern forming method using the same background of the invention | NEC CORPORATION | 2002-02-07 | — | — | US | disclosed |
| US-20020012871-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-01-31 | — | — | US | disclosed |
| US-20020012872-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-01-31 | — | — | US | disclosed |
| US-6340557-B1 | DEPOSITING ANTI-REFLECTION COATING OF ORGANIC MATERIAL FOR ABSORBING ENERGY BEAM ON ETCHING TARGET FILM FORMED ON A SEMICONDUCTOR SUBSTRATE, A PHOTOSENSITIVE FILM INCLUDING A SULFONYL COMPOUND IS DEPOSITED; IRRADIATING, REMOVING | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2002-01-22 | — | — | US | disclosed |
| US-20020006576-A1 | Positive type photoresist composition | FUJIFILM CORPORATION (JP) | 2002-01-17 | — | — | US | disclosed |
| US-20020007031-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-01-17 | — | — | US | disclosed |
| US-20020004178-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-01-10 | — | — | US | disclosed |
| US-20020004569-A1 | Polymer, chemically amplified resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-01-10 | — | — | US | disclosed |
| US-20020001772-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-01-03 | — | — | US | disclosed |
| US-6335141-B1 | HIGH ALKALI DISSOLUTION CONTRAST, HIGH SENSITIVITY AND HIGH RESOLUTION | SHIN-ETSU CHEMICAL, CO., LTD. (JP) | 2002-01-01 | — | — | US | disclosed |
| US-20010055727-A1 | Resist material and method for pattern formation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-12-27 | — | — | US | disclosed |
| EP-1164433-A1 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-12-19 | — | — | EP | disclosed |
| US-20010051315-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-12-13 | — | — | US | disclosed |
| US-20010051316-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-12-13 | — | — | US | disclosed |
| US-6329119-B1 | ALKALI SOLUBLE RESIN, ACID GENERATOR, CROSSLINKING AGENT, AND A BASIC COMPOUND THAT IS EITHER A DIPYRIDYL COMPOUND OR A BISAMINOBENZENE COMPOUND; EXCELLENT PATTERN PROFILE, SMALL TEMPERATURE DEPENDENCY OF THE PATTERN DIMENSIONS, SENSITIVITY | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-12-11 | — | — | US | disclosed |
| US-20010046641-A1 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-11-29 | — | — | US | disclosed |
| US-6322949-B2 | SULFONIUM COMPOUND AS PHOTOACID GENERATOR | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 2001-11-27 | — | — | US | disclosed |
| US-20010044066-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-11-22 | — | — | US | disclosed |
| US-20010044071-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD (JP) | 2001-11-22 | — | — | US | disclosed |
| US-20010044070-A1 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-11-22 | — | — | US | disclosed |
| US-20010038969-A1 | Novel polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. OF (JP) | 2001-11-08 | — | — | US | disclosed |
| US-20010039080-A1 | Chemically amplified positive resist compositon | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-11-08 | — | — | US | disclosed |
| US-6312869-B1 | Chemically amplified positive resist composition, pattern forming method, and method for preparing polymer having a crosslinking group | SHIN-ETSU CHEMICAL, CO., LTD. (JP) | 2001-11-06 | — | — | US | disclosed |
| US-6312867-B1 | Ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-11-06 | — | — | US | disclosed |
| US-20010036589-A1 | CHEMICALLY AMPLIFIED RESIST COMPOSITION | MERCK PATENT GMBH (DE) | 2001-11-01 | — | — | US | disclosed |
| US-20010035394-A1 | Chemically amplified positive resist composition and patterning method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-11-01 | — | — | US | disclosed |
| EP-1150166-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-31 | — | — | EP | disclosed |
| EP-1150167-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-31 | — | — | EP | disclosed |
| EP-1149825-A2 | Ester compounds, polymers, resist compositions and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2001-10-31 | — | — | EP | disclosed |
| US-6309796-B1 | PHOTORESISTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-30 | — | — | US | disclosed |
| US-20010033987-A1 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-10-25 | — | — | US | disclosed |
| US-20010033990-A1 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-25 | — | — | US | disclosed |
| US-20010033989-A1 | Novel polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-25 | — | — | US | disclosed |
| EP-1148044-A1 | Ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-24 | — | — | EP | disclosed |
| EP-1148045-A1 | Ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-24 | — | — | EP | disclosed |
| US-20010031424-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. OF (JP) | 2001-10-18 | — | — | US | disclosed |
| US-20010031429-A1 | (Meth) acrylate, polymer, photoresist composition, and pattern forming process making use of the composition | NEC CORPORATION (JP) | 2001-10-18 | — | — | US | disclosed |
| EP-0880075-B1 | Radiation sensitive resin composition | JSR CORP (JP) | 2001-10-17 | — | — | EP | disclosed |
| US-6303264-B1 | PROFILE OF PATTERN OF QUARTER MICRON ORDER WITHOUT CAUSING FOOTING, WHILE RETAINING HIGH RESOLUTION ABILITY AND HIGH SENSITIVITY | WAKO PURE CHEMICAL INDUSTRIES, LTD (JP) | 2001-10-16 | — | — | US | disclosed |
| EP-1143299-A1 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-10-10 | — | — | EP | disclosed |
| US-20010026904-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-04 | — | — | US | disclosed |
| US-20010026901-A1 | (Meth) acrylate derivative, polymer and photoresist composition having lactone structure, and method for forming pattern by using it | NEC CORPORATION (JP) | 2001-10-04 | — | — | US | disclosed |
| US-20010024765-A1 | Novel process for preparing resists | MERCK PATENT GMBH (DE) | 2001-09-27 | — | — | US | disclosed |
| EP-1136885-A1 | Chemically amplified positive resist composition and patterning method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-09-26 | — | — | EP | disclosed |
| EP-0827970-B1 | New acid-labile group protected hydroxystyrene polymers or copolymers thereof and their application to radiation sensitive materials | CLARIANT FINANCE BVI LTD (VG) | 2001-09-26 | — | — | EP | disclosed |
| US-20010023050-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2001-09-20 | — | — | US | disclosed |
| EP-1132774-A2 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-09-12 | — | — | EP | disclosed |
| US-6284429-B1 | FOR FORMULATING PHOTORESISTS HAVING SENSITIVITY, RESOLUTION, ETCHING RESISTANCE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-09-04 | — | — | US | disclosed |
| US-6284427-B1 | Process for preparing resists | CLARIANT FINANCE (BVI) LIMITED (VG) | 2001-09-04 | — | — | US | disclosed |
| WO-2001063362-A2 | RESIST MATERIALS FOR 157-NM LITHOGRAPHY | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 2001-08-30 | — | — | WO | disclosed |
| WO-2001063360-A2 | ENCAPSULATED INORGANIC RESISTS | MASSACHUSETTS INSTITUTE OF TECHNOLOGY, INC. (US) | 2001-08-30 | — | — | WO | disclosed |
| US-20010018162-A1 | Novel polymers, chemical amplification resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-08-30 | — | — | US | disclosed |
| US-20010018161-A1 | Photosensitive resin for photolithography | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-08-30 | — | — | US | disclosed |
| EP-1128212-A2 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-08-29 | — | — | EP | disclosed |
| US-6280898-B1 | PHOTORESISTS PATTERNS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-08-28 | — | — | US | disclosed |
| US-20010016298-A1 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-08-23 | — | — | US | disclosed |
| EP-1126322-A2 | Fluorine-containing polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-08-22 | — | — | EP | disclosed |
| US-20010014427-A1 | Radiation sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 2001-08-16 | — | — | US | disclosed |
| US-20010014428-A1 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-08-16 | — | — | US | disclosed |
| US-6274286-B1 | Resist compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-08-14 | — | — | US | disclosed |
| EP-1122606-A2 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-08-08 | — | — | EP | disclosed |
| EP-1122604-A2 | Chemically amplified positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2001-08-08 | — | — | EP | disclosed |
| EP-1122605-A2 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-08-08 | — | — | EP | disclosed |
| EP-0794457-B1 | Positive working photosensitive composition | FUJI PHOTO FILM CO LTD (JP) | 2001-08-08 | — | — | EP | disclosed |
| EP-0838727-B1 | Radiation sensitive composition | CLARIANT FINANCE BVI LTD (VG) | 2001-06-20 | — | — | EP | disclosed |
| US-6248499-B1 | ACRYLATE ESTER POLYMERS AND COPOLYMERS | NEC CORPORATION (JP) | 2001-06-19 | — | — | US | disclosed |
| US-20010003772-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICDL CO., LTD. OF (JP) | 2001-06-14 | — | — | US | disclosed |
| US-6239231-B1 | HAS THE POLYMERIZATION UNIT OF 2-ALKYL-2-ADAMANTYL (METH)ACRYLATE AND ONE OR BOTH OF THE POLYMERIZATION UNIT OF 3-HYDROXY-1-ADAMANTYL (METH)ACRYLATE OR (METH)ACRYLONITRILE; ACID GENERATOR; SEMICONDUCTORS | SUMITOMO CHEMICAL, COMPANY LIMITED (JP) | 2001-05-29 | — | — | US | disclosed |
| EP-1099983-A1 | Chemically amplified positive resist composition and patterning method | Shin-Etsu Chemical Co., Ltd. (JP) | 2001-05-16 | — | — | EP | disclosed |
| EP-1096318-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-05-02 | — | — | EP | disclosed |
| EP-1096317-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-05-02 | — | — | EP | disclosed |
| US-6214517-B1 | PHOTORESIST HAVING AN ESTER MOIETY AND HYDROLYZABLE GROUPS TOGETHER WITH AN ACID GENERATOR; ULTRAMICRO LITHOGRAPHY, INTEGRATED CIRCUITS | FUJI PHOTO FILM CO., LTD. (JP) | 2001-04-10 | — | — | US | disclosed |
| EP-0789279-B1 | Polymer and resist material | WAKO PURE CHEM IND LTD (JP) | 2001-03-21 | — | — | EP | disclosed |
| EP-1085377-A1 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-03-21 | — | — | EP | disclosed |
| US-6200729-B1 | A RESIN BLENDS COMPRISING A PHOTOACID GENERATOR WHICH IS CAPABLE OF GENERATING A SULFONIC ACID UPON IRRADIATION WITH ACTINIC RAYS OR A RADIATION; USE IN THE PRODUCTION OF LITHOGRAPHIC PRINTING PLATES AND SEMICONDUCTORS | FUJI PHOTO FILM CO., LTD. (JP) | 2001-03-13 | — | — | US | disclosed |
| US-6187504-B1 | PHOTOSENSITIVE BLEND CONTAINING A NAPHTHALENE SULFONIUM SULFONATE DERIVATIVE PHOTOACID GENERATOR, RESIN HAVING ALKALI INSOLUBLE GROUPS CLEAVABLE BY ACID, AN ALKALI SOLUBLE RESIN AND A SOLUBILITY CONTROL AGENT; POSITIVES, RESOLUTION | JSR CORPORATION (JP) | 2001-02-13 | — | — | US | disclosed |
| EP-1059314-A1 | A resist composition | Wako Pure Chemical Industries, Ltd. (JP) | 2000-12-13 | — | — | EP | disclosed |
| EP-1059563-A1 | Agent for reducing substrate dependence of resist | Wako Pure Chemical Industries, Ltd. (JP) | 2000-12-13 | — | — | EP | disclosed |
| US-6156481-A | WITH HYDROXYSTYRENE-(METH)ACRYLIC ACID OR (METH)ACRYLATE COPOLYMER WHERE SOME PHENOLIC HYDROXYL GROUPS ARE CROSSLINKED WITH ETHER CONTAINING ACID LABILE GROUPS; DISSOLUTION INHIBITION AND INCREASED DISSOLUTION CONTRAST AFTER EXPOSURE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-12-05 | — | — | US | disclosed |
| US-6156477-A | Polymers and chemically amplified positive resist compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-12-05 | — | — | US | disclosed |
| US-6156476-A | Positive photoresist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2000-12-05 | — | — | US | disclosed |
| EP-1053985-A1 | Resist compositions and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2000-11-22 | — | — | EP | disclosed |
| US-6146806-A | Negative photoresist composition using polymer having 1,2-diol structure and process for forming pattern using the same | NEC CORPORATION (JP) | 2000-11-14 | — | — | US | disclosed |
| US-6147249-A | ESTER COMPOUND CAPABLE OF FORMING ACID-DECOMPOSABLE POLYMER WHICH CAN BE BLENDED AS BASE RESIN TO FORMULATE RESIST COMPOSITION HAVING HIGHER SENSITIVITY, RESOLUTION AND ETCHING RESISTANCE THAN CONVENTIONAL RESIST COMPOSITIONS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-11-14 | — | — | US | disclosed |
| US-6136502-A | COMPRISING ORGANIC SOLVENT, AT LEAST TWO POLYMERS WITH WEIGHT AVERAGE MOLECULAR WEIGHTS OF 1,000-500,000 WHICH HAVE AT LEAST ONE TYPE OF ACID LABILE GROUP AND ARE CROSSLINKED WITHIN A MOLECULE AND/OR BETWEEN MOLECULES, PHOTOACID GENERATOR | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-10-24 | — | — | US | disclosed |
| EP-1042298-A1 | POLYCYCLIC ALPHA-AMINO-EPSILON-CAPROLACTAMS AND RELATED COMPOUNDS | Elan Pharmaceuticals, Inc. (US) | 2000-10-11 | — | — | EP | disclosed |
| EP-1039346-A1 | Resist compositions and pattering process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-09-27 | — | — | EP | disclosed |
| US-6117621-A | APPLYING A CHEMICALLY AMPLIFIED POSITIVE RESIST OF A POLYMER WITH ACID LABILE GROUPS, A PHOTOACID GENERATOR AND A ORGANIC SOLVENT; RESOLUTION AND FOCAL DEPTH; EXPOSING, BAKING, AND DEVELOPING; CALIBRATION OF EXPOSURES AND DISSOLUTION RATES | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-09-12 | — | — | US | disclosed |
| US-6114462-A | CROSSLINKING A POLYVINYLPHENOL DERIVATIVE WITH UNSATURATED ETHER DERIVATIVES | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-09-05 | — | — | US | disclosed |
| EP-1031879-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-08-30 | — | — | EP | disclosed |
| US-6106993-A | HIGHLY SENSITIVE TO ACTINIC RADIATION SUCH AS DEEP-UV, ELECTRON BEAM AND X-RAY, CAN BE DEVELOPED WITH ALKALINE AQUEOUS SOLUTION TO FORM A PATTERN, AND IS THUS SUITABLE FOR USE IN A FINE PATTERNING TECHNIQUE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-08-22 | — | — | US | disclosed |
| EP-0665470-B1 | Method for forming a fine pattern | MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) | 2000-08-02 | — | — | EP | disclosed |
| EP-1024406-A1 | Resist composition | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 2000-08-02 | — | — | EP | disclosed |
| US-6087072-A | Article having a light-controllable super-water-repellent surface and a printing machine using the article | HITACHI, LTD. (JP) | 2000-07-11 | — | — | US | disclosed |
| US-6080522-A | CONTAINING PHOTORESIST AND POLYMER | CLARIANT INTERNAITONAL, LTD. (CH) | 2000-06-27 | — | — | US | disclosed |
| EP-0607899-B1 | Positive photoresist composition | SUMITOMO CHEMICAL CO (JP) | 2000-06-14 | — | — | EP | disclosed |
| US-6074801-A | POLYMER WITH REPEATING UNITS, CROSSLINKING AND ADDING PHOTOACID GENERATOR WITH LIGHT | NEC CORPORATION (JP) | 2000-06-13 | — | — | US | disclosed |
| EP-1004568-A2 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-05-31 | — | — | EP | disclosed |
| EP-0869393-B1 | Positive photosensitive composition | FUJI PHOTO FILM CO LTD (JP) | 2000-05-31 | — | — | EP | disclosed |
| US-6066433-A | SILICONE POLYMER CONTAINING PHENOLIC HYDROXYL GROUPS HAVING HYDROGEN ATOMS OF SOME PHENOLIC HYDROXYL GROUPS REPLACED BY ACID LABILE GROUPS, CROSSLINKED AT SOME OF THE REMAINING PHENOLIC HYDROXYL GROUPS WITH GROUPS HAVING ETHER LINKAGES | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-05-23 | — | — | US | disclosed |
| US-6063545-A | Negative-working radiation-sensitive mixture, and radiation-sensitive recording material produced with this mixture | CLARIANT GMBH (DE) | 2000-05-16 | — | — | US | disclosed |
| EP-0762207-B1 | Positive working photosensitive composition and method of producing relief structures | BASF AG (DE) | 2000-04-12 | — | — | EP | disclosed |
| US-6048661-A | POLYMER WITH HYDROXY AND CARBOXY GROUPS AND ETHER ESTER GROUPS FOR PHOTORESISTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-04-11 | — | — | US | disclosed |
| EP-0989460-A1 | PATTERN FORMING METHOD | Clariant Finance (BVI) Limited (VG) | 2000-03-29 | — | — | EP | disclosed |
| EP-0989459-A1 | CHEMICALLY AMPLIFIED RESIST COMPOSITION | Clariant Finance (BVI) Limited (VG) | 2000-03-29 | — | — | EP | disclosed |
| US-6037098-A | AROMATIC SULFONIC ACID GENERATED FROM A SULFONIUM COMPOUND TO ENHANCE RESIN ALKALINE SOLUBILITY; REDUCED DIFFUSIBILITY OF ACID IN FILM, I.E., UNIFORM LINE WIDTH; HIGH PHOTOSENSITIVITY AND PHOTODECOMPOSITION EFFICIENCY | FUJI PHOTO FILM CO., LTD. (JP) | 2000-03-14 | — | — | US | disclosed |
| US-6033826-A | POLYHYDROXYSTYRENE DERIVATIVE CONTAINING AN ACETAL OR KETAL GROUP WHICH CAN EASILY BE ELIMINATED IN THE PRESENCE OF AN ACID IN THE MOLECULE AND HAVING A VERY NARROW MOLECULAR WEIGHT DISTRIBUTION GIVES A RESIST MATERIAL | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2000-03-07 | — | — | US | disclosed |
| US-6033828-A | POLYVINYLPHENOL DERIVATIVES | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-03-07 | — | — | US | disclosed |
| EP-0982628-A2 | A chemical amplifying type positive resist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2000-03-01 | — | — | EP | disclosed |
| US-6030746-A | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPRISES A ORGANIC SOLVENT, AN ALKALI SOLUBLE RESIN, A PHOTOACID GENERATOR AND A DISSOLUTION RATE REGULATOR | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-02-29 | — | — | US | disclosed |
| US-6030747-A | CHEMICALLY AMPLIFIED RESIST CONSISTS OF A PHOTOACID GENERATOR, A CROSSLINKING AGENT ACTIVATED IN PRESENCE OF ACID AND A COPOLYMER OF ACRYLIC OR METHACRYLIC ESTER CONTAINING AN ACID, HYDROXY OR ESTER POLAR GROUP AND A COMPOUND | NEC CORPORATION (JP) | 2000-02-29 | — | — | US | disclosed |
| US-6027854-A | ACTINIC RADIATION-SENSITIVE, CROSSLINKED TERPOLYMER CONTAINING STYRENIC GROUPS RING-SUBSTITUTED WITH HYDROXYL, HYDROXYALKYLOXY, CARBOXYALKYLOXY MOIETIES AND ACID LABILE GROUPS; ETCHING AND HEAT RESISTANCE | SHIN-ETSU CHEMICAL CO., LTD. | 2000-02-22 | — | — | US | disclosed |
| US-6027852-A | Article having a light-controllable super-water-repellent surface and a printing machine using the article | HITACHI, LTD. (JP) | 2000-02-22 | — | — | US | disclosed |
| US-6013413-A | Alicyclic nortricyclene polymers and co-polymers | CORNELL RESEARCH FOUNDATION, INC. (US) | 2000-01-11 | — | — | US | disclosed |
| US-6010820-A | COMPOUND CAPABLE OF GENERTING SULFONIC ACID UPON IRRADIATION | FUJI PHOTO FILM CO., LTD. (JP) | 2000-01-04 | — | — | US | disclosed |
| EP-0534324-B1 | Radiation sensitive compositions comprising polymer having acid labile groups | SHIPLEY CO (US) | 1999-12-22 | — | — | EP | disclosed |
| EP-0704762-B1 | Resist material and pattern formation | WAKO PURE CHEM IND LTD (JP) | 1999-12-15 | — | — | EP | disclosed |
| US-5994022-A | BECOMES SOLUBLE IN ALKALI DEVELOPING SOLUTION BY ACTION OF AN ACID | JSR CORPORATION (JP) | 1999-11-30 | — | — | US | disclosed |
| US-5981140-A | COMPRISES A RESIN GROUP CAPABLE OF DECOMPOSING BY THE ACTION OF AN ACID TO ENHANCE SOLUBILITY OF THE RESIN IN AN ALKALINE DEVELOPING SOLUTION AND A SULFONIUM OR IODINIUM ARYLATE CONTAINING AROMATIC SULFONIC ACID COMPOUND | FUJI PHOTO FILM CO., LTD. (JP) | 1999-11-09 | — | — | US | disclosed |
| US-5976759-A | ALKALI SOLUBLE BY HEATING | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 1999-11-02 | — | — | US | disclosed |
| US-5972560-A | A CROSSLINKED POLYSILOXANE PHOTOACID GENERATOR HAVING HIGH TRANSPARENCY, HIGH RESOLUTION, IMPROVED LATITUDE OF EXPOSURE, PROCESS ADAPTABILITY, AND FOR PRECISE MICRO-PROCESSING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-10-26 | — | — | US | disclosed |
| US-5972559-A | A PHOTORESIST MIXTURE COMPRISING AN ORGANIC SOLVENT, A COPOLYCARBONS BASE RESIN, A PHOTOACID GENERATOR, AND AN AROMATIC ALKYLENE CARBOXYLIC ACID COMPOUND; FOR IMPROVING THE FOOTING ON NITRIDE FILM SUBSTRATES AND POST EXPOSURE DELAY | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-10-26 | — | — | US | disclosed |
| US-5962187-A | MIXED SOLVENT OF PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE AND OTHER PROPYLENE GLYCOL DERIVATIVE. PHOTORESISTS | CLARIENT INTERNATIONAL LTD. (CH) | 1999-10-05 | — | — | US | disclosed |
| US-5958648-A | Radiation sensitive resin composition | JSR CORPORATION (JP) | 1999-09-28 | — | — | US | disclosed |
| EP-0553737-B1 | Radiation-sensitive composition | BASF AG (DE) | 1999-09-22 | — | — | EP | disclosed |
| EP-0942329-A1 | NOVEL PROCESS FOR PREPARING RESISTS | Clariant International Ltd. (CH) | 1999-09-15 | — | — | EP | disclosed |
| US-5952150-A | COMPRISING A DISULFONYLMETHANE DERIVATIVE, A RESIN PROTECTED BY AN ACID DECOMPOSABLE GROUP OR AN ALKALI-SOLUBLE RESIN AND AN ALKALI SOLUBILITY CONTROL AGENT; PHOTORESISTS | JSR CORPORATION (JP) | 1999-09-14 | — | — | US | disclosed |
| EP-0939342-A1 | Process for forming photoresist patterns | Sharp Kabushiki Kaisha (JP) | 1999-09-01 | — | — | EP | disclosed |
| US-5945250-A | CONTAINING A SULFONIUM SALT RESIN; HAVING GOOD SOLUBILITY IN SOLVENT, HIGH PHOTOSENSITIVITY, EXCELLENT RESIST PATTERN AND STABILITY | FUJI PHOTO FILM CO., LTD. (JP) | 1999-08-31 | — | — | US | disclosed |
| US-5942367-A | HIGH SENSITIVITY, RESOLUTION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-08-24 | — | — | US | disclosed |
| WO-1999032453-A1 | POLYCYCLIC α-AMINO-⊂-CAPROLACTAMS AND RELATED COMPOUNDS | ELAN PHARMACEUTICALS, INC. (US) | 1999-07-01 | — | — | WO | disclosed |
| US-5916728-A | RESIN WHICH IS CONVERTED TO ALKALI-SOLUBLE FROM ALKALI-INSOLUBLE OR ALKALI-SLIGHTLY SOLUBLE BY THE ACTION OF AN ACID, ACID GENERATOR AND TERTIARY AMINE COMPOUND HAVING AN ALIPHATIC HYDROXYL GROUP. | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-06-29 | — | — | US | disclosed |
| US-5914219-A | Radiation-sensitive mixture and the production of relief structures having improved contrast | BASF AKTIENGESELLSCHAFT (DE) | 1999-06-22 | — | — | US | disclosed |
| EP-0922998-A1 | RADIATION-SENSITIVE RESIST COMPOSITION WITH HIGH HEAT RESISTANCE | Clariant International Ltd. (CH) | 1999-06-16 | — | — | EP | disclosed |
| EP-0908783-A1 | Resist compositions, their preparation and use for patterning processes | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-04-14 | — | — | EP | disclosed |
| EP-0908473-A1 | Styrene polymers, chemically-amplified positive resist compositions, their preparation and use in a patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-04-14 | — | — | EP | disclosed |
| US-5891603-A | N-HYDROCARBYLSULFONYLOXY-SUBSTITUTED CYCLIC IMIDE SULFONIC ACID GENERATORS, POLYVINYLPHENOL DERIVATIVES | FUJI PHOTO FILM CO., LTD. (JP) | 1999-04-06 | — | — | US | disclosed |
| US-5891601-A | DIPYRIDYL COMPOUND | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 1999-04-06 | — | — | US | disclosed |
| US-5876900-A | POLYHYDROXYSTYRENE POLYMER | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-03-02 | — | — | US | disclosed |
| US-5866304-A | USING AN ACRYLATED ACID TERPOLYMER | NEC CORPORATION (JP) | 1999-02-02 | — | — | US | disclosed |
| US-5856561-A | Bisphenol carboxylic acid tertiary ester derivatives and chemically amplified positive resist compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-01-05 | — | — | US | disclosed |
| EP-0887705-A1 | Resist compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1998-12-30 | — | — | EP | disclosed |
| US-5852128-A | Acid-labile group protected hydroxystyrene polymers or copolymers thereof and their application to radiation sensitive materials | CLARIANT AG (CH) | 1998-12-22 | — | — | US | disclosed |
| EP-0880075-A1 | Radiation sensitive resin composition | JSR Corporation (JP) | 1998-11-25 | — | — | EP | disclosed |
| EP-0681713-B1 | SULPHONIC ACID ESTERS, RADIATION-SENSITIVE MIXTURES MADE THEREWITH, AND THEIR USE | CLARIANT GMBH (DE) | 1998-11-18 | — | — | EP | disclosed |
| US-5837423-A | Semiconductor IC device fabricating method | HITACHI, LTD. (JP) | 1998-11-17 | — | — | US | disclosed |
| US-5837420-A | USED IN MANUFACTURING OF LITHOGRAPHIC PRINTING PLATE, INTEGRATED CIRCUITS, CIRCUIT SUBSTRATE FOR LIQUID CRYSTAL, THERMAL HEAD | FUJI PHOTO FILM CO., LTD. (JP) | 1998-11-17 | — | — | US | disclosed |
| EP-0875787-A1 | Method for reducing the substrate dependence of resist | Wako Pure Chemical Industries, Ltd. (JP) | 1998-11-04 | — | — | EP | disclosed |
| EP-0869393-A1 | Positive photosensitive composition | FUJI PHOTO FILM CO., LTD. (JP) | 1998-10-07 | — | — | EP | disclosed |
| EP-0510449-B1 | Acid-cleavable compounds, positive-working radiation-sensitive composition containing the same and radiation-sensitive recording material prepared therefrom | CLARIANT GMBH (DE) | 1998-08-05 | — | — | EP | disclosed |
| US-5783354-A | QUATERNARY AMMONIUM COMPOUNDS | BASF AKTIENGESELLSCHAFT (DE) | 1998-07-21 | — | — | US | disclosed |
| EP-0851297-A1 | Radiation-sensitive composition adapted for roller coating | CLARIANT INTERNATIONAL LTD. (CH) | 1998-07-01 | — | — | EP | disclosed |
| EP-0851298-A1 | Radiation sensitive composition adapted for roller coating | CLARIANT INTERNATIONAL LTD. (CH) | 1998-07-01 | — | — | EP | disclosed |
| EP-0849634-A1 | Radiation sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1998-06-24 | — | — | EP | disclosed |
| US-5759750-A | Radiation-sensitive mixture | BASF AKTIENGESELLSCHAFT (DE) | 1998-06-02 | — | — | US | disclosed |
| EP-0843220-A1 | Radiation sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1998-05-20 | — | — | EP | disclosed |
| EP-0838727-A1 | Radiation sensitive composition | Clariant International Ltd. (CH) | 1998-04-29 | — | — | EP | disclosed |
| EP-0837367-A2 | Positive resist composition comprising a dipyridyl compound | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 1998-04-22 | — | — | EP | disclosed |
| EP-0837368-A1 | Positive resist composition | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 1998-04-22 | — | — | EP | disclosed |
| US-5738975-A | MIXTURE CONTAINING (METH)ACRYLATE TERPOLYMER HAVING GROUP WHICH REACTS WITH AN ACID TO CONVERT POLARITY OF POLYMER, PHOTO ACID GENERATING COMPOUND, SOLVENT | NEC CORPORATION (JP) | 1998-04-14 | — | — | US | disclosed |
| EP-0831369-A2 | Positive photosensitive composition | FUJI PHOTO FILM CO., LTD. (JP) | 1998-03-25 | — | — | EP | disclosed |
| EP-0827970-A2 | New acid-labile group protected hydroxystyrene polymers or copolymers thereof and their application to radiation sensitive materials | Clariant AG (CH) | 1998-03-11 | — | — | EP | disclosed |
| US-5716756-A | POSITIVE OR NEGATIVE WORKING MIXTURES | HOECHST AKTIENGESELLSCHAFT (DE) | 1998-02-10 | — | — | US | disclosed |
| EP-0819981-A1 | Radiation sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1998-01-21 | — | — | EP | disclosed |
| EP-0388813-B1 | Pattern forming material and process for forming pattern using the same | HITACHI LTD (JP) | 1997-12-10 | — | — | EP | disclosed |
| US-5691111-A | SULFONIUM SALT, ACRYLATE ESTER POLYMER | NEC CORPORATION (JP) | 1997-11-25 | — | — | US | disclosed |
| EP-0803775-A1 | Positive working photosensitive composition | FUJI PHOTO FILM CO., LTD. (JP) | 1997-10-29 | — | — | EP | disclosed |
| EP-0795786-A2 | Positive photosensitive composition | FUJI PHOTO FILM CO., LTD. (JP) | 1997-09-17 | — | — | EP | disclosed |
| EP-0794457-A2 | Positive working photosensitive composition | FUJI PHOTO FILM CO., LTD. (JP) | 1997-09-10 | — | — | EP | disclosed |
| EP-0508174-B1 | Radiation sensitive mixture, containing groups which are labile in acid environment and method for fabrication of relief patterns and relief images | BASF AG (DE) | 1997-09-03 | — | — | EP | disclosed |
| EP-0789279-A1 | Polymer and resist material | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1997-08-13 | — | — | EP | disclosed |
| EP-0780732-A2 | Polymer composition and resist material | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1997-06-25 | — | — | EP | disclosed |
| US-5641715-A | Semiconductor IC device fabricating method | HITACHI, LTD. (JP) | 1997-06-24 | — | — | US | disclosed |
| US-5635332-A | MIXTURE WITH ULTRAVIOLET TRANSPARENT POLYMER HAVING GROUPS WHICH ARE UNSTABLE TO ACID | NEC CORPORATION (JP) | 1997-06-03 | — | — | US | disclosed |
| US-5633112-A | Photosensitive resin composition containing a carboxylic acid polymer, photoacid generator and secondary or tertiary aliphatic amine | HITACHI, LTD. (JP) | 1997-05-27 | — | — | US | disclosed |
| EP-0616258-B1 | Radiation sensitive composition and process for forming relief structures with improved contrast | BASF AG (DE) | 1997-05-21 | — | — | EP | disclosed |
| US-5621019-A | PHOTORESIST CONTAINING PHOTO ACID GENERATOR AND ULTRAVIOLET RADIATION TRANSPARENT ACRYLIC POLYMER HAVING BRIDGED CYCLOHYDROCARBON GROUP RESIDUE; RESOLUTION, DRY ETCH RESISTANCE | NEC CORPORATION (JP) | 1997-04-15 | — | — | US | disclosed |
| EP-0762207-A2 | Positive working photosensitive composition and method of producing relief structures | BASF AKTIENGESELLSCHAFT (DE) | 1997-03-12 | — | — | EP | disclosed |
| US-5585507-A | FINENESS PATTERNS | NEC CORPORATION (JP) | 1996-12-17 | — | — | US | disclosed |
| US-5585223-A | RADIATION ACTIVATION; HEATING; ETCHING | CORNELL RESEARCH FOUNDATION, INC. (US) | 1996-12-17 | — | — | US | disclosed |
| US-5565304-A | ALKALI SOLUBLE BINDER RESIN FROM HYDROXYSTYRENEAND METHYLOLATED PHENOLIC COMPOUND | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-10-15 | — | — | US | disclosed |
| US-5558971-A | HYDROXYSTYRENE POLYMER DERIVATIVES, PHOTOACID GENERATOR | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 1996-09-24 | — | — | US | disclosed |
| US-5558976-A | HYDROXYSTYRENE POLYMER DERIVATIVES, PHOTOACID GENERATOR, PHOTORESISTS | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 1996-09-24 | — | — | US | disclosed |
| US-5550004-A | RESIN BINDER HAVING HYDROXYSTYRENE AND MONOMETHYLOLATED PHENOLIC COMPOUNDS | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-08-27 | — | — | US | disclosed |
| EP-0727711-A2 | Photoresist compositions containing supercritical fluid fractionated polymeric binder resins | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-08-21 | — | — | EP | disclosed |
| US-5536616-A | Photoresists containing water soluble sugar crosslinking agents | CORNELL RESEARCH FOUNDATION, INC. (US) | 1996-07-16 | — | — | US | disclosed |
| US-5532113-A | IRRADIATING PREDETERMINED SITES OF PHOTORESIST TO ACTIVATE PHOTOACTIVE AGENT AT THE SITES AND CREATE EXPOSED AND UNEXPOSED SITES OF PHOTORESIST, HEATING PHOTORESIST, REMOVING MATTER FROM UNEXPOSED SITES | CORNELL RESEARCH FOUNDATION (US) | 1996-07-02 | — | — | US | disclosed |
| US-5532106-A | MICROELECTRONICS WITH POLYMERS, PHOTOACTIVE AGENTS AND DISSOLUTION INHIBITORS | CORNELL RESEARCH FOUNDATION, INC. (US) | 1996-07-02 | — | — | US | disclosed |
| US-5518579-A | SEMICONDUCTORS | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1996-05-21 | — | — | US | disclosed |
| EP-0704762-A1 | Resist material and pattern formation | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1996-04-03 | — | — | EP | disclosed |
| EP-0697632-A2 | Chemically amplified radiation-sensitive composition | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-02-21 | — | — | EP | disclosed |
| US-5470996-A | Pattern forming material and process for forming pattern using the same | HITACHI, LTD. (JP) | 1995-11-28 | — | — | US | disclosed |
| EP-0681713-A1 | SULPHONIC ACID ESTERS, RADIATION-SENSITIVE MIXTURES MADE THEREWITH, AND THEIR USE | HOECHST AKTIENGESELLSCHAFT (DE) | 1995-11-15 | — | — | EP | disclosed |
| EP-0665470-A2 | Method for forming a fine pattern | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1995-08-02 | — | — | EP | disclosed |
| JP-H06348015-A | PHOTOSENSITIVE RESIN COMPOSITION AND RESIST IMAGE FORMING METHOD | HITACHI CHEM CO LTD | 1994-12-22 | — | — | JP | disclosed |
| US-5362600-A | Radiation sensitive compositions comprising polymer having acid labile groups | SHIPLEY COMPANY INC. (US) | 1994-11-08 | — | — | US | disclosed |
| EP-0620500-A2 | Resist and pattern formation using the same | HITACHI, LTD. (JP) | 1994-10-19 | — | — | EP | disclosed |
| EP-0616258-A1 | Radiation sensitive composition and process for forming relief structures with improved contrast | BASF Aktiengesellschaft (DE) | 1994-09-21 | — | — | EP | disclosed |
| WO-1994018606-A1 | SULPHONIC ACID ESTERS, RADIATION-SENSITIVE MIXTURES MADE THEREWITH, AND THEIR USE | HOESCHT AKTIENGESELLSCHAFT (DE) | 1994-08-18 | — | — | WO | disclosed |
| EP-0607899-A2 | Positive photoresist composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1994-07-27 | — | — | EP | disclosed |
| US-5328807-A | Method of forming a pattern | HITICHI, LTD. (JP) | 1994-07-12 | — | — | US | disclosed |
| US-5318876-A | Solutions of water insoluble, base soluble polymeric binder, substituted sulfonium salts, substituted benzenesulfonates, having tolerance for delay between exposure and heating to develop | BASF AKTIENGESELLSCHAFT (DE) | 1994-06-07 | — | — | US | disclosed |
| EP-0588544-A2 | Fine pattern forming material and pattern formation process | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1994-03-23 | — | — | EP | disclosed |
| EP-0586860-A2 | Photoresist composition and process for forming a pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 1994-03-16 | — | — | EP | disclosed |
| US-5258257-A | Radiation sensitive compositions comprising polymer having acid labile groups | SHIPLEY COMPANY INC. (US) | 1993-11-02 | — | — | US | disclosed |
| EP-0553737-A1 | Radiation-sensitive composition | BASF Aktiengesellschaft (DE) | 1993-08-04 | — | — | EP | disclosed |
| EP-0534324-A1 | Radiation sensitive compositions comprising polymer having acid labile groups | SHIPLEY COMPANY INC. (US) | 1993-03-31 | — | — | EP | disclosed |
| EP-0510441-A1 | Positive-working radiation-sensitive composition and radiation-sensitive recording material produced therewith | HOECHST AKTIENGESELLSCHAFT (DE) | 1992-10-28 | — | — | EP | disclosed |
| EP-0510446-A1 | Negative-working radiation-sensitive composition and radiation-sensitive recording material produced therewith | HOECHST AKTIENGESELLSCHAFT (DE) | 1992-10-28 | — | — | EP | disclosed |
| EP-0508174-A1 | Radiation sensitive mixture, containing groups which are labile in acid environment and method for fabrication of relief patterns and relief images | BASF Aktiengesellschaft (DE) | 1992-10-14 | — | — | EP | disclosed |
| US-5118582-A | PATTERN FORMING MATERIAL AND PROCESS FOR FORMING PATTERN USING THE SAME | HITACHI, LTD. (JP) | 1992-06-02 | — | — | US | disclosed |
| EP-0388813-A2 | Pattern forming material and process for forming pattern using the same | HITACHI, LTD. (JP) | 1990-09-26 | — | — | EP | disclosed |
| EP-0388813-A2 | Pattern forming material and process for forming pattern using the same | HITACHI, LTD. (JP) | 1990-09-26 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (50 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-10564542-B2 | Photoresist compositions and methods | PARG, PNN, PARN | CYP1A2 4427/4885ALPL 2194/4885TSHR 4722/4885 |
| US-20030194634-A1 | Novel anthracene derivative and radiation-sensitive resin composition | SRSF1, ARL1, ERCC4 | CYP1A2 2917/4885ALPL 2280/4885TSHR 3953/4885 |
| US-12493241-B2 | Photoacid generators, photoresist compositions, and pattern formation methods | ARF1, ARL1, GNA11 | CYP1A2 528/4885ALPL 4371/4885TSHR 3242/4885 |
| US-20170144954-A1 | MATERIAL FOR FORMING FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING FILM FOR LITHOGRAPHY, FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD AND PURIFICATION METHOD | FRG1, MLLT3, FEM1B | CYP1A2 3665/4885ALPL 1933/4885TSHR 3481/4885 |
| US-20240019779-A1 | COMPOUNDS AND PHOTORESIST COMPOSITIONS INCLUDING THE SAME | CRY1, CCNT1, CCNA1 | CYP1A2 902/4885ALPL 2894/4885TSHR 3135/4885 |
| US-20180284615-A1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | GPX4, PLOD1, AQP1 | CYP1A2 606/4885ALPL 1347/4885TSHR 4593/4885 |
| US-10416563-B2 | Resist underlayer film composition, patterning process, and method for forming resist underlayer film | PRDX1, PRDX4, QSOX1 | CYP1A2 1450/4885ALPL 2579/4885TSHR 3507/4885 |
| US-10577323-B2 | Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and method for purifying compound or resin | TXNL1, RER1, LAS1L | CYP1A2 2928/4885ALPL 2838/4885TSHR 3138/4885 |
| US-20180284614-A1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | PRDX1, PRDX4, QSOX1 | CYP1A2 1450/4885ALPL 2579/4885TSHR 3507/4885 |
| US-20190018320-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | TET1, KDM2B, ARCN1 | CYP1A2 2344/4885ALPL 4440/4885TSHR 4134/4885 |
| US-20260079398-A1 | PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | ARCN1, SMC4, CCT4 | CYP1A2 3591/4885ALPL 4300/4885TSHR 2944/4885 |
| US-10364314-B2 | Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, resist pattern forming method, circuit pattern forming method, and purification method | TXNL1, RER1, MLLT1 | CYP1A2 2958/4885ALPL 3297/4885TSHR 3091/4885 |
| US-20260132241-A1 | MAIN CHAIN SCISSIONABLE BLOCK COPOLYMERS, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS | DCLRE1A, CD79B, RAD1 | CYP1A2 3708/4885ALPL 4484/4885TSHR 1687/4885 |
| US-20110003250-A1 | COATING COMPOSITIONS SUITABLE FOR USE WITH AN OVERCOATED PHOTORESIST | DHPS, HAAO, FTO | CYP1A2 50/4885ALPL 928/4885TSHR 4365/4885 |
| US-20150376202-A1 | COMPOUND, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD | APOL1, TOP1, VIL1 | CYP1A2 804/4885ALPL 1125/4885TSHR 4484/4885 |
| US-10338471-B2 | Composition for forming underlayer film for lithography, underlayer film for lithography and pattern forming method | LCLAT1, SGMS1, LIPA | CYP1A2 1583/4885ALPL 554/4885TSHR 4793/4885 |
| US-20100331508-A1 | (METH)ACRYLATE DERIVATIVE, INTERMEDIATE THEREOF, AND POLYMER COMPOUND | MTR, WDR1, WDR3 | CYP1A2 1908/4885ALPL 4844/4885TSHR 950/4885 |
| US-10816900-B2 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | TET1, KDM2B, ARCN1 | CYP1A2 2344/4885ALPL 4440/4885TSHR 4134/4885 |
| US-20090042123-A1 | CALIXRESORCINARENE COMPOUND, PHOTORESIST BASE COMPRISING THE SAME, AND COMPOSITION THEREOF | HCCS, NR4A1, RCN1 | CYP1A2 533/4885ALPL 4596/4885TSHR 530/4885 |
| US-20060009602-A1 | Polymerizable fluorinated ester, manufacturing method, polymer, photoresist composition and patterning process | HRH3, SUV39H2, SUV39H1 | CYP1A2 748/4885ALPL 4560/4885TSHR 705/4885 |
| US-20020098443-A1 | Amine compounds, resist compositions and patterning process | PARG, EHMT1, EHMT2 | CYP1A2 3198/4885ALPL 4211/4885TSHR 3757/4885 |
| US-20180120702-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | TET1, KDM1A, KDM2B | CYP1A2 2494/4885ALPL 4491/4885TSHR 3618/4885 |
| US-20100190107-A1 | CYCLIC COMPOUND, PHOTORESIST BASE MATERIAL AND PHOTORESIST COMPOSITION | CRY1, PCNA, ERCC4 | CYP1A2 2507/4885ALPL 1510/4885TSHR 4179/4885 |
| US-10274824-B2 | Photobase generators and photoresist compositions comprising same | PPOX, CRY1, CCNB1 | CYP1A2 308/4885ALPL 3819/4885TSHR 2007/4885 |
| US-10457779-B2 | Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film | ARCN1, COL1A1, F12 | CYP1A2 1983/4885ALPL 4030/4885TSHR 4289/4885 |
| US-10703917-B2 | Coating compositions suitable for use with an overcoated photoresist | DHPS, HAAO, FTO | CYP1A2 50/4885ALPL 928/4885TSHR 4365/4885 |
| US-20020007031-A1 | Novel ester compounds, polymers, resist compositions and patterning process | RER1, ARCN1, EMC1 | CYP1A2 3240/4885ALPL 4707/4885TSHR 3854/4885 |
| US-20260093176-A1 | ELECTROACTIVE COMPOUNDS, COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS | ETV6, KCNQ4, KCNQ1 | CYP1A2 4422/4885ALPL 2198/4885TSHR 4417/4885 |
| US-20230314934-A1 | PHOTOACTIVE COMPOUNDS, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS | CRY1, CBR3, C1S | CYP1A2 49/4885ALPL 4640/4885TSHR 1483/4885 |
| US-20190169211-A1 | NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | CAD, LCP1, CD79B | CYP1A2 4492/4885ALPL 3890/4885TSHR 3758/4885 |
| US-20180095368-A1 | COMPOUND, RESIN, AND PURIFICATION METHOD THEREOF, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM, AND UNDERLAYER FILM, AS WELL AS RESIST PATTERN FORMING METHOD AND CIRCUIT PATTERN FORMING METHOD | C5, PRMT9, C9 | CYP1A2 2571/4885ALPL 2151/4885TSHR 464/4885 |
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“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.